JPH06196885A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPH06196885A JPH06196885A JP35776092A JP35776092A JPH06196885A JP H06196885 A JPH06196885 A JP H06196885A JP 35776092 A JP35776092 A JP 35776092A JP 35776092 A JP35776092 A JP 35776092A JP H06196885 A JPH06196885 A JP H06196885A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- adhesive
- heat sink
- oil
- outer casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器アセンブリにお
ける発熱体からの熱を外筺等の放熱体に伝導させて放熱
を行なう放熱装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for conducting heat from a heat generating body in an electronic equipment assembly to a heat radiating body such as an outer casing to radiate heat.
【０００２】[0002]
【従来の技術】従来より、電子素子基板上における発熱
体（例えば発熱半導体）から発生させる熱をアルミや鉄
板による放熱体に伝導させて熱拡散を行なうことが行な
われており、例えば機器の外筺体自体が放熱体として用
いられることが多い。2. Description of the Related Art Conventionally, heat generated from a heat generating element (for example, a heat generating semiconductor) on an electronic element substrate is conducted to a heat radiating element made of aluminum or an iron plate to diffuse heat. The housing itself is often used as a heat radiator.
【０００３】[0003]
【発明が解決しようとする課題】ところで、このような
放熱装置構造としては、例えば基板上にマウントされた
発熱半導体に対して熱伝導を行なう補助放熱体を固定
し、この補助放熱体を放熱体となる外筺体（又は外筺以
外のヒートシンク部材）に固定することにより、発熱半
導体からの熱が例えば外筺体上に伝導されて拡散される
ようにしている。つまり、例えば基板上に取り付けられ
る発熱体及び補助放熱体による発熱系を放熱体に固着さ
せている。By the way, as such a heat dissipation device structure, for example, an auxiliary heat radiator that conducts heat to a heat generating semiconductor mounted on a substrate is fixed, and this auxiliary heat radiator is used as the heat radiator. By fixing to the outer casing (or a heat sink member other than the outer casing), the heat from the heat-generating semiconductor is conducted and diffused onto the outer casing, for example. That is, for example, the heat generating system including the heat generating element and the auxiliary heat radiating element mounted on the substrate is fixed to the heat radiating element.
【０００４】ここで、補助放熱体を外筺体に固着する際
に、ネジ固定を行なうようにすると、外筺体外部にネジ
山が露出し場合によっては装置の外観を損なってしまう
ことがある。そこで、熱伝導性に優れた接着剤を補助放
熱体と外筺体の間に充填して接着固定することが行なわ
れている。If the auxiliary heat radiator is fixed to the outer casing with screws, the threads may be exposed outside the outer casing, and the appearance of the device may be impaired in some cases. Therefore, an adhesive having excellent thermal conductivity is filled between the auxiliary heat radiating body and the outer casing to bond and fix them.
【０００５】しかしながら、このように接着剤を用いる
と、発熱系と放熱体（外筺体）の分離が困難になり、例
えば機器組立後や製造出荷後において調整や各種メンテ
ナンスを行なう際に非常に不便なものとなるとともに、
分離しようとして発熱半導体や基板等にストレスが加わ
って回路や機構の破損等が生じ易いという問題がある。However, when the adhesive is used in this way, it becomes difficult to separate the heat generating system and the heat radiating body (outer housing), and it is very inconvenient when carrying out adjustments and various maintenances after the device is assembled or manufactured and shipped. As well as
There is a problem that stress is applied to the heat-generating semiconductor, the substrate, or the like in an attempt to separate them, and the circuit or mechanism is easily damaged.
【０００６】[0006]
【課題を解決するための手段】本発明はこのような問題
点に鑑みて、発熱系を放熱体に接着固定する際に、放熱
体と発熱系の間にオイルやコンパウンド等の非接着性材
の塗布層と熱伝導性接着剤の充填層を介在させて発熱系
が放熱体に接着されるように放熱装置を構成するもので
ある。In view of the above problems, the present invention provides a non-adhesive material such as oil or compound between the heat radiating body and the heat generating system when the heat generating system is adhered and fixed to the heat radiating system. The heat dissipating device is configured so that the heat generating system is adhered to the heat dissipating body with the coating layer and the filling layer of the heat conductive adhesive interposed.
【０００７】[0007]
【作用】接着剤をオイルやコンパウンドを介して充填す
ることにより、通常固着時の接着性はさほど損なわれな
いとともに、発熱系と放熱体を分離することは容易とな
る。By filling the adhesive with oil or a compound, the adhesiveness at the time of fixing is not so much deteriorated, and the heat generating system and the radiator are easily separated.
【０００８】[0008]
【実施例】図１は本発明の実施例を示すものであり、１
は電子素子が実装されている基板、２は発熱半導体を示
している。発熱半導体２はネジ３によりアルミ等によっ
て成る補助放熱体４に当接された状態で固定されてい
る。５は例えば電子装置の外筺体を示し、例えばアルミ
板や鉄板等によって形成されることにより放熱体として
の機能を有している。FIG. 1 shows an embodiment of the present invention.
Indicates a substrate on which electronic elements are mounted, and 2 indicates a heat generating semiconductor. The heat generating semiconductor 2 is fixed in a state of being in contact with an auxiliary heat radiator 4 made of aluminum or the like by a screw 3. Reference numeral 5 denotes, for example, an outer casing of the electronic device, which has a function as a radiator by being formed of, for example, an aluminum plate or an iron plate.
【０００９】発熱半導体２から発生した熱は補助放熱体
４を介して外筺体５に伝導され、放熱されるようにする
ために、補助放熱体４は外筺体５の内面に当接状態で固
着されることになるが、本実施例ではこの固着部分とな
る外筺体５の内面にオイル６が塗布された上で、熱伝導
性の優れた接着剤７が充填されて、接着固定されるよう
になされている。The heat generated from the heat-generating semiconductor 2 is conducted to the outer casing 5 through the auxiliary heat radiator 4, and the auxiliary heat radiator 4 is fixed to the inner surface of the outer casing 5 so as to be radiated. In this embodiment, the oil 6 is applied to the inner surface of the outer casing 5 which is the fixed portion, and then the adhesive 7 having excellent heat conductivity is filled and fixed by adhesion. Has been done.
【００１０】このようにオイル６を塗布した上で接着剤
７を充填して接着することにより、通常固着状態では支
障のない程度の固着力が維持されているとともに、補助
放熱体４を外筺体５から外したい場合には、容易に分離
できることになる。By thus applying the oil 6 and then filling and bonding the adhesive 7 with each other, a fixing force that does not hinder the normal fixing state is maintained, and the auxiliary heat radiating body 4 is attached to the outer casing. If you want to remove from 5, you can easily separate.
【００１１】なお、オイル６にかえて樹脂に可塑材、充
填材、安定材等を混合したコンパウンド材を塗布するよ
うにしてもよい。また、実施例とは逆に補助放熱体７に
オイル６を塗布し、オイル６と外筺体５の間に接着剤７
を充填してもよい。放熱体は外筺体５を用いるものでは
なく、機器内部にヒートシンク部材を設ける場合は、補
助放熱体４がこれに接着されるようにすればよい。もち
ろん発熱体としては発熱半導体２に限定されない。It should be noted that instead of the oil 6, a compound material obtained by mixing a resin with a plastic material, a filler, a stabilizer and the like may be applied. Contrary to the embodiment, the oil 6 is applied to the auxiliary heat radiator 7, and the adhesive 7 is applied between the oil 6 and the outer casing 5.
May be filled. The heat radiator does not use the outer casing 5, but when a heat sink member is provided inside the device, the auxiliary heat radiator 4 may be adhered thereto. Of course, the heating element is not limited to the heating semiconductor 2.
【００１２】[0012]
【発明の効果】以上説明したように本発明の放熱装置
は、放熱体と発熱系の間に非接着性材の塗布層と熱伝導
性接着剤の充填層を介在させて発熱系が放熱体に接着固
定される様にしたため、メンテナンス等のために発熱系
を放熱体から分離したいような場合には、容易に分離で
きるという効果があり、またこのため分離の際に基板等
の構造体に不要なストレスが加わることなく、回路、機
構の信頼性を向上させることができる。また、このよう
に接着材による固定における問題が解消されたことに伴
い、放熱体の接着面が必ずしも平坦でなくとも充填され
た接着剤により発熱系から放熱体に良好に熱伝導がなさ
れるため、接着位置設定の自由度が広がり、さらに、ネ
ジ止めでないため放熱体が外筺体である場合でも、ネジ
山により外観が損なわれることもないという利点が生ず
る。As described above, in the heat dissipation device of the present invention, the heat generating system has a heat dissipating body with a non-adhesive coating layer and a heat conductive adhesive filling layer interposed between the heat dissipating body and the heat generating system. Since it is bonded and fixed to the heat-dissipating body, it has an effect that it can be easily separated when it is desired to separate the heat-generating system from the heat-dissipating body for maintenance. The reliability of the circuit and the mechanism can be improved without applying unnecessary stress. In addition, as the problem of fixing with the adhesive is solved in this way, even if the heat-dissipating body does not necessarily have a flat adhesive surface, the filled adhesive allows good heat conduction from the heat-generating system to the heat-dissipating body. Further, there is an advantage that the degree of freedom in setting the bonding position is widened, and even if the heat radiator is an outer casing because it is not screwed, the external appearance is not damaged by the screw thread.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の放熱装置の実施例の説明図である。FIG. 1 is an explanatory diagram of an embodiment of a heat dissipation device of the present invention.
１ 基板 ２ 発熱半導体 ４ 補助放熱体 ５ 外筺体 ６ オイル ７ 接着剤 1 Substrate 2 Heat-generating semiconductor 4 Auxiliary heat radiator 5 Outer housing 6 Oil 7 Adhesive
Claims (3)
記放熱体と前記発熱系の間に非接着性材の塗布層と熱伝
導性接着剤の充填層を介在させて前記発熱系が前記放熱
体に接着されるように構成したことを特徴とする放熱装
置。1. When the heat-generating system is adhered and fixed to a heat-dissipating body, the heat-generating system is provided with a non-adhesive coating layer and a heat-conductive adhesive filling layer interposed between the heat-dissipating body and the heat-generating system. A heat dissipation device, wherein the heat dissipation device is configured to be adhered to the heat dissipation body.
徴とする請求項１に記載の放熱装置。2. The heat dissipation device according to claim 1, wherein the non-adhesive material is oil.
とを特徴とする請求項１に記載の放熱装置。3. The heat dissipation device according to claim 1, wherein the non-adhesive material is a compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35776092A JPH06196885A (en) | 1992-12-25 | 1992-12-25 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35776092A JPH06196885A (en) | 1992-12-25 | 1992-12-25 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06196885A true JPH06196885A (en) | 1994-07-15 |
Family
ID=18455789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35776092A Pending JPH06196885A (en) | 1992-12-25 | 1992-12-25 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06196885A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017098703A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
| JP2018063921A (en) * | 2016-10-14 | 2018-04-19 | 株式会社デンソー | Cell device |
| JP2018148125A (en) * | 2017-03-08 | 2018-09-20 | Tdk株式会社 | Electronic equipment and manufacturing method of electronic equipment |
| JP2020167425A (en) * | 2015-12-10 | 2020-10-08 | パナソニックＩｐマネジメント株式会社 | Heat radiation device for heat generating electronic component, in-vehicle charger, and vehicle |
-
1992
- 1992-12-25 JP JP35776092A patent/JPH06196885A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017098703A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
| JP2017108007A (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiation structure for heat evolution electronic component and manufacturing method for the same |
| JP2020167425A (en) * | 2015-12-10 | 2020-10-08 | パナソニックＩｐマネジメント株式会社 | Heat radiation device for heat generating electronic component, in-vehicle charger, and vehicle |
| JP2018063921A (en) * | 2016-10-14 | 2018-04-19 | 株式会社デンソー | Cell device |
| JP2018148125A (en) * | 2017-03-08 | 2018-09-20 | Tdk株式会社 | Electronic equipment and manufacturing method of electronic equipment |
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