CN204367512U - Metallic steel reinforcement conductive adhesive film in a kind of printed substrate - Google Patents
Metallic steel reinforcement conductive adhesive film in a kind of printed substrate Download PDFInfo
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- CN204367512U CN204367512U CN201420792937.2U CN201420792937U CN204367512U CN 204367512 U CN204367512 U CN 204367512U CN 201420792937 U CN201420792937 U CN 201420792937U CN 204367512 U CN204367512 U CN 204367512U
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- conductive adhesive
- adhesive film
- printed substrate
- film
- steel reinforcement
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Abstract
The utility model discloses metallic steel reinforcement conductive adhesive film in a kind of printed substrate, comprising: heat-resisting lamination protecting film layer and coating conducting resinl rete thereon.Usefulness is: conductive adhesive film of the present utility model has good conduction property, conducting resistance is below 100 milliohms, can by electric charge from the smooth conducting of printed substrate to the position of metal reinforcement steel disc, whole conductive adhesive film has high pliability, to metal, there is extremely strong adhesion strength simultaneously, meet the instructions for use of steel disc reinforcement, there is good commercial introduction prospect.
Description
Technical field
The utility model relates to metallic steel reinforcement conductive adhesive film in a kind of printed substrate, and this conductive adhesive film has can the characteristic of plyability (namely use pressing machine carry out pressing) and low on-resistance; Belong to electronics field.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and ancillary equipment, communication product and consumption electronic products, and along with the sustainable growth of consumption electronic products demand, the requirement for printed circuit board (PCB) also grows with each passing day.
Printed substrate mainly comprises copper clad laminate (FCCL or CCL) and protection epiphragma or printing-ink and forms.Because the printed substrate of flexibility is soft, printed substrate needs to gain in strength and electric conductivity in portion of terminal and particular component place, generally by using reinforcing material to realize at this reinforcement position, common reinforcing material is stainless steel disc, in order to realize between steel disc with printed substrate being connected, use non-conductive pure glue (Bondingsheet) between in early days, and be mostly conductive adhesive in the market.But conductive adhesive exists the problems such as low with stainless steel steel disc peel strength, conducting resistance is unstable, has had a strong impact on the performance of electronic product, therefore, in the urgent need to improving.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide metallic steel reinforcement conductive adhesive film in a kind of printed substrate.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
Metallic steel reinforcement conductive adhesive film in a kind of printed substrate, is characterized in that, comprising: heat-resisting lamination protecting film layer and coating conducting resinl rete thereon, this conductive adhesive film is double-decker.
Further, conducting resinl rete is also coated with the release protective film of one deck, thus defines the conductive adhesive film of three-decker.
Preferably, aforementioned heat-resisting lamination protecting film layer is high molecular polymer film, and mainly to the protection of conducting resinl rete aliquation pressure and carrying effect, can be the modified film of one or more of PET, PEN, PI, PBT, PPS film, thickness be 25-200 micron.
Preferably, aforesaid conductive adhesive film is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, and the thickness of conducting resinl rete is 20-100 μm.
Further preferably, the particle diameter of aforesaid conductive powder is 2-30 μm.
Preferably; aforementioned release protecting film layer is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release liners; release protecting film layer is coated with silicone oil or non-silicone oil mould release; the thickness of release protective film is 25-200 μm, gives the characteristic that this conductive adhesive film can easily be peeled off.
Usefulness of the present utility model is: conductive adhesive film of the present utility model has good conduction property, and conducting resistance, can by electric charge from the smooth conducting of printed substrate to the position of metal reinforcement steel disc below 100 milliohms; Conducting resinl rete has fabulous pliability, has extremely strong adhesion strength to metal simultaneously, meets the instructions for use of steel disc reinforcement; And process for making is simple and easy to realize, and has good commercial introduction prospect.
Accompanying drawing explanation
Fig. 1 is the structural representation of bilayer conductive glued membrane of the present utility model;
Fig. 2 is the structural representation of three layers of conductive adhesive film of the present utility model.
The implication of Reference numeral in figure: 1, heat-resisting lamination protecting film layer, 2, conducting resinl rete, 3, release protective film.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the utility model.
See Fig. 1, metallic steel reinforcement conductive adhesive film in a kind of printed substrate of the present utility model, comprising: heat-resisting lamination protecting film layer 1 and coating conducting resinl rete 2 thereon, so, constitute double-deck conductive adhesive film.
Preferably, heat-resisting lamination protecting film layer is high molecular polymer film, and mainly play lamination protection and carrying effect to conducting resinl rete 2, can be the modified film of one or more of PET, PEN, PI, PBT, PPS film, thickness be 25-200 micron; Conducting resinl rete 2 is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, the thickness of conducting resinl rete 2 is 20-100 μm, and the particle diameter of conducting powder is 2-30 μm.
Further, as shown in Figure 2, conducting resinl rete 2 is also coated with the release protective film 3 of one deck, thus defines the conductive adhesive film of three-decker, give the characteristic that this conductive adhesive film can easily be peeled off.
Preferably, release protective film 3 is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release liners, and release protective film 3 is coated with silicone oil or non-silicone oil mould release, and the thickness of release protective film 3 is 25-200 μm.
Bilayer of the present utility model and three layers of conductive adhesive film all have good pliability, to metal steel disc, there is extremely strong adhesion strength, and have good conduction property, conducting resistance is below 100 milliohms, and effectiveness also can meet actual production demand.
In order to apply the utility model better, be introduced the manufacturing process of bilayer conductive glued membrane of the present utility model below, step is as follows:
A1, the greasy dirt removing heat-resisting lamination protecting film layer 1 inner face and foreign matter;
A2, on heat-resisting lamination protecting film layer 1 inner face, be coated with the conducting resinl rete 2 prepared, and through oven drying, oven temperature is 60-120 DEG C, linear velocity is 5-30m/min;
A3, rolling.
The manufacturing process of three layers of conductive adhesive film and upper similar, concrete steps are as follows:
B1, the greasy dirt removing heat-resisting lamination protecting film layer 1 inner face and foreign matter;
B2, on heat-resisting lamination protecting film layer 1 inner face, be coated with the conducting resinl rete 2 prepared, and through oven drying, oven temperature is 60-120 DEG C, linear velocity is 5-30m/min;
B3, on conducting resinl rete 2 the release protective film 3 of thermal-adhering one deck;
B4, rolling.
As can be seen here, the operation such as removing foreign matter, coating, baking and curing, thermal-adhering used in the manufacturing process of conductive adhesive film of the present utility model is all mature common technologies of industry in prior art, do not repeat, adopt the mature technology of these routines, make manufacturing process of the present utility model be simple and easy to realize and can effectively control cost, be convenient to industrially apply.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection domain of the present utility model.
Claims (4)
1. a metallic steel reinforcement conductive adhesive film in printed substrate, is characterized in that, comprising: heat-resisting lamination protecting film layer and coating conducting resinl rete thereon.
2. metallic steel reinforcement conductive adhesive film in a kind of printed substrate according to claim 1, is characterized in that, conducting resinl rete is also coated with the release protective film of one deck.
3. metallic steel reinforcement conductive adhesive film in a kind of printed substrate according to claim 1; it is characterized in that; described heat-resisting lamination protecting film layer is high molecular polymer film, and be the one of PET, PEN, PI, PBT, PPS film, thickness is 25-200 micron.
4. metallic steel reinforcement conductive adhesive film in a kind of printed substrate according to claim 2; it is characterized in that; described release protective film is the one in PET mould release membrance, PP mould release membrance, PBT mould release membrance and release liners, and the thickness of release protective film is 25-200 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420792937.2U CN204367512U (en) | 2014-12-16 | 2014-12-16 | Metallic steel reinforcement conductive adhesive film in a kind of printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420792937.2U CN204367512U (en) | 2014-12-16 | 2014-12-16 | Metallic steel reinforcement conductive adhesive film in a kind of printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204367512U true CN204367512U (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420792937.2U Active CN204367512U (en) | 2014-12-16 | 2014-12-16 | Metallic steel reinforcement conductive adhesive film in a kind of printed substrate |
Country Status (1)
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| CN (1) | CN204367512U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104527170A (en) * | 2014-12-16 | 2015-04-22 | 苏州城邦达力材料科技有限公司 | Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film |
| CN107189708A (en) * | 2017-07-17 | 2017-09-22 | 苏州城邦达力材料科技有限公司 | A kind of conductive adhesive film with metal high-bond and preparation method thereof |
-
2014
- 2014-12-16 CN CN201420792937.2U patent/CN204367512U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104527170A (en) * | 2014-12-16 | 2015-04-22 | 苏州城邦达力材料科技有限公司 | Conductive adhesive film for reinforcing metal steel in printed circuit board and manufacture process of conductive adhesive film |
| CN107189708A (en) * | 2017-07-17 | 2017-09-22 | 苏州城邦达力材料科技有限公司 | A kind of conductive adhesive film with metal high-bond and preparation method thereof |
| CN107189708B (en) * | 2017-07-17 | 2023-08-29 | 东莞市鸿兴烫画材料有限公司 | Conductive adhesive film with high bonding force with metal and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co., Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: Suzhou City-State Dali Material Technology Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |