CN205828428U - A kind of LED encapsulation - Google Patents

Abstract

A kind of LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin lens layer, is electrically connected line, reflectance coating, conductive silver paste；Wherein said luminous die is arranged on the top of described substrate, and is fixed on surface by described conductive silver paste；Described anode electrode, cathode electrode are separately positioned on described substrate both sides, described anode electrode side pass through described in be electrically connected line and be connected with described luminous die, described cathode electrode side is connected with described substrate by described conductive silver paste；It is characterized in that: described reflectance coating is arranged on the top of described substrate, described cathode electrode is internally formed the bowl shaped space accommodating described luminous die, and the inwall of the formation bowl shaped space of the described reflectance coating described cathode electrode of covering.

Description

A kind of LED encapsulation

Technical field

This utility model belongs to field of semiconductor package, relates to light emitting diode (LED), has well particularly to one Radiator structure and the encapsulating structure of mechanism.

Background technology

Light emitting diode (LED) is a kind of circulating current in quasiconductor, thus sends the diode of light.Wherein, according to Luminous difference, including using GaAs, (GaAs sends ultrared light emitting diode, uses arsenic gallium aluminum (GaAIAs) to send red Outside line or the light emitting diode of HONGGUANG, use gallium arsenide phosphide (GaAsP) to send redness, the orange or light emitting diode of yellow, Use gallium phosphide (GaP) to send the light emitting diode of redness, green or yellow, use gallium nitride (GaN) to send white Light emitting diode.

It is now widely used for the surface mounting LED in the various fields such as technicolo tabula rasa and illuminator, is by making pottery The substrate that porcelain or printed circuit board are formed welds LED chip, and at an upper portion thereof with resin plastic-sealed, thus form lens, While improving brightness, it is easier to give out in heat produced by LED chip.

Light emitting diode (LED:light emitting diode) belongs to a kind of specific type of diode, is can be by Electric energy is converted into the solid-state semiconductor device of luminous energy, when electric current is by the PN junction of LED, can inspire photon.LED light energy simultaneously Transformation efficiency is higher, and therefore LED is widely used in instruction, display, illuminating lamp field, and particularly at light source lighting field, LED should More and more, single emitting led power is increasing.

In recent years, along with the gradually exploitation of high-power LED chip, in order to be effectively discharged out in LED chip produced heat Technology be developed the most therewith, to improve the radiating efficiency of LED chip, it has been developed that substrate is made by metal material LED chip, wherein for preventing from producing short circuit when installing LED chip, on metal basal board after formation insulating barrier, passes through shape Become the circuit board on insulating barrier that LED chip is installed, and realize electrical connection by lead-in wire joint etc..

White light LEDs is little with volume, life-span length, environmental protection, and can meet various adverse circumstances require advantage and obtain greatly Development, and power type white light LED has become one of important solid light source, its encapsulation technology have also been obtained unprecedented Development.

A kind of high-power white light LED packaging method as open in Chinese patent CN101404317A, by LED wafer die bond at base In seat, after baking bonding wire, in pedestal, put transparent silica gel so that transparent silica gel covers LED wafer, then covers whole with lens Pedestal, then in the cavity that lens and pedestal bonding are formed, fill fluorescent glue at the aperture of picking up the ears of rims of the lens.Final raising The concordance of LED light color, but this patent is to improving light efficiency DeGrain.

And for example Chinese patent CN101369623A provides the technique of coating fluorescent powder in a kind of LED chip, by fluorescent material and After glue mixes according to a certain percentage, through repeatedly applying baking-curing, until the glue in bowl and phosphor mixture solidification After liquid level concordant with bowl top edge, without indenture occur.Effectively solve the fluorescent material precipitation in the solidification of fluorescent material primary coating And clustering phenomena.

The side of layering and precipitating fluorescent powder during and for example Chinese patent CN101714598A discloses a kind of packaging process of white LED Method, the most uniformly mixes additive, yellow fluorescent powder, silica gel and does deaeration process, this material is filled into white light LEDs In high-power support bowl, after keeping 2 hours, carry out segmentation baking, through 70 DEG C, 90 DEG C, 110 DEG C, then keep 1 respectively to 150 DEG C ～2 hours, make white light LEDs finished product.This utility model specially uses the mode of layering and precipitating so that fluorescent material precipitation is uniform, The problem being effectively improved homogeneity of product difference.Carry out toasting to a certain extent through repeatedly coating baking or segmentation by fluorescent material Enough play the effect improving aperture, strengthening product uniformity, but usually can introduce fluorescent material lamination simultaneously, still can not obtain Specular removal, the white light LEDs of high uniformity.

The and for example open a kind of high-power LED encapsulation structure of Chinese patent CN102185087A, uses a kind of big in its structure Granule mixing small size salt, makes the fluorescent glue of coating more than sides of chip position, is formed consistent with the lens radian covered Arc.Fluorescent glue of its coating is to be mixed into little granule in bulky grain, the radius of large and small granule, consumption be each meet certain Proportionate relationship.Bulky grain mixes little granule and can play certain effect improving photochromic quality, but owing to once completing painting Cover, coating height more than sides of chip position, thus makes sides of chip still deposit a large amount of fluorescent material, it is to avoid not Huang Occurring again of circle phenomenon.

And for example Chinese patent CN103178194A discloses a kind of large power white light LED encapsulating structure and preparation method thereof, By first time rotary coating, on LED chip upper surface and sidewall, coating one layer is mixed by small size salt Layer fluorescent glue, after drying, recycles automatic dispensing machine specking, local corresponding above internal layer fluorescent glue upper surface, LED chip One layer of outer layer fluorescent glue mixed by large granule fluorescent material of position coating.Outer layer fluorescent glue is utilized to be difficult to infiltrate and dry The characteristic of internal layer fluorescent glue so that outer layer fluorescent glue only in LED chip upright corresponding local location form a convex closure.Carry High light efficiency, avoid fluorescent material to be deposited in LED chip lateral location in a large number to a certain extent and produce the technology of yellow circle phenomenon not Foot.But the program the most thoroughly solves this technical problem.

At present LED photovoltaic transformation efficiency only about 35～50%, other electric energy are converted to heat energy, and the power of LED is not Disconnected lifting, the heat dissipation problem how solving LED becomes increasingly to highlight.If the heat radiation of LED can not be solved in time, can be because dissipating Heat makes wavelength change, thus the transformation efficiency producing yellowing phenomenon or light diminishes.Before actual LED uses, it is necessary to Luminous die is packaged.General finished product LED mainly comprises LED die, heat sink, electrical connection, fluorescence coating, resin lens etc. Parts.The heat that LED generates finally discharges device and encapsulation, it is necessary to through encapsulation, heat sink, circuit board and each layer connecting layer.Pass The LED of system is limited to the factors such as its encapsulating structure, heat sink material, light path setting, connecting layer heat conduction and technique, it is impossible to solve very well Heat dissipation problem, limits further genralrlization and the application of LED, and especially on great power LED, problem highlights to become apparent from.

For solving this technical problem.This utility model people, through concentrating on studies, proposes a kind of side solving this technical problem Case.

Utility model content

The purpose of this utility model provides a kind of LED encapsulation with great heat radiation effect and method for packing.

This utility model provides a kind of LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence Layer, resin lens layer, be electrically connected line, reflectance coating, conductive silver paste；Wherein said luminous die is arranged on the upper of described substrate Side, and it is fixed on surface by described conductive silver paste；Described anode electrode, cathode electrode are separately positioned on described substrate Both sides, described anode electrode side pass through described in be electrically connected line and be connected with described luminous die, described cathode electrode side leads to Cross described conductive silver paste to be connected with described substrate；It is characterized in that:

Described reflectance coating is arranged on the top of described substrate, and described cathode electrode has been internally formed the described luminous die of receiving Bowl shaped space, and described reflectance coating covers the inwall of formation bowl shaped space of described cathode electrode.

Preferably, described reflectance coating is W metal film, and thickness is 8nm；Described fluorescence coating, resin lens layer are arranged on described Above luminous die, and present elliptical lenses shape.

Preferably, described substrate material is SiAl alloy, and the bowl shaped space that described substrate is formed is inverted round table shape；Described Conductive silver paste is Ag and Sn mixture.

Novel LED encapsulation structure of the present utility model, can improve the radiating effect of LED encapsulation；

Heat conduction silver of the present utility model is starched, and has radiating effect and adhesion strength；

Reflectance coating of the present utility model has good optical reflecting properties, can effectively reflect visible ray and infrared light so that Luminous energy in LED encapsulation effectively reflects, and improves light emission rate, causes LED temperature higher, under performance with material heat absorption in reducing encapsulation Fall problem.

As preferably, New LED encapsulation includes that anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin are saturating Mirror layer.

As preferably, luminous die is positioned at directly over substrate；

As preferably, anode electrode, cathode electrode are positioned at substrate both sides, and cathode electrode also can be one-body molded with substrate.

As preferably, substrate is inverted round table shape, and round platform sideline and base plane angle are 30～60 °；

As preferably, SiAl alloy selected by substrate, and wherein the content of Si is 3～10%；

As preferably, substrate can arrange one or more tube core；

As preferably, can be bondd by conductive silver paste between substrate and luminous die, conductive silver paste is Ag and Sn mixture, The content of Ag is 15～28%.

As preferably, substrate being provided with layer of Ni reflecting layer, thickness is 5～15nm；

This utility model additionally provide a kind of LED encapsulation method for packing:

1, electrode, substrate cutting, round platform compacting are carried out by press machine；

2, carry out realizing substrate film coating by vacuum coating or electro-plating method；

3, luminous die is fixed on substrate by the silver slurry by modulating, and thickness is 0.05～0.1mm；

4, gold thread welding；

5, fluorescence coating is laid；

6, epoxy resin cure and optical lens are one-body molded；

7, electrical testing.

This utility model has the advantage that

1, this utility model has great heat radiation effect, and tube core is long for service life, and light emission rate and conversion ratio are higher, is suitable for shining Bright field LED encapsulates use.

2, this utility model process links is more succinct, is suitable for industrialization and produces.

Accompanying drawing explanation

Fig. 1 is this utility model LED encapsulation structure schematic diagram；

Fig. 2 a and Fig. 2 b is this utility model LED package substrate and electrode schematic diagram；

Fig. 3 a, Fig. 3 b and Fig. 3 c are substrate and electrode schematic diagrams in embodiment one；

Fig. 4 is split series connection schematic diagram in embodiment two；

Detailed description of the invention

Below in conjunction with specific embodiment, this utility model is further described, but this utility model is not limited to In these detailed description of the invention.One skilled in the art would recognize that this utility model covers in Claims scope All alternatives, improvement project and the equivalents potentially included.

Embodiment 1

Below in conjunction with accompanying drawing, this utility model is described in further detail.With reference to Fig. 1, this embodiment provides one LED encapsulation contains anode electrode 05, cathode electrode 04, substrate 03, luminous die 01, fluorescence coating 06, resin lens layer 07, electricity Learn connecting line 09, reflectance coating 08, conductive silver paste 02.

Wherein said luminous die 01 is arranged on the top of substrate 03, and is fixed on substrate 03 by conductive silver paste 02 Side；Anode electrode 05, cathode electrode 04 are separately positioned on substrate 03 both sides, anode electrode 05 side by be electrically connected line 09 with Luminous die 01 connects, and cathode electrode 04 side is connected with substrate by conductive silver paste 02.

Alternatively, as shown in Figure 2 a and 2 b, anode electrode 05, cathode electrode 04 also can both sides by being electrically connected line 09 It is connected with luminous die 01.

As shown in Figure 1, Figure 2 shown in a, Fig. 2 b, Fig. 3 a, Fig. 3 b, Fig. 3 c and Fig. 4；Reflectance coating 08 is arranged on above substrate 03, negative electrode Electrode 04 is formed with the bowl shaped space accommodating luminous die 01, and the formation bowl shaped space of reflectance coating 08 covered cathode electrode 04 Inwall.

Further, reflectance coating 08 is W metal film, and thickness is 8nm；Fluorescence coating 06, resin lens layer 07 are arranged on luminescence Above tube core 01, and present elliptical lenses shape.

In this embodiment, substrate material is SiAl alloy, and wherein the content of Si is 3%, and the content of Al is 95%；The bowl shaped space that substrate 03 is formed is inverted round table shape, and round platform sideline and substrate 03 base plane angle are 45 °, substrate A luminous die 01 is placed on 03；Conductive silver paste 02 is Ag and Sn mixture, and the content of preferred Ag is 18%, the content of Sn It is 82%.

It is as follows that the present embodiment also provides for a kind of concrete method for packing:

1) substrate manufacture: carry out anode electrode, cathode electrode and substrate cutting by lathe, and use punching press bedding at the moon The inverted round table shape with holonmic space is suppressed on the electrode of pole；

2) substrate film coating: carry out realizing substrate film coating by vacuum coating, concrete operations are the substrate that will manufacture in step 1 To being placed in film plating frame, open vacuum pump and coater indoor are evacuated to 10^-5Pascal, power-on energising plated film, It is heated to Ni fusing point 5 seconds, fast shut-off power supply, to be cooled, inflate in vacuum chamber, open vacuum chamber, take out substrate, Thus obtain the reflectance coating on substrate；

3) silver slurry is laid: is fixed on substrate by luminous die by the silver slurry modulated, and is preheated to 100 DEG C, on brush Silver slurry, fixing luminous die, silver slurry thickness is 0.08mm；

4) gold thread welding: line will be electrically connected and be connected with luminous die；

5) fluorescence coating is laid: transparent silica gel adds appropriate fluorescent material, covers LED wafer, forms fluorescence coating；

6) resin lens layer is formed: use epoxy resin cure outside fluorescence coating, and be formed as the shape of lens, with light Lens are one-body molded.Obtain LED encapsulation.

This utility model content is simply schematically illustrated by above-mentioned specific embodiment, does not represent this utility model content Restriction.It may occur to persons skilled in the art that, in this utility model, concrete structure can have a lot of versions, but The technical characteristics of the used technical solution is same or similar with this utility model, all should be covered by this utility model protection model In enclosing.

Claims (3)

1. a LED encapsulation, contains anode electrode, cathode electrode, substrate, luminous die, fluorescence coating, resin lens layer, electricity Learn connecting line, reflectance coating, conductive silver paste；Wherein said luminous die is arranged on the top of described substrate, and leads described in passing through Electricity silver slurry is fixed on surface；Described anode electrode, cathode electrode are separately positioned on described substrate both sides, described anode electrode Side is electrically connected line and is connected with described luminous die described in passing through, and described conductive silver paste and institute are passed through in described cathode electrode side State substrate to connect；It is characterized in that:

Described reflectance coating is arranged on the top of described substrate, and described cathode electrode is internally formed the bowl accommodating described luminous die Shape space, and the inwall of the formation bowl shaped space of the described reflectance coating described cathode electrode of covering.

2. LED encapsulation as claimed in claim 1, it is characterised in that: described reflectance coating is W metal film, and thickness is 8nm；Described Fluorescence coating, resin lens layer are arranged on above described luminous die, and present elliptical lenses shape.

3. LED encapsulation as claimed in claim 1, it is characterised in that: described substrate material is SiAl alloy, and described substrate is formed Bowl shaped space be inverted round table shape；Described conductive silver paste is Ag and Sn mixture.