CN207529596U - LED support, LED module, LED component and display screen - Google Patents

Abstract

The utility model discloses a kind of LED support, LED module, LED component and display screen, wherein, LED support includes substrate and force fit plate, pad is provided on the substrate, the substrate sets pin electrode in the one side of the pad, the pin electrode is connect with the pad by carrying the through-hole through the substrate of electric connection layer, the pad setting is corresponded on the force fit plate and goes out optical channel through the force fit plate, the substrate is connect with the force fit plate by pressure-sensitive adhesive, the pad goes out described in being located in optical channel, when setting LED luminescence units on the pad, it is described go out optical channel form the reflectors of the LED luminescence units.It is bonded by using substrate and force fit plate, also, pad is set on substrate, be set on force fit plate pad it is corresponding go out optical channel, the LED support is allowd to take into account TOP LED and CHIP LED requirements, had both had good spotlight effect, and had also had smaller size and good processing performance.

Description

LED support, LED module, LED component and display screen

Technical field

The utility model is related to LED technology field more particularly to a kind of LED support, LED module, LED component and displays Screen.

Background technology

Existing LED display is mainly formed with adopting surface mounted LED device currently on the market, and adopting surface mounted LED device includes Two kinds of TOP LED and CHIP LED, wherein TOP LED supports structure band reflector and size is larger, in view of its design feature, ruler It will be limited during very little past small development；CHIP LED are then smaller without cup, as device size during small development toward being born.CHIP The manufacturing process of LED is after die bond, bonding wire in the circuit board, whole plastic packaging molding, after by monoblock wiring board cutting-up be single device Part, whole flow process are efficient.

But since CHIP LED are 5 face light extractions, it is impossible to go increase optically focused, therefore meeting by reflector as TOP LED There is optical crosstalk and light extraction the problems in not collect, and display screen of its composition due to spacing it is small, surface not veneer cover so that contrast Difference influences display effect.

Utility model content

One purpose of the utility model is：A kind of LED support is provided, small, producing efficiency is high.

Another purpose of the utility model is：A kind of LED module and LED component are provided, light-gathering is good, can prevent Optical crosstalk.

The further object of the utility model is：A kind of display screen is provided, contrast is high, and display effect is good.

For this purpose, the utility model uses following technical scheme：

In a first aspect, providing a kind of LED support, including substrate and force fit plate, pad, the base are provided on the substrate Pin electrode is set in one side of the backboard from the pad, and the pin electrode is with the pad by carrying passing through for electric connection layer The through-hole connection of the substrate is worn, the pad setting is corresponded on the force fit plate and goes out optical channel, institute through the force fit plate It states substrate to connect by pressure-sensitive adhesive with the force fit plate, the pad goes out described in optical channel, sets when on the pad During LED luminescence units, it is described go out optical channel form the reflectors of the LED luminescence units.

According in a first aspect, in the first possible embodiment of the utility model, it is described go out optical channel have and connect It connects the bottom end of the substrate, the top far from the substrate being oppositely arranged with the bottom end and connect the bottom end and described The side wall on top, the side wall are plane, curved surface or step surface.

According in a first aspect, in second of possible embodiment of the utility model, the pressing plate surface is made mute Light processing.

According in a first aspect, in the third possible embodiment of the utility model, the force fit plate and/or described Substrate is set as black or dark color.

According in a first aspect, in the 4th kind of possible embodiment of the utility model, the thickness of the substrate is 0.2mm~2.0mm, the thickness of the force fit plate is 0.15mm~1.2mm.

According in a first aspect, in the 5th kind of possible embodiment of the utility model, it is described go out optical channel it is close The slot that one end setting of the substrate is recessed inwardly.

According in a first aspect, in the 6th kind of possible embodiment of the utility model, it is described go out in optical channel uses Diameter is 0.5mm~3.0mm cylindrical-shaped structures.

Second aspect provides a kind of LED module, including LED support, multiple LED luminescence units and packaging plastic, the LED Stent using the first aspect of the utility model or the first to the LED any in the 6th kind of possible embodiment Stent, the LED support have multiple pads and it is corresponding with the pad go out optical channel, multiple LED shine list Member is respectively and fixedly installed on the pad of the LED support, and the packaging plastic is filled in going out in optical channel simultaneously for the LED support Cover the LED luminescence units.

The third aspect provides a kind of LED component, the cutting of LED module described in second aspect according to the present utility model and Into.

Fourth aspect, provides a kind of display screen, and the display screen is included described in the third aspect according to the present utility model LED component.

The beneficial effects of the utility model：Force fit plate and substrate can during making separate machined, it is convenient to substrate With the making of force fit plate, while the volume smaller of LED support may be such that, can reduce the size of LED component, the setting of reflector can Enhance the light-gathering of LED component so that the light sent out is more concentrated, and can reduce optical crosstalk phenomenon.

Description of the drawings

The utility model is described in further detail below according to drawings and examples.

Fig. 1 is the schematic cross-section of the LED support described in an embodiment of the utility model.

Fig. 2 is the schematic cross-section of the LED support described in another embodiment of the utility model.

Fig. 3 is the schematic cross-section of the LED support described in another embodiment of the utility model.

Fig. 4 is the schematic cross-section of the LED support described in another embodiment of the utility model.

Fig. 5 is the schematic cross-section of the LED support described in another embodiment of the utility model.

Fig. 6 is the schematic cross-section of the LED module described in an embodiment of the utility model.

Fig. 7 is the schematic cross-section of the LED component described in another embodiment of the utility model.

In figure：

1st, substrate；2nd, force fit plate；3rd, go out optical channel；31st, bottom end；32nd, top；33rd, side wall；4th, pad；5th, glue is pressed；6、 Slot；7th, LED luminescence units；8th, packaging plastic.

Specific embodiment

Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.

As shown in Figure 1, in this present embodiment, a kind of LED support described in the utility model, including substrate 1 and force fit plate 2, pad 4 is provided on the substrate 1, the substrate 1 sets pin electrode, the pin in the one side of the pad 4 Electrode is connect with the pad 4 by carrying the through-hole through the substrate 1 of electric connection layer, and institute is corresponded on the force fit plate 2 It states the setting of pad 4 and goes out optical channel 3 through the force fit plate 2, the substrate 1 is be bonded by pressing glue 5 with the force fit plate 2, The pad 4 be located at it is described go out optical channel 3 in, when setting LED luminescence units on the pad 4, it is described go out optical channel 3 formed The reflector of the LED luminescence units.

It is bonded by using substrate 1 and force fit plate 2, also, pad 4 is set on substrate 1, pad 4 is set on force fit plate 2 It is corresponding go out optical channel 3 so that the LED support can take into account TOP LED and CHIP LED requirements, both have good optically focused effect Fruit also has smaller size and good processing performance.

In an example of the utility model, it is described go out optical channel 3 have connect the substrate 1 bottom end 31, with it is described The top 32 for the separate substrate that bottom end 31 is oppositely arranged and the side wall 33 on the connection bottom end 31 and the top 32, institute Side wall 33 is stated as plane, curved surface or step surface.

In some examples of the utility model, the size of the bottom end 31 is not more than the size on the top 32.Such as Fig. 1 In shown example, the size of bottom end 31 is equal to the size on top 32, and side wall 33 is arc-shaped surface.At this point, it is big to go out optical channel 3 It causes cylindrical.Optionally, it is described go out optical channel use internal diameter as 0.5mm~3.0mm cylindrical-shaped structures.As shown in Figure 2 shows In example, the size of bottom end 31 is less than the size on top 32, and side wall 33 is arc-shaped curved surface.At this point, go out the generally curved bowl of optical channel Shape.It should be pointed out that the present invention not limits the size of bottom end 31 and/or top 32, but to the size of the two Relative size define, with the magnitude relationship both shown.

In an example of the utility model, go out the slot being recessed inwardly close to the setting of one end of the substrate 1 of optical channel 3 6.By setting the slot 6, the faying face of packaging plastic and substrate 1 when going out filling packaging plastic in optical channel 3, can be increased Product improves the bond strength of substrate 1 and force fit plate 2, enhances the air-tightness of LED component.In example as shown in Figure 3, the slot 6 For square groove.In example as shown in Figure 4, the slot 6 is arc groove.In example as shown in Figure 5, the slot 6 is stepped groove. Predictably, the present invention does not limit the shape of slot 6, and the trench structure of other shapes should also be as the protection in the present invention In the range of.

In some examples of the utility model, the substrate 1 sets pin electrode in the one side of the pad 4, The pin electrode is connect with the pad 4 by carrying the through-hole through the substrate 1 of electric connection layer.The electric connection Layer can be the metal layers such as layers of copper, layer gold, be set to the through-hole wall, connect with pad 4 and the pin electrode, realize The electric connection of pad 4 and pin electrode.

In some examples of the utility model, preferably to improve visual effect, the force fit plate 2 and the substrate 1 It is set as black or dark color.Force fit plate 2 and substrate 1 are set as black or dark color can enhance force fit plate 2 and substrate 1 and LED module Or the contrast of light that LED component is sent out, reduce optical crosstalk phenomenon so that the display effect of LED module or LED component is more preferable. Specifically, force fit plate 2 and substrate 1 are made of black or dark material.

In some examples of the utility model, matte management is made on 2 surface of force fit plate, can improve LED module or The contrast for the light that LED component is sent out enhances the display effect of LED module or LED component.

In some examples of the utility model, the thickness of the substrate is 0.2mm~2.0mm, the thickness of the force fit plate It spends for 0.15mm~1.2mm.The substrate 1 of different-thickness can be selected according to different use environments.

In the case of indoors, thickness 0.2mm~1.2mm, preferably 0.4mm~0.8mm can be selected in substrate 1；Situation outdoors Under, thickness 0.5mm~2.0mm, preferably 0.8mm~1.2mm can be selected in substrate 1.Formal dress that can be according to luminescence chip and upside-down mounting, can Select the force fit plate 2 of different-thickness.In the case of positive cartridge chip, the selection of force fit plate 2 thickness 0.3mm~1.2mm, preferably 0.4mm~ 0.6mm；In the case of flip-chip, force fit plate 2 selects thickness 0.15mm~0.5mm, preferably 0.2mm~0.4mm.

Preferably, the substrate 1 and force fit plate 2 are made of BT materials or FR4 materials.

BT materials are synthesized by bismaleimide with cyanate ester resin to be made, and has preferable dielectric properties, low thermal expansion Rate, good mechanical characteristics.FR4 is that resin material passes through a kind of material specification that combustion state allows for self-extinguish, FR4 Material, which is capable of providing, good prevents combustibility.

As shown in fig. 6, the utility model also provides a kind of LED module, including LED support, multiple 7 and of LED luminescence units Packaging plastic 8, the LED support have multiple pads 4 and it is corresponding with pad 4 go out optical channel 3, multiple LED shine list Member 7 is respectively and fixedly installed on the pad 4 of the LED support, and what the packaging plastic 8 was filled in the LED support goes out optical channel 3 It is interior and cover the LED luminescence units 7.

As shown in fig. 7, the embodiment of the utility model also provides a kind of LED component, the LED component is according to described LED module is cut.

In addition, the embodiment of the utility model also provides a kind of display screen, the display screen includes described in the utility model LED component.

It is to be understood that the utility model is illustrated above by specific embodiment, but the utility model It is not limited to these specific embodiments.It will be understood by those skilled in the art that the utility model can also be done various modifications, Equivalent replacement, variation etc..But these convert the spirit without departing from the utility model, it all should be in the utility model Within protection domain.In addition, some terms used in present specification and claims are not limitation, it is only Convenient for description.In addition, " one embodiment ", " another embodiment " described in Yi Shang many places etc. represents different embodiments, It can certainly completely or partially be combined in one embodiment.

Claims (10)

1. a kind of LED support, which is characterized in that including substrate and force fit plate, pad, the substrate back of the body are provided on the substrate Pin electrode is set in the one side from the pad, the pin electrode and the pad by carry electric connection layer through institute The through-hole connection of substrate is stated, the pad setting is corresponded on the force fit plate and goes out optical channel, the base through the force fit plate Plate is connect with the force fit plate by pressure-sensitive adhesive, and the pad goes out described in optical channel, when setting LED is sent out on the pad During light unit, it is described go out optical channel form the reflectors of the LED luminescence units.

2. LED support according to claim 1, which is characterized in that it is described go out optical channel there is the bottom for connecting the substrate End, the separate substrate being oppositely arranged with the bottom end top and connect the side wall on the bottom end and the top, institute Side wall is stated as plane, curved surface or step surface.

3. LED support according to claim 1, which is characterized in that the pressing plate surface makees matte management.

4. LED support according to claim 1, which is characterized in that the force fit plate and/or the substrate are set as black It is or dark.

5. LED support according to claim 1, which is characterized in that the thickness of the substrate is 0.2mm~2.0mm, described The thickness of force fit plate is 0.15mm~1.2mm.

6. LED support according to claim 1, which is characterized in that it is described go out optical channel close to the substrate one end The slot being recessed inwardly is set.

7. LED support according to claim 1, which is characterized in that it is described go out optical channel use internal diameter for 0.5mm~ 3.0mm cylindrical-shaped structure.

8. a kind of LED module, including LED support, multiple LED luminescence units and packaging plastic, which is characterized in that the LED support Using such as claim 1-7 any one of them LED support, the LED support have multiple pads and with the pad pair That answers goes out optical channel, and multiple LED luminescence units are respectively and fixedly installed on the pad of the LED support, the encapsulation Glue is filled in going out in optical channel and covering the LED luminescence units for the LED support.

9. a kind of LED component, which is characterized in that cut using LED module as claimed in claim 8.

10. a kind of display screen, which is characterized in that use LED component as claimed in claim 9.