JP7466850B2 - On-board chargers and inverters - Google Patents
On-board chargers and inverters Download PDFInfo
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- JP7466850B2 JP7466850B2 JP2023050349A JP2023050349A JP7466850B2 JP 7466850 B2 JP7466850 B2 JP 7466850B2 JP 2023050349 A JP2023050349 A JP 2023050349A JP 2023050349 A JP2023050349 A JP 2023050349A JP 7466850 B2 JP7466850 B2 JP 7466850B2
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- 230000017525 heat dissipation Effects 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 17
- 238000004382 potting Methods 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 39
- 229910052782 aluminium Inorganic materials 0.000 description 39
- 238000000034 method Methods 0.000 description 7
- 239000000945 filler Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
本発明は、車載充電器およびインバータに関する。 The present invention relates to an on-board charger and an inverter.
従来、放熱部材で形成された略直方体の筐体内に基板や電子部品を格納し、電子部品から発生する熱を、筐体を介して放熱することが知られている。このような略直方体の筐体の構造の製造方法として、上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法と、下面（底面）と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法の２通りが知られている。 It is known that a circuit board or electronic components are stored in a roughly rectangular parallelepiped housing formed of a heat dissipation member, and heat generated by the electronic components is dissipated through the housing. There are two known manufacturing methods for the structure of such a roughly rectangular parallelepiped housing: a method in which a housing whose top and sides are integrally molded into a box shape and whose bottom is open is placed over the housing from above, and a method in which a housing whose bottom (bottom) and sides are integrally molded into a box shape and whose top is open is placed over the housing with a lid member (top).
上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法を用いる場合、下面に基板や電子部品を取り付ける際には側面が存在しないため、側方から電子部品をネジ留めすることが可能であるが、一方、筐体内に格納した電子部品を筐体外の電子部品と電気的に接続するための端子（コネクタ）の配置に制約が生じる。 When using a method in which a housing with an open bottom and top that is integrally molded into a box shape is placed over the top, there are no sides when mounting a board or electronic component on the bottom, so it is possible to screw the electronic component in place from the side. However, this places restrictions on the placement of the terminals (connectors) that electrically connect the electronic components stored inside the housing to electronic components outside the housing.
一般的に、コネクタを側面に設ける場合には、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法を用いることが好ましい。 In general, when installing a connector on the side, it is preferable to use a method in which the bottom and sides are integrally molded into a box shape and the housing has an open top and is covered with a lid member (top).
しかしながら、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法においては、下面と側面が箱型に一体成型されているため、側方から電子部品をネジ留めすることが不可能であり、開口された上面からネジ留めを行う必要がある。 However, in the method of covering a housing whose bottom and sides are integrally molded into a box shape and whose top is open with a lid member (top), because the bottom and sides are integrally molded into a box shape, it is not possible to screw the electronic components in from the side, and it is necessary to screw them in from the open top.
開口された上面から電子部品を固定するためのネジ留めを行う方法として、発熱電子部品のリード線を折り曲げることで発熱電子部品の放熱面を底面に直接接触させて配置し、例えば、特許文献１に開示されている弾性部材が放熱面の反対側の面を押さえつけるように弾性部材を上方からネジ留めすることが考えられる。 One possible method for screwing the electronic component into place from the open top surface is to bend the lead wires of the heat-generating electronic component so that the heat dissipation surface of the heat-generating electronic component is placed in direct contact with the bottom surface, and then screw an elastic member, as disclosed in Patent Document 1, from above so that the elastic member presses down on the surface opposite the heat dissipation surface.
しかしながら、上述した放熱機構の底面に発熱電子部品を配置する方法では、放熱効果を確保するために、放熱機構の底面において発熱電子部品の放熱面が接触する部分の面積および弾性部材が設置される部分の面積が必要となり、底面積の大型化、ひいては装置全体が大型化してしまうおそれがある。 However, in the above-mentioned method of placing heat-generating electronic components on the bottom surface of the heat dissipation mechanism, in order to ensure the heat dissipation effect, the area of the bottom surface of the heat dissipation mechanism where the heat dissipation surface of the heat-generating electronic components comes into contact and the area of the part where the elastic member is placed are required, which may result in an increase in the bottom surface area and therefore an increase in the size of the entire device.
本発明の目的は、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる車載充電器およびインバータを提供することである。 The object of the present invention is to provide an on-board charger and inverter that can dissipate heat from heat-generating electronic components while preventing the charger from becoming too large when using a heat dissipation mechanism that is integrally molded into a box shape with an opening on only one side.
本発明の一態様に係る車載充電器は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品が配置される伝熱体と、前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、前記リアクトル部品は、放熱部品と熱的に接続され、前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されていることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 The on-board charger according to one aspect of the present invention includes a circuit board, a heat-generating electronic component that generates heat by itself when current is applied and has a lead wire connected to the circuit board, and a heat transfer body in which the heat-generating electronic component is disposed. The heat transfer body has a housing portion with a space for housing a reactor component, the reactor component is thermally connected to a heat dissipation component, and a potting material having heat dissipation properties is filled between the reactor component and the housing portion, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body has a second surface and a third surface opposite to the second surface, the heat transfer body is thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body is thermally connected to the reactor component via the potting material via the third surface.
本発明の一態様に係るインバータは、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品が配置される伝熱体と、前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、前記リアクトル部品は、放熱部品と熱的に接続され、前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 An inverter according to one aspect of the present invention includes a circuit board, a heat-generating electronic component that generates heat by itself when current is applied and has a lead wire connected to the circuit board, a heat transfer body in which the heat-generating electronic component is disposed, the heat transfer body having a housing portion with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material having heat dissipation properties is filled between the reactor component and the housing portion, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface opposite the second surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the potting material via the third surface.
本発明によれば、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる。 According to the present invention, when a heat dissipation mechanism that is integrally molded into a box shape and has an opening on only one side is used, it is possible to dissipate heat from heat-generating electronic components while preventing the device from becoming too large.
（実施の形態）
以下、本発明の実施の形態について、図面を参照して説明する。
(Embodiment)
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
まず、図１～４を用いて、本実施の形態に係る発熱電子部品の放熱構造１の構成例について説明する。図１は、発熱電子部品の放熱構造１の一例を示す斜視図である。図２は、発熱電子部品の放熱構造１の一例を示す正面図である。図３は、発熱電子部品の放熱構造１の一例を示す側面図である。図４は、発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図１、図２では、ヒートシンク２の前面部分の図示を省略しており、図３では、ヒートシンク２の側面部分の図示を省略している。また、図４では、図１～図３に示す回路基板９の図示を省略している。 First, an example of the configuration of a heat dissipation structure 1 for a heat-generating electronic component according to the present embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component. Figure 2 is a front view showing an example of a heat dissipation structure 1 for a heat-generating electronic component. Figure 3 is a side view showing an example of a heat dissipation structure 1 for a heat-generating electronic component. Figure 4 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component. Note that the front portion of the heat sink 2 is omitted from illustration in Figures 1 and 2, and the side portion of the heat sink 2 is omitted from illustration in Figure 3. Also, the circuit board 9 shown in Figures 1 to 3 is omitted from illustration in Figure 4.
発熱電子部品の放熱構造１は、例えば、車両に搭載される充電器やインバータ等に用いられる。発熱電子部品の放熱構造１は、ヒートシンク２、アルミブロック３、電子部品５ａ、５ｂ、回路基板９を備える。 The heat dissipation structure 1 for heat-generating electronic components is used, for example, in chargers and inverters mounted on vehicles. The heat dissipation structure 1 for heat-generating electronic components includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.
ヒートシンク２（放熱機構の一例）は、箱型に一体成型され、一面のみに開口部が設けられている。Ｆ１は、開口面（第２の面の一例）であり、Ｆ２は、開口面Ｆ１に対向する底面（第１の面の一例）である。 The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded into a box shape, with an opening on only one side. F1 is the opening side (an example of a second side), and F2 is the bottom side (an example of a first side) that faces the opening side F1.
ヒートシンク２の底面Ｆ２の四隅には、底面Ｆ２に対する垂直方向Ｄ（以下、単に「垂直方向」という）に沿って、支柱２ａ、２ｂ、２ｃ、２ｄが設けられている。支柱２ａ～２ｄには、それぞれ、ネジ穴（図示略）が形成されており、後述する回路基板９がネジ留めされる。 Support posts 2a, 2b, 2c, and 2d are provided at the four corners of the bottom surface F2 of the heat sink 2 along a vertical direction D (hereinafter simply referred to as the "vertical direction") relative to the bottom surface F2. Each of the support posts 2a to 2d has a screw hole (not shown) formed therein, into which a circuit board 9 (described later) is screwed.
アルミブロック３（伝熱体の一例）は、アルミで形成された略直方体の部材である。アルミブロック３は、その長手方向が垂直方向Ｄに沿うようにヒートシンク２の内部に配置されている。 The aluminum block 3 (an example of a heat transfer body) is a roughly rectangular parallelepiped member made of aluminum. The aluminum block 3 is placed inside the heat sink 2 so that its longitudinal direction is aligned with the vertical direction D.
アルミブロック３は、その下部に略直方体の締結部３ａを有している。この締結部３ａは、ネジ４ａ、４ｂ（固定部材の一例）により底面Ｆ２にネジ留めされる。これにより、アルミブロック３は、底面Ｆ２に接触して固定される。 The aluminum block 3 has a generally rectangular parallelepiped fastening portion 3a at its bottom. This fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). This causes the aluminum block 3 to come into contact with and be fixed to the bottom surface F2.
電子部品５ａ、５ｂ（発熱電子部品の一例）は、通電によって自己発熱する電子部品であり、例えば、ディスクリート部品、ＦＥＴ（Field Effect Transistor）等である。電子部品５ａ、５ｂは、それぞれ、リード線６ａ、６ｂを有する。 The electronic components 5a and 5b (examples of heat-generating electronic components) are electronic components that generate heat by themselves when electricity is applied, such as discrete components or FETs (field effect transistors). The electronic components 5a and 5b have lead wires 6a and 6b, respectively.
電子部品５ａ、５ｂは、それぞれの放熱面がアルミブロック３の側面に接触するように、アルミブロック３に取り付けられる。例えば、電子部品５ａ、５ｂは、それぞれ、バネ７ａ、７ｂ（保持部材の一例）により、放熱面に対向する面から押さえ付けられ、アルミブロック３の側面に固着して保持される。バネ７ａ、７ｂは、それぞれ、ネジ８ａ、８ｂによりアルミブロック３の側面にネジ留めされる。 The electronic components 5a and 5b are attached to the aluminum block 3 so that their heat dissipation surfaces are in contact with the side of the aluminum block 3. For example, the electronic components 5a and 5b are pressed down from the surfaces facing the heat dissipation surfaces by springs 7a and 7b (an example of a holding member), respectively, and are fixed and held on the side of the aluminum block 3. The springs 7a and 7b are screwed to the side of the aluminum block 3 by screws 8a and 8b, respectively.
アルミブロック３に固着した電子部品５ａ、５ｂは、垂直方向Ｄに沿って直立した状態となる。また、アルミブロック３に固着した電子部品５ａ、５ｂは、ヒートシンク２に接触しない。 The electronic components 5a and 5b attached to the aluminum block 3 stand upright along the vertical direction D. In addition, the electronic components 5a and 5b attached to the aluminum block 3 do not come into contact with the heat sink 2.
以上のようにアルミブロック３に固着した電子部品５ａ、５ｂから発生する熱は、アルミブロック３を介して、ヒートシンク２へ伝熱される。これにより、電子部品５ａ、５ｂの放熱が実現される。 The heat generated by the electronic components 5a and 5b fixed to the aluminum block 3 as described above is transferred to the heat sink 2 via the aluminum block 3. This allows the electronic components 5a and 5b to dissipate heat.
なお、図１～図４では、例として、アルミブロック３に固着する電子部品を２つとしたが、１つであってもよいし、３つ以上であってもよい。また、複数の電子部品は、アルミブロック３の一面のみならず複数の面に固着されてもよい。 In the example shown in Figures 1 to 4, two electronic components are fixed to the aluminum block 3, but the number may be one, or three or more. In addition, multiple electronic components may be fixed to multiple surfaces of the aluminum block 3, not just one surface.
回路基板９は、パターンが形成されたり、所定の半導体素子（図示略）が実装されたりするプリント基板である。回路基板９は、上述した支柱２ａ～２ｄに載置される。そして、回路基板９は、ネジ１０ａ、１０ｂ、１０ｃ、１０ｄにより柱２ａ～２ｄにネジ留めされる。これにより、回路基板９は、支柱２ａ～２ｄに固定される。 The circuit board 9 is a printed circuit board on which a pattern is formed and on which a specified semiconductor element (not shown) is mounted. The circuit board 9 is placed on the above-mentioned supports 2a to 2d. The circuit board 9 is then screwed to the supports 2a to 2d by screws 10a, 10b, 10c, and 10d. In this way, the circuit board 9 is fixed to the supports 2a to 2d.
また、回路基板９は、例えば半田付けにより、電子部品５ａのリード線６ａおよび電子部品５ｂのリード線６ｂと接続する。 The circuit board 9 is also connected to the lead wires 6a of the electronic component 5a and the lead wires 6b of the electronic component 5b, for example by soldering.
アルミブロック３および回路基板９は、垂直方向Ｄに沿って、底面Ｆ２からアルミブロック３、回路基板９の順に配置される。 The aluminum block 3 and circuit board 9 are arranged in the vertical direction D, starting from the bottom surface F2, in that order: aluminum block 3, circuit board 9.
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される。これにより、回路基板９における固定点が多くなり、リード線６ａ、６ｂの折れを防止できる。特に支柱２ａ～２ｄが高く、振動が多く生じる場合に効果を奏する。 The aluminum block 3 and the circuit board 9 are also bonded and fixed to each other with bonds 11a and 11b (an example of an adhesive material). This increases the number of fixing points on the circuit board 9, preventing the lead wires 6a and 6b from breaking. This is particularly effective when the supports 2a to 2d are tall and there is a lot of vibration.
また、ボンド１１ａ、１１ｂは、絶縁性または放熱性の少なくとも一方を有することが好ましい。ボンド１１ａ、１１ｂが絶縁性を有する場合、回路基板９においてボンド１１ａ、１１ｂに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。また、ボンド１１ａ、１１ｂが放熱性を有する場合、回路基板９で発生した熱を、ボンド１１ａ、１１ｂを介してアルミブロック３へ伝熱できる。 It is also preferable that the bonds 11a and 11b have at least one of insulating properties and heat dissipation properties. If the bonds 11a and 11b have insulating properties, patterns can be formed or semiconductor elements can be mounted on the circuit board 9 at the locations corresponding to the bonds 11a and 11b. If the bonds 11a and 11b have heat dissipation properties, heat generated on the circuit board 9 can be transferred to the aluminum block 3 via the bonds 11a and 11b.
なお、図１～図４では、図示を省略しているが、回路基板９の上方に、開口面Ｆ１を閉塞するカバーが設けられてもよい。 Although not shown in Figures 1 to 4, a cover that closes the opening surface F1 may be provided above the circuit board 9.
以上説明したように、本実施の形態の発熱電子部品の放熱構造１は、ヒートシンク２に接触して配置されたアルミブロック３に対して電子部品５ａ、５ｂの放熱面を接触させて配置するため、電子部品５ａ、５ｂの放熱面をヒートシンク２の底面Ｆ２に接触させて配置する場合に比べて、大型化を抑制しつつ、電子部品の放熱に対応することができる。 As described above, the heat dissipation structure 1 for heat-generating electronic components in this embodiment is arranged so that the heat dissipation surfaces of the electronic components 5a, 5b are in contact with the aluminum block 3 that is arranged in contact with the heat sink 2, so that it is possible to accommodate heat dissipation from the electronic components while suppressing enlargement compared to a case in which the heat dissipation surfaces of the electronic components 5a, 5b are arranged in contact with the bottom surface F2 of the heat sink 2.
以上、発熱電子部品の放熱構造１の構成例について説明した。 The above describes an example of the configuration of the heat dissipation structure 1 for heat-generating electronic components.
次に、発熱電子部品の放熱構造１の製造方法について、図１～図４を用いて説明する。 Next, the manufacturing method of the heat dissipation structure 1 for heat-generating electronic components will be described with reference to Figures 1 to 4.
まず、バネ７ａ、７ｂおよびネジ８ａ、８ｂを用いて、電子部品５ａ、５ｂをアルミブロック３に固定して接着させる。このとき、電子部品５ａ、５ｂの放熱面をアルミブロック３に接触させる。なお、電子部品５ａ、５ｂが、絶縁が必要なタイプの場合であれば、電子部品５ａ、５ｂの放熱面とアルミブロック３の間に放熱絶縁シート（図示略）を設けることが好ましい。 First, the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using springs 7a and 7b and screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are in contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulation sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.
次に、電子部品５ａ、５ｂが固着したアルミブロック３を、ヒートシンク２の開口面Ｆ１からヒートシンク２の内部に収容し、アルミブロック３を底面Ｆ２に配置する。そして、ネジ４ａ、４ｂを用いて締結部３ａを底面Ｆ２にネジ留めする。 Next, the aluminum block 3 with the electronic components 5a and 5b attached is placed inside the heat sink 2 through the opening face F1 of the heat sink 2, and the aluminum block 3 is placed on the bottom face F2. Then, the fastening portion 3a is screwed to the bottom face F2 using the screws 4a and 4b.
次に、回路基板９を、ヒートシンク２の開口面からヒートシンク２の内部に収容し、支柱２ａ～２ｄに配置する。このとき、リード線６ａ、６ｂを回路基板９に対して半田付けする。そして、ネジ１０ａ～１０ｄを用いて回路基板９を支柱２ａ～２ｄにネジ留めする。 Next, the circuit board 9 is placed inside the heat sink 2 through the opening of the heat sink 2 and placed on the supports 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is fastened to the supports 2a to 2d using the screws 10a to 10d.
以上の製造方法により、図１～図４に示した発熱電子部品の放熱構造１が製造される。 The above manufacturing method produces the heat dissipation structure 1 for a heat-generating electronic component shown in Figures 1 to 4.
なお、回路基板９のネジ留めの後で、回路基板９の上方に、開口面Ｆ１を閉塞するカバー（図示略）を設けてもよい。 After the circuit board 9 is screwed in place, a cover (not shown) may be provided above the circuit board 9 to close the opening F1.
以上、本発明の実施の形態について説明したが、本発明は上記実施の形態に限定されず、種々の変形が可能である。以下、変形例について説明する。 The above describes an embodiment of the present invention, but the present invention is not limited to the above embodiment and various modifications are possible. Modifications are described below.
（変形例１）
本変形例に係る発熱電子部品の放熱構造１について、図５を用いて説明する。図５は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図５において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図５では、図１～図３に示した回路基板９の図示を省略している。
(Variation 1)
The heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 5. Fig. 5 is a top perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component according to this modified example. Note that in Fig. 5, the same components as those in Figs. 1 to 4 are given the same reference numerals and their description will be omitted. Also, in Fig. 5, the circuit board 9 shown in Figs. 1 to 3 is not shown.
本変形例では、図５に示すように、ヒートシンク２において、アルミブロック３０および電子部品３２を備える点が図１～図４と異なる。 As shown in FIG. 5, this modified example differs from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32.
アルミブロック３０は、その下部に略直方体の締結部３０ａを有している。なお、図５では、支柱２ａと支柱２ｂとの間にある締結部３０ａのみを図示しているが、これと同様に支柱２ｄと支柱２ｃの間にも締結部３０ａが存在する。 The aluminum block 30 has a generally rectangular parallelepiped fastening portion 30a at its bottom. Note that in FIG. 5, only the fastening portion 30a between support columns 2a and 2b is shown, but a similar fastening portion 30a also exists between support columns 2d and 2c.
締結部３０ａは、ネジ３１により底面Ｆ２にネジ留めされる。これにより、アルミブロック３０は、底面Ｆ２に接触して固定される。 The fastening portion 30a is screwed to the bottom surface F2 by the screw 31. This causes the aluminum block 30 to come into contact with the bottom surface F2 and be fixed.
また、アルミブロック３０は、略直方体状の空間が設けられた収容部３０ｂを有する。この収容部３０ｂの空間には、電子部品３２（例えば、リアクトル部品。高背部品の一例）が収容される。電子部品３２の底面は、ヒートシンク２の底面Ｆ２に接触して固定される。なお、図示は省略しているが、電子部品３２と収容部３０ｂとの間には、ポッティング材が充填されている。 The aluminum block 30 also has a housing portion 30b that is provided with a substantially rectangular parallelepiped space. An electronic component 32 (e.g., a reactor component, an example of a tall component) is housed in the space of the housing portion 30b. The bottom surface of the electronic component 32 is fixed in contact with the bottom surface F2 of the heat sink 2. Although not shown in the figure, a potting material is filled between the electronic component 32 and the housing portion 30b.
電子部品３２は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３２の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３２の垂直方向Ｄの長さ（電子部品３２の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see Figs. 1 to 3) with the longitudinal direction of the electronic component 32 aligned along the vertical direction D (see Figs. 1 to 3). In addition, the length of the electronic component 32 in the vertical direction D (the longitudinal length of the electronic component 32) is longer than the length of the electronic components 5a, 5b in the vertical direction D (the longitudinal length of the electronic components 5a, 5b).
このように、電子部品３２を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 In this way, by arranging the electronic components 32 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in that space. Therefore, the heat dissipation structure 1 for heat-generating electronic components does not become larger in its height direction (vertical direction D).
本変形例によれば、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３２の固定（振動対策）も行うことができる。また、ポッティング材が放熱性のポッティング材である場合には、電子部品３２の固定（振動対策）と放熱も行うことができる。 In addition to the effects described in the first embodiment, this modification can also fix the electronic components 32 arranged on the bottom surface F2 of the heat sink 2 (anti-vibration measures). Furthermore, if the potting material is a heat-dissipating potting material, it can fix the electronic components 32 (anti-vibration measures) and dissipate heat.
（変形例２）
本変形例に係る発熱電子部品の放熱構造１について、図６を用いて説明する。図６は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図６において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図６では、図１～図３に示した回路基板９の図示を省略している。
(Variation 2)
The heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 6. Fig. 6 is a top perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component according to this modified example. Note that in Fig. 6, the same components as those in Figs. 1 to 4 are given the same reference numerals, and their description will be omitted. Also, in Fig. 6, the circuit board 9 shown in Figs. 1 to 3 is not shown.
本変形例では、図６に示すように、ヒートシンク２において、電子部品３３、３４を備える点が図１～図４と異なる。 As shown in FIG. 6, this modified example differs from FIGS. 1 to 4 in that the heat sink 2 is provided with electronic components 33 and 34.
電子部品３３、３４（例えば、リアクトル部品。高背部品の一例）は、それぞれ、ヒートシンク２の底面Ｆ２に接触して固定される。 Electronic components 33 and 34 (e.g., reactor components, an example of a high-profile component) are each fixed in contact with the bottom surface F2 of the heat sink 2.
電子部品３３、３４は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３３、３４の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３３、３４の垂直方向Ｄの長さ（電子部品３３、３４の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic components 33, 34 are arranged upright between the bottom surface F2 and the circuit board 9 (see Figs. 1 to 3) with the longitudinal direction of the electronic components 33, 34 aligned along the vertical direction D (see Figs. 1 to 3). In addition, the length of the electronic components 33, 34 in the vertical direction D (the longitudinal length of the electronic components 33, 34) is longer than the length of the electronic components 5a, 5b in the vertical direction D (the longitudinal length of the electronic components 5a, 5b).
このように、電子部品３３、３４を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 In this way, by arranging the electronic components 33 and 34 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in that space. Therefore, the heat dissipation structure 1 for the heat-generating electronic component does not become larger in its height direction (vertical direction D).
本変形例では、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３３、３４の放熱も行うことができる。 In addition to the effects described in the first embodiment, this modified example can also dissipate heat from electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2.
（変形例３）
実施の形態では、ヒートシンク２を用いて空冷を行う場合を例に挙げて説明したが、空冷の代わりに、水冷を適用してもよい。
(Variation 3)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.
（変形例４）
実施の形態では、アルミブロック３の底面Ｆ２への締結、バネ７ａ、７ｂのアルミブロック３への締結、回路基板９の支柱２ａ～２ｄへの締結にネジを用いる場合を例に挙げて説明したが、ネジの代わりに、ボンドを用いてもよい。また、実施の形態では、電子部品５ａ、５ｂのアルミブロック３への固着にバネを用いる場合を例に挙げて説明したが、バネの代わりに、ネジを用いてもよい。
(Variation 4)
In the embodiment, an example has been described in which screws are used to fasten the bottom surface F2 of the aluminum block 3, the springs 7a and 7b to the aluminum block 3, and the circuit board 9 to the supports 2a to 2d, but bonds may be used instead of screws. Also, in the embodiment, an example has been described in which springs are used to fasten the electronic components 5a and 5b to the aluminum block 3, but screws may be used instead of springs.
（変形例５）
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される場合を例に挙げて説明したが、グリスやギャップフィラー（放熱部材の一例）等の接着性を有しない放熱性部材をアルミブロック３と回路基板９の間に設けてもよい。これにより、回路基板９で発生した熱を、グリスやギャップフィラー等を介してアルミブロック３へ伝熱できる。また、グリスやギャップフィラーが絶縁性を有する場合、回路基板９においてグリスやギャップフィラーに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。
(Variation 5)
In addition, while the aluminum block 3 and the circuit board 9 have been described as being fixed to each other by bonding with bonds 11a and 11b (an example of an adhesive member), a non-adhesive heat dissipation member such as grease or a gap filler (an example of a heat dissipation member) may be provided between the aluminum block 3 and the circuit board 9. This allows heat generated in the circuit board 9 to be transferred to the aluminum block 3 via the grease or gap filler. Furthermore, if the grease or gap filler has insulating properties, a pattern can be formed or a semiconductor element can be mounted on the circuit board 9 at a location corresponding to the grease or gap filler.
本発明は、車載充電器およびインバータに有用である。 The present invention is useful for on-board chargers and inverters.
１ 発熱電子部品の放熱構造
２ ヒートシンク
２ａ、２ｂ、２ｃ、２ｄ 支柱
３、３０ アルミブロック
３ａ、３０ａ 締結部
４ａ、４ｂ、８ａ、８ｂ、１０ａ、１０ｂ、１０ｃ、１０ｄ、３１ ネジ
５ａ、５ｂ 電子部品
６ａ、６ｂ リード線
７ａ、７ｂ バネ
９ 回路基板
３０ｂ 収容部
３２、３３、３４ 電子部品
REFERENCE SIGNS LIST 1 Heat dissipation structure for heat-generating electronic component 2 Heat sink 2a, 2b, 2c, 2d Support 3, 30 Aluminum block 3a, 30a Fastening portion 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screw 5a, 5b Electronic component 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Storage portion 32, 33, 34 Electronic component
Claims (12)
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品が配置される伝熱体と、
前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、
前記リアクトル部品は、放熱部品と熱的に接続され、
前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されていることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、
前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、
前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、
前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と
熱的に接続される、
車載充電器。 A circuit board;
a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board;
a heat transfer body on which the heat-generating electronic component is disposed;
The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component,
The reactor component is thermally connected to a heat dissipation component,
a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material;
the heat transfer body has a second surface and a third surface opposite to the second surface,
the heat transfer body is thermally connected to the heat-generating electronic component via the second surface;
the heat transfer body is thermally connected to the reactor part by the potting material via the third surface;
Car charger.
請求項１に記載の車載充電器。 the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component;
The vehicle-mounted charger according to claim 1 .
接着部材により前記回路基板に接着して固定される、
請求項２に記載の車載充電器。 The heat transfer body is
The circuit board is fixed to the substrate by an adhesive member.
The vehicle-mounted charger according to claim 2 .
絶縁性または放熱性の少なくとも一方を有する、
請求項３に記載の車載充電器。 The adhesive member is
At least one of insulating property and heat dissipation property is provided.
The vehicle-mounted charger according to claim 3 .
請求項１から４のいずれか１項に記載の車載充電器。 A heat dissipation member is disposed between the heat transfer body and the circuit board.
The on-board charger according to any one of claims 1 to 4.
前記回路基板において、前記絶縁性および放熱性を有する部材に対応する箇所に、パターンが形成される、
請求項１から５のいずれか１項に記載の車載充電器。 a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board;
A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties.
The on-board charger according to any one of claims 1 to 5.
請求項６に記載の車載充電器。 The member having insulating properties and heat dissipation properties also has adhesive properties.
The vehicle-mounted charger according to claim 6.
前記高背部品の前記第１の方向の長さは、前記発熱電子部品の前記第１の方向の長さよりも長い、
請求項２に記載の車載充電器。 The reactor component is a high-profile component,
The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction.
The vehicle-mounted charger according to claim 2 .
請求項１に記載の車載充電器。 The reactor part is thermally connected to the heat dissipation part by the potting material having heat dissipation properties.
The vehicle-mounted charger according to claim 1 .
請求項１に記載の車載充電器。 The heat transfer body holds the reactor component by a housing portion having a space for housing the reactor component.
The vehicle-mounted charger according to claim 1 .
請求項１０に記載の車載充電器。 The reactor component is thermally connected to the heat dissipation component via the accommodation portion.
The vehicle-mounted charger according to claim 10.
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品が配置される伝熱体と、
前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、
前記リアクトル部品は、放熱部品と熱的に接続され、
前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、
前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、
前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、
前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される、
インバータ。
A circuit board;
a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board;
a heat transfer body on which the heat-generating electronic component is disposed;
The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component,
The reactor component is thermally connected to a heat dissipation component,
a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material;
the heat transfer body has a second surface and a third surface opposite to the second surface,
the heat transfer body is thermally connected to the heat-generating electronic component via the second surface;
the heat transfer body is thermally connected to the reactor part by the potting material via the third surface;
Inverter.
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| JP2015241074A JP6726862B2 (en) | 2015-12-10 | 2015-12-10 | Heat dissipation device for heat-generating electronic components and in-vehicle charger |
| JP2020100805A JP6982776B2 (en) | 2015-12-10 | 2020-06-10 | Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles |
| JP2021178787A JP7262012B2 (en) | 2015-12-10 | 2021-11-01 | Onboard charger and inverter |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031978A (en) | 2001-07-13 | 2003-01-31 | Auto Network Gijutsu Kenkyusho:Kk | Control unit and manufacturing method therefor |
| JP2008062825A (en) | 2006-09-08 | 2008-03-21 | Bosch Corp | Brake liquid pressure controller |
| WO2014033852A1 (en) | 2012-08-29 | 2014-03-06 | 三菱電機株式会社 | In-vehicle power conversion apparatus |
| WO2014080462A1 (en) | 2012-11-21 | 2014-05-30 | 三洋電機株式会社 | Power conversion apparatus |
| JP2014139986A (en) | 2013-01-21 | 2014-07-31 | Hitachi Automotive Systems Ltd | Electronic controller |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2014060344A (en) | 2012-09-19 | 2014-04-03 | Sanken Electric Co Ltd | Semiconductor module manufacturing method and semiconductor module |
| JP2018107364A (en) | 2016-12-28 | 2018-07-05 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031978A (en) | 2001-07-13 | 2003-01-31 | Auto Network Gijutsu Kenkyusho:Kk | Control unit and manufacturing method therefor |
| JP2008062825A (en) | 2006-09-08 | 2008-03-21 | Bosch Corp | Brake liquid pressure controller |
| WO2014033852A1 (en) | 2012-08-29 | 2014-03-06 | 三菱電機株式会社 | In-vehicle power conversion apparatus |
| WO2014080462A1 (en) | 2012-11-21 | 2014-05-30 | 三洋電機株式会社 | Power conversion apparatus |
| JP2014139986A (en) | 2013-01-21 | 2014-07-31 | Hitachi Automotive Systems Ltd | Electronic controller |
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| JP7262012B2 (en) | 2023-04-21 |
| JP2023076565A (en) | 2023-06-01 |
| JP2022009834A (en) | 2022-01-14 |
| JP2024075654A (en) | 2024-06-04 |
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