CN204296143U - Flexible printed circuit board copper moulds composite membrane - Google Patents
Flexible printed circuit board copper moulds composite membrane Download PDFInfo
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- CN204296143U CN204296143U CN201420742462.6U CN201420742462U CN204296143U CN 204296143 U CN204296143 U CN 204296143U CN 201420742462 U CN201420742462 U CN 201420742462U CN 204296143 U CN204296143 U CN 204296143U
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- adhesive layer
- circuit board
- copper foil
- printed circuit
- composite membrane
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Abstract
The utility model discloses a kind of flexible printed circuit board copper and mould composite membrane, be made up of PEN flexible insulation film, adhesive layer and Copper Foil, adhesive layer is formed on a surface of described PEN flexible insulation film, adhesive layer is between Copper Foil and PEN flexible insulation film and bonding Copper Foil and PEN flexible insulation film, the thickness of PEN flexible insulation film is 6 μm-150 μm, the thickness of adhesive layer is 1 μm-20 μm, the thickness of Copper Foil is 7 μm-50 μm, and this flexible printed circuit board copper moulds composite membrane good heat resistance, shrinkage factor is little, photostability is high.
Description
Technical field
The utility model relates to a kind of flexible printed wiring board material, is specifically related to a kind of good heat resistance, copper that shrinkage factor is little moulds composite membrane.
Background technology
Printed wiring board is that raw material manufacture forms with copper clad laminate, and copper clad laminate is the composite be made up of dielectric layer and Copper Foil, and at present, the material that dielectric layer generally adopts is phenolic resins, polyimide resin, epoxy resin, polytetrafluoroethylene (PTFE) or glass fibre.In flexible printed circuit board field, its raw material copper clad laminate is generally be made up of polyimide material and Copper Foil.
Utility model content
In order to solve the problem, the utility model provides a kind of flexible printed circuit board copper and moulds composite membrane, and this flexible printed circuit board copper moulds composite membrane good heat resistance, shrinkage factor is little, photostability is high.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of flexible printed circuit board copper moulds composite membrane, be made up of PEN (PEN) flexible insulation film, adhesive layer and Copper Foil, described adhesive layer is formed on a surface of described PEN flexible insulation film, described adhesive layer is between described Copper Foil and described PEN flexible insulation film and bonding described Copper Foil and described PEN flexible insulation film, the thickness of described PEN flexible insulation film is 6 μm-150 μm, the thickness of described adhesive layer is 1 μm-20 μm, and the thickness of described Copper Foil is 7 μm-50 μm.
The utility model in order to the further technical scheme solving its technical problem and adopt is:
It is preferred that described Copper Foil is electrolytic copper foil (ED) or rolled copper foil (RA).
It is preferred that described adhesive layer is polyurethane glue adhesion coating, epoxy glue adhesion coating, acrylate glue adhesion coating or polyimides adhesive layer, preferably polyurethane glue adhesion coating.
It is preferred that the thickness of described PEN flexible insulation film is 12 μm-125 μm.
It is preferred that the thickness of described Copper Foil is 7 μm-30 μm.
It is preferred that the thickness of described adhesive layer is 3 μm-10 μm.
The beneficial effects of the utility model are: flexible printed circuit board copper of the present utility model moulds composite membrane by PEN flexible insulation film, adhesive layer and Copper Foil are formed, and the thickness of PEN flexible insulation film is 6 μm-150 μm, the thickness of adhesive layer is the thickness of 1 μm-20 μm and Copper Foil is 7 μm-50 μm, this flexible printed circuit board copper moulds the Long-Time Service temperature of composite membrane can up to more than 160 degree, to exceed a lot than 120 degree of copper clad laminate of prior art, its percent thermal shrinkage is more much smaller than the copper clad laminate of prior art, its photostability is 5 times of prior art copper clad laminate.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Detailed description of the invention
Below by way of specific instantiation, detailed description of the invention of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, under the category do not disclosed departing from the utility model, can give different modifications and change.
Embodiment: a kind of flexible printed circuit board copper moulds composite membrane, as shown in Figure 1, be made up of PEN (PEN) flexible insulation film 1, adhesive layer 2 and Copper Foil 3, described adhesive layer is formed on a surface of described PEN flexible insulation film, and described adhesive layer is between described Copper Foil and described PEN flexible insulation film and bonding described Copper Foil and described PEN flexible insulation film.
The thickness of described PEN flexible insulation film is 6 μm-150 μm, preferably 12 μm-125 μm.
The thickness of described adhesive layer is 1 μm-20 μm, preferably 3 μm-10 μm.
The thickness of described Copper Foil is 7 μm-50 μm, preferably 7 μm-30 μm.
Described Copper Foil is electrolytic copper foil (ED) or rolled copper foil (RA).
Described adhesive layer is polyurethane glue adhesion coating, epoxy glue adhesion coating, acrylate glue adhesion coating or polyimides adhesive layer, preferably polyurethane glue adhesion coating.
Flexible printed circuit board copper of the present utility model is moulded composite membrane and is had following advantage: Long-Time Service temperature can up to more than 160 degree, will exceed a lot than 120 degree of copper clad laminate of prior art; Percent thermal shrinkage is more much smaller than the copper clad laminate of prior art; Photostability is 5 times of prior art copper clad laminate.
Claims (7)
1. a flexible printed circuit board copper moulds composite membrane, it is characterized in that: be made up of PEN flexible insulation film (1), adhesive layer (2) and Copper Foil (3), described adhesive layer is formed on a surface of described PEN flexible insulation film, described adhesive layer is between described Copper Foil and described PEN flexible insulation film and bonding described Copper Foil and described PEN flexible insulation film, the thickness of described PEN flexible insulation film is 6 μm-150 μm, the thickness of described adhesive layer is 1 μm-20 μm, and the thickness of described Copper Foil is 7 μm-50 μm.
2. flexible printed circuit board copper as claimed in claim 1 moulds composite membrane, it is characterized in that: described Copper Foil is electrolytic copper foil or rolled copper foil.
3. flexible printed circuit board copper as claimed in claim 1 moulds composite membrane, it is characterized in that: described adhesive layer is polyurethane glue adhesion coating, epoxy glue adhesion coating, acrylate glue adhesion coating or polyimides adhesive layer.
4. flexible printed circuit board copper as claimed in claim 3 moulds composite membrane, it is characterized in that: described adhesive layer is polyurethane glue adhesion coating.
5. flexible printed circuit board copper as claimed in claim 1 moulds composite membrane, it is characterized in that: the thickness of described PEN flexible insulation film is 12 μm-125 μm.
6. flexible printed circuit board copper as claimed in claim 1 moulds composite membrane, it is characterized in that: the thickness of described Copper Foil is 7 μm-30 μm.
7. flexible printed circuit board copper as claimed in claim 1 moulds composite membrane, it is characterized in that: the thickness of described adhesive layer is 3 μm-10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420742462.6U CN204296143U (en) | 2014-12-01 | 2014-12-01 | Flexible printed circuit board copper moulds composite membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420742462.6U CN204296143U (en) | 2014-12-01 | 2014-12-01 | Flexible printed circuit board copper moulds composite membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204296143U true CN204296143U (en) | 2015-04-29 |
Family
ID=53101719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420742462.6U Active CN204296143U (en) | 2014-12-01 | 2014-12-01 | Flexible printed circuit board copper moulds composite membrane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204296143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115584216A (en) * | 2022-11-02 | 2023-01-10 | 江苏伊诺尔新材料科技有限公司 | Copper-plastic composite adhesive tape suitable for flexible circuit board |
-
2014
- 2014-12-01 CN CN201420742462.6U patent/CN204296143U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115584216A (en) * | 2022-11-02 | 2023-01-10 | 江苏伊诺尔新材料科技有限公司 | Copper-plastic composite adhesive tape suitable for flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 214000 Wind Energy Road 67-9, Huishan Economic Development Zone, Wuxi City, Jiangsu Province Patentee after: Lorell Nano-synthetic Materials (Jiangsu) Co., Ltd. Address before: 215300 No. 401 Matang Road, Kunshan Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: Industrial membrane (Kunshan) Co., Ltd. |