CN208690245U - The radiator and onboard charger of heat-generating electronic part - Google Patents
The radiator and onboard charger of heat-generating electronic part Download PDFInfo
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- CN208690245U CN208690245U CN201690001311.2U CN201690001311U CN208690245U CN 208690245 U CN208690245 U CN 208690245U CN 201690001311 U CN201690001311 U CN 201690001311U CN 208690245 U CN208690245 U CN 208690245U
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 230000002269 spontaneous effect Effects 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 40
- 229910052782 aluminium Inorganic materials 0.000 description 40
- 239000004411 aluminium Substances 0.000 description 40
- 238000000034 method Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 230000001050 lubricating effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000010412 perfusion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The radiator of heat-generating electronic part has circuit substrate, heat-generating electronic part, heat carrier and thermal component.Heat-generating electronic part has the conducting wire connecting with circuit substrate by the spontaneous heating that is powered.The cooling surface contacts of heat carrier and heat-generating electronic part, for configuring heat-generating electronic part.Thermal component is shaped to box, and there is the first face and second face opposite with the first face, the thermal component for configuring heat carrier to radiate to the heat from heat carrier.Heat-generating electronic part is fixed in the face of heat carrier intersected with the first face.Heat carrier and circuit substrate are arranged in order along vertical direction by heat carrier, circuit substrate from the first face.
Description
Technical field
The utility model relates to a kind of radiator of heat-generating electronic part and onboard chargers.
Background technique
In the past, it is known that substrate, electronic component are accommodated in the shell of the approximately cuboid formed by radiating component,
The heat generated from electronic component radiates via shell.The manufacturing method of the construction of shell as such approximately cuboid, it is public
Knowing has the method for covering from above the shell for being integrally molded so as box and lower surface opening with side above and to following
(bottom surface) and side are integrally molded so as the method both methods of box and top-open case lid cap member (above).
In the feelings using the method for covering from above the shell for being integrally molded so as box and lower aperture with side above
Under condition, side is not present when substrate, electronic component are installed on following, therefore screw thread can be carried out to electronic component from side
Fastening, on the other hand, to the terminal (connection for the electronic component saved in shell to be electrically connected with the electronic component outside shell
Device) configuration generate restriction.
In general, in the case where connector is set to side, it is preferable to use being integrally molded so as to following with side
The method of box and upper opening of case lid cap member (above).
However, to it is following be integrally molded so as with side box and upper opening of case lid cap member (above)
In method, it is integrally molded so as box with side due to following, electronic component can not be threadably secured from side, be needed
It is threadably secured from the upper surface of opening.
As the method carried out for the screw threads for fastening from the fixed electronic component of the upper surface of opening, it may be considered that by that will send out
The radiating surface of heat-generating electronic part is configured to directly contact with bottom surface by the conducting wire bending of thermoelectricity subassembly, such as it is contemplated that
It is disclosed in Patent Document 1 to be threadably secured elastic component from top so that elastic component pressing and radiating surface opposite side
Face.
Patent document 1: Japanese Unexamined Patent Publication 2002-217343 bulletin
Utility model content
The radiator of heat-generating electronic part involved in one mode of the disclosure has circuit substrate, the fever ministry of electronics industry
Part, heat carrier and thermal component.Heat-generating electronic part has the conducting wire connecting with circuit substrate by the spontaneous heating that is powered.
The cooling surface contacts of heat carrier and heat-generating electronic part, for configuring heat-generating electronic part.Thermal component is shaped to box, has
For configuring the first face of heat carrier and the second face that is opposite and being provided with opening portion with the first face, the thermal component is to coming from
The heat of heat carrier radiates.Heat-generating electronic part is fixed in the face of heat carrier intersected with the first face.Heat carrier and circuit
Substrate is arranged in order along the direction vertical with the first face by heat carrier, circuit substrate from the first face.
The second aspect of the utility model provides the radiator of the heat-generating electronic part according to aforementioned first aspect,
It is characterized in that, the shape that the heat-generating electronic part is parallel with the first direction with the longitudinal direction of the heat-generating electronic part
State and the state for not contacting the thermal component are fixed in the heat carrier.
The third aspect of the utility model provides the heat-generating electronic part according to aforementioned first aspect or second aspect
Radiator, which is characterized in that the heat carrier is glued and be fixed on the circuit substrate by adhesive member.
The fourth aspect of the utility model provides the radiator of the heat-generating electronic part according to the aforementioned third aspect,
It is characterized in that, the adhesive member has at least one party in insulating properties and thermal diffusivity.
5th aspect of the utility model provides the heat-generating electronic part according to aforementioned first aspect or second aspect
Radiator, which is characterized in that between the heat carrier and the circuit substrate be configured with radiating component.
6th aspect of the utility model provides the heat-generating electronic part according to aforementioned first aspect or second aspect
Radiator, which is characterized in that between the heat carrier and the circuit substrate configured with have insulating properties and thermal diffusivity
Adhesive member, with described there is the corresponding position of the adhesive member of insulating properties and thermal diffusivity to be formed in the circuit substrate
Pattern.
7th aspect of the utility model provides the heat-generating electronic part according to aforementioned first aspect or second aspect
Radiator, which is characterized in that between the bottom surface and the circuit substrate of the thermal component also have tall and big component, institute
The length stated on the first direction of tall and big component is longer than the length on the first direction of the heat-generating electronic part.
The eighth aspect of the utility model provides the heat-generating electronic part according to aforementioned first aspect or second aspect
Radiator, which is characterized in that the heat carrier is fixed in a manner of first face contact with the thermal component.
Another aspect of the present invention provides a kind of onboard charger comprising: circuit substrate；Generate heat electronics
Component by the spontaneous heating that is powered, and has the conducting wire connecting with the circuit substrate；Heat carrier, with the heating electric
The cooling surface contacts of subassembly, for configuring the heat-generating electronic part；And thermal component, it is shaped to box, has and uses
In the first face for configuring the heat carrier and with first face it is opposite and be provided with the second face of opening portion, the radiating part
Part radiates to the heat from the heat carrier, the heat-generating electronic part be fixed in the heat carrier with described first
The face that face intersects, the heat carrier and the circuit substrate are from first face along the first party vertical with first face
It is arranged in order to by the heat carrier, the circuit substrate.
According to the disclosure, using being shaped to box and only in the case where being provided with the thermal component of opening portion on one side,
The heat dissipation of heat-generating electronic part can be carried out while inhibiting enlargement.
Detailed description of the invention
Fig. 1 is the solid for indicating an example of radiator of heat-generating electronic part involved in embodiment of the present disclosure
Figure.
Fig. 2 be indicate an example of the radiator of heat-generating electronic part involved in embodiment of the present disclosure, from just
The perspective view of face observation.
Fig. 3 be indicate an example of the radiator of heat-generating electronic part involved in embodiment of the present disclosure, from side
The perspective view of face observation.
Fig. 4 is that the vertical view of an example of radiator for indicating heat-generating electronic part involved in embodiment of the present disclosure is vertical
Body figure.
Fig. 5 is to indicate that the structural example of the radiator of heat-generating electronic part involved in the first variation of the disclosure is bowed
Parallax stereogram.
Fig. 6 is to indicate that the structural example of the radiator of heat-generating electronic part involved in the second variation of the disclosure is bowed
Parallax stereogram.
Specific embodiment
Before illustrating embodiment of the present disclosure, the problem of simpling illustrate previous wiring plate.In patent document 1
The disclosed bottom surface in thermal component configures in the method for heat-generating electronic part, in order to ensure heat dissipation effect, in thermal component
Bottom surface in need with the area of the part of the cooling surface contacts of heat-generating electronic part and be arranged elastic component part face
Product, it is possible to lead to the enlargement of floor space or even the whole enlargement of device.
The disclosure provides a kind of using being shaped to box and only the case where being provided with the thermal component of opening portion on one side
The radiator and its system of the heat-generating electronic part of the heat dissipation of heat-generating electronic part can be coped with while inhibiting enlargement down
Make method.
(embodiment)
Hereinafter, being explained with reference to embodiment of the present disclosure.
Firstly, illustrating the structure of the radiator 1 of heat-generating electronic part involved in present embodiment using Fig. 1~4
Example.Fig. 1 is the perspective view for indicating an example of radiator 1 of heat-generating electronic part.Fig. 2 is the heat dissipation for indicating heat-generating electronic part
An example of device 1, the perspective view that is observed from the front.Fig. 3 be indicate an example of the radiator 1 of heat-generating electronic part, from
The perspective view of side observation.Fig. 4 is the top perspective view for indicating an example of radiator 1 of heat-generating electronic part.In addition, scheming
1, the diagram of the previous section of radiator 2 is omitted in Fig. 2, the diagram of the lateral parts of radiator 2 is omitted in Fig. 3.Separately
Outside, the diagram of circuit substrate 9 shown in FIG. 1 to FIG. 3 is omitted in Fig. 4.
The radiator 1 of heat-generating electronic part is such as being used in the charger for being equipped on vehicle, inverter.Generate heat electronics
The radiator 1 of component has radiator 2, aluminium block 3, electronic component 5a, 5b and circuit substrate 9.
Radiator 2 (an example of thermal component) is integrally molded so as box, is only being provided with opening portion on one side.F1 is opening
Face (an example in the second face), F2 are the bottom surface (an example in first face) opposite with opening face F1.
In the quadrangle of the bottom surface F2 of radiator 2, along the direction D (hreinafter referred to as " Vertical Square vertical with bottom surface F2
To ".An example of " first direction ") it is provided with pillar 2a, 2b, 2c, 2d.Threaded hole is respectively formed in pillar 2a~2d (to omit
Diagram), for being threadably secured to aftermentioned circuit substrate 9.
Aluminium block 3 (an example of heat carrier) is the component of the approximately cuboid formed by aluminium.Aluminium block 3 with its longitudinal direction along
The mode of vertical direction D is configured at the inside of radiator 2.
Aluminium block 3 has the fastening part 3a of approximately cuboid in its underpart.Fastening part 3a passes through screw 4a, 4b (fixed structure
An example of part) it is screwed to bottom surface F2.Aluminium block 3 is fixed in a manner of contacting with bottom surface F2 as a result,.
Electronic component 5a, 5b (an example of heat-generating electronic part) are by the electronic component of energization spontaneous heating, e.g.
Discrete parts, FET (Field Effect Transistor: field effect transistor) etc..Electronic component 5a, 5b, which are respectively provided with, to be led
Line 6a, 6b.
Electronic component 5a, 5b are installed on aluminium block 3 in such a way that respective radiating surface is contacted with the side of aluminium block 3.That is, electric
Subassembly 5a, 5b are fixed on the face of aluminium block 3 intersected with bottom surface F2.For example, electronic component 5a, 5b are respectively by spring 7a, 7b
(an example of holding member) is pressed from the opposite face of radiating surface, is kept in a manner of being close to the side of aluminium block 3.Spring
7a, 7b pass through the side that screw 8a, 8b are screwed to aluminium block 3 respectively.
Electronic component 5a, the 5b being close to aluminium block 3 are the state upright along vertical direction D.That is, being configured to electronic component
The longitudinal direction of 5a, 5b are parallel with vertical direction D.In addition, electronic component 5a, 5b for being close to aluminium block 3 do not contact radiator 2.
The heat generated from electronic component 5a, the 5b being close to as described above with aluminium block 3 is conducted via aluminium block 3 to radiator 2.
Hereby it is achieved that the heat dissipation of electronic component 5a, 5b.
In addition, in FIG. 1 to FIG. 4, by way of example, by the electronic component being close to aluminium block 3 be set as two but it is also possible to be
One, it can also be three or more.It, can also be in addition, multiple electronic components are not limited to only be close to a face of aluminium block 3
It is close in multiple faces.
Circuit substrate 9 is the printed circuit for being formed with pattern or being equipped with defined semiconductor element (illustration omitted)
Plate.Circuit substrate 9 is placed in above-mentioned pillar 2a~2d.Moreover, circuit substrate 9 passes through screw 10a, 10b, 10c, 10d quilt
It is screwed to pillar 2a~2d.Circuit substrate 9 is fixed in pillar 2a~2d as a result,.
In addition, circuit substrate 9 is for example by welding come the conducting wire 6b of conducting wire 6a and electronic component 5b with electronic component 5a
Connection.
Aluminium block 3 and circuit substrate 9 are arranged in order along vertical direction D according to aluminium block 3, circuit substrate 9 from the F2 of bottom surface.
In addition, aluminium block 3 is mutually bonded with circuit substrate 9 by binder (bond) 11a, 11b (an example of adhesive member)
And it fixes.The fixed point in circuit substrate 9 increases as a result, can prevent the bending of conducting wire 6a, 6b.Particularly, in pillar 2a
It is had effect in the case that~2d high, vibration are multiple.
It is further preferred, that binder 11a, 11b have at least one party in insulating properties and thermal diffusivity.In binder
In the case that 11a, 11b have insulating properties, pattern can be formed in position corresponding with binder 11a, 11b in circuit substrate 9
Or installation semiconductor element.In addition, binder 11a, 11b have thermal diffusivity in the case where, can via binder 11a,
11b conducts heat caused by circuit substrate 9 to aluminium block 3.
In addition, though the illustration is omitted, the face that will be open can also be arranged in the top of circuit substrate 9 in FIG. 1 to FIG. 4
The closed cover of F1.
As described above, the radiator 1 of the heat-generating electronic part of present embodiment be configured to electronic component 5a,
The radiating surface of 5b is contacted with the aluminium block 3 that same radiator 2 configures in contact, thus with the heat dissipation that is configured to electronic component 5a, 5b
Face can cope with the heat dissipation of electronic component compared with the case where bottom surface F2 of radiator 2 is contacted while inhibiting enlargement.
It this concludes the description of the structural example of the radiator 1 of heat-generating electronic part.
Then, the manufacturing method of the radiator 1 of heat-generating electronic part is illustrated using FIG. 1 to FIG. 4.
Firstly, electronic component 5a, 5b are fixed using spring 7a, 7b and screw 8a, 8b and are adhered to aluminium block 3.At this point, making
The radiating surface of electronic component 5a, 5b are contacted with aluminium block 3.In addition, if electronic component 5a, 5b are the feelings for needing the type to insulate
Under condition, then radiating insulating piece (illustration omitted) is set preferably between the radiating surface and aluminium block 3 of electronic component 5a, 5b.
Then, the aluminium block 3 for being glued with electronic component 5a, 5b is received into radiator 2 from the opening face F1 of radiator 2
Portion, and aluminium block 3 is configured at bottom surface F2.Then, fastening part 3a is screwed to bottom surface F2 using screw 4a, 4b.
Then, circuit substrate 9 is received into the inside of radiator 2 from the opening face of radiator 2, and be configured at pillar 2a~
2d.At this point, conducting wire 6a, 6b are welded in circuit substrate 9.Then, using screw 10a~10d by 9 screw threads for fastening of circuit substrate
In pillar 2a~2d.
The radiator 1 of heat-generating electronic part shown in FIG. 1 to FIG. 4 is manufactured by above manufacturing method.
In addition it is also possible to be, after being threadably secured to circuit substrate 9, in the top of circuit substrate 9, setting will be opened
The mouth closed cover (illustration omitted) of face F1.
It this concludes the description of embodiment of the present disclosure, but the disclosure is not limited to above embodiment, be able to carry out various
Deformation.Hereinafter, illustrating variation.
(first variation)
Illustrate the radiator 1 of heat-generating electronic part involved in this variation using Fig. 5.Fig. 5 is to indicate this variation
The top perspective view of an example of the radiator 1 of related heat-generating electronic part.In addition, in Fig. 5, to FIG. 1 to FIG. 4 phase
Same constituent element marks identical label, and the description thereof will be omitted.In addition, circuit base shown in FIG. 1 to FIG. 3 is omitted in Fig. 5
The diagram of plate 9.
In this variation, as shown in figure 5, have in radiator 2 aluminium block 30 and 32 this respect of electronic component and Fig. 1~
Fig. 4 is different.
Aluminium block 30 has the fastening part 30a of approximately cuboid in its underpart.In addition, illustrating only in Fig. 5 positioned at pillar
Fastening part 30a between 2a and pillar 2b, but therewith similarly, there is also fastening part 30a between pillar 2d and pillar 2c.
Fastening part 30a is screwed to bottom surface F2 by screw 31.Side of the aluminium block 30 to be contacted with bottom surface F2 as a result,
Formula is fixed.
In addition, aluminium block 30 has the receiving portion 30b in the space for being provided with substantially rectangular parallelepiped.In the sky of receiving portion 30b
Between middle receiving electronic component 32 (for example, reactor part.An example of tall and big component).The bottom surface of electronic component 32 with radiator
The mode of 2 bottom surface F2 contact is fixed.Though being filled between electronic component 32 and receiving portion 30b in addition, the illustration is omitted
There is perfusion encapsulating material.
Electronic component 32 is upright in such a way that the longitudinal direction of electronic component 32 is along vertical direction D (referring to Fig.1~Fig. 3)
Ground configures between bottom surface F2 and circuit substrate 9 (referring to Fig.1~Fig. 3).In addition, the length on the vertical direction D of electronic component 32
Spend (length in the longitudinal direction of electronic component 32) than electronic component 5a, 5b vertical direction D on length (electronic component
Length in the longitudinal direction of 5a, 5b) it is long.
By the way that electronic component 32 is configured at bottom surface F2 like this, sky can be set between circuit substrate 9 and bottom surface F2
Between, and in the space configuration aluminium block 3.Avoid the radiator 1 of heat-generating electronic part in its short transverse (vertical direction as a result,
D enlarged on).
According to this modification, other than the effect described in the embodiment 1, additionally it is possible to carry out being configured at radiator 2
Bottom surface F2 electronic component 32 fixation (vibration countermeasure).In addition, in the perfusion package material that perfusion encapsulating material is thermal diffusivity
In the case where material, it is also able to carry out the fixation (vibration countermeasure) and heat dissipation of electronic component 32.
(the second variation)
Illustrate the radiator 1 of heat-generating electronic part involved in this variation using Fig. 6.Fig. 6 is to indicate this variation
The top perspective view of an example of the radiator 1 of related heat-generating electronic part.In addition, in Fig. 6, to FIG. 1 to FIG. 4 phase
Same constituent element marks identical label, and the description thereof will be omitted.In addition, circuit base shown in FIG. 1 to FIG. 3 is omitted in Fig. 6
The diagram of plate 9.
In this variation, as shown in fig. 6, having electronic component 33,34 this respects and FIG. 1 to FIG. 4 in radiator 2 not
Together.
Electronic component 33,34 is (for example, reactor part.An example of tall and big component) respectively with the bottom surface F2 with radiator 2
The mode of contact is fixed.
Electronic component 33,34 is with the longitudinal direction of electronic component 33,34 along the side of vertical direction D (referring to Fig.1~Fig. 3)
Formula erectly configures between bottom surface F2 and circuit substrate 9 (referring to Fig.1~Fig. 3).In addition, the Vertical Square of electronic component 33,34
Length (length in the longitudinal direction of electronic component 33,34) on D than electronic component 5a, 5b vertical direction D on it is long
It is long to spend (length in the longitudinal direction of electronic component 5a, 5b).
By the way that electronic component 33,34 is configured at bottom surface F2 like this, can be set between circuit substrate 9 and bottom surface F2
Between emptying, and in the space configuration aluminium block 3.Avoid the radiator 1 of heat-generating electronic part (vertical in its short transverse as a result,
Direction D) on enlargement.
In this variation, other than the effect described in embodiment 1, additionally it is possible to carry out being configured at radiator 2
The heat dissipation of the electronic component 33,34 of bottom surface F2.
(third variation)
In embodiments, it enumerates and be illustrated for air cooled situation using radiator 2, but can also be with
Water cooling is applied instead of air cooling.
(the 4th variation)
In embodiments, it enumerates using screw and carries out aluminium block 3 to the fastening of bottom surface F2, spring 7a, 7b to aluminium block 3
Fastening, fastening from circuit substrate 9 to pillar 2a~2d in case where be illustrated, but also can replace screw and use
Binder.In addition, in embodiments, enumerate using spring carry out electronic component 5a, 5b to aluminium block 3 abutting in case where
It is illustrated, but also can replace spring and use screw.
(5th variation)
In addition, enumerating aluminium block 3 with circuit substrate 9 to be mutually bonded by binder 11a, 11b (an example of adhesive member)
Mode it is fixed in case where be illustrated, but can also be by lubricating grease, gap fillers (an example of radiating component) etc.
Thermal diffusivity component without cementability is arranged between aluminium block 3 and circuit substrate 9.Thereby, it is possible to via lubricating grease, gap
Filler etc. conducts heat caused by circuit substrate 9 to aluminium block 3.In addition, there is insulating properties in lubricating grease, gap fillers
In the case of, pattern or installation semiconductor element can be formed in part corresponding with lubricating grease, gap fillers in circuit substrate 9
Part.
Industrial availability
The disclosure is useful to the radiator and its manufacturing method of heat-generating electronic part.
Description of symbols
1: the radiator of heat-generating electronic part；2: radiator；2a, 2b, 2c, 2d: pillar；3,30: aluminium block；3a, 30a:
Fastening part；4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31: screw；5a, 5b: electronic component；6a, 6b: conducting wire；7a, 7b: bullet
Spring；9: circuit substrate；30b: receiving portion；32,33,34: electronic component.
Claims (9)
1. a kind of radiator of heat-generating electronic part comprising:
Circuit substrate；
Heat-generating electronic part by the spontaneous heating that is powered, and has the conducting wire connecting with the circuit substrate；
Heat carrier, the cooling surface contacts with the heat-generating electronic part, for configuring the heat-generating electronic part；And
Thermal component is shaped to box, have for configure the first face of the heat carrier and with first face it is opposite
And it is provided with the second face of opening portion, the thermal component radiates to the heat from the heat carrier,
Wherein, the heat-generating electronic part is fixed in the face of the heat carrier intersected with first face,
The heat carrier and the circuit substrate are from first face along the first direction vertical with first face by institute
State heat carrier, the circuit substrate is arranged in order.
2. the radiator of heat-generating electronic part according to claim 1, which is characterized in that
The heat-generating electronic part is with the longitudinal direction of the heat-generating electronic part state parallel with the first direction and not
The state for contacting the thermal component is fixed in the heat carrier.
3. the radiator of heat-generating electronic part according to claim 1 or 2, which is characterized in that
The heat carrier is glued by adhesive member and is fixed on the circuit substrate.
4. the radiator of heat-generating electronic part according to claim 3, which is characterized in that
The adhesive member has at least one party in insulating properties and thermal diffusivity.
5. the radiator of heat-generating electronic part according to claim 1 or 2, which is characterized in that
Radiating component is configured between the heat carrier and the circuit substrate.
6. the radiator of heat-generating electronic part according to claim 1 or 2, which is characterized in that
The adhesive member with insulating properties and thermal diffusivity is configured between the heat carrier and the circuit substrate,
With described there is the corresponding position of the adhesive member of insulating properties and thermal diffusivity to be formed with pattern in the circuit substrate.
7. the radiator of heat-generating electronic part according to claim 1 or 2, which is characterized in that
Also there is tall and big component between the bottom surface and the circuit substrate of the thermal component,
Length on the first direction of the tall and big component is than long on the first direction of the heat-generating electronic part
Degree length.
8. the radiator of heat-generating electronic part according to claim 1 or 2, which is characterized in that
The heat carrier is fixed in a manner of first face contact with the thermal component.
9. a kind of onboard charger comprising:
Circuit substrate；
Heat-generating electronic part by the spontaneous heating that is powered, and has the conducting wire connecting with the circuit substrate；
Heat carrier, the cooling surface contacts with the heat-generating electronic part, for configuring the heat-generating electronic part；And
Thermal component is shaped to box, have for configure the first face of the heat carrier and with first face it is opposite
And it is provided with the second face of opening portion, the thermal component radiates to the heat from the heat carrier,
The heat-generating electronic part is fixed in the face of the heat carrier intersected with first face,
The heat carrier and the circuit substrate are from first face along the first direction vertical with first face by institute
State heat carrier, the circuit substrate is arranged in order.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015241074A JP6726862B2 (en) | 2015-12-10 | 2015-12-10 | Heat dissipation device for heat-generating electronic components and in-vehicle charger |
| JP2015-241074 | 2015-12-10 | ||
| PCT/JP2016/005018 WO2017098703A1 (en) | 2015-12-10 | 2016-11-30 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208690245U true CN208690245U (en) | 2019-04-02 |
Family
ID=59013845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690001311.2U Active CN208690245U (en) | 2015-12-10 | 2016-11-30 | The radiator and onboard charger of heat-generating electronic part |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6726862B2 (en) |
| CN (1) | CN208690245U (en) |
| WO (1) | WO2017098703A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7233026B2 (en) | 2018-04-25 | 2023-03-06 | パナソニックＩｐマネジメント株式会社 | power supply |
| JP7056375B2 (en) * | 2018-05-22 | 2022-04-19 | 株式会社オートネットワーク技術研究所 | Circuit equipment |
| JP7304540B2 (en) * | 2019-12-12 | 2023-07-07 | パナソニックＩｐマネジメント株式会社 | POWER CONVERSION DEVICE AND METHOD FOR MANUFACTURING POWER CONVERSION DEVICE |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6247199U (en) * | 1985-09-12 | 1987-03-23 | ||
| JP2524127Y2 (en) * | 1986-10-23 | 1997-01-29 | 富士電機株式会社 | Cooling body |
| JP2568003Y2 (en) * | 1991-10-18 | 1998-04-08 | 株式会社ケンウッド | Radiator |
| JPH06196885A (en) * | 1992-12-25 | 1994-07-15 | Sony Corp | Heat sink |
| JP4407067B2 (en) * | 2001-03-14 | 2010-02-03 | 株式会社デンソー | Electronic equipment |
| JP4796999B2 (en) * | 2007-07-17 | 2011-10-19 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
| JP4408444B2 (en) * | 2007-09-28 | 2010-02-03 | 株式会社日立製作所 | Electronic control device using LC module structure |
| JP5846181B2 (en) * | 2013-04-22 | 2016-01-20 | 株式会社デンソー | Electronic control unit |
-
2015
- 2015-12-10 JP JP2015241074A patent/JP6726862B2/en active Active
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2016
- 2016-11-30 WO PCT/JP2016/005018 patent/WO2017098703A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2017098703A1 (en) | 2017-06-15 |
| JP2017108007A (en) | 2017-06-15 |
| JP6726862B2 (en) | 2020-07-22 |
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Effective date of registration: 20240326 Address after: Kanagawa Prefecture, Japan Patentee after: Panasonic Automotive Electronic Systems Co.,Ltd. Country or region after: Ri Ben Address before: Osaka, Japan Patentee before: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Country or region before: Ri Ben |