CN203126052U - Composite double-sided copper foil substrate - Google Patents
Composite double-sided copper foil substrate Download PDFInfo
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- CN203126052U CN203126052U CN 201320013893 CN201320013893U CN203126052U CN 203126052 U CN203126052 U CN 203126052U CN 201320013893 CN201320013893 CN 201320013893 CN 201320013893 U CN201320013893 U CN 201320013893U CN 203126052 U CN203126052 U CN 203126052U
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- copper foil
- glue
- basement membrane
- sided
- copper
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Abstract
The utility model discloses a composite double-sided copper foil substrate which is formed by carrying out low-temperature thermal compression on a non-glue single-sided copper-clad plate formed by a layer of copper foil and an insulating base layer on one surface of the copper foil, and a glued copper foil plate formed by another copper foil and an insulating adhesive layer coated on one surface of the copper foil. The prepared composite double-sided copper foil substrate is free of a high-temperature compression process in the prior art, and can meet the demand on the characteristics of a non-glue double-sided board; the production cost is reduced, the production yield of products is improved, and the application scope of the products is expanded; and furthermore, the composite double-sided copper foil substrate has excellent dimensional stability and bending resistance, a color masking effect, high heat resistance and high reflectivity.
Description
Technical field
The utility model belongs to flexible printed circuit board structure and technology field, is specifically related to the two-sided copper clad laminate of a kind of combined type.
Background technology
At present the global electronic industry development to compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, high dimensional stability, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin heat endurance is high and have excellent thermal diffusivity, mechanical strength, reach adherence, often applies to multiple electronic material, as being used for flexible printed wiring board (Flexible Printed Circuit).
Because at present the employed no glue copper foil base material of FPC industry generally is subjected to the technology control of external former material manufacturer such as Japan, higher and the complex manufacturing of relative production cost, need be through very high high-temperature process, be not easy to the cost control with price of promoting the use of of product.The processing procedure of traditional no glue dual platen is, two-sided Copper Foil pressing TPI (TPI) is produced finished product through high temperature pressing baking processing procedure curing reaction after fully, and this production technology not only expends the energy, and yield is on the low side in process of production.Therefore, usually there is the restriction that needs processing procedure controls such as high-temperature process, long-time high-temperature baking when producing at the two-sided copper clad laminate of the no glue that uses at present, not only need higher production cost, waste energy and the production time, and can't guarantee yield and the efficient of producing to have limited production capacity.
In view of above-mentioned defective, be necessary to develop superior performance, be convenient to volume production and cost is low, yield is high two-sided copper clad laminate and manufacturing process.A kind of double side flexible copper coated board and preparation method thereof is disclosed as Chinese patent 200810217932.6, this double side flexible copper coated board comprises a single-side coated copper plate, coat the adhesive layer on this single-side coated copper plate and be overlaid on another Copper Foil or another single face flexibility coat copper plate on this adhesive layer, described single-side coated copper plate comprises a Copper Foil and coats polyimide layer on the Copper Foil, the adjacent setting of described polyimide layer and adhesive layer; Its preparation method comprises the steps: step 1, Copper Foil is provided and prepares polyamic acid and adhesive; Step 2 at Copper Foil coating one deck polyamic acid, forms the single-sided polyimide flexibility coat copper plate after super-dry, high-temperature sub amination; Step 3, at the polyimides face of a single face flexibility coat copper plate that makes coating one deck adhesive, after drying with Copper Foil or another single face flexibility coat copper plate through roll-in compound and solidify after make double side flexible copper coated board.Though the original idea of patent 200810217932.6 provides and a kind ofly can overcome three-layer process and make double side flexible copper coated board and be difficult to slimming and the relatively poor deficiency of dimensional stability, and the problem of the expensive and apparent difference of two-layer method flexibility coverlay, and excellent combination property, with low cost, can realize the double side flexible copper coated board and preparation method thereof of the slimming of base material, but can there be following defective in it in actual production: procedure for producing is difficult, equipment need be controlled tension force fine, after being coated with upper glue layer, be easy to produce wrinkle in the pressing section, length can't be done length, yield is not high, and yield has only about 30%.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of low temperature and pressure that adopts to close explained hereafter, and produce simple, the yield two-sided copper clad laminate of combined type high, excellent performance, easy to use, done great improvement with respect to traditional processing technology.
The utility model for the technical scheme that solves its technical problem and adopt is:
The two-sided copper clad laminate of a kind of combined type, constituted by no glue single-side coated copper plate and band glue copper foil plate, described no glue single-side coated copper plate is made of one deck Copper Foil and the insulated substrate that is formed at Copper Foil one surface, wherein, described insulated substrate is made of one deck first insulating basement membrane and one deck second insulating basement membrane, described band glue copper foil plate is made of another Copper Foil and the insulation adhesive glue-line that is coated on another Copper Foil one surface, and described second insulating basement membrane and the adjacent setting of described insulation adhesive glue-line.
Say that further described first insulating basement membrane is a kind of in heat curing-type polyimide film, PETG film, poly-naphthalene ester film and the liquid crystalline polymer film, and the thickness of described first insulating basement membrane is 7 ~ 100um; Described second insulating basement membrane is the thermoplasticity polyimide film, and the thickness of described second insulating basement membrane is 0.1 ~ 2um.
Be preferably, described first insulating basement membrane is the heat curing-type polyimide film.
Be preferably, respectively do for oneself a kind of in rolled copper foil, electrolytic copper foil and the high extension Copper Foil of described Copper Foil and another Copper Foil, and the thickness of described Copper Foil and another Copper Foil is all 7.5～35um.
Preferably, the thickness of described insulation adhesive glue-line is 5 ~ 50um.
The beneficial effects of the utility model are: the utility model closes and makes the two-sided copper clad laminate of combined type of the present utility model by using no glue single-side coated copper plate commonly used and band glue copper foil plate to carry out low temperature and pressure, avoided the high temperature pressure programming of prior art, and obtain to satisfy the two-sided copper clad laminate of combined type of no glue dual platen characteristic needs, not only saved production cost, and improved the yield of production, expanded the scope of application of product, and the two-sided copper clad laminate of combined type of the present utility model has excellent size stability and anti-bending performance, and has the screening chromatic effect, high-fire resistance and high reflectance.
Description of drawings
Fig. 1 is the two-sided copper clad laminate structural representation of combined type of the present utility model;
Fig. 2 is the preparation method schematic diagram of the two-sided copper clad laminate of combined type of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection domain of the present utility model is made more explicit defining.
Embodiment: the two-sided copper clad laminate of a kind of combined type, constituted by no glue single-side coated copper plate 1 and band glue copper foil plate 2, described no glue single-side coated copper plate 1 is made of one deck Copper Foil 11 and the insulated substrate that is formed at Copper Foil one surface, wherein, described insulated substrate is made of one deck first insulating basement membrane 12 and one deck second insulating basement membrane 13, described band glue copper foil plate is made of another Copper Foil 21 and the insulation adhesive glue-line 22 that is coated on another Copper Foil one surface, and described second insulating basement membrane 13 and the 22 adjacent settings of described insulation adhesive glue-line.
Wherein, described first insulating basement membrane 12 is a kind of in heat curing-type polyimide film (PI), PETG film (PET), poly-naphthalene ester film (PEN) and the liquid crystalline polymer film (PLC), and the thickness of described first insulating basement membrane 12 is 7 ~ 100um; Described second insulating basement membrane 13 is thermoplasticity polyimide film (TPI), and the thickness of described second insulating basement membrane 13 is 0.1 ~ 2um.
Described first insulating basement membrane 12 is preferably and adopts the heat curing-type polyimide film.
Wherein, respectively do for oneself a kind of in rolled copper foil, electrolytic copper foil and the high extension Copper Foil of described Copper Foil 11 and another Copper Foil 21, and the thickness of described Copper Foil 11 and another Copper Foil 21 is all 7.5～35um.
Wherein, the thickness of described insulation adhesive glue-line 22 is 5 ~ 50um.
The manufacture method of the two-sided copper clad laminate of above-mentioned combined type is as follows:
One, the preparation of no glue single-side coated copper plate 1: utilize organic solvent to come each required component of mixed dissolution first insulating basement membrane, form the liquid dispersion of first insulating basement membrane, use the coating production equipment that this liquid dispersion is coated on the Copper Foil 11, pass through online drying oven then, remove the organic solvent that includes and reach curing, in order to avoid when rolling, adhere to mutually, and reach composition reaction by follow-up baking process and solidify, form first insulating basement membrane 12, method for making according to first insulating basement membrane, make second insulating basement membrane 13 at first insulating basement membrane, finally make no glue single-side coated copper plate 1;
Two, the preparation of RCC Copper Foil (resin coated copper foil) substrate: utilize organic solvent to mix each required component, form the liquid dispersion of insulation adhesive glue-line, use the coating production equipment to be coated on the matsurface side of another Copper Foil 21 liquid dispersion of this insulation adhesive glue-line, baking through online drying oven, the organic solvent that removal includes, and make the insulation adhesive glue-line reach the moving semi-cured state of semi-fluid, and paste release layer at the insulation adhesive glue-line at last, form the RCC copper clad laminate;
Three, use no glue single-side coated copper plate 1 and RCC copper clad laminate, the release layer of RCC copper clad laminate removed obtain being with glue copper foil plate 2, to not have glue single-side coated copper plate 1 and band glue copper foil plate 2 by obtaining the two-sided copper clad laminate of combined type through overcuring again behind the pressing machine hot pressing, wherein the control of hot pressing temperature is at 30 ~ 100 ℃.
In the said method, the adjustment by prescription makes first insulating basement membrane 12, second insulating basement membrane 13 and insulation adhesive glue-line 22 reach approaching thermal coefficient of expansion.
Manufacture method of the present utility model tension force is aborning controlled easily, and can produce continuously, needn't worry to reload midway and causes problem such as machine down, produces yield also than higher, and yield reaches more than 70%.Adopt the no glue single-side coated copper plate of length range 100 ~ 1000m to carry out hot pressing, realize continuous volume production.By using the two-sided copper clad laminate of combined type that obtains utility model after no glue single-side coated copper plate commonly used and the compound combination of RCC copper foil base material, saved production cost, improve the yield of production, expanded the scope of application of product.
The dimensional stability test result of the two-sided copper clad laminate of the two-sided copper clad laminate of combined type of the present utility model and prior art such as following table 1:
Table 1:
| Sample 1 | |
Sample 3 | Sample 4 | |
| Copper Foil | RA copper | ED copper | RA copper | RA copper |
| Insulated substrate | PI+TPI | PI+?TPI | PI | TPI |
| The insulation glue-line | The insulation adhesive glue-line | The insulation adhesive glue-line | Do not have | Transparent |
| Dimensional stability | 0.05% | 0.06% | 0.08% | 0.07% |
| The scolding tin hear resistance | 288℃?10S | 288℃?10S | 288℃?10S | 288℃?10S |
| Reflectivity | 95% | 85% | 82% | 83% |
| Cover power | Opaque | Opaque | Opaque | Opaque |
| The number of times of anti-the bending | ＞10 ten thousand times | ＞9 ten thousand times | ＞7 ten thousand times | ＞8 ten thousand times |
In the last table 1, sample 1 and 2 is the two-sided copper clad laminate of combined type of the present utility model; Sample 3 and sample 4 are the two-sided copper clad laminate of prior art.
Show that by table 1 data the two-sided copper clad laminate of combined type of the present utility model has excellent size stability and anti-bending performance, and have chromatic effect, high-fire resistance and the high reflectance of screening.
Claims (5)
1. two-sided copper clad laminate of combined type, it is characterized in that: constituted by no glue single-side coated copper plate (1) and band glue copper foil plate (2), described no glue single-side coated copper plate (1) is made of one deck Copper Foil (11) and the insulated substrate that is formed at Copper Foil one surface, wherein, described insulated substrate is made of one deck first insulating basement membrane (12) and one deck second insulating basement membrane (13), described band glue copper foil plate is made of another Copper Foil (21) and the insulation adhesive glue-line (22) that is coated on another Copper Foil one surface, and described second insulating basement membrane (13) and the adjacent setting of described insulation adhesive glue-line (22).
2. the two-sided copper clad laminate of combined type as claimed in claim 1, it is characterized in that: described first insulating basement membrane (12) is a kind of in heat curing-type polyimide film, PETG film, poly-naphthalene ester film and the liquid crystalline polymer film, and the thickness of described first insulating basement membrane (12) is 7 ~ 100um; Described second insulating basement membrane (13) is the thermoplasticity polyimide film, and the thickness of described second insulating basement membrane (13) is 0.1 ~ 2um.
3. the two-sided copper clad laminate of combined type as claimed in claim 2, it is characterized in that: described first insulating basement membrane (12) is the heat curing-type polyimide film.
4. the two-sided copper clad laminate of combined type as claimed in claim 1, it is characterized in that: respectively do for oneself a kind of in rolled copper foil, electrolytic copper foil and the high extension Copper Foil of described Copper Foil (11) and another Copper Foil (21), and the thickness of described Copper Foil (11) and another Copper Foil (21) is all 7.5～35um.
5. the two-sided copper clad laminate of combined type as claimed in claim 1, it is characterized in that: the thickness of described insulation adhesive glue-line (22) is 5 ~ 50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320013893 CN203126052U (en) | 2013-01-11 | 2013-01-11 | Composite double-sided copper foil substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320013893 CN203126052U (en) | 2013-01-11 | 2013-01-11 | Composite double-sided copper foil substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203126052U true CN203126052U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320013893 Withdrawn - After Issue CN203126052U (en) | 2013-01-11 | 2013-01-11 | Composite double-sided copper foil substrate |
Country Status (1)
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| CN (1) | CN203126052U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103029375A (en) * | 2013-01-11 | 2013-04-10 | 松扬电子材料(昆山)有限公司 | Composite double-face copper foil substrate and manufacturing method thereof |
| CN110062520A (en) * | 2018-01-18 | 2019-07-26 | 昆山雅森电子材料科技有限公司 | Combined type fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and preparation method |
-
2013
- 2013-01-11 CN CN 201320013893 patent/CN203126052U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103029375A (en) * | 2013-01-11 | 2013-04-10 | 松扬电子材料(昆山)有限公司 | Composite double-face copper foil substrate and manufacturing method thereof |
| CN103029375B (en) * | 2013-01-11 | 2016-04-13 | 松扬电子材料(昆山)有限公司 | Composite double-face copper foil substrate and manufacture method thereof |
| CN110062520A (en) * | 2018-01-18 | 2019-07-26 | 昆山雅森电子材料科技有限公司 | Combined type fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and preparation method |
| CN110062520B (en) * | 2018-01-18 | 2024-05-17 | 昆山雅森电子材料科技有限公司 | Composite fluorine polymer high-frequency high-transmission double-sided copper foil substrate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130814 Effective date of abandoning: 20160413 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |