CN205863219U - A kind of LED encapsulation of Multi-core - Google Patents
A kind of LED encapsulation of Multi-core Download PDFInfo
- Publication number
- CN205863219U CN205863219U CN201620707860.3U CN201620707860U CN205863219U CN 205863219 U CN205863219 U CN 205863219U CN 201620707860 U CN201620707860 U CN 201620707860U CN 205863219 U CN205863219 U CN 205863219U
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- substrate
- cathode electrode
- led
- reflectance coating
- luminous
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
A kind of LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin lens layer, is electrically connected line, reflectance coating, conductive silver paste；Plurality of described luminous die is arranged on the top of described substrate, and is fixed on surface by described conductive silver paste；Described anode electrode, cathode electrode are separately positioned on described substrate both sides, described anode electrode side pass through described in be electrically connected line and be connected with multiple described luminous dies, described cathode electrode side is connected with described substrate by described conductive silver paste；It is characterized in that: described reflectance coating is arranged on the top of described substrate, described cathode electrode is internally formed the bowl shaped space accommodating described luminous die, and the inwall of the formation bowl shaped space of the described reflectance coating described cathode electrode of covering.
Description
Technical field
This utility model belongs to field of semiconductor package, relates to light emitting diode (LED), has well particularly to one
The LED encapsulation structure of the Multi-core of radiator structure and mechanism.
Background technology
Light emitting diode (LED) is a kind of circulating current in quasiconductor, thus sends the diode of light.Wherein, according to
Luminous difference, including using GaAs, (GaAs sends ultrared light emitting diode, uses arsenic gallium aluminum (GaAIAs) to send red
Outside line or the light emitting diode of HONGGUANG, use gallium arsenide phosphide (GaAsP) to send redness, the orange or light emitting diode of yellow,
Use gallium phosphide (GaP) to send the light emitting diode of redness, green or yellow, use gallium nitride (GaN) to send white
Light emitting diode.
It is now widely used for the surface mounting LED in the various fields such as technicolo tabula rasa and illuminator, is by making pottery
The substrate that porcelain or printed circuit board are formed welds LED chip, and at an upper portion thereof with resin plastic-sealed, thus form lens,
While improving brightness, it is easier to give out in heat produced by LED chip.
Light emitting diode (LED:light emitting diode) belongs to a kind of specific type of diode, is can be by
Electric energy is converted into the solid-state semiconductor device of luminous energy, when electric current is by the PN junction of LED, can inspire photon.LED light energy simultaneously
Transformation efficiency is higher, and therefore LED is widely used in instruction, display, illuminating lamp field, and particularly at light source lighting field, LED should
More and more, single emitting led power is increasing.
In recent years, along with the gradually exploitation of high-power LED chip, in order to be effectively discharged out in LED chip produced heat
Technology be developed the most therewith, to improve the radiating efficiency of LED chip, it has been developed that substrate is made by metal material
LED chip, wherein for preventing from producing short circuit when installing LED chip, on metal basal board after formation insulating barrier, passes through shape
Become the circuit board on insulating barrier that LED chip is installed, and realize electrical connection by lead-in wire joint etc..
White light LEDs is little with volume, life-span length, environmental protection, and can meet various adverse circumstances require advantage and obtain greatly
Development, and power type white light LED has become one of important solid light source, its encapsulation technology have also been obtained unprecedented
Development.
A kind of high-power white light LED packaging method as open in Chinese patent CN101404317A, by LED wafer die bond at base
In seat, after baking bonding wire, in pedestal, put transparent silica gel so that transparent silica gel covers LED wafer, then covers whole with lens
Pedestal, then in the cavity that lens and pedestal bonding are formed, fill fluorescent glue at the aperture of picking up the ears of rims of the lens.Final raising
The concordance of LED light color, but this patent is to improving light efficiency DeGrain.
And for example Chinese patent CN101369623A provides the technique of coating fluorescent powder in a kind of LED chip, by fluorescent material and
After glue mixes according to a certain percentage, through repeatedly applying baking-curing, until the glue in bowl and phosphor mixture solidification
After liquid level concordant with bowl top edge, without indenture occur.Effectively solve the fluorescent material precipitation in the solidification of fluorescent material primary coating
And clustering phenomena.
The side of layering and precipitating fluorescent powder during and for example Chinese patent CN101714598A discloses a kind of packaging process of white LED
Method, the most uniformly mixes additive, yellow fluorescent powder, silica gel and does deaeration process, this material is filled into white light LEDs
In high-power support bowl, after keeping 2 hours, carry out segmentation baking, through 70 DEG C, 90 DEG C, 110 DEG C, then keep 1 respectively to 150 DEG C
～2 hours, make white light LEDs finished product.This utility model specially uses the mode of layering and precipitating so that fluorescent material precipitation is uniform,
The problem being effectively improved homogeneity of product difference.Carry out toasting to a certain extent through repeatedly coating baking or segmentation by fluorescent material
Enough play the effect improving aperture, strengthening product uniformity, but usually can introduce fluorescent material lamination simultaneously, still can not obtain
Specular removal, the white light LEDs of high uniformity.
The and for example open a kind of high-power LED encapsulation structure of Chinese patent CN102185087A, uses a kind of big in its structure
Granule mixing small size salt, makes the fluorescent glue of coating more than sides of chip position, is formed consistent with the lens radian covered
Arc.Fluorescent glue of its coating is to be mixed into little granule in bulky grain, the radius of large and small granule, consumption be each meet certain
Proportionate relationship.Bulky grain mixes little granule and can play certain effect improving photochromic quality, but owing to once completing painting
Cover, coating height more than sides of chip position, thus makes sides of chip still deposit a large amount of fluorescent material, it is to avoid not Huang
Occurring again of circle phenomenon.
And for example Chinese patent CN103178194A discloses a kind of large power white light LED encapsulating structure and preparation method thereof,
By first time rotary coating, on LED chip upper surface and sidewall, coating one layer is mixed by small size salt
Layer fluorescent glue, after drying, recycles automatic dispensing machine specking, local corresponding above internal layer fluorescent glue upper surface, LED chip
One layer of outer layer fluorescent glue mixed by large granule fluorescent material of position coating.Outer layer fluorescent glue is utilized to be difficult to infiltrate and dry
The characteristic of internal layer fluorescent glue so that outer layer fluorescent glue only in LED chip upright corresponding local location form a convex closure.Carry
High light efficiency, avoid fluorescent material to be deposited in LED chip lateral location in a large number to a certain extent and produce the technology of yellow circle phenomenon not
Foot.But the program the most thoroughly solves this technical problem.
At present LED photovoltaic transformation efficiency only about 35～50%, other electric energy are converted to heat energy, and the power of LED is not
Disconnected lifting, the heat dissipation problem how solving LED becomes increasingly to highlight.If the heat radiation of LED can not be solved in time, can be because dissipating
Heat makes wavelength change, thus the transformation efficiency producing yellowing phenomenon or light diminishes.Before actual LED uses, it is necessary to
Luminous die is packaged.General finished product LED mainly comprises LED die, heat sink, electrical connection, fluorescence coating, resin lens etc.
Parts.The heat that LED generates finally discharges device and encapsulation, it is necessary to through encapsulation, heat sink, circuit board and each layer connecting layer.Pass
The LED of system is limited to the factors such as its encapsulating structure, heat sink material, light path setting, connecting layer heat conduction and technique, it is impossible to solve very well
Heat dissipation problem, limits further genralrlization and the application of LED, and especially on great power LED, problem highlights to become apparent from.
For solving this technical problem.This utility model people, through concentrating on studies, proposes a kind of side solving this technical problem
Case.
Utility model content
The purpose of this utility model provides a kind of LED encapsulation with great heat radiation effect and method for packing.
This utility model provides a kind of LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence
Layer, resin lens layer, be electrically connected line, reflectance coating, conductive silver paste；Plurality of described luminous die is arranged on described substrate
Top, and it is fixed on surface by described conductive silver paste；Described anode electrode, cathode electrode are separately positioned on described base
Plate both sides, described anode electrode side pass through described in be electrically connected line and be connected with multiple described luminous dies, described cathode electrode
Side is connected with described substrate by described conductive silver paste；It is characterized in that: described reflectance coating is arranged on the top of described substrate,
Described cathode electrode is internally formed the bowl shaped space accommodating described luminous die, and described reflectance coating covers described negative electrode electricity
The inwall of the formation bowl shaped space of pole；And the bottom of described substrate is pressed into the internal shape protruded of bowl shaped space.
Described reflectance coating is arranged on the top of described substrate, and described cathode electrode has been internally formed the described luminous die of receiving
Bowl shaped space, and described reflectance coating covers the inwall of formation bowl shaped space of described cathode electrode.
Preferably, described reflectance coating is W metal film, and thickness is 8nm；Described fluorescence coating, resin lens layer are arranged on described
Above luminous die, and present elliptical lenses shape.
Preferably, described substrate material is SiAl alloy, and the bowl shaped space that described substrate is formed is inverted round table shape；Described
Conductive silver paste is Ag and Sn mixture.
Novel LED encapsulation structure of the present utility model, can improve the radiating effect of LED encapsulation；
Heat conduction silver of the present utility model is starched, and has radiating effect and adhesion strength；
Reflectance coating of the present utility model has good optical reflecting properties, can effectively reflect visible ray and infrared light so that
Luminous energy in LED encapsulation effectively reflects, and improves light emission rate, causes LED temperature higher, under performance with material heat absorption in reducing encapsulation
Fall problem.
As preferably, New LED encapsulation includes that anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin are saturating
Mirror layer.
As preferably, luminous die is positioned at directly over substrate；
As preferably, anode electrode, cathode electrode are positioned at substrate both sides, and cathode electrode also can be one-body molded with substrate.
As preferably, substrate is inverted round table shape, and round platform sideline and base plane angle are 30～60 °；
As preferably, SiAl alloy selected by substrate, and wherein the content of Si is 3～10%；
As preferably, substrate can arrange one or more tube core；
As preferably, can be bondd by conductive silver paste between substrate and luminous die, conductive silver paste is Ag and Sn mixture,
The content of Ag is 15～28%.
As preferably, substrate being provided with layer of Ni reflecting layer, thickness is 5～15nm；
This utility model additionally provide a kind of LED encapsulation method for packing:
1, electrode, substrate cutting, round platform compacting are carried out by press machine；
2, carry out realizing substrate film coating by vacuum coating or electro-plating method；
3, luminous die is fixed on substrate by the silver slurry by modulating, and thickness is 0.05～0.1mm；
4, gold thread welding；
5, fluorescence coating is laid；
6, epoxy resin cure and optical lens are one-body molded；
7, electrical testing.
This utility model has the advantage that
1, this utility model has great heat radiation effect, and tube core is long for service life, and light emission rate and conversion ratio are higher, is suitable for shining
Bright field LED encapsulates use.
2, this utility model process links is more succinct, is suitable for industrialization and produces.
Accompanying drawing explanation
Fig. 1 is Multi-core LED encapsulation structure schematic diagram of the present utility model；
Fig. 2 is the Multi-core LED encapsulation structure schematic diagram of another embodiment of the present utility model；
The Multi-core LED encapsulation structure schematic diagram of Fig. 3 another embodiment of the present utility model.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is further described, but this utility model is not limited to
In these detailed description of the invention.One skilled in the art would recognize that this utility model covers in Claims scope
All alternatives, improvement project and the equivalents potentially included.
Embodiment 1
Below in conjunction with accompanying drawing, this utility model is described in further detail.With reference to Fig. 1, this embodiment provides one many
Tube core LED encapsulation contains anode electrode 05, cathode electrode 04, substrate 03, luminous die 01, fluorescence coating 06, resin lens layer
07, it is electrically connected line 09, reflectance coating 08, conductive silver paste 02.
Plurality of described luminous die 01 is arranged on the top of substrate 03, and is fixed on substrate by conductive silver paste 02
Above in the of 03；Anode electrode 05, cathode electrode 04 are separately positioned on substrate 03 both sides, and anode electrode 05 side is by being electrically connected line
09 is connected in parallel with multiple luminous dies 01, and cathode electrode 04 side is connected with substrate by conductive silver paste 02.
Alternatively, anode electrode 05, cathode electrode 04 also can be connected with luminous die 01 by being electrically connected line 09 both sides.
As shown in Figure 1；Reflectance coating 08 is arranged on above substrate 03, and cathode electrode 04 is formed with the bowl accommodating luminous die 01
Shape space, and the inwall of the formation bowl shaped space of reflectance coating 08 covered cathode electrode 04.
Further, reflectance coating 08 is W metal film, and thickness is 8nm；Fluorescence coating 06, resin lens layer 07 are arranged on luminescence
Above tube core 01, and present elliptical lenses shape.
In this embodiment, substrate material is SiAl alloy, and wherein the content of Si is 3%, and the content of Al is
95%；The bowl shaped space that substrate 03 is formed is inverted round table shape, and round platform sideline and substrate 03 base plane angle are 45 °, substrate
A luminous die 01 is placed on 03；Conductive silver paste 02 is Ag and Sn mixture, and the content of preferred Ag is 18%, the content of Sn
It is 82%.
It is as follows that the present embodiment also provides for a kind of concrete method for packing:
1) substrate manufacture: carry out anode electrode, cathode electrode and substrate cutting by lathe, and use punching press bedding at the moon
The inverted round table shape with holonmic space is suppressed on the electrode of pole；
2) substrate film coating: carry out realizing substrate film coating by vacuum coating, concrete operations are the substrate that will manufacture in step 1
To being placed in film plating frame, open vacuum pump and coater indoor are evacuated to 10-5Pascal, power-on energising plated film,
It is heated to Ni fusing point 5 seconds, fast shut-off power supply, to be cooled, inflate in vacuum chamber, open vacuum chamber, take out substrate,
Thus obtain the reflectance coating on substrate；
3) silver slurry is laid: is fixed on substrate by multiple luminous dies by the silver slurry modulated, and is preheated to 100 DEG C,
Silver slurry on brush, fixing luminous die, silver slurry thickness is 0.08mm；
4) gold thread welding: line will be electrically connected and be connected with luminous die；
5) fluorescence coating is laid: transparent silica gel adds appropriate fluorescent material, covers LED wafer, forms fluorescence coating；
6) resin lens layer is formed: use epoxy resin cure outside fluorescence coating, and be formed as the shape of lens, with light
Lens are one-body molded.Obtain LED encapsulation.
Embodiment 2
With reference to Fig. 2, this embodiment provides a kind of Multi-core LED encapsulation to contain anode electrode 05, cathode electrode 04, base
Plate 03, luminous die 01, fluorescence coating 06, resin lens layer 07, be electrically connected line 09, reflectance coating 08, conductive silver paste 02.
Plurality of described luminous die 01 is arranged on the top of substrate 03, and is fixed on substrate by conductive silver paste 02
Above in the of 03；Anode electrode 05, cathode electrode 04 are separately positioned on substrate 03 both sides, and anode electrode 05 side is by being electrically connected line
09 is connected in series with multiple luminous dies 01, and cathode electrode 04 side is connected with substrate by conductive silver paste 02.
Alternatively, anode electrode 05, cathode electrode 04 also can be connected with luminous die 01 by being electrically connected line 09 both sides.
As shown in Figure 1；Reflectance coating 08 is arranged on above substrate 03, and cathode electrode 04 is formed with the bowl accommodating luminous die 01
Shape space, and the inwall of the formation bowl shaped space of reflectance coating 08 covered cathode electrode 04.
Further, reflectance coating 08 is W metal film, and thickness is 8nm；Fluorescence coating 06, resin lens layer 07 are arranged on luminescence
Above tube core 01, and present elliptical lenses shape.
Embodiment 3,
Different from embodiment 1, the bottom of substrate 03 is pressed into the internal shape protruded of bowl shaped space, so that base
The bottom of plate 03 has bigger cooling surface area, improves the radiating effect of substrate.
This utility model content is simply schematically illustrated by above-mentioned specific embodiment, does not represent this utility model content
Restriction.It may occur to persons skilled in the art that, in this utility model, concrete structure can have a lot of versions, but
The technical characteristics of the used technical solution is same or similar with this utility model, all should be covered by this utility model protection model
In enclosing.
Claims (3)
1. a LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin lens layer, electricity
Learn connecting line, reflectance coating, conductive silver paste；Plurality of described luminous die is arranged on the top of described substrate, and passes through institute
State conductive silver paste and be fixed on surface；Described anode electrode, cathode electrode are separately positioned on described substrate both sides, described anode
Electrode side is electrically connected line and is connected with multiple described luminous dies described in passing through, and described cathode electrode side is by described conduction
Silver slurry is connected with described substrate；It is characterized in that:
Described reflectance coating is arranged on the top of described substrate, and described cathode electrode is internally formed the bowl accommodating described luminous die
Shape space, and the inwall of the formation bowl shaped space of the described reflectance coating described cathode electrode of covering；And the bottom of described substrate
It is pressed into the internal shape protruded of bowl shaped space.
2. LED encapsulation as claimed in claim 1, it is characterised in that: described reflectance coating is W metal film, and thickness is 8nm；
Described fluorescence coating, resin lens layer are arranged on above described luminous die, and present elliptical lenses shape.
3. LED encapsulation as claimed in claim 1, it is characterised in that: described substrate material is SiAl alloy, and described substrate is formed
Bowl shaped space be inverted round table shape；Described conductive silver paste is Ag and Sn mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620707860.3U CN205863219U (en) | 2016-06-30 | 2016-06-30 | A kind of LED encapsulation of Multi-core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620707860.3U CN205863219U (en) | 2016-06-30 | 2016-06-30 | A kind of LED encapsulation of Multi-core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205863219U true CN205863219U (en) | 2017-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620707860.3U Expired - Fee Related CN205863219U (en) | 2016-06-30 | 2016-06-30 | A kind of LED encapsulation of Multi-core |
Country Status (1)
| Country | Link |
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| CN (1) | CN205863219U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105914286A (en) * | 2016-06-30 | 2016-08-31 | 王正作 | Multi-tube core LED package and packaging method thereof |
| CN109192722A (en) * | 2018-08-07 | 2019-01-11 | 东莞中之光电股份有限公司 | A kind of LED flip chip packaging technology |
| CN114719235A (en) * | 2022-03-17 | 2022-07-08 | 漳州汉鼎智能驱动科技有限公司 | LED lamp packaging structure |
-
2016
- 2016-06-30 CN CN201620707860.3U patent/CN205863219U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105914286A (en) * | 2016-06-30 | 2016-08-31 | 王正作 | Multi-tube core LED package and packaging method thereof |
| CN109192722A (en) * | 2018-08-07 | 2019-01-11 | 东莞中之光电股份有限公司 | A kind of LED flip chip packaging technology |
| CN114719235A (en) * | 2022-03-17 | 2022-07-08 | 漳州汉鼎智能驱动科技有限公司 | LED lamp packaging structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170104 Termination date: 20180630 |
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| CF01 | Termination of patent right due to non-payment of annual fee |