CN204088315U - MCOB LED fluorescent powder separate package structure - Google Patents
MCOB LED fluorescent powder separate package structure Download PDFInfo
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- CN204088315U CN204088315U CN201420484733.2U CN201420484733U CN204088315U CN 204088315 U CN204088315 U CN 204088315U CN 201420484733 U CN201420484733 U CN 201420484733U CN 204088315 U CN204088315 U CN 204088315U
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- led chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
A kind of MCOB LED fluorescent powder separate package structure, comprises substrate, the LED chip that substrate is provided with multiple cup and is fixed in cup.Substrate comprises the metal level, insulating barrier, copper plating circuit layer and the silver coating that set gradually.LED chip is fixed on the bottom of cup, and the bottom of cup is located on metal level.LED chip is wired to copper plating circuit layer, the opening part of cup is provided with ladder box dam, the thin web being coated with fluorescent coating is fixed with in ladder box dam, fluorescent coating and LED chip are isolated and are arranged, ladder box dam is fixed with silica-gel lens, and silica-gel lens is positioned at the side that thin web deviates from LED chip.Above-mentioned MCOB LED fluorescent powder separate package structure, by forming the silica-gel lens that encapsulates above cup and fluorescent coating that optical simulation makes on substrate, improves light extraction efficiency effectively.LED chip is directly fixed on not to be had in the cup bottom metal of insulating barrier, and fluorescent material and LED chip are isolated, thus significantly reduction fluorescent powder colloid yellow, look drift and LED light decline.
Description
technical field
The utility model relates to LED technical field, particularly relates to a kind of MCOB LED fluorescent powder separate package structure.
Background technology
MCOB (Multi Chips On Board, multi-chip on plate, abbreviation MCOB) LED (the Light Emitting Diode that encapsulates, light-emitting diode, abbreviation LED) light source has a wide range of applications, particularly improve a lot in the application percentage of lighting field over the past two years, have greatly and replace traditional SMD (Surface Mounted Devices, surface mount device, abbreviation SMD) trend of LED, COB LED light source and imitative lumen formula High Power LED.Consider production technology, cost, dazzle, the technical requirement of the aspects such as light fixture form, increasing lighting will adopt the LED light source of this packaged type.
MCOB light source all will consider the problems such as light efficiency, reliability and cost with the LED light source of other packaged type is the same.First, traditional MCOB light-source encapsulation directly fluorescent powder colloid is coated in LED chip on the surface, but the heat that LED chip long-term work produces can make fluorescent powder colloid yellow, color temperature shift serious very soon; Secondly, due to conventional substrate because insulating barrier coefficient of heat transfer is lower, LED can be caused to dispel the heat not in time, the light decay of LED is strengthened, light efficiency declines, and the LED life-span can not get a desired effect; Again, from luminous efficiency, traditional MCOB encapsulates mostly on planar substrates, and the phosphor gel dignity of coating also all becomes plane, and cause LED light line form total reflection in inside and lose, thus do not reach desirable light extraction efficiency, light efficiency is lower.
Utility model content
Based on this, provide a kind of specular removal, low light attenuation, the MCOB LED fluorescent powder separate package structure that color temperature shift is little.
This MCOB LED fluorescent powder separate package structure, comprises substrate, the LED chip that substrate is provided with multiple cup and is fixed in cup.Wherein, substrate comprises the metal level, insulating barrier, copper plating circuit layer and the silver coating that set gradually.Be provided with by the electronic circuit of wrapped with insulation in described copper plating circuit layer.LED chip is fixed on the bottom of cup, and the bottom of cup is located on the metal level of substrate, and LED chip is wired to copper plating circuit layer.The opening part of cup is provided with ladder box dam.Be fixed with the thin web being coated with fluorescent coating in ladder box dam, this fluorescent coating and LED chip are isolated and are arranged, and ladder box dam is fixed with silica-gel lens, and silica-gel lens is positioned at the side that thin web deviates from LED chip.
Cup is the optics cup that optical simulation makes, and silver coating is formed at the one side that copper plating circuit layer deviates from insulating barrier.
Wherein in an embodiment, thin web is arranged on the side of LED chip near the opening of described cup, and is separated fixing with LED chip.
Wherein in an embodiment, LED chip is blue-light LED chip.
Wherein in an embodiment, the blue-light LED chip of LED chip to be peak luminous wavelength be 430nm-480nm, the fluorescent coating on thin web comprises the green emitting phosphor of mixing mutually, yellow fluorescent powder and red fluorescence powder.
Wherein in an embodiment, the wavelength peak that green emitting phosphor is stimulated is 520nm-530nm, and the wavelength peak that yellow fluorescent powder is stimulated is 550nm-580nm, and the wavelength peak that red fluorescence powder is stimulated is 610nm-630nm.
Wherein in an embodiment, surface thin web being coated with fluorescent coating is matsurface.
Wherein in an embodiment, ladder box dam is ring-type.
Wherein in an embodiment, silica-gel lens is transparent hemisphere.
Wherein in an embodiment, LED chip is pasted on the metal layer by crystal-bonding adhesive.
Wherein in an embodiment, wire is gold thread.
Above-mentioned MCOB LED fluorescent powder separate package structure, by forming the silica-gel lens that encapsulates above cup and fluorescent coating that optical simulation makes on substrate, exiting surface and rising angle are increased, greatly reduces the total reflection of light, effectively improve light extraction efficiency.Simultaneously, LED chip is directly solid in the cup bottom metal not having insulating barrier, greatly reduce LED thermal resistance, fluorescent coating is improved to isolate with chip is arranged by the chip surface that is attached in conventional art, fluorescent material and LED chip are isolated, thus significantly the yellow of reduction fluorescent powder colloid, color temperature shift and LED light decline.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the MCOB LED fluorescent powder separate package structure of a kind of execution mode of the present utility model;
Fig. 2 is the substrate shown in Fig. 1, the distribution schematic diagram of ladder box dam and cup;
Fig. 3 be in Fig. 1 MCOB LED fluorescent powder separate package structure along the schematic cross-section in A-A direction;
Fig. 4 is the structure enlarged diagram of local B in Fig. 3;
In accompanying drawing, the implication of each label is:
1-substrate, 1a-metal level, 1b-insulating barrier, 1c-copper plating circuit layer, 1d-silver coating;
2-cup, 3-ladder box dam, 4-silica-gel lens, 5-thin web, 6-fluorescent coating, 7-gold thread, 8-LED chip, 9-crystal-bonding adhesive.
Embodiment
For feature of the present utility model, technological means and the specific purposes reached, function can be understood further, resolve advantage of the present utility model and spirit, by below in conjunction with accompanying drawing and embodiment, detailed description of the present utility model is further understood.
See attached Fig. 1 and 2, it is respectively the overall structure schematic diagram of MCOB LED fluorescent powder separate package structure and the distribution schematic diagram of the substrate 1 shown in Fig. 1, ladder box dam 3 and cup 2 of a kind of execution mode of the present utility model.
This MCOB LED fluorescent powder separate package structure, comprises one piece of circular substrate 1.Substrate 1 is provided with six cups 2 be formed in substrate 1, and in the present embodiment, the optics cup 2 that this cup 2 makes for optical simulation, particularly, cup 2 is for being formed at the groove of the one side of substrate 1.Each cup 2 internal fixtion has a LED chip 8 (in certain embodiments, also can place multiple LED chip 8 in a cup 2).Around the opening part of each cup 2, be provided with a circular ladder box dam 3, and each ladder box dam 3 be fixed with a transparent semispherical silicon glue lens 4.This ladder box dam 3 is metal or plastic cement material.
Please refer to accompanying drawing 3 and 4, it is respectively the structure enlarged diagram of MCOB LED fluorescent powder separate package structure local B in the schematic cross-section and Fig. 3 in A-A direction in Fig. 1.
Substrate 1 is four-layer structure, comprises the metal level 1a, insulating barrier 1b, copper plating circuit layer 1c and the silver coating 1d that set gradually.
Metal level 1a: the main part of substrate 1, plays the effect of other structures of carrying and heat radiation.
Insulating barrier 1b: for the insulation between the copper plating circuit layer 1c of substrate 1 and metal level 1a.
Copper plating circuit layer 1c: form electronic circuit for substrate 1, this electronic circuit is by wrapped with insulation.Copper plating circuit layer is formed in the one side that insulating barrier 1b deviates from metal level 1a.
Silver coating 1d: the one side copper plating circuit layer 1c being formed at substrate 1 deviating from described insulating barrier 1b.Due to the electronic circuit in copper plating circuit layer 1c wrap up by insulating material, therefore, silver coating 1d can't produce with this electronic circuit and contact.In certain embodiments, the bottom of cup 2 and inwall are equipped with silver coating 1d.The good heat conduction effect of this silver coating 1d, and reflective effect can be played, improve the light extraction efficiency of LED encapsulation structure.
In the present embodiment, LED chip 8 is directly pasted onto the bottom of cup 2 by crystal-bonding adhesive 9, and the bottom of cup 2 is located on metal level 1a.LED chip 8 is connected to the electronic circuit in copper plating circuit layer 1c by wire 7.Be fixed with the thin web 5 being coated with fluorescent coating 6 in ladder box dam 3, fluorescent coating 6 is isolated with LED chip 8 and is arranged (directly not contacting), and silica-gel lens 4 is positioned at the side that thin web 5 deviates from LED chip 8.In the present embodiment, particularly, thin web 5 is embedded on ladder box dam 3, and separation is fixed on the side of LED chip 8 near cup 2 opening, and thin web 5 is not directly contacted with this LED chip 8.In the present embodiment, fluorescent coating 6 is coated in the one side that thin web 5 deviates from described LED chip 8.In other examples, fluorescent coating 6 can be coated in the one side of thin web 5 near described LED chip 8, and even fluorescent material 6 can be coated in the two sides of thin web 5, as long as ensure that fluorescent coating 6 does not directly contact with LED chip 8.
In certain embodiments, LED chip 8 can select peak luminous wavelength to be the blue-light LED chip 8 of 430nm-480nm.Surface thin web 5 being coated with fluorescent coating 6 is matsurface.This fluorescent coating 6 can comprise the green emitting phosphor, yellow fluorescent powder and the red fluorescence powder that mutually mix.The wavelength peak that green emitting phosphor is stimulated is 520nm-530nm, and the wavelength peak that yellow fluorescent powder is stimulated is 550nm-580nm, and the wavelength peak that red fluorescence powder is stimulated is 610nm-630nm.The wavelength peak range of choice of above-mentioned LED chip 8 and fluorescent material, the light color that LED is sent is purer, and illumination effect is better.Wherein, fluorescent coating 6 reaches different color rendering indexs and colour temperature by changing its proportioning, thus meets the demand of different product.
Wire 7 can be gold thread.Gold thread is usually used in LED, and its conductivity is large, corrosion-resistant, good toughness, and non-oxidizability is strong.
Above-mentioned MCOB LED fluorescent powder separate package structure, by formed on substrate 1 optical simulation make cup 2 and fluorescent coating 6 above encapsulation silica-gel lens 4, substrate 1 is arranged multiple cup 2, increase LED and go out luminous point, reduce and light loss, than single go out the plane COB LED of luminous point there is better light extraction efficiency, exiting surface and rising angle are increased, greatly reduce the total reflection of light, effectively improve light extraction efficiency.The material of silica-gel lens 4 is high refraction, high light transmittance, temperature-resistant material.Simultaneously, LED chip 8 is directly solid in cup 2 bottom metal not having insulating barrier 1b, when packaging LED chips 8, without packaging silicon rubber or other resin glues in cup 2, the light decay in medium can be reduced like this, reduce the refraction of light, reduce heat trnasfer etc. to fluorescent coating 6, greatly reduce LED thermal resistance, fluorescent coating 6 is improved to isolate with chip by the chip surface in conventional art and arranges, fluorescent material and LED chip 8 are isolated, thus significantly the yellow of reduction fluorescent powder colloid, color temperature shift and LED light decline.
The above embodiment only have expressed preferred embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a MCOB LED fluorescent powder separate package structure, comprise substrate, the LED chip that described substrate is provided with multiple cup and is fixed in described cup, it is characterized in that, described substrate comprises the metal level set gradually, insulating barrier, copper plating circuit layer and silver coating, be provided with in described copper plating circuit layer by the electronic circuit of wrapped with insulation, described LED chip is fixed on the bottom of described cup, the bottom of described cup is located on described metal level, described LED chip is wired to described copper plating circuit layer, the opening part of described cup is provided with ladder box dam, the thin web being coated with fluorescent coating is fixed with in described ladder box dam, described fluorescent coating and described LED chip are isolated and are arranged, described ladder box dam is fixed with silica-gel lens, described silica-gel lens is positioned at the side that described thin web deviates from described LED chip,
Described cup is the optics cup that optical simulation makes, and described silver coating is formed at the one side that described copper plating circuit layer deviates from described insulating barrier.
2. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described thin web is arranged on the side of described LED chip near the opening of described cup, and is separated fixing with described LED chip.
3. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described LED chip is blue-light LED chip.
4. MCOB LED fluorescent powder separate package structure according to claim 3, it is characterized in that, the blue-light LED chip of described LED chip to be peak luminous wavelength be 430nm-480nm, described fluorescent coating comprises the green emitting phosphor of mixing mutually, yellow fluorescent powder and red fluorescence powder.
5. MCOB LED fluorescent powder separate package structure according to claim 4, it is characterized in that, the wavelength peak that described green emitting phosphor is stimulated is 520nm-530nm, the wavelength peak that described yellow fluorescent powder is stimulated is 550nm-580nm, and the wavelength peak that described red fluorescence powder is stimulated is 610nm-630nm.
6. MCOB LED fluorescent powder separate package structure according to claim 1, is characterized in that, the surface described thin web being coated with described fluorescent coating is matsurface.
7. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described ladder box dam is ring-type.
8. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described silica-gel lens is transparent hemisphere.
9. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described LED chip is pasted onto the bottom of described cup by crystal-bonding adhesive.
10. MCOB LED fluorescent powder separate package structure according to claim 1, it is characterized in that, described wire is gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420484733.2U CN204088315U (en) | 2014-08-26 | 2014-08-26 | MCOB LED fluorescent powder separate package structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420484733.2U CN204088315U (en) | 2014-08-26 | 2014-08-26 | MCOB LED fluorescent powder separate package structure |
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| CN204088315U true CN204088315U (en) | 2015-01-07 |
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| CN201420484733.2U Active CN204088315U (en) | 2014-08-26 | 2014-08-26 | MCOB LED fluorescent powder separate package structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853491A (en) * | 2015-05-14 | 2015-08-19 | 芜湖市神龙新能源科技有限公司 | Small low-power LED streetlight |
| CN108140704A (en) * | 2015-09-17 | 2018-06-08 | 日机装株式会社 | The manufacturing method of light emitting module and light emitting module |
| CN110504345A (en) * | 2018-05-18 | 2019-11-26 | 深圳市聚飞光电股份有限公司 | LED and light emitting device with circuit |
| CN111128978A (en) * | 2019-12-31 | 2020-05-08 | 山东盛品电子技术有限公司 | System-level packaging structure and method |
| CN111180567A (en) * | 2020-02-21 | 2020-05-19 | 松山湖材料实验室 | Carrier and light emitting device |
| CN113314656A (en) * | 2021-05-24 | 2021-08-27 | 深圳市华拓照明有限公司 | Packaging structure and packaging method of high-light-transmission high-heat-dissipation type LED lamp strip |
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2014
- 2014-08-26 CN CN201420484733.2U patent/CN204088315U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853491A (en) * | 2015-05-14 | 2015-08-19 | 芜湖市神龙新能源科技有限公司 | Small low-power LED streetlight |
| CN108140704A (en) * | 2015-09-17 | 2018-06-08 | 日机装株式会社 | The manufacturing method of light emitting module and light emitting module |
| US10883680B2 (en) | 2015-09-17 | 2021-01-05 | Nikkiso Co., Ltd. | Light-emitting module and method of manufacturing light-emitting module |
| CN110504345A (en) * | 2018-05-18 | 2019-11-26 | 深圳市聚飞光电股份有限公司 | LED and light emitting device with circuit |
| CN110504345B (en) * | 2018-05-18 | 2024-06-04 | 深圳市聚飞光电股份有限公司 | LED with circuit and light-emitting device |
| CN111128978A (en) * | 2019-12-31 | 2020-05-08 | 山东盛品电子技术有限公司 | System-level packaging structure and method |
| CN111180567A (en) * | 2020-02-21 | 2020-05-19 | 松山湖材料实验室 | Carrier and light emitting device |
| CN113314656A (en) * | 2021-05-24 | 2021-08-27 | 深圳市华拓照明有限公司 | Packaging structure and packaging method of high-light-transmission high-heat-dissipation type LED lamp strip |
| CN113314656B (en) * | 2021-05-24 | 2022-02-18 | 深圳市华拓照明有限公司 | Packaging method of packaging structure of high-light-transmission high-heat-dissipation type LED lamp strip |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180710 Address after: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee after: Dongguan Yanyuan Investment Company Limited Address before: 523000, 4 floor, building 1, Songshan Lake innovation and Technology Park, Dongguan, Guangdong. Patentee before: Dongguan Institute of Opto-Electronics Peking University |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180730 Address after: 523000 Dongguan, Guangdong Province, the town of Xiao Lang village, 8 Patentee after: DONGGUAN ZHONGHAO LIGHTING TECHNOLOGY CO., LTD. Address before: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee before: Dongguan Yanyuan Investment Company Limited |