CN209201389U - A kind of ceramic substrate that can be gold-plated in specified region - Google Patents
A kind of ceramic substrate that can be gold-plated in specified region Download PDFInfo
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- CN209201389U CN209201389U CN201821403873.7U CN201821403873U CN209201389U CN 209201389 U CN209201389 U CN 209201389U CN 201821403873 U CN201821403873 U CN 201821403873U CN 209201389 U CN209201389 U CN 209201389U
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- specified region
- gold
- plated
- ceramic substrate
- copper plate
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Abstract
The utility model discloses a kind of ceramic substrate that can be gold-plated in specified region, includes potsherd, copper plate, specified region coating layer and specified region Gold plated Layer；The copper plate is set on the surface of potsherd；The specified region coating layer is set to the corresponding position in surface on the surface and copper plate of potsherd；The specified region Gold plated Layer is set on the surface corresponding position of copper plate.By the way that specified region coating layer is arranged in the corresponding position in the surface of potsherd and the surface of copper plate; to be protected to without upper golden region; so can evade completely in gold plating process without upper golden region; the layers of copper in not upper golden region will not be oxidized easily due to there is specified region coating layer to protect.Designed by such structure, not only can significantly save gold-plated cost, and reduce because technique edges remove caused by that edges of boards are damaged, secretly split etc. is bad.
Description
Technical field
The utility model relates to ceramic substrate field technologies, refer in particular to a kind of ceramic base that can be gold-plated in specified region
Plate.
Background technique
Ceramic substrate circuit board has become the basic material of power electronic circuit structure technology and interconnection technique, is answered extensively
For in the high pressures such as automobile, oil well, electric power pick-up, high insulation, high frequency, high temperature, highly reliable, small size electronic product.
It, need to be gold-plated to ceramic substrate during making ceramic substrate.However, some regions are not plated on ceramic substrate
The demand of gold can waste gilding if certain method is not taken to be isolated, and improve unnecessary cost.Moreover, often
It is bad that the ceramic substrate of rule be easy to cause that edges of boards are damaged, secretly split etc. when stripping technology side.
Therefore, it is necessary to be improved to current ceramic substrate.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose, which is to provide one kind, to be referred to
Determine the gold-plated ceramic substrate in region, can solve the problem for wasting golden material during making ceramic substrate.
To achieve the above object, the utility model is using following technical solution:
A kind of ceramic substrate that can be gold-plated in specified region, include potsherd, copper plate, specified region coating layer and
Specified region Gold plated Layer；The copper plate is set on the surface of potsherd；The specified region coating layer is set to the table of potsherd
The corresponding position in face and the surface of copper plate；The specified region Gold plated Layer is set on the surface corresponding position of copper plate.
As a preferred embodiment, the surface of the potsherd has outer technique edges, interior technique edges and location hole, the finger
Determine region coating layer and covers outer technique edges, interior technique edges.
As a preferred embodiment, the copper plate includes multiple step layers and multiple functional areas, in each step layer
Multiple functional areas are all had, which covers the outer surface of each step layer, which is covered in
The surface of functional areas.
As a preferred embodiment, the multiple step layer array arrangement.
As a preferred embodiment, the specified region coating layer structure design inside contracts compensation 25um.
As a preferred embodiment, the specified region coating layer is UV ink, and granularity need to reach 200-500nm.
As a preferred embodiment, the UV ink is five bronze inks.
As a preferred embodiment, the specified region Gold plated Layer is chemical turmeric.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Known to scheme:
By the way that specified region coating layer is arranged in the corresponding position in the surface of potsherd and the surface of copper plate, with to being not necessarily to
Upper gold region is protected, and can so be evaded completely in gold plating process without upper golden region, the layers of copper in not upper golden region
Due to there is specified region coating layer to protect, will not be oxidized easily.It is designed by such structure, not only can significantly be saved
Gold-plated cost, and reduce because technique edges remove caused by that edges of boards are damaged, secretly split etc. is bad.
For the structure feature and effect for more clearly illustrating the utility model, come with reference to the accompanying drawing with specific embodiment pair
The utility model is described in detail.
Detailed description of the invention
Fig. 1 is the overall top view of the preferred embodiment of the utility model；
Fig. 2 is the top view of single LED bracket of the preferred embodiment of the utility model；
Fig. 3 is the sectional view of single LED bracket of the preferred embodiment of the utility model.
10, potsherd 11, outer technique edges
12, interior technique edges 13, location hole
20, copper plate 21, step layer
22, functional areas 30, specified region coating layer
40, region Gold plated Layer is specified.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 3, that show the specific structures of the preferred embodiment of the utility model, include
Potsherd 10, copper plate 20, specified region coating layer 30 and specified region Gold plated Layer 40.
The surface of the potsherd 10 has outer technique edges 11, interior technique edges 12 and location hole 13, and potsherd 10 is aluminium oxide
Or alumimium nitride ceramic sheet；The copper plate 20 is set on the surface of potsherd 10, copper plate 20 with a thickness of 500-950 μm, should
Copper plate 20 includes multiple step layers 21 and multiple functional areas 22, multiple 21 array of step layer arrangement, each step layer
Multiple functional areas 22 are all had in 21.
The specified region coating layer 30 is set to the corresponding position in surface on the surface and copper plate 20 of potsherd 10, at this
In embodiment, specified region coating layer 30 covers the outer surface of outer technique edges 11, interior technique edges 12 and each step layer 21, specifies area
The design of 30 structure of domain coat inside contracts compensation 25um, the UV ink customized by ink-jet printer, and granularity need to reach 200-
500nm, color is predominantly transparent, white or black, also, UV ink is five bronze inks, more preferable with metallic cohesion, and can be with
Resistance to immersion process is not fallen off after changing gold.
The specified region Gold plated Layer 40 is set on the surface corresponding position of copper plate 20, and in the present embodiment, this is specified
Region Gold plated Layer 40 is covered in the surface of functional areas 22, and specified region Gold plated Layer 40 is chemical turmeric, is mainly used for beating gold thread
And chip die bond.
The manufacturing process that the present embodiment is described in detail is as follows:
Firstly, copper facing is carried out to potsherd 10, so that forming copper plate 20 on the surface of potsherd 10.Then pass through ink-jet
The UV ink of printer customization carries out coating processing and forms specified region coating layer 30, so that specified region coating layer 30 is covered on
The outer surface of outer technique edges 11, interior technique edges 12 and each step layer 21, and specified 30 structure of region coating layer designs interior truncate
Repay 25um.Then, it carries out gold-plated formed and specifies region Gold plated Layer 40, so that specified region Gold plated Layer 40 is covered in functional areas 22
Surface can evade the region without upper gold in gold plating process due to specifying the protective separation effect of region coating layer 30 completely.
In addition, being directed to the multilager base plate product of Different Plane, the utility model additionally provides a kind of ink coating method.Cause
Silk-screen can not be carried out using traditional silk-screen printing for the multilayered structure of Different Plane, therefore the utility model uses inkjet printing
Machine is coated, and is designed differentiation according to functional areas and nonfunctional area, not only can satisfy the elevated track precision of product, but also
Evaded exposure process due to Different Plane can not vacuum suction problem.
The design focal point of the utility model is:
By the way that specified region coating layer is arranged in the corresponding position in the surface of potsherd and the surface of copper plate, with to being not necessarily to
Upper gold region is protected, and can so be evaded completely in gold plating process without upper golden region, the layers of copper in not upper golden region
Due to there is specified region coating layer to protect, will not be oxidized easily.It is designed by such structure, not only can significantly be saved
Gold-plated cost, and reduce because technique edges remove caused by that edges of boards are damaged, secretly split etc. is bad.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (8)
1. the ceramic substrate that one kind can be gold-plated in specified region, it is characterised in that: include potsherd, copper plate, specified region
Coat and specified region Gold plated Layer；The copper plate is set on the surface of potsherd；The specified region coating layer is set to
The corresponding position in the surface of potsherd and the surface of copper plate；The surface that the specified region Gold plated Layer is set to copper plate corresponds to position
It sets.
2. ceramic substrate that can be gold-plated in specified region according to claim 1, it is characterised in that: the table of the potsherd
Face has outer technique edges, interior technique edges and location hole, and the specified region coating layer covers outer technique edges, interior technique edges.
3. ceramic substrate that can be gold-plated in specified region according to claim 1, it is characterised in that: the copper plate includes
There are multiple step layers and multiple functional areas, multiple functional areas are all had in each step layer, the specified region coating layer covering is each
The outer surface of step layer, the specified region Gold plated Layer are covered in the surface of functional areas.
4. ceramic substrate that can be gold-plated in specified region according to claim 3, it is characterised in that: the multiple step layer
Array arrangement.
5. ceramic substrate that can be gold-plated in specified region according to claim 1, it is characterised in that: the specified region applies
Coat structure design inside contracts compensation 25um.
6. ceramic substrate that can be gold-plated in specified region according to claim 1, it is characterised in that: the specified region applies
Coating is UV ink, and granularity need to reach 200-500nm.
7. ceramic substrate that can be gold-plated in specified region according to claim 6, it is characterised in that: the UV ink is five
Bronze ink.
8. ceramic substrate that can be gold-plated in specified region according to claim 1, it is characterised in that: the specified region plating
Layer gold is chemical turmeric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821403873.7U CN209201389U (en) | 2018-08-29 | 2018-08-29 | A kind of ceramic substrate that can be gold-plated in specified region |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821403873.7U CN209201389U (en) | 2018-08-29 | 2018-08-29 | A kind of ceramic substrate that can be gold-plated in specified region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209201389U true CN209201389U (en) | 2019-08-02 |
Family
ID=67405206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821403873.7U Active CN209201389U (en) | 2018-08-29 | 2018-08-29 | A kind of ceramic substrate that can be gold-plated in specified region |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958772A (en) * | 2019-11-15 | 2020-04-03 | 盐城维信电子有限公司 | Selective gold plating method for FPC board |
| CN112040664A (en) * | 2020-08-04 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Method for preventing edge of PCB from being gold-plated |
| CN114698244A (en) * | 2020-12-30 | 2022-07-01 | 深南电路股份有限公司 | Method for spreading copper on positioning hole of packaging substrate and circuit board |
-
2018
- 2018-08-29 CN CN201821403873.7U patent/CN209201389U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958772A (en) * | 2019-11-15 | 2020-04-03 | 盐城维信电子有限公司 | Selective gold plating method for FPC board |
| CN112040664A (en) * | 2020-08-04 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Method for preventing edge of PCB from being gold-plated |
| CN114698244A (en) * | 2020-12-30 | 2022-07-01 | 深南电路股份有限公司 | Method for spreading copper on positioning hole of packaging substrate and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Ceramic substrate capable of plating gold in designated area Effective date of registration: 20200707 Granted publication date: 20190802 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201015 Granted publication date: 20190802 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201103 Address after: 710000 unit 1707, building 1, Wanke hi tech living Plaza, No.56 Xifeng Road, Yanta District, Xi'an, Shaanxi Province Patentee after: Xi'an Boxin Chuangda Electronic Technology Co., Ltd Address before: 523000 No. 12, ancient Liao Road, Tangxia Town, Dongguan, Guangdong Patentee before: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |