CN206790770U - Aluminium-based copper-clad laminate - Google Patents
Aluminium-based copper-clad laminate Download PDFInfo
- Publication number
- CN206790770U CN206790770U CN201720468041.2U CN201720468041U CN206790770U CN 206790770 U CN206790770 U CN 206790770U CN 201720468041 U CN201720468041 U CN 201720468041U CN 206790770 U CN206790770 U CN 206790770U
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- copper foil
- aluminium
- clad laminate
- copper
- metal substrate
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Abstract
The utility model discloses a kind of aluminium-based copper-clad laminate, including metal substrate, copper foil layer and the epoxy glue adhesion coating between metal substrate and copper foil layer, several horizontal through hole are provided with the middle part of the metal substrate and along its in-plane, several this horizontal through hole are parallel and arranged at equal intervals；The copper foil layer is evenly distributed with several semi-circular projection portions with the lower surface that epoxy glue adhesion coating contacts；Between the adjacent semi-circular projection portion at intervals of 2 ~ 4mm.The utility model aluminium-based copper-clad laminate had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, avoids the copper foil in PCB following process and etching and comes off, is also beneficial to reduce resistivity when copper foil conduction.
Description
Technical field
A kind of copper clad laminate, more particularly to aluminium-based copper-clad laminate are the utility model is related to, belongs to printed substrate neck
Domain.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of aluminium-based copper-clad laminate, and the aluminium-based copper-clad laminate both improves copper
The adhesive strength of layers of foil and epoxy glue adhesion coating, coming off in PCB following process and etching copper foil is avoided, is also beneficial to reduce
Resistivity when copper foil conduction.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of aluminium-based copper-clad laminate, including gold
Belong to substrate, copper foil layer and the epoxy glue adhesion coating between metal substrate and copper foil layer, positioned at metal substrate middle part and edge
Its in-plane is provided with several horizontal through hole, and several this horizontal through hole are parallel and arranged at equal intervals；The copper foil layer and ring
The lower surface of oxygen adhesive layer contact is evenly distributed with several semi-circular projection portions.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the adjacent horizontal through hole at intervals of 10 ~ 30mm.
2. in such scheme, between the adjacent semi-circular projection portion at intervals of 2 ~ 4mm.
3. in such scheme, the thickness of the epoxy glue adhesion coating is 80 ~ 200 microns.
4. in such scheme, the thickness ratio of the metal substrate, copper foil layer and epoxy glue adhesion coating is（300~3000）：（5~
70）：（80~200）.
5. in such scheme, the metal substrate is aluminium base, copper base or iron substrate.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model aluminium-based copper-clad laminate, if it is located in the middle part of the metal substrate and is provided with along its in-plane
A dry horizontal through hole, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, be advantageous to by from
The heat of copper foil layer device quickly transmits, and so as to be advantageous to improve the service life of device, improves the reliability of product, its
Secondary, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows several horizontal through hole, so that will more
More heats are taken out of；Again, its copper foil layer is evenly distributed with several semi-circular projection portions with the lower surface that epoxy glue adhesion coating contacts,
Both the adhesive strength of copper foil layer and epoxy glue adhesion coating had been improved, the copper foil in PCB following process and etching has been avoided and comes off,
Advantageously reduce resistivity when copper foil conduction.
Brief description of the drawings
Accompanying drawing 1 is the utility model aluminium-based copper-clad laminate structural representation；
Accompanying drawing 2 is the A-A cross-sectional views of accompanying drawing 1.
In the figures above：1st, metal substrate；2nd, copper foil layer；3rd, epoxy glue adhesion coating；4th, horizontal through hole；5th, semi-circular projection portion.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of aluminium-based copper-clad laminate, including metal substrate 1, copper foil layer 2 and positioned at metal substrate 1 and copper
Epoxy glue adhesion coating 3 between layers of foil 2, positioned at the middle part of metal substrate 1 and it is provided with several horizontal through hole along its in-plane
4, several this horizontal through hole 4 are parallel and arranged at equal intervals；The lower surface that the copper foil layer 2 contacts with epoxy glue adhesion coating 3 is uniform
Several semi-circular projection portions 5 are distributed with.
The adjacent horizontal through hole 4 at intervals of 12mm.
Between adjacent above-mentioned semi-circular projection portion 5 at intervals of 3mm；The thickness of above-mentioned epoxy glue adhesion coating 3 is 140 microns.
The thickness ratio of said metal substrates 1, copper foil layer 2 and epoxy glue adhesion coating 3 is 1000：30：90.
Said metal substrates 1 are aluminium base.
Embodiment 2：A kind of aluminium-based copper-clad laminate, including metal substrate 1, copper foil layer 2 and positioned at metal substrate 1 and copper
Epoxy glue adhesion coating 3 between layers of foil 2, positioned at the middle part of metal substrate 1 and it is provided with several horizontal through hole along its in-plane
4, several this horizontal through hole 4 are parallel and arranged at equal intervals；The lower surface that the copper foil layer 2 contacts with epoxy glue adhesion coating 3 is uniform
Several semi-circular projection portions 5 are distributed with.
The adjacent horizontal through hole 4 at intervals of 20mm.
Between adjacent above-mentioned semi-circular projection portion 5 at intervals of 2.6mm；The thickness of above-mentioned epoxy glue adhesion coating 3 is 90 microns.
The thickness ratio of said metal substrates 1, copper foil layer 2 and epoxy glue adhesion coating 3 is 2000：50：120.
Said metal substrates 1 are copper base.
During using above-mentioned aluminium-based copper-clad laminate, if it is located in the middle part of the metal substrate and is provided with along its in-plane
A dry horizontal through hole, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, be advantageous to by from
The heat of copper foil layer device quickly transmits, and so as to be advantageous to improve the service life of device, improves the reliability of product, its
Secondary, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows several horizontal through hole, so that will more
More heats are taken out of；Secondly, its copper foil layer is evenly distributed with several semi-circular projection portions with the lower surface that epoxy glue adhesion coating contacts,
Both the adhesive strength of copper foil layer and epoxy glue adhesion coating had been improved, the copper foil in PCB following process and etching has been avoided and comes off,
Advantageously reduce resistivity when copper foil conduction.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (7)
- A kind of 1. aluminium-based copper-clad laminate, it is characterised in that：Including metal substrate（1）, copper foil layer（2）With positioned at metal substrate （1）And copper foil layer（2）Between epoxy glue adhesion coating（3）, positioned at the metal substrate（1）If middle part and being provided with along its in-plane Dry horizontal through hole（4）, several this horizontal through hole（4）Parallel and arranged at equal intervals；The copper foil layer（2）With epoxy glue adhesion coating （3）The lower surface of contact is evenly distributed with several semi-circular projection portions（5）.
- 2. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The adjacent horizontal through hole（4）'s At intervals of 10 ~ 30mm.
- 3. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The adjacent semi-circular projection portion（5）It Between at intervals of 2 ~ 4mm.
- 4. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The epoxy glue adhesion coating（3）Thickness For 80 ~ 200 microns.
- 5. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The metal substrate（1）, copper foil layer （2）With epoxy glue adhesion coating（3）Thickness ratio be（300~3000）：（5~70）：（80~200）.
- 6. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The metal substrate（1）For aluminium base, Copper base or iron substrate.
- 7. aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The metal substrate（1）Thickness is 0.3 ~3.0mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468041.2U CN206790770U (en) | 2017-04-29 | 2017-04-29 | Aluminium-based copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468041.2U CN206790770U (en) | 2017-04-29 | 2017-04-29 | Aluminium-based copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790770U true CN206790770U (en) | 2017-12-22 |
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ID=60709315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720468041.2U Active CN206790770U (en) | 2017-04-29 | 2017-04-29 | Aluminium-based copper-clad laminate |
Country Status (1)
| Country | Link |
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| CN (1) | CN206790770U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452454A (en) * | 2020-05-26 | 2020-07-28 | 上海禾技实业有限公司 | Metal-based copper-clad laminate and preparation method thereof |
| CN113969117A (en) * | 2021-12-14 | 2022-01-25 | 芜湖徽氏新材料科技有限公司 | Steel foil adhesive tape and production process thereof |
-
2017
- 2017-04-29 CN CN201720468041.2U patent/CN206790770U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452454A (en) * | 2020-05-26 | 2020-07-28 | 上海禾技实业有限公司 | Metal-based copper-clad laminate and preparation method thereof |
| CN113969117A (en) * | 2021-12-14 | 2022-01-25 | 芜湖徽氏新材料科技有限公司 | Steel foil adhesive tape and production process thereof |
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