CN205352584U - Pressure sensor of PCB encapsulation - Google Patents
Pressure sensor of PCB encapsulation Download PDFInfo
- Publication number
- CN205352584U CN205352584U CN201620102863.4U CN201620102863U CN205352584U CN 205352584 U CN205352584 U CN 205352584U CN 201620102863 U CN201620102863 U CN 201620102863U CN 205352584 U CN205352584 U CN 205352584U
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- pcb
- pcb board
- chip
- encapsulation
- circular cavity
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Abstract
The utility model provides a pressure sensor of PCB encapsulation, it includes the casing, and the casing has hollow circular cavity body, packs silicon oil in the circular cavity body, and the casing has upper and lower two rings shape surface, and the welding is gone up on the annular surface down has clamping ring and diaphragm, and the center of going up the annular surface is round opening, and round opening and circular cavity body communicate with each other, and the inside riveting of round opening has the PCB board, and the nation is attend to the PCB board has chip and welding to have the wire surely. This sensor utilizes PCB to be connected provide platform as the base plate surely and for the wire with chip nation, adopt riveting technology with PCB board riveting in stainless steel shell, simple process is feasible, the efficiency is high, effective sealed and insulation problem of solving can not cause to reveal and reduce with the electrical property.
Description
Technical field
This utility model relates to a kind of pressure transducer.
Background technology
Pressure transducer of the prior art continues to use external production technology more, specifically include that chunk glass makes, the cleaning of metalwork and mould and vacuum purification, metalwork oxidation processes, filling mould, high temperature sintering, lead-foot-line are gold-plated, wherein glass sintering sealing technology technology difficulty is high, need the equipment of specialty and the personnel of professional ability just can complete, complex procedures, time-consuming power consumption, is the immediate cause causing this production high expensive.Additionally clean, vacuum purification and oxidation processes, if controlling the bad insufficient strength all easily causing glass and metal welding and impurities left, cause leakage and electrical property to reduce, for pressure transducer, these are all fatal defects.When also having the drawback that chip bonding, owing to binding post reduces in hardness after high temperature furnace, capillary is beaten and is easily produced vibration on binding post, causes failure welding or weldering not to reach the standard grade, affects bonding wire quality.Need when binding post is gold-plated individually to apply electrode, it is easy to cause electroplating quality inconsistent, affect welding quality.The structure of the integration of sintering, can not do over again when rear operation produces bad, can only entirety scrap, and causes subsequent quality loss irretrievable.
Utility model content
In order to solve Problems existing in background technology, this utility model provides the pressure transducer of a kind of PCB encapsulation, this sensor utilizes PCB as substrate and chip bonding and to connect for wire and provide platform, adopt riveting process by sealing ring and PCB riveting in stainless steel case body, technique simple possible, effect is high.
For reaching above-mentioned purpose, this utility model adopts the following technical scheme that
A kind of pressure transducer of PCB encapsulation, including housing, it is characterized in that: described housing has the circular cavity of hollow, filling silicon oil in circular cavity, housing has upper and lower two annular surfaces, and lower annular surface is welded with pressure ring and diaphragm, the center of upper annular surface is circular open, circular open communicates with circular cavity, and the internal riveted joint of circular open has pcb board, and on pcb board, bonding has chip and is welded with wire.
The bottom of described circular open is provided with annular seal groove, is provided with sealing ring in seal groove.
Described bonding refers to and is fixed on pcb board by chip and the effective node connection on chip is conducting on the corresponding solder joint of pcb board with bonding line.
Described pcb board is fixed in circular open by the mode of slash.
The beneficial effects of the utility model are:
1. this utility model utilizes PCB for substrate and chip bonding and to connect for wire and provide platform, adopts riveting process by sealing ring and PCB riveting in stainless steel case body, and technique simple possible, effect is high.
2. adopt PCB and sealing ring to add riveting technique, effectively solve to seal and Insulation Problems, do not result in leakage and electrical property reduces.
3. chip bonding and wire connect is all bonding wire in the gold plated pads of PCB, and ripe PCB processing technology ensures the solderability of pad, has stopped the problems of welded quality because binding post is trembled and poor plating causes.
4. rivet pressing structure is disassembled, useful parts can be disassembled reuse when rear operation produces quality problems, effectively reduce mass loss.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, this utility model is further illustrated
Fig. 1 is the Split type structure schematic diagram of pressure transducer described in the utility model；
Fig. 2 is the overall structure schematic diagram of pressure transducer described in the utility model；
Fig. 3 is the cross-sectional view of pressure transducer in Fig. 2.
Detailed description of the invention
Illustrate with detailed description of the invention, this utility model to be further described below in conjunction with accompanying drawing:
Embodiment 1
As Figure 1-3, a kind of pressure transducer of PCB encapsulation, including pressure ring 1, diaphragm 2, housing 3, sealing ring 4, chip 5, pcb board 9 and wire 10, described housing 3 has the circular cavity 6 of hollow, filling silicon oil in circular cavity 6, housing 3 has upper and lower two annular surfaces, lower annular surface is welded with pressure ring 1 and diaphragm 2, the center of upper annular surface is circular open, circular open communicates with circular cavity 6, the bottom of circular open is provided with annular seal groove, seal groove is provided with sealing ring 4, the internal riveted joint of circular open has pcb board 9, on pcb board 9, bonding has chip 5 and is welded with wire 10.
The manufacturing process of the pressure transducer of above-mentioned PCB encapsulation is:
1. pressure ring 1 and diaphragm 2 are welded on the lower end of housing 3, and cleaning, drying is stand-by；
2. by chip 5 bonding on pcb board 9, described bonding refers to and is fixed on pcb board with glue by chip, then effective node connection on chip is conducting on the corresponding solder joint of pcb board with bonding line 8；
3. sealing ring 4 is placed in the seal groove of housing 3 upper end, sealing ring is put the pcb board of the good chip of bonding, is then put in the mould of forcing press and rivets；
4. the housing 3 riveted is inhaled filling silicone oil after vacuum；
5. wire 10 is welded on pcb board 9.
Except the fixing pcb board of the mode adopting riveted joint and housing, it is also possible to adopt the fixing pcb board of mode and the housing of other modes such as slash.
This utility model adopts pcb board to accept inside chip and outer lead matrix realizes insulation and the function of conducting；Adopting sealing member and riveting process to realize encapsulation and sealing function, so that the technique simple possible of pressure transducer, effect is high.
It will be recognized by those skilled in the art, under the premise not necessarily departing from protection scope of the present invention, it is possible to above-mentioned embodiment is carried out various amendment, change and combination, and thinks that this amendment, change and combination are within the scope of originality thought.
Claims (4)
1. the pressure transducer of a PCB encapsulation, including housing, it is characterized in that: described housing has the circular cavity of hollow, filling silicon oil in circular cavity, housing has upper and lower two annular surfaces, and lower annular surface is welded with pressure ring and diaphragm, the center of upper annular surface is circular open, circular open communicates with circular cavity, and the internal riveted joint of circular open has pcb board, and on pcb board, bonding has chip and is welded with wire.
2. the pressure transducer of a kind of PCB as claimed in claim 1 encapsulation, it is characterised in that the bottom of described circular open is provided with annular seal groove, is provided with sealing ring in seal groove.
3. the pressure transducer of a kind of PCB as claimed in claim 1 encapsulation, it is characterised in that described bonding refers to and is fixed on pcb board by chip and the effective node connection on chip is conducting on the corresponding solder joint of pcb board with bonding line.
4. the pressure transducer of a kind of PCB as claimed in claim 1 encapsulation, it is characterised in that described pcb board is fixed in circular open by the mode of slash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620102863.4U CN205352584U (en) | 2016-01-20 | 2016-01-20 | Pressure sensor of PCB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620102863.4U CN205352584U (en) | 2016-01-20 | 2016-01-20 | Pressure sensor of PCB encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205352584U true CN205352584U (en) | 2016-06-29 |
Family
ID=56182810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620102863.4U Active CN205352584U (en) | 2016-01-20 | 2016-01-20 | Pressure sensor of PCB encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205352584U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
-
2016
- 2016-01-20 CN CN201620102863.4U patent/CN205352584U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |