CN209216944U - Single tube stripping machine and single tube system of processing - Google Patents
Single tube stripping machine and single tube system of processing Download PDFInfo
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- CN209216944U CN209216944U CN201920127340.9U CN201920127340U CN209216944U CN 209216944 U CN209216944 U CN 209216944U CN 201920127340 U CN201920127340 U CN 201920127340U CN 209216944 U CN209216944 U CN 209216944U
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Abstract
The utility model relates to laser technology fields, more particularly, to a kind of single tube stripping machine and the single tube system of processing including the single tube stripping machine.Single tube stripping machine includes wafer central, positioning mechanism and ejector pin mechanism, and blue film is located on wafer central, and positioning mechanism is for carrying wafer central and wafer central being driven to move in the horizontal plane, to change the relative position of single tube on ejector pin mechanism and blue film.After the adjustment of position, so that the thimble of ejector pin mechanism is passed through positioning mechanism and is directed at single tube to be taken, driving device driving thimble moves upwards, since blue film has certain elasticity, therefore thimble can jack up corresponding single tube during moving upwards, so that single tube is partially disengaged blue film, to reduce blue film gluing to the adsorption capacity of single tube, picks up single tube convenient for sucking pen.When thimble jacks up one end of single tube, single tube lower surface is mutually separated with blue film, and the lower surface of single tube can be directly drawn when sucking pen is adsorbed at this time, is very easy to turn single tube after removing, is greatly facilitated subsequent handling.
Description
Technical field
The present invention relates to laser technology fields, more particularly, to a kind of single tube stripping machine and the list including the single tube stripping machine
Pipe system of processing.
Background technique
Bar item is placed on dedicated blue film the single tube for becoming proper alignment after cutting machine is cut, and single tube is needed from blue film
On remove and be put into inside spare box, and cannot be had damage in the process of taking.And due to single tube subsequent use during
That contacted with blue film is face-up, so being put into the front upper and lower more convenient progress in subsequent handling of overturning of box in single tube.
General stripping machine inhales single tube upper surface using vacuum WAND, by the suction of sucking pen by single tube and blue UF membrane, so
And because being coated with one layer of glue on blue film, glue is larger to the cohesive force of single tube, therefore sucking pen removes the lesser single tube of size,
The single tube slightly larger for size is because the adsorption area of glue causes greatly suction bigger, so that sucking pen can not be from blue film single tube
It removes, and easily causes the fracture of single tube；In addition, the single tube that sucking pen is drawn cannot be overturn before being put into box.
Summary of the invention
The application's is designed to provide a kind of single tube stripping machine and the single tube system of processing including the single tube stripping machine, with
Solving single tube when stripping machine existing in the prior art draws single tube using vacuum WAND can not overturn, and slightly larger for size
The technical issues of single tube sucking pen can not remove single tube from blue film.
This application provides a kind of single tube stripping machines, including wafer central, positioning mechanism and ejector pin mechanism；
Blue film is placed on the wafer central, and the wafer central is located on the positioning mechanism, and the positioning mechanism can
The wafer central is driven to move in the horizontal plane；
The ejector pin mechanism is located at below the positioning mechanism；The ejector pin mechanism includes thimble and driving device, described
Driving device can drive the thimble to go up and down, and so that the thimble is passed through positioning mechanism and the single tube on the blue film is jacked up or put
Under.
Further, the positioning mechanism includes wafer central placement plate, the first positioning plate and the second positioning plate；
Locating slot is provided in the wafer central placement plate, the wafer central is placed in the locating slot；
First positioning plate is located at below the wafer central placement plate, and first positioning plate and the wafer central are placed
First direction is provided with first straight line sliding rail between plate, first positioning plate and the wafer central placement plate are along described first
Opposite sliding occurs for line slide rail；
Second positioning plate is located at below first positioning plate, second positioning plate and first positioning plate it
Between to be provided with second straight line sliding rail, second positioning plate and first positioning plate in a second direction sliding along the second straight line
Opposite sliding occurs for rail；
The first direction and the second direction are perpendicular in the horizontal plane.
Further, on the wafer central placement plate, first positioning plate and second positioning plate along the vertical direction
It is provided with positioning through hole, the thimble can pass through the positioning through hole and be in contact with the blue film on the wafer central.
Further, the positioning mechanism further includes adjustment component；
The adjustment component includes knob mounting plate, the first knob, the first positioning tooth bar, the second knob and the second positioning tooth
Item；
First knob and second knob are located on the knob mounting plate, and first knob lower end is provided with
First positioning gear, first knob are able to drive the first positioning tooth wheel rotation；Second knob lower end is set
It is equipped with the second positioning tooth bar, second knob is able to drive the second positioning tooth wheel rotation；
First positioning tooth bar is set to the side of the wafer central placement plate along the first direction, and described second is fixed
Position rack gear is set to the side of second positioning plate along the second direction；First positioning tooth bar and first positioning
Gear is meshed, and second positioning tooth bar is meshed with the second positioning gear.
Further, the single tube stripping machine further includes image enlarger, and it is described fixed that described image enlarger is located at
Below the mechanism of position；
Described image enlarger includes plane mirror and CCD magnifying glass, and the plane mirror and vertical direction are in a certain angle,
The relative position image of single tube and the thimble can be passed to the CCD magnifying glass after plane mirror reflection on the indigo plant film
In；
The CCD magnifying glass is connected with display screen, for that will be presented in institute through the amplified image of CCD magnifying glass
It states on display screen.
Further, rotation briquetting is provided in the wafer central placement plate, the rotation briquetting can be in the wafer
It is rotated on the upper surface of ring placement plate, and pushes down the wafer central in the wafer central placement plate.
Further, blue membrane pressure block is provided in the wafer central placement plate, the indigo plant membrane pressure block is set to the wafer
The edge of ring placement plate, for being limited to the blue film.
Further, the single tube stripping machine further includes shell, the positioning mechanism, the ejector pin mechanism and described image
Enlarger is respectively positioned in the shell, and the wafer central is located at the upper surface of the shell.
Further, switch, the start and stop switched for controlling the driving device are provided on the shell.
Present invention also provides a kind of single tube systems of processing, including single tube stripping machine described in any of the above-described technical solution.
Compared with prior art, the invention has the benefit that
Single tube stripping machine provided by the present application is used to be partially separated single tube and blue film realization before sucking pen draws single tube, with
Reduce the glue adsorption capacity on single tube, single tube is removed and overturn convenient for subsequent.Specifically, single tube stripping machine include wafer central,
Positioning mechanism and ejector pin mechanism, blue film are located on wafer central, and positioning mechanism is for carrying wafer central and driving wafer central in level
It is moved in face, to change the relative position of single tube on ejector pin mechanism and blue film.After the adjustment of position, pass through the thimble of ejector pin mechanism
Positioning mechanism is directed at single tube to be taken, and driving device driving thimble moves upwards, since blue film has certain elasticity, thimble
Corresponding single tube can be jacked up during moving upwards, single tube is made to be partially disengaged blue film, to reduce blue film gluing to list
The adsorption capacity of pipe, picks up single tube convenient for sucking pen；Particularly with the single tube of large scale and strip, the part point of single tube and blue film
From, it can be convenient for the air-breathing of large scale single tube, strip single tube is also not easy to break.It is single when thimble jacks up one end of single tube
Pipe lower surface is mutually separated with blue film, and the lower surface of single tube can be directly drawn when sucking pen is adsorbed at this time, and being very easy to after removing will
Single tube turns, and greatly facilitates subsequent handling.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the overall structure diagram of single tube stripping machine provided in an embodiment of the present invention；
Fig. 2 is the configuration schematic diagram of single tube stripping machine provided in an embodiment of the present invention；
Fig. 3 is the arrangement schematic diagram of single tube on the blue film of single tube stripping machine provided in an embodiment of the present invention；
Fig. 4 is schematic diagram of the single tube stripping machine provided in an embodiment of the present invention when thimble jacks up single tube.
Appended drawing reference:
1- wafer central, 2- wafer central placement plate, 21- locating slot, the first positioning tooth bar of 22-, 23- rotate briquetting, 24- indigo plant film
Briquetting, the first positioning plate of 3-, 31- first straight line sliding rail, the second positioning plate of 4-, 41- second straight line sliding rail, the second positioning tooth of 42-
Item, 5- thimble, 6- driving device, 7- positioning through hole, 8- knob mounting plate, the first knob of 9-, the second knob of 10-, 101- second
Position gear, 11- plane mirror, 12-CCD magnifying glass, 13- shell, 14- switch, 15- indigo plant film, 16- single tube, 17- sucking pen.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.
The component for the embodiment of the present invention for usually describing and showing in attached drawing here can be with a variety of different configurations
To arrange and design.Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below and is wanted
The scope of the present invention of protection is sought, but is merely representative of selected embodiment of the invention.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Referring to Fig. 1 to Fig. 4 description single tube stripping machine according to some embodiments of the invention and including the single tube stripping
The single tube system of processing of machine.
Referring to FIG. 1 to FIG. 4, embodiments herein provides a kind of single tube stripping machine, including wafer central 1, positioning
Mechanism and ejector pin mechanism；
Blue film 15 is placed on wafer central 1, and wafer central 1 is located on positioning mechanism, and positioning mechanism is able to drive wafer central 1 and exists
It is moved in horizontal plane；
Ejector pin mechanism is located at below positioning mechanism；Ejector pin mechanism includes thimble 5 and driving device 6, and driving device 6 can drive
Dynamic thimble 5 is gone up and down, and so that thimble 5 is passed through positioning mechanism and the single tube 16 on blue film 15 is jacked up or put down.
As shown in figure 4, single tube stripping machine provided by the embodiments of the present application is used for single tube before sucking pen 17 draws single tube 16
16 are partially separated with the blue realization of film 15, to reduce the glue adsorption capacity on single tube 16, single tube 16 are removed and are overturn convenient for subsequent.
Specifically, single tube stripping machine includes wafer central 1, positioning mechanism and ejector pin mechanism, and blue film 15 is located on wafer central 1, positioning mechanism
For carrying wafer central 1 and wafer central 1 being driven to move in the horizontal plane, to change the phase of ejector pin mechanism with single tube 16 on blue film 15
To position.After the adjustment of position, driving device 6 drives thimble 5 to move upwards, and the thimble 5 of ejector pin mechanism is made to pass through positioning mechanism pair
Standard single tube 16 to be taken, since blue film 15 has certain elasticity, thimble 5 can be by corresponding list during moving upwards
Pipe 16 jacks up, and single tube 16 is made to be partially disengaged blue film 15, to reduce the blue gluing of film 15 to the adsorption capacity of single tube 16, is convenient for sucking pen 17
Single tube 16 is picked up；Particularly with the single tube 16 of large scale and strip, single tube 16 is partially separated with blue film 15, can be convenient for
Large scale single tube 16 picks up, and strip single tube 16 is also not easy to break.
In addition, 16 lower surface of single tube is separated with blue 15 phase of film, at this time sucking pen when thimble 5 jacks up one end of single tube 16
The lower surface that single tube 16 can be directly drawn when 17 absorption is very easy to turn single tube 16 after removing, greatly convenient
Subsequent handling.
Preferably, driving device 6 is cylinder.
It is shown in Figure 2, in one embodiment of the application, it is preferable that positioning mechanism include wafer central placement plate 2,
First positioning plate 3 and the second positioning plate 4；
Locating slot 21 is provided in wafer central placement plate 2, wafer central 1 is placed in locating slot 21；
First positioning plate 3 is located at 2 lower section of wafer central placement plate, along first between the first positioning plate 3 and wafer central placement plate 2
Direction is provided with first straight line sliding rail 31, the first positioning plate 3 and wafer central placement plate 2 and occurs to slide relatively along first straight line sliding rail 31
It is dynamic；
Second positioning plate 4 is located at 3 lower section of the first positioning plate, between the second positioning plate 4 and the first positioning plate 3 in a second direction
It is provided with second straight line sliding rail 41, the second positioning plate 4 and the first positioning plate 3 and opposite slide occurs along second straight line sliding rail 41；
First direction and second direction are perpendicular in the horizontal plane.
In this embodiment, positioning mechanism includes the wafer central placement plate 2 sequentially arranged from top to bottom, the first positioning plate 3
With the second positioning plate 4.Wherein, wafer central placement plate 2 is provided with locating slot in wafer central placement plate 2 for placing wafer central 1
21, locating slot 21 is adapted with wafer central 1, and wafer central 1 is placed in locating slot 21.First positioning plate 3 is located at wafer
The lower section of ring placement plate 2, and preferably, the upper surface of the first positioning plate 3 is provided with first straight line sliding rail 31, first straight line is sliding
Rail 31 extends in a first direction, and the first sliding block is provided on first straight line sliding rail 31, and the first sliding block can be sliding along first straight line
Rail 31 slides；First sliding block and the lower end surface of wafer central placement plate 2 are mutually fixed, therefore wafer board placement plate can be along first straight line
Sliding rail 31 slides, and changes the positional relationship of wafer central placement plate 2 and the first positioning plate 3 in a first direction.
Similarly, it is preferable that the upper surface of the second positioning plate 4 is provided with second straight line sliding rail 41, second straight line sliding rail 41
Extend in a second direction, the second sliding block is provided on second straight line sliding rail 41, the second sliding block can be sliding along second straight line sliding rail 41
It is dynamic；The lower end surface of second sliding block and the first positioning plate 3 is mutually fixed, therefore the first positioning plate 3 can be sliding along second straight line sliding rail 41
It is dynamic, change the positional relationship of the second positioning plate 4 and the first positioning plate 3 in a second direction.
First direction is arranged along the x-axis direction, and second direction is arranged along the y-axis direction, and passes through wafer central placement plate 2, first
Positioning plate 3 and the second positioning plate 4 and corresponding sliding rail are equipped with, can adjust wafer central 1 in wafer central placement plate 2,
The position of blue film 15 and corresponding single tube 16 in the horizontal plane, to change the positional relationship of single tube 16 and thimble 5, so that thimble
5 can jack up corresponding single tube 16.
It preferably, is the stability for guaranteeing sliding, the quantity of first straight line sliding rail 31 can be more on the first positioning plate 3
A, multiple first straight line sliding rails 31 are arranged in parallel in collective effect on the first positioning plate 3.Similarly, second on the second positioning plate 4
The quantity of line slide rail 41 is also multiple.
It is shown in Figure 2, in one embodiment of the application, it is preferable that wafer central placement plate 2,3 and of the first positioning plate
Positioning through hole 7 is provided on second positioning plate 4 along the vertical direction, thimble 5 can pass through on positioning through hole 7 and wafer central 1
Blue film 15 is in contact.
In this embodiment, it is passing through convenient for thimble 5, makes thimble 5 and the 15 phase apical grafting of blue film on wafer central 1, this Shen
Perforation is provided on positioning mechanism please.Specifically, along perpendicular on wafer central placement plate 2, the first positioning plate 3 and the second positioning plate 4
Histogram can sequentially pass through the second positioning plate 4, the first positioning plate 3 when moving upwards to positioning through hole 7, thimble 5 is provided with
With the positioning through hole 7 of wafer central placement plate 2, and the 15 phase apical grafting of blue film on wafer central 1, so that the single tube 16 on blue film 15 be pushed up
It rises.
It should be noted that the shape of wafer central placement plate 2, the first positioning plate 3 and the positioning through hole 7 on the second positioning plate 4
Shape and of different sizes can specifically cooperate the other structures adjustment in a structure, as long as guaranteeing to push up in 1 moving range of wafer central
Needle 5 can pass through positioning through hole 7.
It is shown in Figure 2, in one embodiment of the application, it is preferable that positioning mechanism further includes adjustment component；
Adjustment component includes knob mounting plate 8, the first knob 9, the first positioning tooth bar 22, the second knob 10 and the second positioning
Rack gear 42；
First knob 9 and the second knob 10 are located on knob mounting plate 8, and 9 lower end of the first knob is provided with the first positioning tooth
Wheel, the rotation of the first knob 9 are able to drive the rotation of the first positioning tooth wheel；Second knob, 10 lower end is provided with the second positioning tooth bar 42,
The rotation of second knob 10 is able to drive the rotation of the second positioning gear 101；
First positioning tooth bar 22 is set to the side of wafer central placement plate 2 along first direction, and the second positioning tooth bar 42 is along
Two directions are set to the side of the second positioning plate 4；First positioning tooth bar 22 is meshed with the first positioning gear, the second positioning tooth bar
42 are meshed with the second positioning gear 101.
It in this embodiment, is wafer central 1, blue film 15 and the corresponding single tube in preferably adjustment wafer central placement plate 2
16 position in the horizontal plane, the application is to evolution on wafer central placement plate 2, the first positioning plate 3 and the second positioning plate 4
Control is to be realized by knob with the cooperation of moving gear, rack gear.
Specifically, adjustment component includes knob mounting plate 8, the first knob 9, the first positioning tooth bar 22,10 and of the second knob
Second positioning tooth bar 42；First knob 9 and the second knob 10 are located on knob mounting plate 8, and 9 lower end of the first knob is provided with first
Gear is positioned, the rotation of the first knob 9 is able to drive the rotation of the first positioning tooth wheel；First positioning tooth bar 22 is set to along first direction
The side of wafer central placement plate 2, the first positioning tooth bar 22 is meshed with the first positioning gear, therefore passes through the first knob 9 of rotation
Wafer central placement plate 2 and single tube 16 thereon can be driven to move along first direction, in a first direction so as to adjust single tube 16
Position.
Similarly, 10 lower end of the second knob is provided with the second positioning gear 101, and it is fixed that the rotation of the second knob 10 is able to drive second
Position gear 101 rotates；Second positioning tooth bar 42 is set to the side of the second positioning plate 4, the second positioning tooth bar 42 in a second direction
It is meshed with the second positioning gear 101, therefore the second positioning plate 4 and structure thereon can be driven by rotating second knob 10
It moves in a second direction, so as to adjust the position of single tube 16 in a second direction.
Therefore, it is adjusted by the cooperation of the first knob 9 and the second knob 10, adjustment single tube 16 can be stablized in horizontal plane
Position, and facilitate operation.
Preferably, as shown in Fig. 2, the first knob 9 and the second knob 10 can be sheathed on together, the second knob 10 is sheathed on
Outside first knob 9, but two knobs still divide to act on, and integrally seem simpler from structure.
It is shown in Figure 2, in one embodiment of the application, it is preferable that single tube stripping machine further includes image enlarger
Structure, image enlarger are located at below positioning mechanism；
Image enlarger includes plane mirror 11 and CCD magnifying glass 12, and plane mirror 11 and vertical direction are in a certain angle, blue
The relative position image of single tube 16 and thimble 5 can be passed in CCD magnifying glass 12 after the reflection of plane mirror 11 on film 15；
CCD magnifying glass 12 is connected with display screen, for that will be presented in display screen through the amplified image of CCD magnifying glass 12
On.
In this embodiment, it is the position for observing thimble 5 and single tube 16, jacks up list in order to more accurately control thimble 5
The single tube stripping machine of the process of pipe 16, the application further includes image enlarger, for observing and amplifying thimble 5 and single tube 16
Positional relationship image.Specifically, image enlarger includes plane mirror 11 and CCD magnifying glass 12, and plane mirror 11 is located at localization machine
The lower section of structure, and it is located at 7 lower section of positioning through hole of positioning mechanism, so that thimble 5 and the positional relationship image of single tube 16 is fallen into
On plane mirror 11.And plane mirror 11 is located at the side of plane mirror 11 horizontal by certain angle, CCD magnifying glass 12, so that
The positional relationship image of 5 head of thimble and single tube 16 incoming CCD magnifying glass 12 after the reflection of plane mirror 11, and CCD magnifying glass 12
Image is finally presented on a display screen by connection computer display screen, so as to clearly observe thimble 5 by display screen
The positional relationship on head and single tube 16, and then can accurately adjust the position of single tube 16 and the jack-up process of thimble 5.
It is shown in Figure 2, in one embodiment of the application, it is preferable that be provided with rotation pressure in wafer central placement plate 2
Block 23, rotation briquetting 23 can rotate on the upper surface of wafer central placement plate 2, and push down the wafer in wafer central placement plate 2
Ring 1.
In this embodiment, to guarantee stability of the wafer central 1 during position adjusts, in wafer central placement plate 2
It is additionally provided with rotation briquetting 23, the one end and wafer central placement plate 2 for rotating briquetting 23 are rotatablely connected, and rotate the other end of briquetting 23
The top of wafer central 1 in wafer central placement plate 2, and recline with wafer central 1, to control the position of wafer central 1.And lead to
Rotation rotation briquetting 23 is crossed, the position of rotation briquetting 23 can be adjusted, convenient for the pick-and-place of wafer central 1.
It is shown in Figure 2, in one embodiment of the application, it is preferable that be provided with blue membrane pressure in wafer central placement plate 2
Block 24, blue membrane pressure block 24 are set to the edge of wafer central placement plate 2, for limiting to blue film 15.
In this embodiment, for preferably to the position for controlling blue film 15, the application is also set up in wafer central placement plate 2
There is blue membrane pressure block 24, for limiting to blue film 15.
Blue membrane pressure block 24 is located at the edge of wafer central placement plate 2, and the quantity of blue membrane pressure block 24 can be one or more
It is a.
Referring to figure 1 and figure 2, in one embodiment of the application, it is preferable that single tube stripping machine further includes shell
13, positioning mechanism, ejector pin mechanism and image enlarger are respectively positioned in shell 13, and wafer central 1 is located at the upper surface of shell 13.
In this embodiment, the single tube stripping machine of the application further includes shell 13, and 13 upper end of shell is open, positioning mechanism,
Ejector pin mechanism and image enlarger are respectively positioned in shell 13, and the application is made to form the entirety of a completion.Wafer central placement plate 2
Positioned at 13 upper end open-mouth of shell, therefore convenient for being picked and placed to single tube 16 thereon.
Referring to figure 1 and figure 2, in one embodiment of the application, it is preferable that switch 14 is provided on shell 13,
Switch 14 is used to control the start and stop of driving device 6.
Embodiments herein additionally provides a kind of single tube system of processing, the single tube stripping including any of the above-described embodiment
Machine.
In this embodiment, single tube system of processing includes single tube stripping machine, further includes single tube cutting processing device etc., with reality
The whole process of existing single tube processing.Since single tube system of processing includes single tube stripping machine, thus it is with the complete of single tube stripping machine
Portion's beneficial effect, this is no longer going to repeat them.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of single tube stripping machine, which is characterized in that including wafer central, positioning mechanism and ejector pin mechanism；
Blue film is placed on the wafer central, and the wafer central is located on the positioning mechanism, and the positioning mechanism is able to drive
The wafer central moves in the horizontal plane；
The ejector pin mechanism is located at below the positioning mechanism；The ejector pin mechanism includes thimble and driving device, the driving
Device can drive the thimble to go up and down, and so that the thimble is passed through positioning mechanism and the single tube on the blue film is jacked up or put down.
2. single tube stripping machine according to claim 1, which is characterized in that the positioning mechanism include wafer central placement plate,
First positioning plate and the second positioning plate；
Locating slot is provided in the wafer central placement plate, the wafer central is placed in the locating slot；
First positioning plate is located at below the wafer central placement plate, first positioning plate and the wafer central placement plate it
Between first direction is provided with first straight line sliding rail, first positioning plate and the wafer central placement plate are along the first straight line
Opposite sliding occurs for sliding rail；
Second positioning plate is located at below first positioning plate, edge between second positioning plate and first positioning plate
Second direction is provided with second straight line sliding rail, and second positioning plate and first positioning plate are sent out along the second straight line sliding rail
Raw opposite sliding；
The first direction and the second direction are perpendicular in the horizontal plane.
3. single tube stripping machine according to claim 2, which is characterized in that the wafer central placement plate, first positioning
Be provided with positioning through hole on plate and second positioning plate along the vertical direction, the thimble can pass through the positioning through hole with
The blue film on the wafer central is in contact.
4. single tube stripping machine according to claim 2, which is characterized in that the positioning mechanism further includes adjustment component；
The adjustment component includes knob mounting plate, the first knob, the first positioning tooth bar, the second knob and the second positioning tooth bar；
First knob and second knob are located on the knob mounting plate, and first knob lower end is provided with first
Gear is positioned, first knob is able to drive the first positioning tooth wheel rotation；Second knob lower end is provided with
Second positioning tooth bar, second knob are able to drive the second positioning tooth wheel rotation；
First positioning tooth bar is set to the side of the wafer central placement plate, second positioning tooth along the first direction
Item is set to the side of second positioning plate along the second direction；First positioning tooth bar and the first positioning gear
It is meshed, second positioning tooth bar is meshed with the second positioning gear.
5. single tube stripping machine according to claim 1, which is characterized in that further include image enlarger, described image is put
Great institutions are located at below the positioning mechanism；
Described image enlarger includes plane mirror and CCD magnifying glass, and the plane mirror and vertical direction are in a certain angle, described
The relative position image of single tube and the thimble can be passed in the CCD magnifying glass after plane mirror reflection on blue film；
The CCD magnifying glass is connected with display screen, described aobvious for that will be presented in through the amplified image of CCD magnifying glass
In display screen.
6. single tube stripping machine according to claim 2, which is characterized in that be provided with rotation pressure in the wafer central placement plate
Block, the rotation briquetting can rotate on the upper surface of the wafer central placement plate, and push down in the wafer central placement plate
The wafer central.
7. single tube stripping machine according to claim 2, which is characterized in that be provided with blue membrane pressure in the wafer central placement plate
Block, the indigo plant membrane pressure block are set to the edge of the wafer central placement plate, for limiting to the blue film.
8. single tube stripping machine according to claim 5, which is characterized in that it further include shell, the positioning mechanism, the top
Needle mechanism and described image enlarger are respectively positioned in the shell, and the wafer central is located at the upper surface of the shell.
9. single tube stripping machine according to claim 8, which is characterized in that be provided with switch, the switch on the shell
For controlling the start and stop of the driving device.
10. a kind of single tube system of processing, which is characterized in that including the described in any item single tube stripping machines of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920127340.9U CN209216944U (en) | 2019-01-24 | 2019-01-24 | Single tube stripping machine and single tube system of processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920127340.9U CN209216944U (en) | 2019-01-24 | 2019-01-24 | Single tube stripping machine and single tube system of processing |
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| CN209216944U true CN209216944U (en) | 2019-08-06 |
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| CN201920127340.9U Active CN209216944U (en) | 2019-01-24 | 2019-01-24 | Single tube stripping machine and single tube system of processing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585355A (en) * | 2019-01-24 | 2019-04-05 | 深圳市杰普特光电股份有限公司 | Single tube stripping machine and single tube system of processing |
| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
-
2019
- 2019-01-24 CN CN201920127340.9U patent/CN209216944U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585355A (en) * | 2019-01-24 | 2019-04-05 | 深圳市杰普特光电股份有限公司 | Single tube stripping machine and single tube system of processing |
| CN109585355B (en) * | 2019-01-24 | 2024-07-12 | 深圳市杰普特光电股份有限公司 | Single-tube membrane stripping machine and single-tube processing system |
| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
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