CN204560028U - There is the printed circuit board of embedding resistance - Google Patents
There is the printed circuit board of embedding resistance Download PDFInfo
- Publication number
- CN204560028U CN204560028U CN201520262440.4U CN201520262440U CN204560028U CN 204560028 U CN204560028 U CN 204560028U CN 201520262440 U CN201520262440 U CN 201520262440U CN 204560028 U CN204560028 U CN 204560028U
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Abstract
The utility model discloses a kind of printed circuit board with embedding resistance; Belong to circuit board technology field; Its technical essential comprises body, wherein said body is provided with some first through holes or the first blind hole along the direction in vertical panel face, the first resistance printing ink is filled with in the first through hole or the first blind hole, first resistance printing ink is provided with the second through hole or the second blind hole, in the second through hole or the second blind hole, be filled with the first dielectric ink or electrically conductive ink, the first resistance printing ink is connected to form serial or parallel connection structure by the metallic conductor on body; The printed circuit board with embedding resistance that the utility model aims to provide a kind of compact conformation, resistance precision can accurately control; Prepare for circuit board.
Description
Technical field
The utility model relates to a kind of board structure of circuit, more particularly, particularly relates to one and has embedding resistance printed circuit board.
Background technology
Along with electronic product compactization increasingly, and its function growth requirement that more multimode integrated level is higher, motherboard as mounting related components: printed circuit board (PCB:print circuit board), its figure is more complicated meticulous, more product requirement is reserved to initiatively chip and more mount space simultaneously, therefore imbeds a kind of inexorable trend that passive device technology becomes printed circuit board development gradually.Imbed passive device technology and not only can reduce attachment expense, and plate face size under same design condition, can be reduced; The shortening of signal transmission distance can reduce electromagnetic interference, improves signal integrity; Device solder joint number reduces and greatly can improve product reliability simultaneously.
The embedding resistance circuit board technology of current main flow mainly contains two kinds: a kind of is the flat film resistance that is representative with the product of Ohmega company of the U.S., i.e. a kind of nickel phosphorus film resistor in the process of Copper Foil hair side, then be pressed together on insulating substrate and become thin substrate, after graphic making, form flat film resistance; One is silk-screen resistive technologies, resistance printing ink for representative, is printed on circuit board patterned surface by the technology of wire mark with the resistance printing ink of Japanese Ashahi company by ink for screen printing, forms silk-screen thick-film resistor, the thickness of its resistive film is at least more than 3 μm, and industry is also referred to as planar thick film resistance.But the technological deficiency of two kinds of embedding resistances hinders its development and commercialization, the flat film resistance of Ohmega company of the U.S. is expensive, cost of manufacture is far longer than the resistive element of surface soldered, and its large resistance formed needs to take very large area, and this defect not easily overcomes, although silk-screen planar resistor is cheap, significantly can reduce the cost of embedding resistance circuit board, but its complex process, high to the silk-screen performance requirement of resistance printing ink, silkscreen precision control ability is poor, along with the increase of resistance, control ability declines gradually, it has been very difficult that current industry can control 20%, and in silk-screen printing process, resistance printing ink can the exhibition of oozing in the in-plane direction (exhibition of oozing be resistance printing ink in press and the expansion of uncured forward direction ink outer and the irregular phenomenon in a kind of edge that presents, some is similar to ink and oozes paper phenomenon) bring to circuit board micro-short, the bad phenomenon such as short circuit.
Utility model content
The purpose of this utility model is for above-mentioned the deficiencies in the prior art, provides the printed circuit board with embedding resistance that a kind of compact conformation, resistance precision can accurately control.
The technical solution of the utility model is achieved in that a kind of printed circuit board with embedding resistance, comprise body, wherein said body is provided with some first through holes or the first blind hole along the direction in vertical panel face, the first resistance printing ink is filled with in the first through hole or the first blind hole, first resistance printing ink is provided with the second through hole or the second blind hole, in the second through hole or the second blind hole, be filled with the first dielectric ink or electrically conductive ink, the first resistance printing ink is connected to form serial or parallel connection structure by the metallic conductor on body.
Above-mentioned has in the printed circuit board of embedding resistance, on at least one conductive plate face of described body, pressing has semi-solid preparation insulation material layer, semi-solid preparation insulation material layer is provided with fourth hole, the second resistance printing ink is filled with in fourth hole, second resistance printing ink is provided with fifth hole, in fifth hole, is filled with the second dielectric ink or electrically conductive ink; Outside semi-solid preparation insulation material layer, be provided with metal level, the second resistance printing ink is connected by the metallic conductor on body and metal level and forms serial or parallel connection structure.
Above-mentioned has in the printed circuit board of embedding resistance, and described body is single layer printed circuit plate, double layer printed circuit plate or multilayer printed circuit board.
Above-mentioned has in the printed circuit board of embedding resistance, and on the degree of depth of described first through hole or the first blind hole and body, the thickness of single-layer insulation material layer or the thickness of some layers of insulation material layer adapt.
After the utility model adopts above-mentioned technique and structure, compared with prior art, there is following advantage:
(1) at circuit board vertical direction embedding resistance, reduce attachment expense, and plate face size under same design condition, can be reduced; The shortening of signal transmission distance can reduce electromagnetic interference, improves signal integrity; Device solder joint number reduces and greatly can improve product reliability simultaneously;
(2) reduce costs, the metal thin film resistor that the utility model both need not be expensive, also without the silk-screen planar resistor ink (meeting high accuracy silk-screen demand) that price is relatively high, required resistance printing ink and common insulation rabbet ink similar;
(3) resistance precision is promoted, first be fill in resistance printing ink in upright opening, in resistance printing ink hole, dielectric ink or electrically conductive ink are filled in boring again, carry out controlling resistance resistance size by the size and the degree of depth filling in dielectric ink or conductive oil ink hole, resistance accuracy can control within 10%;
(4) Simplified flowsheet, reduce manufacture difficulty, the metal thin film resistor of Ohmega company of the U.S. needs three etch processs just can make, silk-screen planar resistor not only needs high accuracy CCD screen printer, also need the resistance printing ink of applicable silk-screen to coordinate, also need laser cutting correction resistance accuracy after silk-screen is complete, process time is very long, silk-screen parameter is slightly improper, and resistance precision will be very poor; No matter be adopt metal thin film resistor or the large resistance value embedded resistor of silk-screen thick film resistor fabrication, all need to make flat serpentine figure and obtain longer resistance length, serpentine pattern precision controlling difficulty.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail, but do not form any restriction of the present utility model.
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of the utility model embodiment 2.
In figure: body 1, first through hole or the first blind hole 2, first resistance printing ink 3, second through hole or the second blind hole 4, first dielectric ink or electrically conductive ink 5, metallic conductor 6, semi-solid preparation insulation material layer 7, fourth hole 7a, metal level 7b, the second resistance printing ink 8, fifth hole 8a, the second dielectric ink or electrically conductive ink 9.
Embodiment
Embodiment 1
Consult shown in Fig. 1, a kind of printed circuit board of the present utility model, comprise body 1, body 1 is provided with some first through holes or the first blind hole 2 along the direction in vertical panel face, the first resistance printing ink 3 is filled with in the first through hole or the first blind hole 2, first resistance printing ink 3 is provided with the second through hole or the second blind hole 4, in the second through hole or the second blind hole 4, is filled with the first dielectric ink or electrically conductive ink 5, first resistance printing ink 3 is connected to form serial or parallel connection structure by the metallic conductor 6 on body 1.
In the present embodiment, described body 1 is single layer printed circuit plate, double layer printed circuit plate or multilayer printed circuit board.Meanwhile, on the degree of depth of described first through hole or the first blind hole 2 and body 1, the thickness of single-layer insulation material layer or the thickness of some layers of insulation material layer adapt, and determine according to real needs.
Embodiment 2
Consult shown in Fig. 2, a kind of printed circuit board of the present utility model, its structure is substantially the same manner as Example 1, difference is, on at least one conductive plate face of body 1, also pressing has semi-solid preparation insulation material layer 7, semi-solid preparation insulation material layer 7 is provided with fourth hole 7a, is filled with the second resistance printing ink 8 in fourth hole, second resistance printing ink 8 is provided with fifth hole 8a, in fifth hole 8a, is filled with the second dielectric ink or electrically conductive ink 9; Outside semi-solid preparation insulation material layer 7, be provided with metal level 7b, the second resistance printing ink 8 conducts electricity metallic conductor on trigger and metal level 7b by body 1 and is connected and forms serial or parallel connection structure.In the present embodiment, semi-solid preparation insulation material layer 7 is located at body 1 upper surface.
Actual after completing, the structure of the present embodiment printed circuit board is identical with embodiment 1, and just processing technology is different.
Above illustrated embodiment is better embodiment of the present utility model, only be used for conveniently the utility model being described, not any pro forma restriction is done to the utility model, have in any art and usually know the knowledgeable, if do not depart from the utility model carry in the scope of technical characteristic, utilize the utility model disclose the Equivalent embodiments changing or modify in the done local of technology contents, and do not depart from technical characteristic content of the present utility model, all still belong in the scope of the utility model technical characteristic.
Claims (4)
1. one kind has the printed circuit board of embedding resistance, comprise body (1), it is characterized in that, described body (1) is provided with some first through holes or the first blind hole (2) along the direction in vertical panel face, the first resistance printing ink (3) is filled with in the first through hole or the first blind hole (2), first resistance printing ink (3) is provided with the second through hole or the second blind hole (4), the first dielectric ink or electrically conductive ink (5) is filled with in the second through hole or the second blind hole (4), first resistance printing ink (3) is connected to form serial or parallel connection structure by the metallic conductor (6) on body (1).
2. the printed circuit board with embedding resistance according to claim 1, it is characterized in that, on at least one conductive plate face of described body (1), pressing has semi-solid preparation insulation material layer (7), semi-solid preparation insulation material layer (7) is provided with fourth hole (7a), the second resistance printing ink (8) is filled with in fourth hole, second resistance printing ink (8) is provided with fifth hole (8a), in fifth hole (8a), is filled with the second dielectric ink or electrically conductive ink (9); Be provided with metal level (7b) in semi-solid preparation insulation material layer (7) outside, the second resistance printing ink (8) is connected by the metallic conductor on body (1) conduction trigger and metal level (7b) and forms serial or parallel connection structure.
3. the printed circuit board with embedding resistance according to claim 1 and 2, is characterized in that, described body (1) is single layer printed circuit plate, double layer printed circuit plate or multilayer printed circuit board.
4. the printed circuit board with embedding resistance according to claim 1, it is characterized in that, the degree of depth of described first through hole or the first blind hole (2) and body (1) the above thickness of single-layer insulation material layer or the thickness of some layers of insulation material layer adapt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520262440.4U CN204560028U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board of embedding resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520262440.4U CN204560028U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board of embedding resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204560028U true CN204560028U (en) | 2015-08-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520262440.4U Withdrawn - After Issue CN204560028U (en) | 2015-04-27 | 2015-04-27 | There is the printed circuit board of embedding resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204560028U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797083A (en) * | 2015-04-27 | 2015-07-22 | 博敏电子股份有限公司 | Printed circuit board and method for embedding resistor in printed circuit board |
-
2015
- 2015-04-27 CN CN201520262440.4U patent/CN204560028U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797083A (en) * | 2015-04-27 | 2015-07-22 | 博敏电子股份有限公司 | Printed circuit board and method for embedding resistor in printed circuit board |
| CN104797083B (en) * | 2015-04-27 | 2018-08-10 | 博敏电子股份有限公司 | The method and its printed circuit board of embedding resistance in printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150812 Effective date of abandoning: 20180810 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150812 Effective date of abandoning: 20180810 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |