CN206447959U - A kind of diamond wire nickel plating apparatus - Google Patents

A kind of diamond wire nickel plating apparatus Download PDF

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Publication number
CN206447959U
CN206447959U CN201720127428.1U CN201720127428U CN206447959U CN 206447959 U CN206447959 U CN 206447959U CN 201720127428 U CN201720127428 U CN 201720127428U CN 206447959 U CN206447959 U CN 206447959U
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CN
China
Prior art keywords
diamond wire
electrode
electroplating bath
nickel
plating apparatus
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Expired - Fee Related
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CN201720127428.1U
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Chinese (zh)
Inventor
张士骏
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Zhang Shijun
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Individual
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Priority to CN201720127428.1U priority Critical patent/CN206447959U/en
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Abstract

The utility model discloses a kind of diamond wire nickel plating apparatus, including electroplating bath, conductive rollers, go out line wheel, two groups of guide rollers, nickel electrodes;Wherein, the conductive rollers are arranged on one end of the electroplating bath, it is described go out line wheel be arranged on the other end of the electroplating bath;Guide roller described in two groups and the nickel electrode are arranged inside the electroplating bath.The winding displacement mode that the utility model is formed can reduce the size of electroplating bath, save cost, reduce the space taken;Simultaneously, moreover it is possible to convenient operation and the maintenance of equipment.The utility model two ends in electroplating bath respectively set one group of guide roller, can enter row constraint to diamond wire, prevent diamond wire from sliding and being brought together during cabling.

Description

A kind of diamond wire nickel plating apparatus
Technical field
The utility model belongs to technical field of plating equipment, relates particularly to a kind of diamond wire nickel plating apparatus.
Background technology
The world today, due to increasingly highlighting for energy crisis, promotes continuing to develop for solar energy industry, silicon chip is the sun The carrier of energy battery, the fine or not height for directly determining conversion efficiency of solar cell of Si wafer quality, and good cutting effect It is the premise for ensureing Si wafer quality, if the cutting thickness of silicon chip is inaccurate, otch is undesirable, can not only cause raw material crystal The waste of silicon, can also influence the quality of silicon chip.
With continuing to develop for science and technology, people require more and more higher to the cut quality of silicon chip, it is desirable to which cutting tool is being cut Small, material consumption is not only polluted during cutting few, also ensured with preferable cutting effect, to there is cutting essence well Degree.Diamond wire is as a kind of preferable cutting tool of cutting effect, and because it has, joint-cutting is narrow, volume recovery is high;Cutting process Steadily, the fragile material not chipping such as cutting silicon wafer;Can cutting large size workpiece;Temperature is low, and cut surface is without ablation vestige;To environment Pollution is small;The advantages of cutting accuracy is high is widely used in the cutting of high hardness material, particularly crystalline silicon and cuts into silicon chip During.
Diamond wire is produced with electric plating method, diamond particles and electroless nickel layer are only mechanical bond, and adhesion is weak, Electrodeposited coating declines to diamond hold during use, makes diamond easy to fall off, reduces its service life.
In addition, electroplating bath of the prior art is barrel shaped structure, what the speed to increase plating will make electroplating bath Deep, one is inconvenient operation, and two be inconvenient maintenance, and three be to need excessive electroplate liquid.
Utility model content
The purpose of this utility model, which is to provide one kind, can make the more uniform diamond wire plating of diamond wire electroless nickel layer Nickel device.
To achieve the above object, the technical solution of the utility model is:
A kind of diamond wire nickel plating apparatus, including electroplating bath, conductive rollers, go out line wheel, two groups of guide rollers, nickel electrodes;Wherein: The conductive rollers are arranged on one end of the electroplating bath, it is described go out line wheel be arranged on the other end of the electroplating bath;Described in two groups Guide roller and the nickel electrode are arranged inside the electroplating bath.
Further, between guide roller described in the conductive rollers and one group and it is described go out line wheel and another group of institute State and be respectively arranged with directive wheel between guide roller.
Further, nickel electrode includes Top electrode and bottom electrode, wherein:The bottom electrode is fixed on the electroplating bath On madial wall, the Top electrode is detachably connected on the bottom electrode constitute the ring-type of closing.
Further, diamond wire cable tray is formed between Top electrode and bottom electrode.
Further, Top electrode and bottom electrode are the hollow structures being made up of titanium wire network, and nickel is metal filled described In hollow structure.
Further, bottom electrode is fixed on the electroplating bath madial wall by binding post, wherein:In the binding post It is provided with electrified wire.
Further, nickel electrode is multiple, and is connected between the Top electrode of each nickel electrode by connector.
Further, it is additionally provided with pulling apparatus in the Top electrode.
Further, the diamond wire nickel plating apparatus also includes drive mechanism, the drive mechanism and at least one set The guide roller is connected.
Further, the rotating speed of guide roller described in driving mechanisms control is equal to the Trace speed of diamond wire.
Compared with prior art, the utility model has the advantages that:
1st, the winding displacement mode of electroplating bath can reduce the size of electroplating bath in the utility model, save cost, reduce and take Space;Simultaneously, moreover it is possible to convenient operation and the maintenance of equipment;
2nd, one group of guide roller is set by the way that two ends are each in electroplating bath in the utility model, diamond wire can be carried out about Beam, prevents diamond wire from sliding and being brought together during cabling;
3rd, the arrangement density of anode is suitably increased by the multiple nickel electrodes of scattering device in the utility model, to offset Cause the reduction of anode actual effective area due to the reduction of anode arrangement graphics area, so as to maintain the anode surface after adjustment Product is basically unchanged;
4th, by the way that nickel electrode is arranged into two parts of Top electrode and bottom electrode in the utility model, and diamond is formed Line cable tray, nickel electrode surrounds diamond wire, makes plating more uniform;Meanwhile, Top electrode removably connects with bottom electrode It is connected together, is also convenient for winding displacement;
5th, it is equal to the Trace speed of diamond wire using the rotating speed of driving mechanisms control guide roller in the utility model, improves Production efficiency, at the same significantly reduce diamond wire stress it is poly- in the problem of, can prevent diamond wire from breaking or deforming.
Brief description of the drawings
, below will be to embodiment for clearer explanation the utility model embodiment or technical scheme of the prior art Or the accompanying drawing used required in description of the prior art is briefly described, it is clear that, drawings in the following description are only It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is that diamond wire nickel plating apparatus faces cross section structure diagram in the utility model embodiment;
Fig. 2 is the overlooking the structure diagram of diamond wire nickel plating apparatus in the utility model embodiment;
Fig. 3 is the main structure diagram of nickel electrode in the utility model embodiment;
Fig. 4 is the left view structural representation of nickel electrode in the utility model embodiment;
Wherein, 1- conductive rollers, 2- goes out electric under line wheel, 3- directive wheels, 4- guide rollers, 5- nickel electrodes, 51- Top electrodes, 52- Pole, 6- connectors, 7- pulling apparatus, 8- binding posts, 9- electroplating baths.
Embodiment
Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model embodiment is carried out it is clear, Complete description, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole implementation Example.Based on the embodiment in the utility model, those skilled in the art is not on the premise of creative work is made The all other embodiment obtained, belongs to protection domain of the present utility model.
As shown in figure 1, cross section structure diagram is faced for the utility model embodiment diamond wire nickel plating apparatus, the plating Nickel device includes electroplating bath 9, conductive rollers 1, goes out line wheel 2, two groups of guide rollers 4, nickel electrodes 5;Wherein, conductive rollers 1 are arranged on plating One end of groove 9, goes out the other end that line wheel 2 is arranged on electroplating bath 9;Two groups of guide rollers 4 are separately positioned on two inside electroplating bath 9 End;Nickel electrode 5 is arranged on inside electroplating bath 9.
When being electroplated, conductive rollers 1 connect the negative pole of power supply, and nickel electrode 5 connects the positive pole of power supply, and should note The liquid level of injection electroplate liquid must ensure to submerge two groups of guide rollers 4 wherein in meaning, electroplating bath 9, to ensure to be wrapped in wire Diamond wire on wheel 4 can be completely submerged in electroplate liquid, meanwhile, nickel electrode 5 also needs to be immersed in electroplate liquid, to supplement electricity During plating in electroplate liquid nickel ion loss.
The diamond wire of preplating is wound on first guide roller in one group of guide roller 4 by conductive rollers 1, is then wound Onto first guide roller in another group of guide roller 4, return on second guide roller in one group of guide roller 4, then twine On second guide roller in another group of guide roller 4, the process of this coiling is repeated, is covered with until by the diamond wire of preplating Whole electroplating bath 9.Afterwards, the diamond wire of preplating is drawn into electroplating bath 9 by going out line wheel 2.
Guide roller number in every group of guide roller can be set in the utility model according to the size dimension of electroplating bath 9, So that diamond wire can be covered with whole electroplating bath to greatest extent, therefore electroplating bath 9 can be improved by this winding displacement mode Space availability ratio, reduce electroplating bath 9 size, save cost, reduce take space;Simultaneously, moreover it is possible to which convenient operation is with setting Standby maintenance.By respectively setting one group of guide roller 4 at the two ends of electroplating bath 9 in the utility model, make diamond wire from each wire Bypassed on wheel, row constraint can be entered to diamond wire, prevent diamond wire from sliding and being brought together during cabling.
Under preferable case, the winding of diamond wire and cabling for convenience can be in conductive rollers 1 and one group of guide roller 4 Between and going out between line wheel 2 and another group of guide roller 4, directive wheel 3 is set respectively.Also, the setting of directive wheel 3 is highly excellent Choosing is less than guide roller 4.The diamond wire of preplating after conductive rollers 1, is first passing through directive wheel 3, then leads as previously described at two groups It is wound, until being covered with whole electroplating bath 9, then by another directive wheel 3, is drawn finally by line wheel 2 is gone out between line wheel 4 Electroplating bath 9.
As shown in Fig. 2 be the overlooking the structure diagram of the utility model embodiment diamond wire nickel plating apparatus, in order to avoid There is " edge effect " in electroplating process, nickel electrode 5 can be arranged to multiple, be distributed in electroplating bath, to increase anode Arrangement density, keeps annode area not reduce.
As shown in Figure 2,3, 4, it is a kind of preferred embodiment of nickel electrode in the utility model, nickel electrode 5 can include Top electrode 51 and bottom electrode 52, bottom electrode 52 are fixed on the madial wall of electroplating bath 9, and Top electrode 51 is detachably connected to lower electricity With the ring-type of composition closing on pole 52.Wherein, the utility model constitutes the shape of ring-type (such as to Top electrode 51, bottom electrode 52 Annulus, Fang Huan etc.) it is not further limited, those skilled in the art can voluntarily select according to the actual requirements.
The closed circular constituted between Top electrode 51 and bottom electrode 52 can as diamond wire cable tray.Such nickel Electrode 5 can surround diamond wire, so that plating is more uniform;Meanwhile, Top electrode 51 is removably connected with bottom electrode 52 Together, therefore when winding diamond wire Top electrode 51 can be separated with bottom electrode 52, connects the two when being electroplated, Consequently facilitating winding displacement.
Further, Top electrode 51 and bottom electrode 52 can be the hollow structures being made up of titanium wire network, and nickel metal is filled out Fill in hollow structure, to supplement the nickel ion of consumption in electroplate liquid in electroplating process.
Further, as shown in Fig. 2 bottom electrode 52 can be fixed on the madial wall of electroplating bath 9 by binding post 8, And electrified wire is provided with binding post 8, so as to make the positive pole of nickel electrode connection power supply by electrified wire.
Further, as shown in Fig. 2 nickel electrode 5 can be multiple, and can between the Top electrode 51 of each nickel electrode 5 To be connected by connector 6.The synchronized links of each Top electrode 51 and bottom electrode 52 can so be realized and separated.
Further, as shown in figure 1, also including the pulling apparatus 7 being arranged in Top electrode 51 in the present embodiment.Due to Nickel electrode 5 is immersed in electroplate liquid in electroplating process, therefore sets pulling apparatus 7 so that the pulling apparatus 7 reaches electroplate liquid Outside liquid level, it can facilitate and Top electrode 51 and bottom electrode 52 are connected and separated.
When nickel electrode 5 is set to multiple, due to being connected between the Top electrode 51 of each nickel electrode 5 by connector 6, therefore Only pulling apparatus 7 need to be set in a Top electrode 51, can be simultaneously by all Top electrodes 51 and lower electricity by pulling apparatus 7 Pole 52 connects or separated.
Also include drive mechanism (not shown) in the present embodiment, wherein, drive mechanism and at least one set of phase of guide roller 4 Even, so that when being electroplated to diamond wire, driving guide roller is rotated, so as to drive diamond wire cabling, is so not only improved Production efficiency, at the same significantly reduce diamond wire stress it is poly- in the problem of, can prevent diamond wire from breaking.
Further, the rotating speed of the driving mechanisms control guide roller is equal to the Trace speed of diamond wire, so as to prevent Because rotating speed is too fast or it is excessively slow and caused by diamond wire broken string or deform.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in Other related technical fields, are similarly included in scope of patent protection of the present utility model.

Claims (10)

1. a kind of diamond wire nickel plating apparatus, it is characterised in that including electroplating bath (9), conductive rollers (1), go out line wheel (2), two groups Guide roller (4), nickel electrode (5);Wherein:
The conductive rollers (1) are arranged on one end of the electroplating bath (9), it is described go out line wheel (2) be arranged on the electroplating bath (9) The other end;
It is internal that guide roller (4) described in two groups and the nickel electrode (5) are arranged at the electroplating bath (9).
2. diamond wire nickel plating apparatus according to claim 1, it is characterised in that in the conductive rollers (1) and one group of institute State between guide roller (4) and it is described go out guide roller (4) described in line wheel (2) and another group between be respectively arranged with directive wheel (3)。
3. diamond wire nickel plating apparatus according to claim 2, it is characterised in that the nickel electrode (5) includes Top electrode (51) and bottom electrode (52), wherein:The bottom electrode (52) is fixed on the madial wall of the electroplating bath (9), the Top electrode (51) it is detachably connected on the bottom electrode (52) constitute the ring-type of closing.
4. diamond wire nickel plating apparatus according to claim 3, it is characterised in that the Top electrode (51) and bottom electrode (52) diamond wire cable tray is formed between.
5. diamond wire nickel plating apparatus according to claim 3, it is characterised in that the Top electrode (51) and bottom electrode (52) it is the hollow structure that is made up of titanium wire network, nickel is metal filled in the hollow structure.
6. diamond wire nickel plating apparatus according to claim 3, it is characterised in that the bottom electrode (52) passes through binding post (8) it is fixed on the electroplating bath (9) madial wall, wherein:Electrified wire is provided with the binding post (8).
7. diamond wire nickel plating apparatus according to claim 3, it is characterised in that the nickel electrode (5) is multiple, and often Connected between the Top electrode (51) of the individual nickel electrode (5) by connector (6).
8. diamond wire nickel plating apparatus according to claim 3, it is characterised in that also including being arranged on the Top electrode (51) pulling apparatus (7) on.
9. the diamond wire nickel plating apparatus according to any one of claim 1-8 claim, it is characterised in that also include Drive mechanism, the drive mechanism is connected with least one set of guide roller (4).
10. diamond wire nickel plating apparatus according to claim 9, it is characterised in that led described in the driving mechanisms control The rotating speed of line wheel (4) is equal to the Trace speed of diamond wire.
CN201720127428.1U 2017-02-10 2017-02-10 A kind of diamond wire nickel plating apparatus Expired - Fee Related CN206447959U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720127428.1U CN206447959U (en) 2017-02-10 2017-02-10 A kind of diamond wire nickel plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720127428.1U CN206447959U (en) 2017-02-10 2017-02-10 A kind of diamond wire nickel plating apparatus

Publications (1)

Publication Number Publication Date
CN206447959U true CN206447959U (en) 2017-08-29

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Application Number Title Priority Date Filing Date
CN201720127428.1U Expired - Fee Related CN206447959U (en) 2017-02-10 2017-02-10 A kind of diamond wire nickel plating apparatus

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941167A (en) * 2022-05-07 2022-08-26 安徽亚珠金刚石股份有限公司 Even sand device of going up of diamond production coping saw

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941167A (en) * 2022-05-07 2022-08-26 安徽亚珠金刚石股份有限公司 Even sand device of going up of diamond production coping saw
CN114941167B (en) * 2022-05-07 2023-06-20 安徽亚珠金刚石股份有限公司 Uniform sand feeding device for diamond production wire saw

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GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20181114

Address after: 300385 factory 5, cedar Avenue, Xiqing District, Tianjin

Patentee after: Hua Yuxin materials technology (Tianjin) Co.,Ltd.

Address before: 300450 303 gate 3, building 2, Minjiang lane, Guangzhou Road, Tanggu District, Tianjin.

Patentee before: Zhang Shijun

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190517

Address after: 300450 Tianjin Binhai New Area, No. 303, 3rd Gate, No. 2 Building, Minjiang Li, Guangzhou Dao

Patentee after: Zhang Shijun

Address before: 300385 factory 5, cedar Avenue, Xiqing District, Tianjin

Patentee before: Hua Yuxin materials technology (Tianjin) Co.,Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170829

Termination date: 20220210

CF01 Termination of patent right due to non-payment of annual fee