JP4796999B2 - Electronic control unit - Google Patents

Electronic control unit Download PDF

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JP4796999B2
JP4796999B2 JP2007185204A JP2007185204A JP4796999B2 JP 4796999 B2 JP4796999 B2 JP 4796999B2 JP 2007185204 A JP2007185204 A JP 2007185204A JP 2007185204 A JP2007185204 A JP 2007185204A JP 4796999 B2 JP4796999 B2 JP 4796999B2
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electronic control
control device
heat
housing
circuit board
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JP2009026780A (en
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晃 松下
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

本発明は電子制御装置に係り、特に、熱を効率的に放出するための放熱構造を備えた自動車用の電子制御装置に関する。   The present invention relates to an electronic control device, and more particularly, to an electronic control device for an automobile having a heat dissipation structure for efficiently releasing heat.

自動車用の電子制御装置の搭載部位は、エンジンルームの内部やオン・エンジンとなる。このため、電子制御装置は比較的高い温度の環境に置かれることになる。このような環境下で、電子制御措置を正常に動作させるためには、電子制御装置の内部に設けられた電子部品からの発熱を効率的に放出する必要がある。したがって、電子制御装置においては、放熱性の向上が重要な課題となる。   The mounting part of the electronic control device for automobiles is inside the engine room or on-engine. For this reason, the electronic control unit is placed in a relatively high temperature environment. In order to operate the electronic control measures normally in such an environment, it is necessary to efficiently release heat generated from the electronic components provided inside the electronic control device. Therefore, improvement of heat dissipation becomes an important issue in the electronic control device.

ところが、電子制御装置における発熱源である電子部品は、小型化及び高機能化が進み、より大きな熱が小スペース内で発生し、発熱密度が増大する傾向がある。電子部品から発せられた熱は、電子部品を実装する回路基板を経由し、電子制御装置の金属筐体に伝わる。金属筐体に伝わった熱は、最終的には外気へ伝達，放熱される。   However, electronic components, which are heat sources in electronic control devices, are becoming smaller and more functional, and more heat is generated in a small space, which tends to increase the heat generation density. The heat generated from the electronic component is transferred to the metal casing of the electronic control device via the circuit board on which the electronic component is mounted. The heat transferred to the metal casing is finally transferred to the outside air and radiated.

電子部品から回路基板、及び、金属筐体への熱伝導，熱伝達の向上方法に加えて、金属筐体から外気への熱伝達を向上させる方法について、特開２００６−１３５１２０号公報（特許文献１）には、金属筐体に放熱フィンを設けることが開示されている。   Japanese Patent Application Laid-Open No. 2006-135120 (Patent Document) discloses a method for improving heat transfer from an electronic component to a circuit board and a metal casing, as well as heat transfer from the metal casing to the outside air. 1) discloses that a heat dissipating fin is provided in a metal casing.

特開２００６−１３５１２０号公報JP 2006-135120 A

電子制御装置内の電子部品の放熱方式としては、電子部品の熱をプリント基板に伝え、プリント基板の熱を筐体に伝え、筐体に設けた放熱フィンから外気に伝える方式が一般的である。   As a heat dissipation method for electronic components in an electronic control device, a method is generally used in which heat of an electronic component is transmitted to a printed circuit board, heat of the printed circuit board is transmitted to a housing, and heat is dissipated from heat radiation fins provided on the housing to the outside air. .

筐体の熱を筐体外に伝える手段がなければ、電子制御装置内の電子部品の熱を制御装置の筐体へ伝える効率を向上しても、装置全体の放熱性は向上しない。放熱フィンを設け、筐体表面積を増やす方法が採られる背景は、制御装置の筐体から筐体外への放熱性を向上するためである。   If there is no means for transferring the heat of the casing to the outside of the casing, even if the efficiency of transferring the heat of the electronic components in the electronic control apparatus to the casing of the control apparatus is improved, the heat dissipation of the entire apparatus is not improved. The reason why the method of increasing the surface area of the casing by providing the radiation fins is to improve the heat dissipation from the casing of the control device to the outside of the casing.

しかし、装置の取付け環境による制約や、小型化・軽量化要求を満たすために、放熱フィンを付けられない場合もある。また、筐体と大気の間の熱伝達係数は、金属同士の固体接触に比べて小さく、大気中への放熱能力には限界がある。従って、筐体から筐体外への放熱性を向上するには、大気中への熱伝達による放熱に加え、新たな放熱経路が求められる。   However, there are cases in which a heat radiating fin cannot be attached in order to satisfy the restrictions due to the installation environment of the apparatus and the demand for reduction in size and weight. In addition, the heat transfer coefficient between the housing and the atmosphere is small compared to the solid contact between metals, and there is a limit to the ability to dissipate heat into the atmosphere. Therefore, in order to improve the heat dissipation from the casing to the outside of the casing, a new heat dissipation path is required in addition to the heat dissipation by heat transfer to the atmosphere.

ここで、電子制御装置にワイヤハーネス（以下、単に「ハーネス」という。）を接続すると、基板の熱がコネクタピンを経由してハーネスに伝えられて放熱される。このため、ハーネスが接続されるコネクタ周囲のプリント基板温度は、プリント基板上の他の部位に比べて、温度が低くなる。これは、ハーネスが銅系合金からできており、熱伝導性に優れるためである。つまり、ハーネスには放熱効果がある。そこで、本発明は、ハーネスの放熱効果をより積極的に利用するため、従来は放熱フィンに導いていた熱を、ハーネスにも導く熱伝達構造を設けたものである。   Here, when a wire harness (hereinafter simply referred to as “harness”) is connected to the electronic control device, the heat of the board is transmitted to the harness via the connector pin and radiated. For this reason, the temperature of the printed circuit board around the connector to which the harness is connected is lower than that of other parts on the printed circuit board. This is because the harness is made of a copper-based alloy and has excellent thermal conductivity. That is, the harness has a heat dissipation effect. Therefore, the present invention is provided with a heat transfer structure that guides the heat that has been conventionally guided to the radiation fins to the harness in order to more actively utilize the heat dissipation effect of the harness.

本発明は、電子制御装置を作動させるためには不可欠であるハーネスが、熱伝導性に優れる銅系合金でできていることに着目し、ハーネスを一つの放熱経路として利用するものである。   The present invention pays attention to the fact that a harness that is indispensable for operating an electronic control device is made of a copper-based alloy having excellent thermal conductivity, and uses the harness as one heat dissipation path.

本発明は、電子部品の熱をハーネスに導くための熱伝達構造を電子制御装置内に設けることで、従来からある筐体から外気への放熱経路以外に、ハーネスへ熱を導き、放熱経路として活用することにより、電子制御装置の放熱性を向上させることを目的とする。   The present invention provides a heat transfer structure for guiding the heat of the electronic component to the harness in the electronic control device, so that the heat is guided to the harness in addition to the heat dissipation path from the conventional housing to the outside air. It aims at improving the heat dissipation of an electronic control apparatus by utilizing.

上記課題を解決するため、例えば、特許請求の範囲に記載された技術思想を用いればよい。In order to solve the above problem, for example, the technical idea described in the claims may be used.

本発明によれば、放熱性を向上させた電子制御装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic control apparatus which improved heat dissipation can be provided.

以下、本発明の実施例について、図面を参照しながら詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

電子制御装置を作動させるには、ハーネスを用いてバッテリや他の機器と接続することが不可欠である。言い換えれば、制御装置が発熱状態となる作動時には、電子制御装置にはハーネスが接続されていると考えることができる。また、このハーネスは、熱伝導性に優れる銅系の材料からできていることが多い。そこで、電子制御装置の熱を装置外に伝える放熱経路として、ハーネスを利用することができる。   In order to operate the electronic control unit, it is indispensable to connect the battery and other devices using a harness. In other words, it can be considered that a harness is connected to the electronic control device when the control device is in an exothermic state. Moreover, this harness is often made of a copper-based material having excellent thermal conductivity. Therefore, a harness can be used as a heat dissipation path for transferring the heat of the electronic control device to the outside of the device.

ハーネスを介して熱を逃がすには、電子部品の熱をハーネスに導く必要がある。このことは、ハーネスが接続されるコネクタピンに熱を伝えることに等しいと考えられる。そこで、筐体に、コネクタピンに熱を導く構造を設け、ハーネスを放熱経路として活用し、電子制御装置の放熱効率を向上する。   In order to release heat through the harness, it is necessary to guide the heat of the electronic component to the harness. This is considered to be equivalent to transferring heat to the connector pin to which the harness is connected. Therefore, a structure for guiding heat to the connector pin is provided in the housing, and the harness is used as a heat dissipation path to improve the heat dissipation efficiency of the electronic control device.

前述の通り、電子部品から発せられた熱は、一度、プリント基板に伝えられる。プリント基板に伝えられた熱は、電子部品の直下に設ける筐体の突起ボス等を経由して、筐体に伝えられる。   As described above, the heat generated from the electronic component is once transmitted to the printed circuit board. The heat transferred to the printed circuit board is transferred to the housing via a protruding boss of the housing provided immediately below the electronic component.

一方、プリント基板に伝えられた熱の一部は、基板内の熱伝導によってプリント基板全体に広がり、コネクタピンにも導かれる。また同時に、プリント基板表面から放散される。しかし、プリント基板に用いる樹脂材（プリプレグ）の熱伝導率は０.５Ｗ／ｍＫ 程度であり、銅（約４００Ｗ／ｍＫ）やアルミ（約２４０Ｗ／ｍＫ）等の金属に比べると小さく、基板自体の熱伝導能力は小さい。   On the other hand, part of the heat transferred to the printed circuit board spreads over the entire printed circuit board due to heat conduction in the circuit board and is also guided to the connector pins. At the same time, it is dissipated from the printed circuit board surface. However, the thermal conductivity of the resin material (prepreg) used for the printed circuit board is about 0.5 W / mK, which is small compared to metals such as copper (about 400 W / mK) and aluminum (about 240 W / mK). The heat conduction capacity is small.

そこで、プリント基板から筐体に一度伝えられた熱を、コネクタピン近くのプリント基板へ再び導くための構造体を筐体に設ける。筐体からプリント基板に導かれた熱は、コネクタピンに伝えられ、コネクタピンからハーネスに伝えられることで、筐体の外に伝達される。この結果、装置全体の放熱性を向上させることができる。   Therefore, a structure for guiding the heat once transmitted from the printed circuit board to the housing to the printed circuit board near the connector pins is provided in the housing. The heat guided from the housing to the printed circuit board is transmitted to the connector pins, and is transmitted from the connector pins to the harness, thereby being transmitted outside the housing. As a result, the heat dissipation of the entire device can be improved.

なお、回路基板上の電子部品が片面にのみ実装される場合には、部品が実装されない面の全面を筐体に密着させる方法がある。しかし、回路基板の両面に実装が必要となる回路規模の電子制御装置においては、回路基板の全面を筐体と密着させることは困難である。そこで、後述する実施例のように、電子部品の熱を筐体に伝えた後に、プリント基板上の比較的温度の低い領域へ、筐体から熱を導くことが有効である。   When the electronic component on the circuit board is mounted only on one side, there is a method in which the entire surface on which the component is not mounted is in close contact with the housing. However, in an electronic control device having a circuit scale that requires mounting on both sides of the circuit board, it is difficult to bring the entire surface of the circuit board into close contact with the housing. Therefore, it is effective to guide the heat from the casing to a relatively low temperature region on the printed circuit board after transferring the heat of the electronic component to the casing as in an embodiment described later.

図１に本発明の第１の実施例を示す。   FIG. 1 shows a first embodiment of the present invention.

図１の電子制御装置１００は、筐体１，発熱源としての発熱部品である電子部品３，電子部品３を実装するプリント基板２、および、コネクタ４からなる。プリント基板２には、発熱源である電子部品３以外にも、電子制御装置１００の回路を構成するその他の部品が実装されているが、ここでは図示を省略する。電子部品３は、図１では１つだけを示しているが、一般には１つに限定されず、複数実装されている。また、電子部品類やコネクタ等の部品類をプリント基板２に実装，固定するためにはんだ等の導電性材料を使用するが、図示は省略している。   An electronic control device 100 of FIG. 1 includes a housing 1, an electronic component 3 as a heat generating component as a heat source, a printed circuit board 2 on which the electronic component 3 is mounted, and a connector 4. In addition to the electronic component 3 that is a heat generation source, other components that constitute the circuit of the electronic control device 100 are mounted on the printed circuit board 2, but illustration thereof is omitted here. Although only one electronic component 3 is shown in FIG. 1, the electronic component 3 is generally not limited to one, and a plurality of electronic components 3 are mounted. In addition, although a conductive material such as solder is used for mounting and fixing electronic components and components such as connectors on the printed circuit board 2, illustration is omitted.

コネクタ４は、他の制御装置やセンサ機器からの電気信号を受取り、プリント基板２上の電気回路に伝えるためのインターフェイスであり、筐体１の外部には、ハーネス５が接続されており、筐体１内部では、コネクタピン４ａがプリント基板２にはんだ等により接続される。   The connector 4 is an interface for receiving electrical signals from other control devices and sensor devices and transmitting them to an electrical circuit on the printed circuit board 2. A harness 5 is connected to the outside of the housing 1. Inside the body 1, the connector pins 4a are connected to the printed circuit board 2 by solder or the like.

筐体１には熱伝導性に優れ、ダイキャスト成形および機械加工により容易に生産できるアルミを用いることが望ましい。ただし、アルミ以外の金属にて構成することもできるし、また、金属以外の放熱性の良好な素材を用いてもよい。   The casing 1 is preferably made of aluminum that has excellent thermal conductivity and can be easily produced by die casting and machining. However, it can also be comprised with metals other than aluminum, and the material of favorable heat dissipation other than a metal may be used.

筐体１には、電子部品３の熱を、プリント基板２を介して受取るための受熱面１ａを設ける。受熱面１ａには、熱伝導性グリース９（または、熱伝導接着剤や熱伝導シートでもよい）を配し、プリント基板２に密着させ、プリント基板２から放熱フィン１ｂを有する筐体１への熱伝達経路を形成する。本構成による放熱経路を以降では第一の放熱経路と呼ぶ。第一の放熱経路は、従来の一般的な放熱構造である。   The housing 1 is provided with a heat receiving surface 1 a for receiving the heat of the electronic component 3 through the printed circuit board 2. A heat conductive grease 9 (or a heat conductive adhesive or a heat conductive sheet) may be disposed on the heat receiving surface 1a, and the heat receiving surface 1a may be brought into close contact with the printed circuit board 2, and the printed circuit board 2 may be connected to the housing 1 having the radiation fins 1b. Form a heat transfer path. Hereinafter, the heat dissipation path according to this configuration is referred to as a first heat dissipation path. The first heat dissipation path is a conventional general heat dissipation structure.

次に、本発明による放熱経路である第２の放熱経路を説明する。第２の放熱経路は、コネクタ４近傍の周囲に設けられた熱伝達手段（ボス６），プリント基板２，コネクタ４（コネクタピン４ａを含む）、及び、ハーネス５からなる。ボス６は金属にて構成された金属部材であることが望ましいが、金属以外の放熱性の良好な物質を用いることもできる。   Next, a second heat dissipation path that is a heat dissipation path according to the present invention will be described. The second heat dissipation path includes heat transfer means (boss 6), printed circuit board 2, connector 4 (including connector pin 4 a), and harness 5 provided around the connector 4. The boss 6 is preferably a metal member made of metal, but a material having good heat dissipation other than metal can also be used.

第２の放熱経路では、熱は、筐体１からボス６を経由してプリント基板２に伝えられ、プリント基板２からコネクタピン４ａを経由してハーネス５に伝えられる。よって、電子部品３の熱は電子制御装置１００の外に導かれ、筐体１から外気への放熱経路に加えて、新たな放熱経路を形成することができるため、電子制御装置の放熱性を向上できる。   In the second heat radiation path, heat is transmitted from the housing 1 to the printed circuit board 2 via the boss 6 and from the printed circuit board 2 to the harness 5 via the connector pin 4a. Therefore, the heat of the electronic component 3 is guided to the outside of the electronic control device 100, and a new heat dissipation path can be formed in addition to the heat dissipation path from the housing 1 to the outside air. It can be improved.

このように、筐体１の熱をプリント基板２に導くためのボス６等の熱伝達手段をコネクタピン４ａの周囲に設けることにより、筐体１からプリント基板２への熱伝達経路が形成される。コネクタピン４ａの周囲におけるプリント基板２の温度は、ハーネス５の伝熱，放熱効果によって、電子部品３周囲におけるプリント基板２の温度や筐体１の温度に比べて低温である。このため、熱は筐体１からプリント基板２に向けて伝達される。筐体１の熱がプリント基板２へ伝えられると、筐体１の温度が下がるため、電子部品３の熱が筐体１へ向けて伝えられる。従って、電子部品３の温度を下げることができる。   Thus, by providing heat transfer means such as the boss 6 for guiding the heat of the housing 1 to the printed circuit board 2 around the connector pins 4a, a heat transfer path from the housing 1 to the printed circuit board 2 is formed. The The temperature of the printed circuit board 2 around the connector pins 4 a is lower than the temperature of the printed circuit board 2 and the temperature of the housing 1 around the electronic component 3 due to the heat transfer and heat dissipation effect of the harness 5. For this reason, heat is transmitted from the housing 1 toward the printed circuit board 2. When the heat of the housing 1 is transmitted to the printed circuit board 2, the temperature of the housing 1 is lowered, so that the heat of the electronic component 3 is transmitted toward the housing 1. Therefore, the temperature of the electronic component 3 can be lowered.

また、コネクタピン４ａの周囲には、プリント基板２の配線パターンが集中することや、入出力のためのコンデンサ等が実装されため、コネクタピン４ａの周囲に電子部品３が実装される例は少ない。このため、熱伝達手段であるボス６を電子部品３から離して設けるには、コネクタピン４ａ近傍の周囲に設けることがより好ましい。   Further, since the wiring pattern of the printed circuit board 2 is concentrated around the connector pins 4a and capacitors for input / output are mounted, there are few examples of mounting the electronic component 3 around the connector pins 4a. . For this reason, in order to provide the boss | hub 6 which is a heat transfer means away from the electronic component 3, providing in the circumference | surroundings of the connector pin 4a vicinity is more preferable.

ボス６には、受熱面１ａと同様に、熱伝導性グリース９を配し、プリント基板２と密着させている。ボス６は、予め筐体１の一部として筐体１と同時にダイキャスト成形しておく方法が生産性に優れるが、筐体１のダイキャスト成形後に、接着，ネジ止め，圧入などの方法で取り付ける方法でもよい。   Like the heat receiving surface 1 a, the boss 6 is provided with a heat conductive grease 9 and is in close contact with the printed circuit board 2. The boss 6 is die casted simultaneously with the housing 1 as a part of the housing 1, and the productivity is excellent. However, after the die casting of the housing 1, the boss 6 is bonded, screwed, or press-fitted. A method of attaching may be used.

本実施例では、コネクタピン４ａは２×５の長方形に配列されており、ボス６はこれらコネクタピンの全周を囲むように長方形の閉じた壁を形成している。ボス６の形状は、四角形に限定されない。後述するように、種々の理由に応じて、円形，楕円形，コの字形，Ｌ字形等のものを採用することもできる。   In this embodiment, the connector pins 4a are arranged in a 2 × 5 rectangle, and the boss 6 forms a rectangular closed wall so as to surround the entire circumference of these connector pins. The shape of the boss 6 is not limited to a quadrangle. As will be described later, a circular shape, an elliptical shape, a U-shaped shape, an L-shaped shape, or the like can be adopted depending on various reasons.

図２（ａ）〜図２（ｄ）は種々のボス形状を適用した場合の筐体を示す平面図である。   FIG. 2A to FIG. 2D are plan views showing the housing when various boss shapes are applied.

図２（ａ）は四角形のボス６の場合である。コネクタピン４ａの列の全周を囲む閉形状のボス６を設けた本図の構造を採用する場合、筐体１とプリント基板２の接触面積を最大とすることができ、筐体１の熱をより多くプリント基板２へ伝えることができる。結果として、筐体１及び電子部品３の温度を効果的かつ効率的に下げることが可能である。放熱性を重視する場合には、図２（ａ）に示す構造を採用することがより望ましい。   FIG. 2A shows the case of a rectangular boss 6. When the structure of this figure provided with the closed boss 6 surrounding the entire circumference of the row of connector pins 4a is adopted, the contact area between the housing 1 and the printed circuit board 2 can be maximized, and the heat of the housing 1 can be maximized. Can be transmitted to the printed circuit board 2 more. As a result, it is possible to effectively and efficiently lower the temperature of the housing 1 and the electronic component 3. When emphasizing heat dissipation, it is more desirable to adopt the structure shown in FIG.

図２（ｂ）はコの字形のボス７を適用する場合を、図２（ｃ）はＬ字形のボス８を適用する場合の平面図である。図２（ｂ），図２（ｃ）の形状では、図２（ａ）に示す実施例に比べて、筐体１とプリント基板２の接触面積は少ないが、逆に、電子部品の実装面積を増やすことが可能である。回路構成の制約から、部品実装位置を容易に変更できないような場合、本図に示す構造を採用することがより望ましい。また、放熱性よりも筐体１の軽量化が求められる場合にも好んで用いられる。本図の構造は、回路構成を優先しつつ、同時に放熱性をも向上させる場合に適している。   FIG. 2B is a plan view when a U-shaped boss 7 is applied, and FIG. 2C is a plan view when an L-shaped boss 8 is applied. In the shapes of FIGS. 2B and 2C, the contact area between the housing 1 and the printed circuit board 2 is smaller than that of the embodiment shown in FIG. Can be increased. When the component mounting position cannot be easily changed due to the restriction of the circuit configuration, it is more desirable to adopt the structure shown in this figure. Further, it is also preferably used when the casing 1 is required to be lighter than heat dissipation. The structure of this figure is suitable for the case where heat dissipation is also improved while giving priority to the circuit configuration.

また、本図のように、コの字形やＬ字形のボスを採用すれば、コネクタピン４ａの外観を確認することが可能であり、組立て途中や組立て完成後に検査が必要な場合に有効である。また、電子部品類をコネクタピン４ａの直近に実装したく、ボス６の形状が四角形だと干渉するような場合にも有効である。   Further, if a U-shaped or L-shaped boss is employed as shown in this figure, it is possible to confirm the appearance of the connector pin 4a, which is effective when inspection is required during or after assembly. . It is also effective when it is desired to mount electronic components in the immediate vicinity of the connector pin 4a, or when the boss 6 has a quadrangular shape and interferes.

図２（ｄ）は２個のコの字形ボス７を適用する場合の平面図である。本図の構造によれば、図２（ａ）に示す全周を囲む構造に比べて軽量化が可能であり、また、コネクタピン４ａの検査やコネクタピン４ａの周囲に電子部品３を配置する必要がある場合に有効である。   FIG. 2D is a plan view in the case of applying two U-shaped bosses 7. According to the structure of this figure, the weight can be reduced as compared with the structure surrounding the entire circumference shown in FIG. 2A, and the electronic component 3 is arranged around the connector pin 4a and the connector pin 4a. It is effective when necessary.

また、図２（ｂ）や図２（ｃ）に示す構造よりも、筐体１とプリント基板２の接触面積を増やすことができる。このため、電子部品の実装位置については融通できるが、同時に放熱性が求められる場合により適している。放熱性，電子部品の実装自由度，筐体１の軽量化をバランスよく組み合わせている構造である点で、より望ましい。   Moreover, the contact area of the housing | casing 1 and the printed circuit board 2 can be increased rather than the structure shown in FIG.2 (b) and FIG.2 (c). For this reason, the mounting position of the electronic component can be accommodated, but at the same time, it is more suitable when heat dissipation is required. This is more desirable because it has a well-balanced combination of heat dissipation, freedom of mounting electronic components, and weight reduction of the housing 1.

図２（ｅ）は１個のボス１１をコネクタピン４ａを挟んで、電子部品３とは反対側に配置する例である。本図の構造によれば、筐体１とプリント基板２の接触面積はある程度限られるが、筐体を軽量化することができる。筐体１の軽量化を優先しながら、放熱性を確保する場合に好んで用いられる。   FIG. 2E shows an example in which one boss 11 is arranged on the side opposite to the electronic component 3 with the connector pin 4a interposed therebetween. According to the structure of this figure, although the contact area of the housing | casing 1 and the printed circuit board 2 is limited to some extent, a housing | casing can be reduced in weight. It is preferably used for ensuring heat dissipation while giving priority to weight reduction of the housing 1.

図２（ｆ）は三角形のボス１２を、コネクタピン４ａを挟んで、電子部品３とは反対側に配置する例である。本実施例では、筐体の軽量化と電子部品の実装密度の向上を優先する場合に適している。また、筐体１からプリント基板２へ熱を伝えるためのボス７，８、または１１の配置可能な面積が少ない場合には、図２（ｅ）に示すボス１１のように、電子部品から離して設けることで、筐体１からプリント基板２への熱伝達をより促進できる。   FIG. 2F shows an example in which the triangular boss 12 is arranged on the side opposite to the electronic component 3 with the connector pin 4a interposed therebetween. This embodiment is suitable when priority is given to weight reduction of the casing and improvement of the mounting density of electronic components. Further, when the area where the bosses 7, 8, or 11 for transferring heat from the housing 1 to the printed circuit board 2 are small, the bosses 11 shown in FIG. The heat transfer from the housing 1 to the printed circuit board 2 can be further promoted.

図３に第２の実施例を示す。   FIG. 3 shows a second embodiment.

図３は筐体１の平面図であり、ボス７の代わりに、銅合金，アルミ合金、または真鍮等の金属ピン１０の一端を筐体１へ圧入している。複数の金属ピン１０の他端は、プリント基板２に設けるスルーホールにはんだまたは圧入等の方法によって接続され、筐体１からプリント基板２の間に熱伝達経路を形成する。これらの金属ピン１０には、ケースアース等の電気的導通経路としての役割を与えることもできる。また、これらの金属ピン１０の周囲にさらにボス７を設けることもできる。   FIG. 3 is a plan view of the housing 1, and instead of the boss 7, one end of a metal pin 10 such as a copper alloy, an aluminum alloy, or brass is press-fitted into the housing 1. The other ends of the plurality of metal pins 10 are connected to through holes provided in the printed circuit board 2 by a method such as soldering or press fitting, and a heat transfer path is formed between the housing 1 and the printed circuit board 2. These metal pins 10 can also serve as an electrical conduction path such as case ground. Further, a boss 7 can be further provided around these metal pins 10.

図４に第３の実施例を示す。   FIG. 4 shows a third embodiment.

本実施例の電子制御装置２００は、ボス６によって閉じた壁の内部において、熱伝導グリース９が充填されている。熱伝導グリース９は、空気に比べて熱伝導率が大きい。このため、筐体１とプリント基板２の間の熱伝達を向上できる。また、筐体１から熱伝導グリース９に伝えられた熱は、プリント基板２を経由することなくコネクタピン４ａに伝えることが可能である。   In the electronic control device 200 of the present embodiment, the heat conductive grease 9 is filled inside the wall closed by the boss 6. The thermal conductive grease 9 has a higher thermal conductivity than air. For this reason, the heat transfer between the housing | casing 1 and the printed circuit board 2 can be improved. Further, the heat transmitted from the housing 1 to the thermal conductive grease 9 can be transmitted to the connector pins 4a without passing through the printed circuit board 2.

本実施例では、熱伝導グリース９の代わりに、ゲル，接着剤、またはポッティング樹脂等の絶縁物質を使用することもできる。高温で使用される車載用途においては、熱硬化性材料のほうが、熱による劣化や変質の影響を受けにくいため、より適して用いられる。   In this embodiment, an insulating material such as a gel, an adhesive, or a potting resin can be used instead of the heat conductive grease 9. In in-vehicle applications that are used at high temperatures, thermosetting materials are more suitable because they are less susceptible to deterioration and alteration by heat.

本実施例によれば、空気よりも熱伝達のよい熱伝導グリース等の絶縁物質が壁内に充填されているため、筐体とプリント基板との間の熱伝達の効率をさらに向上させることができる。また、プリント基板を介さずに、コネクタピンへ熱を直接伝えることができるため、ハーネスの熱伝達効果をさらに向上させることが可能である。   According to the present embodiment, since the wall is filled with an insulating material such as heat conductive grease that has a heat transfer better than air, the efficiency of heat transfer between the housing and the printed circuit board can be further improved. it can. Moreover, since heat can be directly transmitted to the connector pins without going through the printed circuit board, the heat transfer effect of the harness can be further improved.

以上、本発明の具体的な実施例について説明したが、本発明は上記実施例に限定されるものではなく、本発明の技術思想を逸脱しない範囲において種々の変形が可能である。   As mentioned above, although the specific Example of this invention was described, this invention is not limited to the said Example, A various deformation | transformation is possible in the range which does not deviate from the technical idea of this invention.

第１の実施例の断面図である。It is sectional drawing of a 1st Example. 第１の実施例を筐体内側から見た平面図（１）である。It is the top view (1) which looked at the 1st example from the case inside. 第１の実施例を筐体内側から見た平面図（２）である。It is the top view (2) which looked at the 1st example from the case inside. 第１の実施例を筐体内側から見た平面図（３）である。It is the top view (3) which looked at the 1st example from the case inside. 第１の実施例を筐体内側から見た平面図（４）である。It is the top view (4) which looked at the 1st example from the case inside. 第１の実施例を筐体内側から見た平面図（５）である。It is the top view (5) which looked at the 1st example from the case inside. 第１の実施例を筐体内側から見た平面図（６）である。It is the top view (6) which looked at the 1st example from the case inside. 第２の実施例を筐体内側から見た平面図である。It is the top view which looked at the 2nd example from the case inside. 第３の実施例の断面図である。It is sectional drawing of a 3rd Example.

符号の説明Explanation of symbols

１ 筐体
１ａ 受熱面
１ｂ 放熱フィン
２ プリント基板
３ 電子部品
４ コネクタ
４ａ コネクタピン
５ ハーネス
６，７，８，１１，１２ ボス
９ 熱伝導グリース
１０ 金属ピン DESCRIPTION OF SYMBOLS 1 Case 1a Heat receiving surface 1b Radiation fin 2 Printed circuit board 3 Electronic component 4 Connector 4a Connector pin 5 Harness 6, 7, 8, 11, 12 Boss 9 Thermal conduction grease 10 Metal pin

Claims (7)

金属からなる筐体と、
前記筐体に収納され、回路が形成された基板と、
前記基板の上に搭載され、前記回路に電気的接続された電子部品と、
前記筐体に形成されたコネクタと、
前記回路に電気的接続するように前記基板にはんだ付けされ、前記コネクタに設けられた複数のコネクタピンと、
前記筐体から前記基板に向けて伝熱させるため、前記複数のコネクタピンの周囲に、前記筐体より前記基板に向けて突き出すように設けられた熱伝達手段と、を有することを特徴とする電子制御装置。 A metal casing,
A substrate housed in the housing and having a circuit formed thereon;
An electronic component mounted on the substrate and electrically connected to the circuit;
A connector formed in the housing;
A plurality of connector pins soldered to the substrate for electrical connection to the circuit and provided on the connector;
The order from the housing transferring heat toward the substrate, around the plurality of connector pins, and having a heat transfer means provided to protrude toward the substrate from the housing Electronic control device. 請求項１記載の電子制御装置において、
前記熱伝達手段は、前記複数のコネクタピンの周囲を取り囲むように設けられ、前記筐体と前記基板との間を固定する金属部材であることを特徴とする電子制御装置。 The electronic control device according to claim 1,
The electronic control device according to claim 1, wherein the heat transfer means is a metal member that is provided so as to surround the plurality of connector pins and fixes between the casing and the substrate. 請求項２記載の電子制御装置において、
前記金属部材は、前記複数のコネクタピンの周囲のうち少なくとも一部において欠けていることを特徴とする電子制御装置。 The electronic control device according to claim 2,
The electronic control device according to claim 1, wherein the metal member is missing in at least a part of the periphery of the plurality of connector pins. 請求項２記載の電子制御装置において、
前記金属部材は、複数の金属ピンであることを特徴とする電子制御装置。 The electronic control device according to claim 2,
The electronic control device, wherein the metal member is a plurality of metal pins. 請求項２記載の電子制御装置において、
前記金属部材は、前記複数のコネクタピンの周囲全体を取り囲んでおり、
前記金属部材により取り囲まれた内部は、空気より大きい熱伝導率を有する絶縁物質にて充填されていることを特徴とする電子制御装置。 The electronic control device according to claim 2,
The metal member surrounds the entire periphery of the plurality of connector pins;
An electronic control device characterized in that the interior surrounded by the metal member is filled with an insulating material having a thermal conductivity higher than that of air. 請求項５記載の電子制御装置において、
前記絶縁物質は、熱伝導グリースであることを特徴とする電子制御装置。 The electronic control device according to claim 5.
The electronic control device according to claim 1, wherein the insulating material is a thermal conductive grease. 請求項１乃至６のいずれか一に記載の電子制御装置において、
前記筐体は、前記基板の上に搭載された前記電子部品が発する熱を放出するための受熱部と、該電子部品が発する熱を外部に放出するための放熱フィンとを有し、
前記受熱部は、前記電子部品の下部において、前記基板に固定されていることを特徴とする電子制御装置。 The electronic control device according to any one of claims 1 to 6,
The housing includes a heat receiving portion for releasing heat generated by the electronic component mounted on the substrate, and a heat dissipating fin for releasing heat generated by the electronic component to the outside.
The electronic control device, wherein the heat receiving portion is fixed to the substrate at a lower portion of the electronic component.
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