CN204045589U - A kind of LED-COB light source - Google Patents
A kind of LED-COB light source Download PDFInfo
- Publication number
- CN204045589U CN204045589U CN201420489833.4U CN201420489833U CN204045589U CN 204045589 U CN204045589 U CN 204045589U CN 201420489833 U CN201420489833 U CN 201420489833U CN 204045589 U CN204045589 U CN 204045589U
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- Prior art keywords
- led
- substrate
- light source
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- electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The utility model discloses a kind of LED-COB light source, comprise a substrate, some LED chips are connected with in substrate, pad and first group of electrode is had around substrate, second group of electrode, LED chip and first group of electrode, second group of electrode electrical connection, it is characterized in that: described substrate surface is coated with metallic reflector, metallic reflector is embedded with insulative transparent layer, described insulative transparent layer surface is provided with line layer, described line layer packaging LED chips, described LED chip is coated with fluorescent glue, described fluorescent glue surface is coated with one deck uvioresistant layer, framework is with outside LED chip.The utility model provides that a kind of high color rendering index (CRI), specular removal are high, brightness, free from glare integrated height colour developing COB light source.
Description
Technical field
The utility model relates to a kind of COB light source, specifically a kind of LED-COB light source.
Background technology
Along with the development of COB light source, people to the light efficiency of COB light source, reliability, color rendering index require more and more higher, and COB light source is in the market bad in reliability, light efficiency is not high, does not reach the demand of people, the light efficiency and the color rendering index that therefore improve COB light source are extremely urgent.
China Patent No. 2013205609159 is called that a kind of COB light source of novel high color rendering index (CRI) discloses following technical scheme: a kind of COB light source of novel high color rendering index (CRI), it comprises LED support, LED chip and the packing colloid be enclosed in outside LED chip, is characterized in that described LED chip comprises the first chipset, the second chipset and the 3rd chipset; First chipset, the second chipset and the 3rd chipset are got up by wired in series by multiple chip respectively; Described LED support is also provided with the first group of motor be connected with said chip group, second group of electrode and the 3rd group of electrode, described LED support is also provided with and has the first pin conducting end with first group of Electrode connection, and have the second pin conducting end with second group of Electrode connection, there is the 3rd pin conducting end with the 3rd group of Electrode connection.3 groups of electrodes of the utility model LED support can connect 3 kinds of different LED chips respectively, by increasing ruddiness, green glow or gold-tinted chip, solving conventional blu-ray LED and exciting the problem that the color rendering index of yellow fluorescent powder synthesize white light technology is lower.The requirement of this utility model by using the chip of different colours to reach high colour developing, but undesirable in the brightness each side of light efficiency and light.
Summary of the invention
The utility model overcomes the deficiencies in the prior art, provide that a kind of high color rendering index (CRI), specular removal are high, brightness, free from glare integrated high-color development LED-COB light source light source.
To achieve these goals, the technical solution adopted in the utility model is as follows: a kind of LED-COB light source, comprise a substrate, some LED chips are connected with in substrate, pad and first group of electrode is had around substrate, second group of electrode, LED chip and first group of electrode, second group of electrode electrical connection, described substrate surface is coated with metallic reflector, metallic reflector is embedded with insulative transparent layer, described insulative transparent layer surface is provided with line layer, described line layer packaging LED chips, described LED chip is coated with fluorescent glue, described fluorescent glue surface is coated with one deck uvioresistant layer, framework is with outside LED chip.
Described substrate is ceramic substrate.Described LED chip comprises the first chipset, the second chipset and the 3rd chipset, and the first chipset, the second chipset and the 3rd chipset to be connected in series by gold thread by multiple blue light wafer and red wafer respectively and to form.Described pad has four, is separately positioned on substrate four arms of angle up and down.
Described uvioresistant layer is mercury film.Described line layer thickness is 30-50 μm.
The utility model beneficial effect: the basis of the utility model prior art is improved, improved by the product important parameters such as the color rendering index of COB light source, light efficiency, brightness, colour temperature control, product hot spot is good, and light is soft, free from glare, is more and more applied to indoor and outdoor lighting.
Accompanying drawing explanation
Fig. 1 is the utility model encapsulating structure schematic diagram.
Fig. 2 is the utility model key diagram.
Main element symbol description: substrate 1; Metallic reflector 2; Insulative transparent layer 3; Line layer 4; Chip 5; Fluorescent glue 6; Uvioresistant layer 7; Framework 8; Die bond region 9; Pad (10,101,102,103); First group of electrode 11; Second group of electrode 12; Gold thread 13; First core assembly sheet 51; Second core assembly sheet 52; 3rd core assembly sheet 53; Red wafer 512; Blue light wafer 511.
Embodiment
As depicted in figs. 1 and 2, a kind of LED-COB light source, comprise a substrate 1, be connected with some LED chips 5 in substrate 1, around substrate 1, have pad (10,101,102,103) and first group of electrode 11 (in Fig. 1 left side both positive and negative polarity), second group of electrode 12 (in Fig. 1 right side both positive and negative polarity).LED chip is electrically connected with first group of electrode, second group of electrode, described substrate 1 surface is coated with metallic reflector 2, metallic reflector 2 is embedded with insulative transparent layer 3, described insulative transparent layer 3 surface is provided with line layer 4, described line layer 4 packaging LED chips 5, described LED chip 5 is coated with fluorescent glue 6, and described fluorescent glue 6 surface is coated with one deck uvioresistant layer 7, is with framework 8 outside LED chip 5.
Described substrate 1 is ceramic substrate.Described LED chip 5 is comprised the first chipset 51, second chipset 52 and the 3rd chipset 53, first chipset, the second chipset and the 3rd chipset and to be connected in series by gold thread 13 by multiple blue light wafer 511 and red wafer 512 respectively and to form.Described pad has four, is separately positioned on substrate four arms of angle up and down.First chipset and first group of Electrode connection, the second chipset and the 3rd chipset and second group of Electrode connection.
Described uvioresistant layer is mercury film.Described line layer thickness is 30-50 μm.
Encapsulation step is:
(1) on ceramic substrate, obtain reflector through the processing of precise laser technology, utilize vacuum coating on surface, reflector, obtain specular layer, this reflector is metal level, ensure that ceramic substrate superperformance;
(2) reflector embeds one deck insulative transparent layer, the conductive coefficient of adhesive linkage is suitable with ceramic substrate, is attached to surface through overbaking, and at its surperficial laying-out layer (thickness 30-50 μm) after completing, LED wafer is encapsulated in this surface;
(3) through series of process operation, add at packaged wafer wiring board and cover fluorescent glue, after oven cooking cycle is qualified, at its plated surface last layer mercury film.
Above encapsulation step eliminates conventional steps, and during enforcement, those skilled in the art can with reference to conventional encapsulation step of the prior art.
The utility model is only limitted to absolutely not these examples.The foregoing is only the good embodiment of the utility model, only for describing the utility model, the restriction to scope of the present utility model can not be interpreted as.It should be pointed out that all make within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (6)
1. a LED-COB light source, comprise a substrate, some LED chips are connected with in substrate, pad and first group of electrode, second group of electrode is had around substrate, LED chip is electrically connected with first group of electrode, second group of electrode, it is characterized in that: described substrate surface is coated with metallic reflector, metallic reflector is embedded with insulative transparent layer, described insulative transparent layer surface is provided with line layer, described line layer packaging LED chips, described LED chip is coated with fluorescent glue, and described fluorescent glue surface is coated with one deck uvioresistant layer, outside LED chip, be with framework.
2. a kind of LED-COB light source according to claim 1, is characterized in that: described substrate is ceramic substrate.
3. a kind of LED-COB light source according to claim 1, it is characterized in that: described LED chip comprises the first chipset, the second chipset and the 3rd chipset, the first chipset, the second chipset and the 3rd chipset to be connected in series by gold thread by multiple blue light wafer and red wafer respectively and to form.
4. a kind of LED-COB light source according to claim 1, is characterized in that: described pad has four, is separately positioned on substrate four arms of angle up and down.
5. a kind of LED-COB light source according to claim 1, is characterized in that: described uvioresistant layer is mercury film.
6. a kind of LED-COB light source according to claim 1, is characterized in that: described line layer thickness is 30-50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420489833.4U CN204045589U (en) | 2014-08-28 | 2014-08-28 | A kind of LED-COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420489833.4U CN204045589U (en) | 2014-08-28 | 2014-08-28 | A kind of LED-COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204045589U true CN204045589U (en) | 2014-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420489833.4U Expired - Fee Related CN204045589U (en) | 2014-08-28 | 2014-08-28 | A kind of LED-COB light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN204045589U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070692A (en) * | 2015-07-29 | 2015-11-18 | 常熟市银洋陶瓷器件有限公司 | Double-sided ceramic plate |
| WO2016123789A1 (en) * | 2015-02-06 | 2016-08-11 | 远东科技大学 | Heat-conducting radiation substrate and reflective radiation heat-dissipating light-emitting part |
-
2014
- 2014-08-28 CN CN201420489833.4U patent/CN204045589U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016123789A1 (en) * | 2015-02-06 | 2016-08-11 | 远东科技大学 | Heat-conducting radiation substrate and reflective radiation heat-dissipating light-emitting part |
| CN105070692A (en) * | 2015-07-29 | 2015-11-18 | 常熟市银洋陶瓷器件有限公司 | Double-sided ceramic plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20150828 |
|
| EXPY | Termination of patent right or utility model |