CN206225401U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
- Publication number
- CN206225401U CN206225401U CN201621275513.4U CN201621275513U CN206225401U CN 206225401 U CN206225401 U CN 206225401U CN 201621275513 U CN201621275513 U CN 201621275513U CN 206225401 U CN206225401 U CN 206225401U
- Authority
- CN
- China
- Prior art keywords
- encapsulation structure
- pedestal
- lens
- led encapsulation
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The utility model discloses a kind of LED encapsulation structure,Including pedestal,The left and right sides of the pedestal is provided with pin,The inside of the pedestal is provided with metal heat sink,The upper end of the metal heat sink is welded with LED chip by solder,The LED chip is connected to pin by gold thread,Phosphor powder layer is provided with the outside of the LED chip,The upper end outside of the pedestal is provided with protective cover,The upper inside of the protective cover is provided with lens,The utility model metal heat sink is high heat-conducting copper base plate,Alloy copper soleplate or other high-thermal conductive metal base plates,So as to ensure LED encapsulation structure radiating effect when in use,Lens are covered with LED chip,It can be using other transparent materials such as silica gel,Its shape can use hemispherical or cylinder,So as to lens can be adjusted to the rising angle of LED encapsulation structure,Expand its light-emitting area,So as to improve display quality,Improve the viewing effect of beholder,By the setting of protective cover,Effectively machinery is provided to LED encapsulation structure to ensure.
Description
Technical field
The utility model is related to LED encapsulation technologies field, specially a kind of LED encapsulation structure.
Background technology
LED encapsulation refers to the encapsulation of luminescence chip, and the encapsulation for having relatively big difference, LED compared to integrated antenna package not only will
Asking can protect wick, but also will printing opacity, so the encapsulation of LED has special requirement to encapsulating material, LED encapsulation is
Output electric signal is completed, protects tube core normal work, existing LED encapsulation structure often to be imitated on protection LED chip and lens
It is really bad, therefore, we release a kind of LED encapsulation structure.
Utility model content
The purpose of this utility model is to provide a kind of LED encapsulation structure, with asking for solving to propose in above-mentioned background technology
Topic.
To achieve the above object, the utility model provides following technical scheme：A kind of LED encapsulation structure, including pedestal, institute
The left and right sides for stating pedestal is provided with pin, and the inside of the pedestal is provided with metal heat sink, and the upper end of the metal heat sink is by weldering
Material is welded with LED chip, and the LED chip is connected to pin, phosphor powder layer is provided with the outside of the LED chip by gold thread,
The upper end outside of the pedestal is provided with protective cover, and the upper inside of the protective cover is provided with lens.
Preferably, the pedestal is provided with the glue that is sealing adhesive with metal heat sink contact position.
Preferably, the bottom of the lens is provided with installation projection, described to install the upper inside that projection is connected in protective cover.
Preferably, the inside of the lens is provided with transparent adhesive tape packed layer.
Preferably, the bottom of the lens is provided with protective pad along side.
Compared with prior art, the beneficial effects of the utility model are：The utility model welds LED chip by solder,
So that LED chip and metal heat sink fix stably, metal heat sink is high heat-conducting copper base plate, alloy copper soleplate or other high heat conductions gold
Category base plate, so as to ensure LED encapsulation structure radiating effect when in use, is covered with lens on LED chip, and it can be used
Other transparent materials such as silica gel, its shape can use hemispherical or cylinder, so that lens can be to the beam angle of LED encapsulation structure
Degree is adjusted, and expands its light-emitting area, so as to improve display quality, the viewing effect of beholder is improve, by protective cover
Setting, give LED encapsulation structure provide effectively machinery ensure.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the utility model internal structure schematic diagram；
Fig. 3 is the utility model overlooking the structure diagram.
In figure：Projection, 9 are installed in 1 lens, 2 protective covers, 3 pins, 4 metal heat sinks, 5 solders, 6LED chips, 7 protective pads, 8
Phosphor powder layer, 10 gold threads, 11 pedestals, 12 are sealing adhesive glue.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of LED encapsulation structure, including pedestal 11, institute
The left and right sides for stating pedestal 11 is provided with pin 3, and the inside of the pedestal 11 is provided with metal heat sink 4, the upper end of the metal heat sink 4
LED chip 6 is welded with by solder 5, the LED chip 6 is connected to pin 3, the outside of the LED chip 6 by gold thread 10
Phosphor powder layer 9 is provided with, the upper end outside of the pedestal 11 is provided with protective cover 2, and the upper inside of the protective cover 2 is provided with lens
1。
Further, the pedestal 11 is provided with the glue 12 that is sealing adhesive with the contact position of metal heat sink 4, by the glue 12 that is sealing adhesive
Setting so that pedestal 11 contacts more firm with metal heat sink 4.
Further, the bottom of the lens 1 is provided with installation raised 8, and the projection 8 of installing is connected in the interior of protective cover 2
Portion upside, by the setting for installing raised 8 so that after lens 1 are installed, is connected on the inside of protective cover 2 installing raised 8
Side, the fixation of lens 1, will not outwards come off.
Further, the inside of the lens 1 is provided with transparent adhesive tape packed layer, by the setting of transparent adhesive tape packed layer so that
The inside of lens 1 is in solid shape, while printing opacity is not influenceed, can play a part of to protect lens 1 again.
Further, the bottom of the lens 1 is provided with protective pad 7 along side, by the setting of protective pad 7, effectively protects
Lens 1 will not be caused damage by the bottom of lens 1 in installation process.
Specifically, when using, LED chip 6 is welded by solder 5 so that LED chip 6 and the fix stably of metal heat sink 4,
Metal heat sink 4 is high heat-conducting copper base plate, alloy copper soleplate or other high-thermal conductive metal base plates, so as to ensure that LED encapsulation structure exists
Radiating effect when using, is covered with lens 1 on LED chip 6, and it can be using other transparent materials, its shape such as silica gel
Hemispherical or cylinder can be used, so that lens 1 can be adjusted to the rising angle of LED encapsulation structure, expands its light-emitting area,
So as to improve display quality, the viewing effect of beholder is improve, by the setting of protective cover 2, provided to LED encapsulation structure
Effectively machinery ensures.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out various changes in the case where principle of the present utility model and spirit is not departed from, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of LED encapsulation structure, including pedestal (11), it is characterised in that：The left and right sides of the pedestal (11) is provided with pin
(3), the inside of the pedestal (11) is provided with metal heat sink (4), and the upper end of the metal heat sink (4) is welded with by solder (5)
LED chip (6), the LED chip (6) is connected to pin (3) by gold thread (10), is provided with glimmering on the outside of the LED chip (6)
Light bisque (9), the upper end outside of the pedestal (11) is provided with protective cover (2), and the upper inside of the protective cover (2) is provided with
Mirror (1).
2. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The pedestal (11) and metal heat sink (4)
Contact position is provided with the glue that is sealing adhesive (12).
3. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The bottom of the lens (1) is provided with installation
Raised (8), it is described that the upper inside that raised (8) are connected in protective cover (2) is installed.
4. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The inside of the lens (1) is provided with transparent
Glue packed layer.
5. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The bottom of the lens (1) is provided with along side
Protective pad (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621275513.4U CN206225401U (en) | 2016-11-25 | 2016-11-25 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621275513.4U CN206225401U (en) | 2016-11-25 | 2016-11-25 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206225401U true CN206225401U (en) | 2017-06-06 |
Family
ID=58785776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621275513.4U Expired - Fee Related CN206225401U (en) | 2016-11-25 | 2016-11-25 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206225401U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305927A (en) * | 2018-03-16 | 2018-07-20 | 江苏鸿利国泽光电科技有限公司 | A kind of direct insertion deep ultraviolet LED of inorganic encapsulated |
-
2016
- 2016-11-25 CN CN201621275513.4U patent/CN206225401U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305927A (en) * | 2018-03-16 | 2018-07-20 | 江苏鸿利国泽光电科技有限公司 | A kind of direct insertion deep ultraviolet LED of inorganic encapsulated |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 Termination date: 20201125 |