CN105491788B - A kind of graphene heat radiating type screened film and preparation method thereof - Google Patents
A kind of graphene heat radiating type screened film and preparation method thereof Download PDFInfo
- Publication number
- CN105491788B CN105491788B CN201610023107.7A CN201610023107A CN105491788B CN 105491788 B CN105491788 B CN 105491788B CN 201610023107 A CN201610023107 A CN 201610023107A CN 105491788 B CN105491788 B CN 105491788B
- Authority
- CN
- China
- Prior art keywords
- layer
- film
- coated
- graphene heat
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The present invention relates to shielding technical field of membrane, more particularly to a kind of graphene heat radiating type screened film and preparation method thereof, including carrier film layer, the ink layer that is coated on carrier film layer upper surface, the graphene heat dissipating layer for being coated on ink layer upper surface, the conductive adhesive layer for being coated on graphene heat dissipating layer upper surface.Graphene heat radiating type screened film of the invention has good flexibility, thickness ultrathin, heat resistance meets tin soldering liquid immersion and reaches 340 DEG C * 30 seconds, not stratified blistering, and has good conduction property, conducting resistance is below 300 milliohms, good thermal diffusivity, thermal conductivity are 2.0W/m*K or more, and effectiveness is good, 50db or more can be reached, very well satisfy the demand of electronic product industry.
Description
Technical field
The present invention relates to shielding technical field of membrane, and in particular to a kind of graphene heat radiating type screened film and preparation method thereof.
Background technique
Printed wiring board is material indispensable in electronic product, is widely used in computer at present and its periphery is set
In standby, communication product and consumer electrical product, with consumer electrical product demand sustainable growth, for printed circuit board
Requirement be also growing day by day.
In flexible print circuit board industry, with the update of the electronic equipments such as smart phone, Ipad, to electromagnetic shielding
Requirement it is also higher and higher.It, will be in large quantities using electromagnetic shielding membrane material on route in the process of flexible circuit board.
Now with the raising of the entire integrated level of wiring board, while considering excellent shielding, the heat dissipation that can also consider
Problem.Preferably to solve the problems, such as this, there is an urgent need to a kind of novel shielding film products.
Summary of the invention
In order to overcome shortcoming and defect existing in the prior art, the purpose of the present invention is to provide a kind of good heat dissipation effects
The graphene heat radiating type screened film thin with thickness.
Another object of the present invention is to provide a kind of preparation method of graphene heat radiating type screened film, the preparation method works
Skill is simple, convenient operation and control, and quality is stablized, and high production efficiency, production cost is low, is suitble to large-scale industrial production.
The purpose of the invention is achieved by the following technical solution: a kind of graphene heat radiating type screened film, including carrier thin film
Layer, the graphene heat dissipating layer for being coated on ink layer upper surface, is coated on graphite at the ink layer for being coated on carrier film layer upper surface
The conductive adhesive layer of alkene heat dissipating layer upper surface.
Graphene heat radiating type screened film of the invention has good flexibility, thickness ultrathin, and heat resistance meets scolding tin
Liquid immersion reaches 340 DEG C * 30 seconds, not stratified blistering, and have good conduction property, conducting resistance 300 milliohms with
Under, good thermal diffusivity, thermal conductivity is 2.0W/m*K or more, and effectiveness is good, can reach 50db or more, well
Meet the demand of electronic product industry.
Preferably, the carrier film layer is high molecular polymer film, and high molecular polymer film is PET film, PEN
At least one of film, PI film, PBT film and PPS film.The present invention by using above-mentioned film as carrier film layer,
With preferable translucency and light diffusing.
Preferably, the raw material of the ink layer is epoxy resin, polyacrylic resin, modified rubber, phenolic resin, polyester
At least one of resin and polyurethane resin.The present invention by using above-mentioned raw materials as ink layer so that graphene radiates
Type screened film has good insulating properties.More preferably, the raw material of the ink layer is by epoxy resin, polyacrylic resin
The mixture formed with phenolic resin with weight ratio 1:0.8-1.2:1.4-2.2.Alternatively, the raw material of the ink layer is by being modified
The mixture that rubber, polyester resin and polyurethane resin are formed with weight ratio 0.5-1.5:1.5-2.5:1.
Preferably, the raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 10-100nm.The present invention passes through
Using partial size 10-100nm raw material of the nano-graphene as graphene heat dissipating layer so that graphene heat radiating type screened film has
There are excellent thermally conductive, thermal diffusivity, advantages of good shielding performance.
Preferably, the raw material of the conductive adhesive layer is by adhesive main body and the conducting powder group being distributed in adhesive main body
At.The present invention adds conducting powder by using in adhesive main body, so that graphene heat radiating type screened film has excellent lead
General character energy.More preferably, the weight ratio of the conducting powder and the adhesive main body is 1-5:100.
The raw material of the adhesive main body is modified epoxy, polyacrylic resin, polyimide resin, modified rubber
At least one of glue, phenolic resin, polyester resin and polyurethane resin.The present invention is by using above-mentioned raw materials as viscose
Layer, it is good to cohere effect.More preferably, the raw material of the adhesive main body is by modified epoxy, polyacrylic resin
The mixture formed with polyimide resin with weight ratio 0.8-1.2:1.4-2.2:1.Alternatively, the raw material of the adhesive main body
The mixture being made of phenolic resin, polyester resin and polyurethane resin with weight ratio 2-4:0.5-1.5:1.
The conducting powder is at least one of silver powder, silver-coated copper powder, copper powder and nickel powder, and the partial size of conducting powder is 1-15 μ
m.The present invention is by using above-mentioned conducting powder, and controlling its partial size is 1-15 μm, so that graphene heat radiating type screened film is with excellent
Different conduction property.More preferably, the conducting powder is by silver powder, silver-coated copper powder and nickel powder with weight ratio 2-4:1.4-2.2:
The mixture of 1 composition.
The carrier film layer with a thickness of 25-200 μm；The ink layer with a thickness of 5-50 μm；The graphene dissipates
Thermosphere with a thickness of 2-50 μm；It is described conduction adhesive layer with a thickness of 3-15 μm.
Preferably, the upper surface of the conductive adhesive layer is provided with a leafing type protective film layer；The release protective film layer
With a thickness of 12-200 μm.The present invention is by being arranged a leafing type protective film layer, protection effect in the upper surface of conductive adhesive layer
Fruit is good.
Preferably, the release protective film layer is any in PET release film, PP release film, PBT release film and release paper
It is a kind of.For the present invention by using above-mentioned release film as release protective layer, protecting effect is good.
Preferably, silicone oil mould release between the lower surface of the release protective film layer and the upper surface of the conductive adhesive layer
Or non-silicone oil mould release.The present invention is by using release in the lower surface of release protective film layer coating silicone oil mould release or non-silicone oil
Agent, so that release protective film layer can be removed easily when in use.
Another object of the present invention is achieved through the following technical solutions: a kind of preparation side of graphene heat radiating type screened film
Method includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer, solidifies ink layer through oven drying；
A2, it is coated with one layer of graphene on ink layer, forms graphene heat dissipating layer；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature 60-120
DEG C, linear velocity 5-30m/min；
A4, winding.
Preparation method of the invention can be realized, side by conventional FPC processing technology (be such as coated with, sputter, fitting)
Just commercial introduction application, simple process, convenient operation and control, quality are stablized, and high production efficiency, production cost is low, are suitble to big rule
Mould industrialized production.
Alternatively, another object of the present invention is achieved through the following technical solutions: a kind of system of graphene heat radiating type screened film
Preparation Method includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer, solidifies ink layer through oven drying；
B2, it is coated with one layer of graphene on ink layer, forms graphene heat dissipating layer；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature 60-120
DEG C, linear velocity 5-30m/min；
B4, the one leafing type protective film layer of thermal-adhering on conductive adhesive layer；
B5, winding.
Preparation method of the invention can be realized, side by conventional FPC processing technology (be such as coated with, sputter, fitting)
Just commercial introduction application, simple process, convenient operation and control, quality are stablized, and high production efficiency, production cost is low, are suitble to big rule
Mould industrialized production.
The beneficial effects of the present invention are: graphene heat radiating type screened film of the invention has good by using ink layer
Good insulating properties；Graphene heat radiating type screened film of the invention is by using graphene heat dissipating layer, with excellent thermally conductive, heat dissipation
Property, advantages of good shielding performance；Graphene heat radiating type screened film of the invention has excellent conduction by using conductive adhesive layer
Energy；The present invention has fabulous flexibility, is able to satisfy flexible circuitry board industry by using ink layer and conductive adhesive layer
Softness requirements.Graphene heat radiating type screened film thickness ultrathin of the invention, ink layer, graphene heat dissipating layer and conductive adhesive layer are total
The minimum 8-16um of thickness.
Graphene heat radiating type screened film of the invention has good flexibility, thickness ultrathin, and heat resistance meets scolding tin
Liquid immersion reaches 340 DEG C * 30 seconds, not stratified blistering, and have good conduction property, conducting resistance 300 milliohms with
Under, good thermal diffusivity, thermal conductivity is 2.0W/m*K or more, and effectiveness is good, can reach 50db or more, well
Meet the demand of electronic product industry.
Preparation method of the invention can be realized, side by conventional FPC processing technology (be such as coated with, sputter, fitting)
Just commercial introduction application, simple process, convenient operation and control, quality are stablized, and high production efficiency, production cost is low, are suitble to big rule
Mould industrialized production.
Detailed description of the invention
Fig. 1 is the partial sectional view of the embodiment of the present invention 1.
Fig. 2 is the partial sectional view of the embodiment of the present invention 6.
Appended drawing reference are as follows: 1-carrier film layer, 2-ink layers, 3-graphene heat dissipating layers, 4-conductive adhesive layers, 5-
Release protective film layer.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made below with reference to examples and drawings 1-2 further
Explanation, the content that embodiment refers to not is limitation of the invention.
Embodiment 1
See Fig. 1, a kind of graphene heat radiating type screened film, including carrier film layer 1, it is coated on 1 upper surface of carrier film layer
Ink layer 2, the graphene heat dissipating layer 3 for being coated on 2 upper surface of ink layer, the conduction that is coated on 3 upper surface of graphene heat dissipating layer
Adhesive layer 4.
The carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PET film.
The raw material of the ink layer 2 is epoxy resin.
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 10nm.
The raw material of the conduction adhesive layer 4 is made of adhesive main body and the conducting powder being distributed in adhesive main body；Glue
The raw material of glutinous agent main body is modified epoxy；The conducting powder is silver powder, and the partial size of conducting powder is 1 μm.
The carrier film layer 1 with a thickness of 25 μm；The ink layer 2 with a thickness of 5 μm；The graphene heat dissipating layer 3
With a thickness of 2um；It is described conduction adhesive layer 4 with a thickness of 3 μm.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
A2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 60 DEG C, line
Speed is 30m/min；
A4, winding.
Embodiment 2
The present embodiment and above-described embodiment 1 the difference is that:
The carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PEN film.
The raw material of the ink layer 2 is polyacrylic resin.
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 30nm.
The raw material of the conduction adhesive layer 4 is made of adhesive main body and the conducting powder being distributed in adhesive main body；Glue
The raw material of glutinous agent main body is polyacrylic resin；The conducting powder is silver-coated copper powder, and the partial size of conducting powder is 5 μm.
The carrier film layer 1 with a thickness of 50 μm；The ink layer 2 with a thickness of 20 μm；The graphene heat dissipating layer 3
With a thickness of 20um；It is described conduction adhesive layer with a thickness of 6 μm.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
A2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 80 DEG C, line
Speed is 20m/min；
A4, winding.
Embodiment 3
The present embodiment and above-described embodiment 1 the difference is that:
The carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PI film.
The raw material of the ink layer 2 is modified rubber.
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 50nm.
The raw material of the conduction adhesive layer 4 is made of adhesive main body and the conducting powder being distributed in adhesive main body；Glue
The raw material of glutinous agent main body is polyimide resin；The conducting powder is copper powder, and the partial size of conducting powder is 8 μm.
The carrier film layer 1 with a thickness of 100 μm；The ink layer 2 with a thickness of 30 μm；The graphene heat dissipating layer
3 with a thickness of 30um；It is described conduction adhesive layer with a thickness of 9 μm.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
A2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 90 DEG C, line
Speed is 15m/min；
A4, winding.
Embodiment 4
The present embodiment and above-described embodiment 1 the difference is that:
The carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PBT film.
The raw material of the ink layer 2 is phenolic resin.
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 80nm.
The raw material of the conduction adhesive layer 4 is made of adhesive main body and the conducting powder being distributed in adhesive main body；Glue
The raw material of glutinous agent main body is modified rubber；The conducting powder is nickel powder, and the partial size of conducting powder is 12 μm.
The carrier film layer 1 with a thickness of 150 μm；The ink layer 2 with a thickness of 40 μm；The graphene heat dissipating layer
3 with a thickness of 40um；It is described conduction adhesive layer with a thickness of 12 μm.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
A2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 100 DEG C, line
Speed is 10m/min；
A4, winding.
Embodiment 5
The present embodiment and above-described embodiment 1 the difference is that:
The carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PPS film.
The raw material of the ink layer 2 is polyester resin or polyurethane resin.
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 100nm.
The raw material of the conduction adhesive layer 4 is made of adhesive main body and the conducting powder being distributed in adhesive main body；Glue
The raw material of glutinous agent main body is phenolic resin, polyester resin or polyurethane resin；The conducting powder is silver powder, and the partial size of conducting powder is
15μm。
The carrier film layer 1 with a thickness of 200 μm；The ink layer 2 with a thickness of 50 μm；The graphene heat dissipating layer
3 with a thickness of 50um；It is described conduction adhesive layer with a thickness of 15 μm.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
A2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 120 DEG C, line
Speed is 5m/min；
A4, winding.
Embodiment 6
See Fig. 2, the present embodiment and above-described embodiment 1 the difference is that:
The upper surface of the conduction adhesive layer 4 is provided with a leafing type protective film layer 5；The thickness of the release protective film layer 5
Degree is 12 μm.
The release protective film layer 5 is PET release film.
It is release that silicone oil is coated between the lower surface of the release protective film layer 5 and the upper surface of the conductive adhesive layer 4
Agent.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
B2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 60 DEG C, line
Speed is 30m/min；
B4, the one leafing type protective film layer 5 of thermal-adhering on conductive adhesive layer；
B5, winding.
Embodiment 7
The present embodiment and above-described embodiment 6 the difference is that:
The upper surface of the conduction adhesive layer 4 is provided with a leafing type protective film layer 5；The thickness of the release protective film layer 5
Degree is 50 μm.
The release protective film layer 5 is PP release film.
Be coated between the lower surface of the release protective film layer 5 and the upper surface of the conductive adhesive layer 4 non-silicone oil from
Type agent.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
B2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 80 DEG C, line
Speed is 20m/min；
B4, the one leafing type protective film layer 5 of thermal-adhering on conductive adhesive layer；
B5, winding.
Embodiment 8
The present embodiment and above-described embodiment 6 the difference is that:
The upper surface of the conduction adhesive layer 4 is provided with a leafing type protective film layer 5；The thickness of the release protective film layer 5
Degree is 100 μm.
The release protective film layer 5 is PBT release film.
It is release that silicone oil is coated between the lower surface of the release protective film layer 5 and the upper surface of the conductive adhesive layer 4
Agent.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
B2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 90 DEG C, line
Speed is 15m/min；
B4, the one leafing type protective film layer 5 of thermal-adhering on conductive adhesive layer；
B5, winding.
Embodiment 9
The present embodiment and above-described embodiment 6 the difference is that:
The upper surface of the conduction adhesive layer 4 is provided with a leafing type protective film layer 5；The thickness of the release protective film layer 5
Degree is 150 μm.
The release protective film layer 5 is release paper.
Be coated between the lower surface of the release protective film layer 5 and the upper surface of the conductive adhesive layer 4 non-silicone oil from
Type agent.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
B2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 100 DEG C, line
Speed is 10m/min；
B4, the one leafing type protective film layer 5 of thermal-adhering on conductive adhesive layer；
B5, winding.
Embodiment 10
The present embodiment and above-described embodiment 6 the difference is that:
The upper surface of the conduction adhesive layer 4 is provided with a leafing type protective film layer 5；The thickness of the release protective film layer 5
Degree is 200 μm.
The release protective film layer 5 is PET release film.
It is release that silicone oil is coated between the lower surface of the release protective film layer 5 and the upper surface of the conductive adhesive layer 4
Agent.
A kind of preparation method of graphene heat radiating type screened film, includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink on it
Layer 2 solidifies ink layer 2 through oven drying；
B2, it is coated with one layer of graphene on ink layer 2, forms graphene heat dissipating layer 3；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 120 DEG C, line
Speed is 5m/min；
B4, the one leafing type protective film layer 5 of thermal-adhering on conductive adhesive layer；
B5, winding.
Embodiment 11
The present embodiment and above-described embodiment 1 or embodiment 6 the difference is that:
The raw material of the ink layer 2 is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:0.8:1.4
The mixture of composition.Alternatively, the raw material of the ink layer 2 is by modified rubber, polyester resin and polyurethane resin with weight ratio
The mixture of 0.5:1.5:1 composition.
The weight ratio of the conducting powder and the adhesive main body is 1:100.
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight
Than the mixture of 0.8:1.4:1 composition.Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin and poly- ammonia
The mixture that ester resin is formed with weight ratio 2:0.5:1.
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 2:1.4:1.
Embodiment 12
The present embodiment and above-described embodiment 11 the difference is that:
The raw material of the ink layer 2 is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:0.9:1.6
The mixture of composition.Alternatively, the raw material of the ink layer 2 is by modified rubber, polyester resin and polyurethane resin with weight ratio
The mixture of 0.8:1.8:1 composition.
The weight ratio of the conducting powder and the adhesive main body is 2:100.
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight
Than the mixture of 0.9:1.6:1 composition.Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin and poly- ammonia
The mixture that ester resin is formed with weight ratio 2.5:0.8:1.
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 2.5:1.6:1.
Embodiment 13
The present embodiment and above-described embodiment 11 the difference is that:
The raw material of the ink layer 2 is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:1:1.8 group
At mixture.Alternatively, the raw material of the ink layer 2 is by modified rubber, polyester resin and polyurethane resin with weight ratio 1:
The mixture of 2:1 composition.
The weight ratio of the conducting powder and the adhesive main body is 3:100.
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight
Than the mixture of 1:1.8:1 composition.Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin and polyurethane
The mixture that resin is formed with weight ratio 3:1:1.
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 3:1.8:1.
Embodiment 14
The present embodiment and above-described embodiment 11 the difference is that:
The raw material of the ink layer 2 is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:1.1:2 group
At mixture.Alternatively, the raw material of the ink layer 2 is by modified rubber, polyester resin and polyurethane resin with weight ratio
1.2:2.2:1 the mixture of composition.
The weight ratio of the conducting powder and the adhesive main body is 4:100.
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight
Than the mixture of 1.1:2:1 composition.Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin and polyurethane
The mixture that resin is formed with weight ratio 3.5:1.2:1.
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 3.5:2:1.
Embodiment 15
The present embodiment and above-described embodiment 11 the difference is that:
The raw material of the ink layer 2 is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:1.2:2.2
The mixture of composition.Alternatively, the raw material of the ink layer 2 is by modified rubber, polyester resin and polyurethane resin with weight ratio
1.5:2.5:1 the mixture of composition.
The weight ratio of the conducting powder and the adhesive main body is 5:100.
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight
Than the mixture of 1.2:2.2:1 composition.Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin and poly- ammonia
The mixture that ester resin is formed with weight ratio 4:1.5:1.
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 4:2.2:1.
Above-described embodiment is the preferable implementation of the present invention, and in addition to this, the present invention can be realized with other way,
Do not depart under the premise of present inventive concept it is any obviously replace it is within the scope of the present invention.
Claims (2)
1. a kind of graphene heat radiating type screened film, it is characterised in that: including carrier film layer, be coated on carrier film layer upper surface
Ink layer, be coated on ink layer upper surface graphene heat dissipating layer, be coated on the conductive gluing of graphene heat dissipating layer upper surface
Layer；
The raw material of the ink layer is by epoxy resin, polyacrylic resin and phenolic resin with weight ratio 1:0.8-1.2:1.4-
The mixture of 2.2 compositions；Alternatively, the raw material of the ink layer is by modified rubber, polyester resin and polyurethane resin with weight
Than the mixture of 0.5-1.5:1.5-2.5:1 composition；
The raw material of the graphene heat dissipating layer is nano-graphene of the partial size in 10-100nm；
The raw material of the conduction adhesive layer is made of adhesive main body and the conducting powder being distributed in adhesive main body, the conduction
The weight ratio of powder and the adhesive main body is 1-5:100；
The raw material of the adhesive main body is by modified epoxy, polyacrylic resin and polyimide resin with weight ratio
The mixture of 0.8-1.2:1.4-2.2:1 composition；Alternatively, the raw material of the adhesive main body is by phenolic resin, polyester resin
The mixture formed with polyurethane resin with weight ratio 2-4:0.5-1.5:1；
The mixture that the conducting powder is made of silver powder, silver-coated copper powder and nickel powder with weight ratio 2-4:1.4-2.2:1, conducting powder
Partial size be 1-15 μm；
The carrier film layer is high molecular polymer film, and high molecular polymer film is PET film, PEN film, PI thin
At least one of film, PBT film and PPS film；
The preparation method of the graphene heat radiating type screened film includes the following steps:
A1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink layer on it,
Solidify ink layer through oven drying；
A2, it is coated with one layer of graphene on ink layer, forms graphene heat dissipating layer；
A3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, is sent into oven drying, oven temperature is 60-120 DEG C, line
Speed is 5-30m/min；
A4, winding.
2. a kind of graphene heat radiating type screened film according to claim 1, it is characterised in that: it is described conduction adhesive layer it is upper
Surface is provided with a leafing type protective film layer, the release protective film layer be PET release film, PP release film, PBT release film and from
Any one in type paper, silicone oil is release between the lower surface of the release protective film layer and the upper surface of the conductive adhesive layer
Agent or non-silicone oil mould release；
The preparation method of the graphene heat radiating type screened film includes the following steps:
B1, a carrier thin film is taken, removes greasy dirt and foreign matter on carrier thin film volume inner face, and be coated with one layer of ink layer on it,
Solidify ink layer through oven drying；
B2, one layer of graphene is coated on ink layer, with a thickness of 2-50um；
B3, it is coated with one layer of conductive adhesive on graphene heat dissipating layer, with a thickness of 3-15 μm, is sent into oven drying, oven temperature
It is 60-120 DEG C, linear velocity 5-30m/min；
B4, the one leafing type protective film layer of thermal-adhering on conductive adhesive layer；
B5, winding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610023107.7A CN105491788B (en) | 2016-01-14 | 2016-01-14 | A kind of graphene heat radiating type screened film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610023107.7A CN105491788B (en) | 2016-01-14 | 2016-01-14 | A kind of graphene heat radiating type screened film and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105491788A CN105491788A (en) | 2016-04-13 |
| CN105491788B true CN105491788B (en) | 2019-02-19 |
Family
ID=55678388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610023107.7A Active CN105491788B (en) | 2016-01-14 | 2016-01-14 | A kind of graphene heat radiating type screened film and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105491788B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128563A (en) * | 2016-08-15 | 2016-11-16 | 东莞市纳利光学材料有限公司 | A kind of conductive and heat-conductive film and preparation method thereof |
| CN106993402B (en) * | 2017-04-10 | 2020-06-09 | 东莞市万丰纳米材料有限公司 | Method for manufacturing heat conduction and heat dissipation electromagnetic shielding film |
| CN110936677A (en) * | 2019-12-09 | 2020-03-31 | 苏州康丽达精密电子有限公司 | Preparation method and application of graphite and conductive layer composite film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146024A (en) * | 2013-03-19 | 2013-06-12 | 苏州格瑞丰纳米科技有限公司 | Porous graphene/polymer composite structure and preparation method and application thereof |
| CN103539958A (en) * | 2013-10-31 | 2014-01-29 | 陕西师范大学 | Transfer method of thin film plated with ultrathin metal nanomaterial on base |
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
| CN104883866A (en) * | 2015-05-12 | 2015-09-02 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with excellent thermal conductivity and manufacturing process of electromagnetic shielding film |
| CN105085956A (en) * | 2015-09-08 | 2015-11-25 | 宁波今山电子材料有限公司 | Preparation method of black polyimide film with static electricity prevention and shielding functions |
| CN205546176U (en) * | 2016-01-14 | 2016-08-31 | 苏州城邦达力材料科技有限公司 | Graphite alkene heat dissipation type screened film |
-
2016
- 2016-01-14 CN CN201610023107.7A patent/CN105491788B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146024A (en) * | 2013-03-19 | 2013-06-12 | 苏州格瑞丰纳米科技有限公司 | Porous graphene/polymer composite structure and preparation method and application thereof |
| CN103539958A (en) * | 2013-10-31 | 2014-01-29 | 陕西师范大学 | Transfer method of thin film plated with ultrathin metal nanomaterial on base |
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
| CN104883866A (en) * | 2015-05-12 | 2015-09-02 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with excellent thermal conductivity and manufacturing process of electromagnetic shielding film |
| CN105085956A (en) * | 2015-09-08 | 2015-11-25 | 宁波今山电子材料有限公司 | Preparation method of black polyimide film with static electricity prevention and shielding functions |
| CN205546176U (en) * | 2016-01-14 | 2016-08-31 | 苏州城邦达力材料科技有限公司 | Graphite alkene heat dissipation type screened film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105491788A (en) | 2016-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104507301A (en) | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film | |
| TWM555982U (en) | High-performance EMI shielding film | |
| CN204981729U (en) | High -efficient thermal film who contains thermal conductive adhesive | |
| CN105491788B (en) | A kind of graphene heat radiating type screened film and preparation method thereof | |
| CN104797081B (en) | A kind of electromagnetic shielding film and its manufacturing process suitable for Rigid Flex | |
| CN204669808U (en) | A kind of electromagnetic shielding film with thermal conductive resin | |
| CN104883866A (en) | Electromagnetic shielding film with excellent thermal conductivity and manufacturing process of electromagnetic shielding film | |
| CN204259357U (en) | A kind of electromagnetic shielding film with the coat of metal | |
| CN204578887U (en) | A kind of electromagnetic shielding film being applicable to Rigid Flex | |
| CN105283056A (en) | Electromagnetic wave interference shielding film | |
| CN104010435A (en) | Covering film with electromagnetic shielding function and manufacturing technology of covering film with electromagnetic shielding function | |
| CN205546176U (en) | Graphite alkene heat dissipation type screened film | |
| CN205430758U (en) | Electromagnetic shield membrane suitable for high frequency signal | |
| CN202030694U (en) | High peel strength conductive glue film with through holes | |
| CN207852904U (en) | Flexible near-field communication aerial | |
| CN210011437U (en) | Heat-conducting silica gel heat-dissipation composite film | |
| CN206380244U (en) | A kind of graphite flake for heat conduction | |
| CN207744231U (en) | Circuit board | |
| TWM589118U (en) | Thermal conductive film structure | |
| CN104010436A (en) | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology | |
| CN204585969U (en) | A kind of good copper-clad plate of dispelling the heat | |
| CN209144067U (en) | A kind of high-performance conductive cloth double-sided adhesive | |
| CN101374383B (en) | Insulated basilar membrane, circuit board substrate and circuit board | |
| CN204014268U (en) | A kind of flexibility with effectiveness is covered metal substrate | |
| CN209210695U (en) | A kind of bond plies |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230309 Address after: 215300 room 2, No. 399, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: KUNSHAN ZHUOYUE LANTIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 215300 399 Dongping Road, Baicheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Chengbang Dayi Material Technology Co.,Ltd. |