CN204615782U - A kind of quartz-crystal resonator - Google Patents
A kind of quartz-crystal resonator Download PDFInfo
- Publication number
- CN204615782U CN204615782U CN201520260608.8U CN201520260608U CN204615782U CN 204615782 U CN204615782 U CN 204615782U CN 201520260608 U CN201520260608 U CN 201520260608U CN 204615782 U CN204615782 U CN 204615782U
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- quartz
- upper cover
- pedestal
- crystal resonator
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Abstract
The utility model discloses a kind of quartz-crystal resonator, the upper cover comprising quartz wafer, pedestal and be sealed and matched with it, described quartz wafer is positioned at the sealed cavity that pedestal and upper cover are formed, and the contact-making surface place that described upper cover contacts with pedestal offers continuous print ring-shaped groove.The cross section of described ring-shaped groove is for falling " V " shape structure or class zigzag structure.The utility model is for the shortcoming of the bonding encapsulating structure of existing quartz-crystal resonator, continuous print ring-shaped groove is offered upper covering, add the contact area of upper cover and pedestal bonding plane and the capacity of bonded adhesives, improve bonding firmness, improve the air-tightness of encapsulation.The utility model, with simple architecture advances, improves the reliability of quartz-crystal resonator, greatly can reduce production cost, improves the qualification rate of product, has market application foreground widely.
Description
Technical field
The utility model relates to the encapsulation technology field of electronic component, particularly relates to a kind of quartz-crystal resonator.
Background technology
Quartz-crystal resonator common at present comprises surface attaching type and non-surface attaching type, and shown in attached Fig. 1 and 2, surface adhered quartz crystal resonator comprises pedestal 1, upper cover 2, quartz wafer 3 and pad 4.With reference to shown in accompanying drawing 3 and 4, non-surface adhered quartz crystal resonator comprises pedestal 1, upper cover 2, quartz wafer 3 and lead-in wire 5.After pedestal 1 and upper cover 2 are tightly linked by specific packaging technology, form vacuum or antivacuum airtight cavity; Quartz crystal is arranged in this airtight cavity, and is fixed on pedestal 1; Pad 4 or lead-in wire 5 form the electric connection between quarts crystal electrode and external circuit.
At present the packaging technology that pedestal and upper cover connect is mainly contained two classes: a class adopts various method by the metal molten of pedestal and upper cover contact-making surface thus welds together, and forms airtight chamber.The method of welding has multiple, as rolling weldering, ultrasonic wave heating, hot melt, electric resistance welding, laser welding etc.Another kind of is adopt various available bonded adhesives (hereinafter referred to as glue), pedestal and upper cover is bonded together, forms airtight chamber.The kind of glue has a lot, comprises normal temperature cure glue, high temperature setting glue, UV glue, single-component glue, bi-component glue etc.
After existing quartz-crystal resonator adopts the method encapsulation of metal solder, air-tightness is good, and quartz crystal working stability is reliable.But it is expensive that its shortcoming is sealed in unit, and process costs is high, is unfavorable for promoting the use of, and the method is only applicable to pedestal and upper cover is metal material, or both contact-making surfaces are metal material.
And adopting gluing method, sealed in unit is simple, and process costs is low, and the resonator produced has cost advantage, and can be used for pedestal and the upper cover of various unlike material.But because the contact position between common resonator base and upper cover is a narrow planar annular, contact area is very little, therefore, it is possible to very little for the area of gluing, the adhesive strength after solidification is low, makes the anti-drop of resonator, shock resistance poor, causes poor reliability.In addition owing to being smooth contact-making surface between pedestal and upper cover, if do not extrude during adhesive curing, be then easily coated with to obtain concavo-convex inequality because of glue, cause some position to leak gas and reduce the reliability of resonator; If extrude during adhesive curing, then easily cause the loss of glue and make loosely bonding.
As can be seen here, above-mentioned existing quartz-crystal resonator, in structure, method and use, obviously still has inconvenience and defect, and is urgently further improved.How to found that a kind of structure is simple, the new quartz-crystal resonator of good reliability, become the target that current industry pole need be improved.
Utility model content
The technical problems to be solved in the utility model is to provide the quartz-crystal resonator that a kind of structure is simple, reliability is strong, make its fastness realizing resonator preferably and air-tightness, thus overcome the deficiency of the quartz-crystal resonator of the gluing packaging technology of existing employing.
For solving the problems of the technologies described above, the utility model provides a kind of quartz-crystal resonator, the upper cover comprising quartz wafer, pedestal and be sealed and matched with it, described quartz wafer is positioned at the sealed cavity that pedestal and upper cover are formed, and the contact-making surface place that described upper cover contacts with pedestal offers continuous print ring-shaped groove.
Improve as one of the present utility model, the cross section of described ring-shaped groove is for falling " V " shape structure.
Further improvement, the cross section of described ring-shaped groove is class zigzag structure.
Further improvement, described upper cover is slab construction, and the pedestal be sealed and matched with it has curved cavity.
Further improvement, described upper cover is the structure that mid portion raises up, and the pedestal be sealed and matched with it has or do not have curved cavity.
Further improvement, described pedestal and upper cover adopt metal material.
Further improvement, described pedestal and upper cover adopt pottery or glass nonmetallic materials.
Adopt above-mentioned technical scheme, the utility model at least has the following advantages:
The utility model is for the shortcoming of the bonding encapsulating structure of existing quartz-crystal resonator, continuous print ring-shaped groove is offered upper covering, add the contact area of upper cover and pedestal bonding plane and the capacity of bonded adhesives, improve bonding firmness, improve the air-tightness of encapsulation.
The utility model, with simple architecture advances, improves the reliability of quartz-crystal resonator, greatly can reduce production cost, improves the qualification rate of product, has market application foreground widely.
Accompanying drawing explanation
Above-mentioned is only the general introduction of technical solutions of the utility model, and in order to better understand technological means of the present utility model, below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail.
Fig. 1 is the structural representation before the encapsulation of prior art surface adhered quartz crystal resonator;
Fig. 2 is the structural representation after the encapsulation of prior art surface adhered quartz crystal resonator;
Fig. 3 is the structural representation before the non-surface adhered quartz crystal resonator encapsulation of prior art;
Fig. 4 is the structural representation after the non-surface adhered quartz crystal resonator encapsulation of prior art;
Fig. 5 is the schematic perspective view of the utility model quartz-crystal resonator upper cover embodiment one;
Fig. 6 is the generalized section of the utility model quartz-crystal resonator upper cover embodiment one;
Fig. 7 is the schematic perspective view of the utility model quartz-crystal resonator upper cover embodiment two;
Fig. 8 is the generalized section of the utility model quartz-crystal resonator upper cover embodiment two;
Fig. 9 is the structural representation before the encapsulation of the utility model quartz-crystal resonator;
Figure 10 is the structural representation after the encapsulation of the utility model quartz-crystal resonator;
Figure 11 is the generalized section after the encapsulation of the utility model quartz-crystal resonator.
Embodiment
The utility model quartz-crystal resonator, the upper cover comprising quartz wafer, pedestal and be sealed and matched with it.Quartz wafer is positioned at the sealed cavity that pedestal and upper cover are formed.
With reference to shown in accompanying drawing 5 and 6, the contact-making surface place that this upper cover 10 contacts with pedestal offers continuous print ring-shaped groove 11.The cross section of this groove 11 preferably falls " V " shape or class laciniation, therefore this upper cover 10 is no longer smooth plane with the contact-making surface of pedestal, and be the increase in the space holding bonded adhesives, This structure increases the contact area between upper cover 10 and glue, between glue and pedestal, substantially improve firmness and the air-tightness of bonding encapsulation, improve the encapsulation qualification rate of quartz-crystal resonator simultaneously.
Certainly, the upper cover 10 of the utility model quartz-crystal resonator, can have multiple different structure:
With reference to shown in accompanying drawing 5 and 6, upper cover 10 entirety is a flat board, and the contact position of its edge and pedestal has down " V " shape or class laciniation, and the pedestal matched with it must with curved cavity, both bonding rear cavitys forming accommodation quartz wafer.
With reference to shown in accompanying drawing 7 and 8, the mid portion of upper cover 10 can raise up, the contact position of its edge and pedestal has down " V " shape or class laciniation 11, and the pedestal matched with it can have or not have curved cavity, both bonding rear cavitys forming accommodation quartz wafer.
Superstructure of the present utility model, be applicable to the quartz-crystal resonator using adhesion process encapsulation, comprise the surface attaching type of vacuum or antivacuum encapsulation and non-surface adhered quartz crystal resonator, and the material of its pedestal and upper cover can be metal material, also can be the nonmetallic materials such as pottery, glass.
With reference to shown in accompanying drawing 9 to 11, the encapsulation flow process of the utility model quartz-crystal resonator is as follows:
First, upper cover 10 is inverted, is covered with skim glue 30 at its groove 11 place, the pedestal 20 with wafer is inverted, and be buckled on the groove of upper cover 10 exactly;
Secondly, impose suitable extruding force to pedestal 20, in the process, glue is squeezed into groove 11 part of upper cover 10, is formed with certain thickness complete endless belt-shaped glue-line, and this adhesive tape fits tightly due to squeezing action and pedestal and upper cover;
Finally, normal temperature placement or heat treated are carried out to the quartz-crystal resonator assembled, makes adhesive curing, very firmly bonding and sealing function can be played.
The utility model is by adopting above-mentioned superstructure, the gel content between upper cover and pedestal bonding plane can be increased, expand bond area, thus increase the bond strength of upper cover and pedestal, substantially improve firmness and the air-tightness of bonding encapsulation, and improve anti-drop, the shock resistance of the crystal resonator after encapsulation, improve reliability.
In addition, superstructure of the present utility model, make suitably to extrude upper cover and pedestal when adhesive curing, make glue and upper cover and base into contact more closely evenly but can not run off in a large number, not only increase firmness and the air-tightness of bonding encapsulation, improve the electrical characteristic of resonator, stability, reliability and useful life, improve the encapsulation qualification rate of resonator simultaneously, reduce manufacturing cost, improve the resonator competitiveness of product in market, have market application foreground widely.
The above; it is only preferred embodiment of the present utility model; not do any pro forma restriction to the utility model, those skilled in the art utilize the technology contents of above-mentioned announcement to make a little simple modification, equivalent variations or modification, all drop in protection range of the present utility model.
Claims (7)
1. a quartz-crystal resonator, the upper cover comprising quartz wafer, pedestal and be sealed and matched with it, described quartz wafer is positioned at the sealed cavity that pedestal and upper cover are formed, and it is characterized in that, the contact-making surface place that described upper cover contacts with pedestal offers continuous print ring-shaped groove.
2. quartz-crystal resonator according to claim 1, is characterized in that, the cross section of described ring-shaped groove is for falling " V " shape structure.
3. quartz-crystal resonator according to claim 1, is characterized in that, the cross section of described ring-shaped groove is class zigzag structure.
4. the quartz-crystal resonator according to Claims 2 or 3, is characterized in that, described upper cover is slab construction, and the pedestal be sealed and matched with it has curved cavity.
5. the quartz-crystal resonator according to Claims 2 or 3, is characterized in that, described upper cover is the structure that mid portion raises up, and the pedestal be sealed and matched with it has or do not have curved cavity.
6. quartz-crystal resonator according to claim 1, is characterized in that, described pedestal and upper cover adopt metal material.
7. quartz-crystal resonator according to claim 1, is characterized in that, described pedestal and upper cover adopt pottery or glass nonmetallic materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520260608.8U CN204615782U (en) | 2015-04-27 | 2015-04-27 | A kind of quartz-crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520260608.8U CN204615782U (en) | 2015-04-27 | 2015-04-27 | A kind of quartz-crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204615782U true CN204615782U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520260608.8U Expired - Fee Related CN204615782U (en) | 2015-04-27 | 2015-04-27 | A kind of quartz-crystal resonator |
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| Country | Link |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591944A (en) * | 2017-10-10 | 2018-01-16 | 武汉索特南洋电机有限公司 | Disc type electric machine radiator structure and disc type electric machine |
| CN107612260A (en) * | 2017-10-10 | 2018-01-19 | 武汉索特南洋电机有限公司 | End cap and iron core fixing structure and disc type electric machine |
| CN107888159A (en) * | 2017-11-22 | 2018-04-06 | 铜陵日兴电子有限公司 | A kind of high leakproofness quartz-crystal resonator |
| CN108092451A (en) * | 2018-01-10 | 2018-05-29 | 上海硅泰电子有限公司 | The radiator structure of disc type electric machine |
| CN109743857A (en) * | 2019-01-07 | 2019-05-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Antivibration electronic component encapsulating structure |
-
2015
- 2015-04-27 CN CN201520260608.8U patent/CN204615782U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591944A (en) * | 2017-10-10 | 2018-01-16 | 武汉索特南洋电机有限公司 | Disc type electric machine radiator structure and disc type electric machine |
| CN107612260A (en) * | 2017-10-10 | 2018-01-19 | 武汉索特南洋电机有限公司 | End cap and iron core fixing structure and disc type electric machine |
| CN107888159A (en) * | 2017-11-22 | 2018-04-06 | 铜陵日兴电子有限公司 | A kind of high leakproofness quartz-crystal resonator |
| CN107888159B (en) * | 2017-11-22 | 2021-04-16 | 铜陵日兴电子有限公司 | High-sealing-performance quartz crystal resonator |
| CN108092451A (en) * | 2018-01-10 | 2018-05-29 | 上海硅泰电子有限公司 | The radiator structure of disc type electric machine |
| CN109743857A (en) * | 2019-01-07 | 2019-05-10 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Antivibration electronic component encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20170427 |