CN205196097U - Miniature piece formula electronic component - Google Patents
Miniature piece formula electronic component Download PDFInfo
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- CN205196097U CN205196097U CN201521015519.3U CN201521015519U CN205196097U CN 205196097 U CN205196097 U CN 205196097U CN 201521015519 U CN201521015519 U CN 201521015519U CN 205196097 U CN205196097 U CN 205196097U
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- insulated substrate
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Abstract
The utility model discloses a miniature piece formula electronic component, including insulation substrate, front electrode, back electrode, run through the conducting hole at the front and the back, and be equipped with electrically conductive buried via hole material in the conducting hole and all form electric the connection with front electrode and back electrode, so need not electroplate and just to make front, back electrode realize being electrically connected, and not influence the performance of other aspects of electronic component, it is littleer, thinner to make the electronic component volume accomplish, has not only reduced the technology degree of difficulty, has saved the cost, has also reduced and has electroplated the pollution to the environment.
Description
Technical field
The utility model belongs to field of electrical components, that be specifically related to a kind of chip profile, that volume is small electronic component.
Background technology
Along with the development trend of miniaturization of electronic products, higher small-sized and ultra-thin requirement is also proposed accordingly to the electronic devices and components be applied thereon.Wherein apply the electronic component of surface-adhered type very widely, usually adopt the mode of printed wire on insulated substrate to manufacture.General this technique needs the positive and negative type metal electrode respectively at the two ends of insulated substrate, be called front electrode and backplate, in order to the front electrode and backplate that make each end form electrical connection respectively, usually two kinds of methods are had, one is sputtering or painting silver on the end face of two ends, carry out barrel plating again, rack plating forms metal side connecting electrode, as Chinese patent 02149220.4; Two is punch on front and back electrode, chemical plating layer of metal on hole wall, then carries out rack plating, could connect front and back electrode, as Chinese patent 200810092353.3.These two kinds of modes all need to increase electroplating technique step to electronic component, not only add technology difficulty and cost, also to environment.
Therefore, need a kind of new technical scheme to solve the problem.
Utility model content
Usually adopt front electrode and the backplate of the mode connecting electronic component of plating in prior art, technology difficulty is high, and cost is high, also can to environment.The utility model provides a kind of miniature electronic element of environmental protection, does not need plating just can make front, backplate realization electrical connection, and does not affect the otherwise performance of electronic component, electronic component volume can also be made to accomplish less, thinner.
For achieving the above object, the utility model can adopt following technical scheme:
A kind of miniature electronic element, the backplate comprising insulated substrate, be positioned at the front electrode in insulated substrate front, be positioned at the insulated substrate back side; Described insulated substrate is provided with at least one via running through insulated substrate front and the back side, this via overlaps with front electrode at least partly at the opening in front, this via opening overleaf overlaps at least partly with backplate, be provided with the buried via hole material of conduction in this via, this buried via hole material is all formed with front electrode and backplate and is electrically connected.
The miniature electronic element of environmental protection of the present utility model, punch between front and back electrode, in via, buried via hole material is filled by buried via hole printing technology, to reach the effect connecting front and back electrode, do not need plating just can make front, backplate realization electrical connection like this, and do not affect the otherwise performance of electronic component, electronic component volume can also be made to accomplish less, thinner, not only reduce technology difficulty, provide cost savings, also reduce the pollution of plating to environment.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of monoblock insulated substrate in the utility model first embodiment.
Fig. 2 is the schematic diagram punched on monoblock insulated substrate in the utility model first embodiment.
Fig. 3 is the schematic diagram of each electronic component unit after punching in the utility model first embodiment.
Fig. 4 is the schematic diagram of each electronic component unit front buried via hole in the utility model first embodiment.
Fig. 5 is the schematic diagram of each electronic component unit front buried via hole section in the utility model first embodiment.
Fig. 6 is the schematic diagram of each electronic component unit printing front electrode in the utility model first embodiment.
Fig. 7 is the schematic diagram that in the utility model first embodiment, each electronic component unit front forms circuit.
Fig. 8 is the schematic diagram that in the utility model first embodiment, each electronic component unit front forms protective layer.
Fig. 9 is the schematic diagram that in the utility model first embodiment, each electronic component unit is turned to the back side.
Figure 10 is the schematic diagram of each electronic component unit back side buried via hole in the utility model first embodiment.
Figure 11 is the schematic diagram of each electronic component unit back side buried via hole section in the utility model first embodiment.
Figure 12 is the schematic diagram of each electronic component unit printed back electrode in the utility model first embodiment.
Figure 13 is the schematic diagram that in the utility model first embodiment, monoblock insulated substrate longitudinally splits slivering.
Figure 14 is the schematic diagram that in the utility model first embodiment, whole piece insulated substrate is horizontally divided into single electronic component.
Figure 15 is view when buried via hole viscosity of material is suitable in the utility model first embodiment.
Figure 16 is view when buried via hole viscosity of material is excessive in the utility model first embodiment.
Figure 17 is view when buried via hole viscosity of material is too small in the utility model first embodiment.
Figure 18 is the generalized section of electronic component in the utility model the 3rd embodiment.
Wherein, each label representative in accompanying drawing: 1-insulated substrate, 2-via, 3-buried via hole material, 4-front electrode, 5-element function circuit, 6-protective layer, 7-backplate, 21-first via, 22-second via, 31-front first buried via hole material, 32-front second buried via hole material, 41-first front electrode, 42-second front electrode, 43-front nexine electrode, 44-front outer electrode, the 33-back side the 3rd buried via hole material, the 34-back side the 4th buried via hole material, 71-first backplate, 72-second backplate, 73-back side nexine electrode, 74-back side outer electrode.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the utility model further, these embodiments should be understood and be only not used in restriction scope of the present utility model for illustration of the utility model, after having read the utility model, the amendment of those skilled in the art to the various equivalent form of value of the present utility model has all fallen within the application's claims limited range.
First embodiment:
Shown in composition graphs 1 to Figure 12; the present embodiment is a kind of miniature chip fuse; comprise insulated substrate 1, front electrode 4, backplate 7, be arranged in insulated substrate 1 front and be electrically connected element function circuit 5 (the present embodiment element function circuit is fuse) and the protective layer 6 of two front electrodes 4; wherein the front of insulated substrate 1 is provided with two front electrodes 4 and lays respectively at the two ends in insulated substrate 1 front, to two front electrodes 4 being provided with two backplates 7 equally at insulated substrate 1 back side and decibel is positioned at the two ends at insulated substrate 4 back side.Between the front electrode 4 and backplate 7 of same one end, described via 2 is set.Fuse 5 is arranged between insulated substrate 1 front, two ends front electrode 4; and formed with two ends front electrode and be electrically connected; protective layer 6 wraps up element fuse 5; the two ends that insulated substrate 1 prints front electrode and backplate are provided with via 2; in via 2, fill up buried via hole material by printing technology, make the front electrode of each end and backplate form electrical connection respectively.
Its manufacture process is as follows:
As shown in Figure 1, a monolithic ceramic substrate carves groove in length and breadth, each grid divided out is a fuse unit, and the one side of cutting is called front, and one side is called the back side in addition.As shown in Figure 2, get through hole 2 at the two ends of each fuse unit, and paste one deck high temperature gummed tape at the whole back side (namely bottom via).As shown in Figure 3, be one of them fuse unit on an above-mentioned monolithic ceramic substrate, have substrate 1, first via 21 and the second via 22, wherein via 21 and 22 is same diameter, and the substrate edges of not contact fuse unit, base plate bottom posts high temperature gummed tape.As shown in Figure 4, at the place of substrate front side each via printing buried via hole material, SAC (Sn60% is used in the present embodiment, Ag35%, Cu5%) slurry, with the silver paste replacing cost higher, what imbed in the first via 21 is front first buried via hole material 31, what imbed in the second via 22 is front second buried via hole material 32, dry, sintering.Concrete printing process is, remainder is hidden with the silk screen made, expose via part mesh, screen printing forme one end is poured buried via hole material paste into, certain pressure is applied with scraping the slurry position of head on screen printing forme, move towards the screen printing forme other end, slurry is expressed in via from mesh by scraper plate in movement simultaneously.Optionally to repeat print action, in the present embodiment, print three times back and forth.The present embodiment prints buried via hole material in via, does not need other equipment newly-increased, utilizes the printing equipment of existing printing front electrode can reach the effect of filling perforation.
After being illustrated in figure 5 front buried via hole, the profile of via 22, in 22, buried via hole material 32 can fill the half or more than half of degree of depth of substrate thickness, because via bottoms posts high temperature gummed tape, so buried via hole material can not flow out outside substrate scope.As shown in Figure 6, at the two ends of each fuse unit printing front electrode 4, print one deck silver paste in the present embodiment, republish one deck SAC slurry, good conductivity and solderability can be reached like this.And dry, sintering, in the present embodiment, the width of electrode is greater than the diameter of via, and electrode covers via completely.First front electrode 41 covers the opening of the first via 21 in front, second front electrode 42 covers the opening of the second via 22 in front, after sintering, the first front electrode 41 is formed with front first buried via hole material 31 and is electrically connected, and the second front electrode 42 is formed with front second buried via hole material 32 and is electrically connected.
As shown in Figure 7, between front electrode 41 and 42, print fuse pattern 5, use silver paste to print fuse pattern in the present embodiment, dry, sintering, circuit 5 and 41 contacts with 42 and is formed and is electrically connected.As shown in Figure 8, between front electrode 41 and 42, print protective layer 6, dry, sintering, protective layer 6 covers the pattern of fuse 5, not coated electrode 4.
As shown in Figure 9, by monolithic ceramic substrate overturn to the back side, the high temperature gummed tape being originally attached to the back side is eliminated in the hot environment of 850-900 DEG C of sintering, optionally can increase cleaning step if any cull.As shown in Figure 10, the place printing buried via hole material of each via overleaf, what imbed in via 21 is the back side the 3rd buried via hole material 33, and what imbed in via 22 is the back side the 4th buried via hole material 34, dry, sintering.Be after the buried via hole of the back side as shown in figure 11, the profile of via 21, the back side the 3rd buried via hole material 33 fully contacts with front first buried via hole material 31, fills up in whole via 21, and after sintered, 31 and 33 form good electrical connection.Same, what the back side the 4th buried via hole material 34 was filled fully contacts with front second buried via hole material 32, and be full of in whole via 22,34 and 32 form good electrical connection.As shown in figure 12, at the two ends printed back electrode 7 of each fuse unit, be printing one deck silver paste in the present embodiment, republish one deck SAC slurry, dry, sintering, the width of electrode is greater than the diameter of via, and electrode covers via completely.First backplate 71 covers the first via 21 opening overleaf, and the second backplate 72 covers the second via 22 opening overleaf.After sintered, the first front electrode 41, by the buried via hole material 31 and 33 in via 21, defines good electrical connection with the first backplate 71, same, and 42 to be formed by 32 and 34 and 72 in via 22 and are electrically connected.As shown in figure 13, according to the groove carved in Fig. 1, monoblock insulated substrate longitudinally splits slivering, and as shown in figure 14, the insulated substrate of whole piece is horizontally divided into single electronic component.As mentioned above, do not need plating, only need printing technology, just can realize the electrical connection of two ends front electrode and backplate.
In fact, the state of two-face printing buried via hole is not exclusively also the rule state in Figure 11, the effect of printing buried via hole and aperture, hole depth, the viscosity of buried via hole material and composition, and print speed printing speed, number of times and half tone mesh size etc. are relevant, as shown in figure 15, the direction of arrow is front, when buried via hole viscosity of material is suitable time, in viscous pasty state, as shown in the left diagram, front is printed into the buried via hole material in via, because Action of Gravity Field slowly flows downward, repeatedly can fill the distance exceeding hole depth half after printing, the effect that can reach in left figure for three times is printed back and forth in the present embodiment.Because high temperature gummed tape is posted in bottom, form certain vacuum degree, so buried via hole material can not be unconfined toward current downflow, just stop to a certain extent, also can only reach fixing height several times even if republish, after sintering curing, just can stay the place of contact front electrode in through hole.As shown at right, be turned to the back side second impression and enter buried via hole material, just can fill up whole via.Figure 16 shows that the situation that buried via hole viscosity of material is excessive or via is excessively dark, the direction of arrow is front, as shown in the left diagram, front be printed into buried via hole material in via too thickness cannot move down, the distance exceeding hole depth half can not be filled, as shown at right, be turned to the back side second impression and enter buried via hole material, whole via can not be filled up, just can not reach in the utility model the effect connecting front and back electrode.As shown in figure 17, when buried via hole viscosity of material is little time, because high temperature gummed tape is posted in bottom, time front printing buried via hole material enters via, can flow downward and be deposited on bottom, but still can fill up whole via by repeatedly printing, the back side is not even needed again to print the effect that just can reach in the utility model and connect front and back electrode, if but buried via hole viscosity of material is too small, can spill from the high temperature gummed tape gap of bottom adhe, cause between buried via hole material and front electrode and produce gap, affect final turn-on effect, so need to select suitable aperture in actual production, hole depth, the viscosity of buried via hole material and composition, and print speed printing speed, number of times and half tone mesh size.In the present embodiment, the length, width and height of final products single fuse are 6.4mmx3.25mmx0.75mm, and the width of front electrode and backplate is 1mm, and via is circular hole, diameter is the center superposition of 0.5mm, the via center of circle and front and back electrode, and via hole depth is 0.75mm, buried via hole material is SAC (Sn60%, Ag35%, Cu5%), viscosity is 30000cP, print speed printing speed is 3-8cm/S, half tone mesh is 100 orders, and front prints 3 times, back up 2 times.
Second embodiment:
The present embodiment is a kind of miniature chip fuse; structure is identical with the first embodiment; manufacture method has been beaten after via on monoblock substrate; first stick high temperature gummed tape in substrate front side; print buried via hole material, printing back electrode overleaf, overturn monoblock substrate more afterwards, at front printing buried via hole material, printing front electrode, printing fuse and protective layer; finally carry out longitudinal direction segmentation and horizontal partition, still can form single fuse element of effect same.
3rd embodiment:
The present embodiment is a kind of alloy sheets precision resistance, as shown in figure 18, comprise insulated substrate 1, the via 2 at two ends, be positioned at two front electrodes 4 (comprising the front electrode layer 43 be covered on insulated substrate front and the outer front electrode layer 44 covered on front electrode) at two ends, insulated substrate front, be positioned at two backplates 7 (comprising the back electrode layer be covered on the insulated substrate back side and the outer back electrode layer 74 covered on back electrode layer 73) at two ends, the insulated substrate back side, the resistance alloys sheet 5 of these two front electrodes 4 is electrically connected between two front electrodes 4, the protective layer 6 of covering alloy resistor disc 5.Between the front electrode and backplate of same one end, via 2 is set.Fill up buried via hole material 3 in this two ends via 2, connect the front and back electrode of each end.Front electrode layer 43 and outer front electrode layer 44 in described resistance alloys sheet 5 is electrically connected simultaneously.Its manufacture process is as follows:
Via 2 is produced at the two ends of each resistive element unit of PCB substrate, high temperature gummed tape is sticked in front, back up buried via hole material 3, now the half or over half of via 2 degree of depth filled by buried via hole material 3, then print two ends nexine backplate 73, two ends nexine backplate 73 republishes one deck electrode 74, and dry, sintering, the material of 74 well can merge with 73, and can reach good solderability.Substrate overturn, front printing buried via hole material 3, now buried via hole material 3 fills up whole via 2, printing two ends nexine front electrode 43, each step all dryings above, sintering, now two ends nexine front electrode 43 is defined with two ends nexine backplate 73 respectively by the buried via hole material 3 in via 2 and is electrically connected.By the mode of a glue, resistance alloys sheet 5 is fitted between two nexine front electrodes 43, resistance alloys sheet 5 has overlapping of certain distance with two ends 43, but not exclusively cover 43, the outer front electrode 44 at the two ends of 43 printed thereon same materials, and dry, sintering, 43 and 44 good merge and wrap up the two ends of resistance alloys sheet 5, realize front electrode and are connected with the good electrical of resistance alloys sheet.Alloy resistor disc 5 carries out radium-shine resistance trimming.Above resistance alloys sheet, print protective layer 6, dry, sintering, protective layer 6 is covering alloy resistor disc 5 completely, not exclusively covers two ends front electrode 44.Finally monoblock PCB substrate is partitioned into the resistance product of single.
Claims (10)
1. a miniature electronic element, the backplate comprising insulated substrate, be positioned at the front electrode in insulated substrate front, be positioned at the insulated substrate back side; It is characterized in that: described insulated substrate is provided with at least one via running through insulated substrate front and the back side, this via overlaps with front electrode at least partly at the opening in front, this via opening overleaf overlaps at least partly with backplate, be provided with the buried via hole material of conduction in this via, this buried via hole material is all formed with front electrode and backplate and is electrically connected.
2. miniature electronic element according to claim 1, is characterized in that: described via is covered by front electrode completely at the opening in front, via opening is overleaf covered by backplate completely.
3. miniature electronic element according to claim 2, is characterized in that: described via is circular hole, and the diameter of this circular hole is less than the width of front electrode and backplate.
4. miniature electronic element according to claim 3, is characterized in that: the buried via hole material in described via and described front electrode and described backplate adopt same material.
5. miniature electronic element according to claim 4, is characterized in that: described buried via hole materials'use SAC slurry.
6. miniature electronic element according to any one of claim 1 to 5, it is characterized in that: this miniature electronic element is miniature chip fuse, wherein the front of insulated substrate is provided with two front electrodes and lays respectively at the two ends in insulated substrate front, to two front electrodes two backplates should be provided with equally at the insulated substrate back side and lay respectively at the two ends at the insulated substrate back side, described via is set between the front electrode and backplate of same one end; The front of insulated substrate is also provided with the element function circuit of electrical connection two front electrodes.
7. miniature electronic element according to claim 6, is characterized in that: described element function circuit is fuse, insulated substrate is also provided with the protective layer of parcel fuse.
8. miniature electronic element according to any one of claim 1 to 5, it is characterized in that: this miniature electronic element is alloy sheets precision resistance, wherein the front of insulated substrate is provided with two front electrodes and lays respectively at the two ends in insulated substrate front, corresponding described two front electrodes are provided with two backplates equally at the insulated substrate back side and lay respectively at the two ends at the insulated substrate back side, between the front electrode and backplate of same one end, arrange described via; Also there is between described two front electrodes the resistor disc of these two front electrodes of electrical connection.
9. miniature electronic element according to claim 8, is characterized in that: the protective layer being also provided with parcel resistor disc.
10. miniature electronic element according to claim 9, it is characterized in that: described front electrode comprises the interior front electrode layer be covered on insulated substrate front and the outer front electrode layer covered on interior front electrode, and described resistor disc is electrically connected interior front electrode layer and outer front electrode layer simultaneously; Described backplate comprises the interior back electrode layer be covered on the insulated substrate back side and the outer back electrode layer covered on interior back electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521015519.3U CN205196097U (en) | 2015-12-09 | 2015-12-09 | Miniature piece formula electronic component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521015519.3U CN205196097U (en) | 2015-12-09 | 2015-12-09 | Miniature piece formula electronic component |
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| CN205196097U true CN205196097U (en) | 2016-04-27 |
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| CN201521015519.3U Active CN205196097U (en) | 2015-12-09 | 2015-12-09 | Miniature piece formula electronic component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231371A (en) * | 2016-12-15 | 2018-06-29 | 昆山福仕电子材料工业有限公司 | Two-side film membrane inductor and preparation method thereof |
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2015
- 2015-12-09 CN CN201521015519.3U patent/CN205196097U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231371A (en) * | 2016-12-15 | 2018-06-29 | 昆山福仕电子材料工业有限公司 | Two-side film membrane inductor and preparation method thereof |
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