CN100573863C - Composite packing structure and manufacture method thereof - Google Patents
Composite packing structure and manufacture method thereof Download PDFInfo
- Publication number
- CN100573863C CN100573863C CN 200810095843 CN200810095843A CN100573863C CN 100573863 C CN100573863 C CN 100573863C CN 200810095843 CN200810095843 CN 200810095843 CN 200810095843 A CN200810095843 A CN 200810095843A CN 100573863 C CN100573863 C CN 100573863C
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- chip
- substrate
- slotted eye
- adhesive member
- packing structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
The invention relates to a kind of composite packing structure and manufacture method thereof, this manufacture method is a support adhesive member support adhesive member to be set in the chip with several golden projections and have between the substrate of a slotted eye, and is positioned at the space that this slotted eye periphery is not covered by described golden projection.Described golden projection is arranged between this substrate and this chip and in this slotted eye periphery, and electrically connects this substrate and this chip with the chip bonding method.At last, coat described golden projection and this slotted eye at least with an adhesive material.By this, the present invention can reduce the processing procedure time, increase golden projection the welding reliability, improve productive rate, reduce the process temperatures of chip bonding and reduce production costs.
Description
Technical field
The invention relates to a kind of encapsulating structure and manufacture method thereof, in detail, is about a kind of composite packing structure and manufacture method thereof.
Background technology
With reference to figure 1, it shows the flow chart of the manufacture method of traditional composite packing structure; Fig. 2 shows the schematic diagram of traditional composite packing structure.Cooperation is with reference to figure 1 and Fig. 2, and at first refer step S11 forms several solder projections 11 on a chip 10 to plant lug manufacturing process.Refer step S12 is provided with this chip 10 on a substrate 12, and described solder projection 11 electrically connects several connection pads (scheming not shown) of this chip 10 and this substrate 12, and this chip 10 is to utilize back welding process to carry out chip bonding with this substrate 12.Wherein, described solder projection 11 need attach scaling powder (pre-solder) in advance, and with the described connection pad contraposition of this substrate 12, carry out back welding process (the about 240-260 of process temperatures ℃/minute) again, with chip bonding this chip 10 and this substrate 12.Refer step S13 fills out and establishes a primer material 13 between this chip 10 and this substrate 12, and covers described solder projection 11.Refer step S14 carries out one first baking procedure, to solidify this primer material 13.Refer step S15 carries out a manufacture procedure of adhesive, coats this chip 10 and this substrate 12 with sealing 14.Refer step S16, last, carry out one second baking procedure, to solidify this sealing 14, to finish a traditional composite packing structure 1.
The manufacture method of this tradition composite packing structure has following shortcoming:
(1) utilizes and to plant projection (bumping) processing procedure to make the chip cost that contains solder projection higher.
(2) need to use scaling powder, thus cost increased, and, if when using non-volatile scaling powder, manufacturing process for cleaning need be arranged, except that increase processing procedure time and cost, and have the problem of welding assisted agent residuals.
(3) carry out chip bonding with back welding process, and the primer material is toasted processing procedure, the high temperature in its processing procedure can cause substrate that the defective of warpage is arranged.
(4) need to carry out chip bonding with back welding process, adding needs carry out the some glue filling of primer material one by one at each chip, and follow-up primer material toasts processing procedure, and its required processing procedure time is long, so can significantly reduce the productive rate of product.
Therefore, be necessary to provide the composite packing structure and the manufacture method thereof of a kind of innovation and tool progressive, to address the above problem.
Summary of the invention
A purpose of the present invention is to provide a kind of composite packing structure.This composite packing structure comprises a substrate, a chip, at least one support adhesive member and an adhesive material.This substrate has a slotted eye.This chip is arranged on this substrate, and this chip has an active surface, and this active surface has several golden projections, and described golden projection is arranged between this substrate and this chip and in this slotted eye periphery, and electrically connects this substrate and this chip.This support adhesive member is arranged between this substrate and this chip, and is positioned at the space that this slotted eye periphery is not covered by described golden projection.This adhesive material coats described golden projection and this slotted eye at least.
Another object of the present invention is to provide a kind of manufacture method of composite packing structure.This manufacture method may further comprise the steps: a substrate (a) is provided, and this substrate has a slotted eye; (b) provide a chip, this chip has an active surface, and this active surface has several golden projections; (c) at least one support adhesive member is set between this substrate and this chip, and makes this support adhesive member be positioned at the space that this slotted eye periphery is not covered by described golden projection, and do not cover described golden projection and this slotted eye; (d) engage this substrate and this chip, the described golden projection of this chip is arranged between this substrate and this chip and is positioned at this slotted eye periphery, and electrically connects this substrate and this chip; And (e) adhesive material is set to coat described golden projection and this slotted eye at least.
Composite packing structure of the present invention and manufacture method thereof, it is to form several golden projections in this chip surface (routing or electroplating process), with replace tradition expensive plant lug manufacturing process.And, this support adhesive member is set once in (some glue mode, stencil printing or rubberizing mode) on this chip or on this substrate, to remove from traditional primer processing procedure, slowly put the problem that productive rate that glue causes reduces one by one.Moreover, the present invention can the ultrasonic waves processing procedure or the hot pressing processing procedure carry out this substrate of chip bonding and this chip, with the process temperatures and the time of reducing traditional chip bonding significantly, the use that also can omit scaling powder simultaneously.
In addition, because this support adhesive member and this adhesive material adhesive material can be filled between this chip and this substrate, can save traditional primer processing procedure and can guarantee the reliability of soldering projection, so can save the processing procedure time.In addition, this support adhesive member of the present invention can be toasted after sealing in the lump in processing procedure (post moldcure) processing procedure and be toasted, so more traditional required time of primer processing procedure of required baking-curing time significantly shortens.
Description of drawings
Fig. 1 shows the flow chart of the manufacture method of traditional composite packing structure;
Fig. 2 shows the schematic diagram of traditional composite packing structure;
Fig. 3 shows the flow chart according to the manufacture method of first embodiment of the invention composite packing structure;
Fig. 4 shows according to first embodiment of the invention one chip and utilizes a support adhesive member to be arranged at schematic diagram on the substrate;
Fig. 5 shows the schematic diagram of composite packing structure that is arranged at the periphery of slotted eye one side according to first embodiment of the invention gold projection;
Fig. 6 shows that another of composite packing structure that is arranged at the periphery of slotted eye one side according to first embodiment of the invention gold projection implement aspect schematic diagram;
Fig. 7 shows the composite packing structure schematic diagram of periphery that is formed at slotted eye two sides of substrate according to first embodiment of the invention gold projection;
Fig. 8 shows that another of composite packing structure of periphery that is formed at slotted eye two sides of substrate according to first embodiment of the invention gold projection implement aspect schematic diagram;
Fig. 9 shows the schematic diagram of composite packing structure that is arranged at the periphery of slotted eye one side according to second embodiment of the invention gold projection;
Figure 10 shows that another of composite packing structure that is arranged at the periphery of slotted eye one side according to second embodiment of the invention gold projection implement aspect schematic diagram;
Figure 11 shows the composite packing structure schematic diagram of periphery that is formed at slotted eye two sides of substrate according to second embodiment of the invention gold projection;
Figure 12 shows that another of composite packing structure of periphery that is formed at slotted eye two sides of substrate according to second embodiment of the invention gold projection implement aspect schematic diagram.
Embodiment
Fig. 3 shows the flow chart of the manufacture method of first embodiment of the invention composite packing structure; Fig. 4 shows that first embodiment of the invention is provided with the schematic diagram of a chip on a substrate; Fig. 5 shows the schematic diagram of first embodiment of the invention composite packing structure.Cooperation is with reference to figure 3, Fig. 4 and Fig. 5, and at first refer step S21 provides a substrate 21, and this substrate has a slotted eye 211.Refer step S22 provides a chip 22, and this chip 22 has an active surface 221, and this active surface 221 has several golden projections 222.Wherein, described golden projection 222 can utilize the routing processing procedure to be formed at this active surface 221 of this chip 22, and perhaps, described golden projection 222 also can utilize electroplating process to be formed at this active surface 221 of this chip 22.Then, a support adhesive member 23 is set between this substrate 21 and this chip 22, and is positioned at the space that these slotted eye 211 peripheries are not covered by described golden projection 222.Wherein, these support adhesive member 23 utilisation point glue modes, stencil printing or rubberizing mode are arranged on this active surface 221 of this chip 22.Be noted that this support adhesive member 23 also to be set earlier on this substrate 21, and then fit this substrate 21 and this chip 22.
Refer step S23 engages this substrate 21 and this chip 22.Wherein, the described golden projection 222 of this chip 22 is arranged between this substrate 21 and this chip 22 and in these slotted eye 211 peripheries (described in the present embodiment golden projection 222 is arranged at the periphery of a side of this slotted eye 211), and electrically connects this substrate 21 and this chip 22.Preferably, this substrate 21 and this chip 22 are to carry out chip bonding with a ultrasonic waves processing procedure, and perhaps, this substrate 21 and this chip 22 can also carry out chip bonding by a hot pressing processing procedure.Preferably, after engaging this substrate 21 and these chip 22 steps, can comprise the step of one first baking in addition, to solidify this support adhesive member 23.
Refer step S24, last, carry out a manufacture procedure of adhesive, with this substrate 21 of an adhesive material 24 cover parts, this chip 22, this support adhesive member 23, described golden projection 222 and this slotted eye 211.Preferably, after these adhesive material 24 steps are set, can comprise one second baking procedure in addition, to solidify this adhesive material 24.
With reference to figure 5, it shows the schematic diagram of first embodiment of the invention composite packing structure again.This composite packing structure 2 comprises a substrate 21, a chip 22, a support adhesive member 23 and an adhesive material 24.This substrate 21 has a slotted eye 211, and in the present embodiment, this substrate 21 is a printed circuit board (PCB).
This chip 22 has an active surface 221, and this active surface 221 has several golden projections 222, and described golden projection 222 is arranged between this substrate 21 and this chip 22 and is positioned at the periphery of a side of this slotted eye 211, and electrically connects this substrate 21 and this chip 22.This active surface 221 has several connection pads (scheming not shown) in the present embodiment, and described golden projection 222 is to electrically connect with described connection pad.
This support adhesive member 23 is arranged between this substrate 21 and this chip 22, and is positioned at the space that these slotted eye 211 peripheries are not covered by described golden projection 222.Preferably, this support adhesive member 23 is B rank phenolic resins, and perhaps, this support adhesive member 23 can be epoxy resin (epoxy).Be noted that this support adhesive member 23 can be ring-type or discontinuous shape.
This adhesive material 24 covers a surface, this chip 22, this support adhesive member 23, this gold projection 222 and this slotted eye 211 of this substrate 21, and wherein, a side surface of this adhesive material 24 flushes with a side of this substrate 21.Preferably, this adhesive material 24 is a solid epoxy resin mould closure material.In the present embodiment, this adhesive material 24 that covers these slotted eye 211 parts is a protuberance with respect to a bottom surface of this substrate 21.In other was used, this adhesive material 24 that covers these slotted eye 211 parts also can flush with this bottom surface of this substrate 21, as shown in Figure 6.
With reference to figure 7 and Fig. 8, be noted that active surface 221 described golden projections 22 can be arranged at respectively on this substrate 21 and in the periphery of two sides of these slotted eye 211 peripheries.Wherein, this adhesive material 24 that covers these slotted eye 211 parts also can be a protuberance (as shown in Figure 7) with respect to a bottom surface of this substrate 21, or flushes (as shown in Figure 8) with this bottom surface of this substrate 21.
With reference to figure 9, it shows the schematic diagram of second embodiment of the invention composite packing structure.This composite packing structure 3 comprises a substrate 31, a chip 32, a support adhesive member 33 and an adhesive material 34.This second embodiment composite packing structure 3 and above-mentioned this first embodiment composite packing structure 2 are different be in, this adhesive material 24 is a surface, this chip 22, this support adhesive member 23, described golden projection 222 and this slotted eyes 211 that cover this substrate 21 in this first embodiment, and this adhesive material 34 is this active surface 321 of part, this support adhesive member 33 of part, described golden projection 322 and this slotted eyes 311 that cover this chip 32 in the slotted eye 311 of this substrate 31 in this second embodiment.
Preferably, in this second embodiment, this adhesive material 34 is a primer or a liquid mould closure material.Wherein, this adhesive material 34 that covers these slotted eye 311 parts also can be a protuberance (as shown in Figure 9) with respect to a bottom surface of this substrate 31, or flushes (as shown in figure 10) with this bottom surface of this substrate 31.
Be noted that described golden projection 322 also can be arranged between this substrate 31 and this chip 32 respectively and is positioned at the periphery of two sides of these slotted eye 311 peripheries.In addition, this adhesive material 34 that covers these slotted eye 311 parts also can be a protuberance (as shown in figure 11) with respect to a bottom surface of this substrate 31, or flushes (as shown in figure 12) with this bottom surface of this substrate 31.
Composite packing structure of the present invention and manufacture method thereof, it is to utilize routing or electroplating process to form several golden projections in chip surface, to replace the expensive lug manufacturing process of planting of tradition.And, support adhesive member is set once in (some glue mode, stencil printing or rubberizing mode) on the chip or on the substrate, to remove from traditional primer processing procedure, slowly put the problem that productive rate that glue causes reduces one by one.Moreover, the present invention can the ultrasonic waves processing procedure or the hot pressing processing procedure carry out this substrate of chip bonding and this chip, with the process temperatures and the time of reducing traditional chip bonding significantly, the use that also can omit scaling powder simultaneously.
In addition, because support adhesive member and adhesive material can be filled between chip and the substrate, can save traditional primer processing procedure and can guarantee the reliability of soldering projection, so can save the processing procedure time.In addition, support adhesive member of the present invention can be toasted after sealing in the lump in the processing procedure (post mold cure) and be toasted, so more traditional required time of primer processing procedure of required baking-curing time significantly shortens.
Only the foregoing description only is explanation principle of the present invention and effect thereof, but not in order to restriction the present invention.Therefore, practise the foregoing description being made amendment and changing and still do not take off spirit of the present invention in the personage of this technology.Interest field of the present invention claim as described later is listed.
Claims (15)
1. composite packing structure comprises:
Substrate has a slotted eye;
Chip is arranged on this substrate, and this chip has an active surface, and this active surface has several golden projections, and described golden projection is arranged between this substrate and this chip and in this slotted eye periphery, and electrically connects this substrate and this chip;
At least one support adhesive member is arranged between this substrate and this chip, and is positioned at the space that this slotted eye periphery is not covered by described golden projection, does not cover described golden projection and this slotted eye; And
Adhesive material coats described golden projection and this slotted eye at least.
2. composite packing structure as claimed in claim 1, wherein this support adhesive member is ring-type or discontinuous shape.
3. composite packing structure as claimed in claim 1, wherein this adhesive material more coats the surface that is provided with this chip, this chip and this support adhesive member of this substrate.
4. composite packing structure as claimed in claim 3, wherein a side surface of this adhesive material flushes with a side of this substrate.
5. composite packing structure as claimed in claim 1, wherein this adhesive material more coats this active surface of part and this support adhesive member of part of this chip in this slotted eye of this substrate.
6. composite packing structure as claimed in claim 1, wherein said golden projection is the periphery that is arranged at least one side of this slotted eye.
7. composite packing structure as claimed in claim 1, this adhesive material that wherein covers this slotted eye part is to flush with a bottom surface of this substrate.
8. composite packing structure as claimed in claim 1, this adhesive material that wherein covers this slotted eye part is a protuberance with respect to a bottom surface of this substrate.
9. the manufacture method of a composite packing structure may further comprise the steps:
(a) provide a substrate, this substrate has a slotted eye;
(b) provide a chip, this chip has an active surface, and this active surface has several golden projections;
(c) at least one support adhesive member is set between this substrate and this chip, and makes this support adhesive member be positioned at the space that this slotted eye periphery is not covered by described golden projection, and do not cover described golden projection and this slotted eye;
(d) engage this substrate and this chip, the described golden projection of this chip is arranged between this substrate and this chip and is positioned at this slotted eye periphery, and electrically connects this substrate and this chip; And
(e) adhesive material is set to coat described golden projection and this slotted eye at least.
10. manufacture method as claimed in claim 9, wherein step (c) may further comprise the steps:
(c1) this support adhesive member is set on this active surface of this chip; And
(c2) fit this substrate and this chip are arranged between this substrate and this chip this support adhesive member.
11. manufacture method as claimed in claim 10 wherein is to utilize some glue mode, stencil printing or rubberizing mode this support adhesive member to be set on this active surface of this chip in step (c1).
12. manufacture method as claimed in claim 9, wherein step (c) may further comprise the steps:
(c1) this support adhesive member is set on this substrate; And
(c2) fit this substrate and this chip are arranged between this substrate and this chip this support adhesive member.
13. manufacture method as claimed in claim 12 wherein is to utilize some glue mode, stencil printing or rubberizing mode this support adhesive member to be set on this substrate in step (c1).
14. manufacture method as claimed in claim 9, wherein in step (e), this adhesive material more coats the surface that is provided with this chip, this chip and this support adhesive member of this substrate.
15. manufacture method as claimed in claim 9, wherein in step (e), this adhesive material more coats this active surface of part and this support adhesive member of part of this chip in this slotted eye of this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810095843 CN100573863C (en) | 2008-04-30 | 2008-04-30 | Composite packing structure and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810095843 CN100573863C (en) | 2008-04-30 | 2008-04-30 | Composite packing structure and manufacture method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101266961A CN101266961A (en) | 2008-09-17 |
| CN100573863C true CN100573863C (en) | 2009-12-23 |
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| CN 200810095843 Active CN100573863C (en) | 2008-04-30 | 2008-04-30 | Composite packing structure and manufacture method thereof |
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| TWI474451B (en) * | 2011-09-15 | 2015-02-21 | Chipmos Technologies Inc | Flip chip package sturcture and forming method thereof |
| CN104465598A (en) * | 2014-12-19 | 2015-03-25 | 江苏长电科技股份有限公司 | Metal lead frame high thermal conductivity flip chip packaging structure and technological method thereof |
| TW202129867A (en) * | 2020-01-20 | 2021-08-01 | 大陸商光寶光電（常州）有限公司 | Package structure and method for forming package structure |
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