CN217386330U

CN217386330U - Conducting film and electronic equipment

Info

Publication number: CN217386330U
Application number: CN202220746953.2U
Authority: CN
Inventors: 基亮亮; 周小红
Original assignee: Weiyeda Technology Jiangsu Co ltd; Ivtouch Co ltd
Current assignee: Suzhou Weiyeda Technology Co ltd; Weiyeda Technology Jiangsu Co ltd
Priority date: 2022-04-01
Filing date: 2022-04-01
Publication date: 2022-09-06
Anticipated expiration: 2032-04-01

Abstract

A conductive film and an electronic device are provided. A conductive film, comprising: a base layer; the structural layer is arranged on the substrate layer, and at least one groove is formed in the first surface, far away from the substrate layer, of the structural layer; the first conducting layer is formed in the groove; a second conductive layer disposed on the first surface of the structural layer. The utility model also provides an electronic equipment, include as above the conductive film. The utility model provides a conductive film is through the first conducting layer of formula of buryying and the second conducting layer of cover on the structural layer surface, under the condition that does not change the recess width degree of depth, improves conductive material's cross-sectional area, reduces the resistance of conductive film by a wide margin.

Description

Conducting film and electronic equipment

Technical Field

The utility model relates to a conductive film technical field especially relates to a conductive film and electronic equipment.

Background

With the development of science and technology, more and more terminal devices with touch functions are developed towards flexibility, lightness and thinness. The transparent conductive film has high transmittance and good conductivity, is widely applied to the fields of flat panel display, photovoltaic devices, touch panels, electromagnetic shielding and the like, and has wide market space.

In the prior art, a conductive layer is generally formed on a transparent substrate layer, and generally includes a transparent substrate layer and a related metal buried layer, a patterned and connected groove grid is formed on the surface of the transparent substrate layer, and a conductive material is filled in the groove grid to form the conductive film.

The conventional embedded grid conductive film is formed by filling and curing a conductive material in a groove, the resistance of the conventional embedded grid conductive film is limited by the depth width of the groove, the resistivity of the conductive material and the duty ratio of a grid, the depth width of the groove is limited by equipment and is difficult to increase greatly, and the resistivity of silver paste conventionally used by the conductive material is also limited by raw materials and cannot be reduced greatly.

The foregoing description is provided for general background information and is not admitted to be prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a low resistance conducting film and electronic equipment.

The utility model provides a conductive film, include: a base layer; the structural layer is arranged on the substrate layer, and at least one groove is formed in the first surface, far away from the substrate layer, of the structural layer; the first conducting layer is formed in the groove; a second conductive layer disposed on the first surface of the structural layer.

Further, the second conductive layer covers at least part of the first surface of the structural layer and at least part of the second surface of the first conductive layer at the same time, and the second surface of the first conductive layer is the surface of the first conductive layer far away from the substrate layer.

Further, the second surface of the first conductive layer is flush with the first surface of the structural layer.

Further, a longitudinal projection of the second conductive layer is located within or coincides with a longitudinal projection of the structural layer.

Further, the second conductive layer includes a first conductive portion and a second conductive portion, a hollow portion is formed between the first conductive portion and the second conductive portion, and at least a part of the hollow portion is located right above the structural layer.

Further, the substrate layer is one of PET, PC and PMMA.

Further, the first conductive layer and the second conductive layer are respectively a structure formed by one or more of silver nano-paste, copper nano-paste or graphene paste.

Further, the width of recess is 1-20um, the degree of depth of recess is 1-20 um.

Furthermore, the resistance range of the first conductive layer of the conductive film is 0.1-100 ohm/square meter, and the resistance range of the second conductive layer is 0.05-100 ohm/square meter.

The utility model also provides an electronic equipment, include as above the conductive film.

The utility model provides a conductive film is through the first conducting layer of formula of buryying and the second conducting layer of cover on the structural layer surface, under the condition that does not change the recess width degree of depth, improves conductive material's cross-sectional area, reduces the resistance of conductive film by a wide margin.

Drawings

Fig. 1 is a schematic cross-sectional structure view of a conductive film according to a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure diagram of a conductive film according to a second embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

First embodiment

Referring to fig. 1, a first embodiment of the present invention provides a conductive film, including: a base layer 10, a structural layer 20, a first conductive layer 30, and a second conductive layer 40. The substrate layer 10 is used to support the structural layer 20, and the substrate layer 10 directly abuts against the lower surface of the structural layer 20. The substrate layer 10 is made of a material with high light transmittance, and can be made of one of PET, PC and PMMA.

The structural layer 20 is a UV light curing adhesive coated on the substrate layer 10, and the thickness is greater than 20 um. The first surface of the structural layer 20, which is the side of the structural layer 20 away from the substrate layer 10, i.e. the upper surface of the structural layer 20 in fig. 1, is provided with a plurality of grooves (not labeled). The groove is a latticed patterning structure, the width of the groove is 1-20um, and the depth of the groove is 1-20 um.

The first conductive layer 30 is accommodated in the groove, that is, the width of the first conductive layer 30 is equal to the width of the groove, and the thickness of the first conductive layer 30 is less than or equal to the depth of the groove, wherein the depth of each groove can be set according to actual requirements, and can be the same or different. Preferably, the depth of each groove is the same.

The second conductive layer 40 is disposed on the upper surface of the first conductive layer 30 and/or the structural layer 20, the upper surface of the second conductive layer being higher than the upper surface of the structural layer 20.

In the present embodiment, the second conductive layer 40 covers at least a portion of the first surface of the structural layer 20 and at least a portion of the second surface of the first conductive layer 30, and the second surface of the first conductive layer 30 is a surface of the first conductive layer 30 away from the substrate layer 10, i.e., an upper surface of the first conductive layer 30 in fig. 1.

It will be understood that the longitudinal projection area of the second conductive layer 40 is smaller than or equal to the longitudinal projection area of the structural layer 20, and the longitudinal projection of the second conductive layer 40 is contained in the longitudinal projection of the structural layer 20 or coincides with the longitudinal projection of the structural layer 20. The longitudinal projection area of the first conductive layer 30 is smaller than the longitudinal projection area of the second conductive layer 40, and the longitudinal projection of the first conductive layer 30 is accommodated in the longitudinal projection of the second conductive layer 40.

That is, from the longitudinal view, the coverage area of the first conductive layer 30 is smaller than that of the second conductive layer 40, and the coverage area of the second conductive layer 40 is smaller than or equal to that of the structural layer 20.

In the present embodiment, the upper surface of the first conductive layer 30 is flush with the upper surface of the structural layer 20, that is, the thickness of the first conductive layer 30 is equal to the depth of the groove, and the groove is filled with the first conductive layer 30.

In other embodiments, the width of the open end of the groove may be larger than the width of the bottom of the groove, for example, the cross-sectional shape of the groove is an inverted trapezoid, an inverted triangle, or the like. This has the advantage that when the second conductive layer 40 is printed, the width of the open end is large to facilitate printing.

In this embodiment, the second conductive layer 40 includes a first conductive portion 41 and a second conductive portion 42, and the first conductive portion 41 and the second conductive portion 42 are two adjacent sections of the second conductive layer 40 in a grid shape. A hollow portion 50 is formed between the first conductive portion 41 and the second conductive portion 42, and the hollow portion 50 is at least partially located above the structural layer 20, that is, the structural layer 20 is not completely covered by the second conductive layer 40.

It can be understood that, since the light transmittance of the first conductive layer 30 and the second conductive layer 40 is low, and the light transmittance of the structural layer 20 is high, when the second conductive layer 40 covers the surface of the structural layer 20, the overall light transmittance of the conductive film is reduced.

In the present embodiment, the larger the coverage area of the second conductive layer 40 is, the larger the cross-sectional area of the conductive material in the conductive film is, the smaller the resistance of the conductive film is, but the smaller the transmittance of the conductive film is. The coverage area of the second conductive layer 40 is inversely proportional to the resistance and transmittance of the conductive film. However, the second conductive layer 40 has not only width parameters but also thickness parameters, and the coverage area of the second conductive layer is only slightly increased, so that the resistance of the conductive film is greatly reduced. The scheme can be applied to the shielded non-exposed surface of an area which has no requirement on light transmittance but has a requirement on resistance, such as the frame position of a panel.

The first conductive layer 30 and the second conductive layer 40 adopt one or more conductive pastes of silver nano paste, copper nano paste or graphene paste. Preferably, second conductive layer 40 is a nanoparticle-scale paste and first conductive layer 30 is a micron-scale paste, and since the coverage of first conductive layer 30 is smaller relative to second conductive layer 40, using a micron-scale conductive paste is less expensive, thereby also reducing the cost of the conductive paste. The resistance of the first conductive layer 30 ranges from 0.1 to 100 ohms/square and the resistance of the second conductive layer ranges from 0.05 to 100 ohms/square.

The embodiment of the utility model provides a still provide a manufacturing approach of conducting film, this method is used for making foretell conducting film, include:

s1: providing a substrate layer 10, forming a structural layer 20 on the substrate layer 10, wherein a plurality of grooves are formed in the structural layer 20.

Specifically, a layer of UV light curing adhesive is coated on the substrate layer 10, a mold with patterns of each conductive layer is used for primary imprinting on the UV light curing adhesive to form a plurality of grooves with the same depth, and then curing is performed; after curing, the UV light curing glue forms the structural layer 20. The pattern formed by the plurality of grooves is in a grid shape.

S2: conductive material is filled in the groove in a blade coating mode, and a first conductive layer 30 is formed after curing.

Specifically, the groove is filled with a conductive material only once by blade coating, the thickness of the filled conductive material is equal to the depth of the groove, and after curing, the first conductive layer 30 is formed, that is, a conductive circuit is formed.

S3: and filling a conductive material on the upper surface of the structural layer 20 by a printing mode, and forming a second conductive layer 40 after curing, wherein the second conductive layer 40 is overlapped on the first conductive layer 30 and the structural layer 20.

Specifically, when the thickness of the first conductive layer 30 is smaller than the depth of the groove, the printed conductive material can flow to fill the groove when cured at a high temperature, and the groove of the electrical connection portion 32 can be filled only by one-time printing process after the first conductive layer 30 is formed, so that the filling amount of the conductive material in the groove is satisfied, and meanwhile, the filling frequency of the conductive material is reduced, and the cost is reduced.

The present embodiment also includes an electronic device including the conductive film as described above.

In the conductive film provided by the present embodiment, the embedded first conductive layer 30 and the second conductive layer 40 covering the surface of the structure layer increase the cross-sectional area of the conductive material without changing the width depth of the groove, thereby greatly reducing the resistance of the conductive film. Compared with the scheme of improving the depth and the width of the groove, the method does not need to increase the cost for deepening the groove or fill the conductive material for many times, and provides a new scheme for the area which has no requirement on light transmittance but has a requirement on resistance.

Second embodiment

Referring to fig. 2, a conductive film according to a second embodiment of the present invention is different from the above-mentioned embodiments in that a structural layer 20 'is coated on a substrate layer 10', a first surface of the structural layer 20 'is provided with a plurality of grooves, a thickness of a first conductive layer 30' is smaller than a depth of the grooves, and a second surface (an upper surface) of the first conductive layer 30 'is not flush with the first surface (the upper surface) of the structural layer 20'.

The second conductive layer 40' is partially disposed in the recess, and the second conductive layer 40' continues to be applied to the first surface of the structural layer 20' after the recess is filled.

The second conductive layer 40 'includes a first conductive portion 41' and a second conductive portion 42', and the first conductive portion 41' and the second conductive portion 42 'are two adjacent sections of the second conductive layer 40' in a grid shape. A hollow portion 50' is formed between the first conductive portion 41' and the second conductive portion 42', and the hollow portion 50' is at least partially located above the structural layer 20', i.e. the structural layer 20' is not completely covered by the second conductive layer 40 '.

In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.

In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.

In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the sake of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.

As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A conductive film, comprising:

a base layer;

the structural layer is arranged on the substrate layer, and at least one groove is formed in the first surface, far away from the substrate layer, of the structural layer;

the first conducting layer is formed in the groove;

a second conductive layer disposed on the first surface of the structural layer.

2. The conductive film of claim 1, wherein the second conductive layer covers both at least a portion of the first surface of the structural layer and at least a portion of the second surface of the first conductive layer, the second surface of the first conductive layer being the surface of the first conductive layer distal from the base layer.

3. The conductive film of claim 2, wherein the second surface of the first conductive layer is flush with the first surface of the structural layer.

4. The conductive film of claim 1, wherein a longitudinal projection of the second conductive layer is located within or coincides with a longitudinal projection of the structural layer.

5. The conductive film of claim 4, wherein the second conductive layer comprises a first conductive portion and a second conductive portion, wherein a hollowed-out portion is formed between the first conductive portion and the second conductive portion, and wherein the hollowed-out portion is at least partially located directly above the structural layer.

6. The conductive film of claim 1, wherein the substrate layer is a PET layer, a PC layer, or a PMMA layer.

7. The conductive film according to claim 1, wherein the first conductive layer and the second conductive layer are each a structure formed using one or more of silver nanopaste, copper nanopaste, or graphene nanopaste.

8. The conductive film of claim 1, wherein the width of the groove is 1-20um and the depth of the groove is 1-20 um.

9. The conductive film of claim 1, wherein the first conductive layer of the conductive film has a resistance in the range of 0.1 to 100 ohms/square and the second conductive layer has a resistance in the range of 0.05 to 100 ohms/square.

10. An electronic device comprising the conductive film according to any one of claims 1 to 9.