CN206163520U - LED packaging bracket and LED luminous body - Google Patents
LED packaging bracket and LED luminous body Download PDFInfo
- Publication number
- CN206163520U CN206163520U CN201621233532.0U CN201621233532U CN206163520U CN 206163520 U CN206163520 U CN 206163520U CN 201621233532 U CN201621233532 U CN 201621233532U CN 206163520 U CN206163520 U CN 206163520U
- Authority
- CN
- China
- Prior art keywords
- led
- rack body
- led package
- package supports
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model relates to a LED packaging bracket and LED luminous body, this LED packaging support include and make the support body that has the anti - light cup of spill with the metal, are provided with a through -hole on the anti - light cup bottom surface, be provided with a sheetmetal in the through -hole, the cladding of sheetmetal week side has an insulating material, and this insulating material is with metal electrode and support body electric isolation and fix the sheetmetal on the support body, but all plated the weld metal layer on support body and the sheetmetal, this LED packaging support's support body is as the electrode, has increased the heat radiating area of chip to plate on the anti - light cup and be equipped with the specular reflection layer, improved the emissivity, improved the light efficiency. The utility model discloses the LED luminous element who makes by this LED packaging support is still provided.
Description
Technical field
The utility model is related to a kind of LED package supports, more particularly, to a kind of high radiating and the LED encapsulation of specular removal
Frame.
Background technology
Currently used for having that the material of paster LED bracket is commonly used：Be modified poly- terephthalate p-phenylenediamine（PPA）, it is poly- to benzene
Dioctyl phthalate 1,4 cyclohexane dimethanol ester（PCT）, epoxy molding material（EMC）.These materials constitute the four of LED support
Wall, and the effect of two electrodes of fixed LED, these materials can be because aging so that LED lamp bead during Long-Time Service
Internal material（Such as silver coating, chip, bonding line）Go wrong, affect LED service lifes.
It is because the thermal conductivity of above-mentioned material is all than relatively low that the thermal conductivity of existing paster LED bracket is low（Will be typically less than
1W/(m·K）, therefore the heat major part of the LED chip encapsulated on the LED package supports by made by these materials is by electricity
Pole sheet metal is transmitted on pcb board, and the sheet metal area of existing LED package supports electrode is all smaller, therefore is constrained
The transmission of LED chip heat.The Chinese patent application of the A of Publication No. CN 104425683 discloses a kind of all-metal construction
LED package supports, including metallic plate makes the rack body with spill reflector；High temperature insulation adhesive layer is used, two phases
One is formed under the conditions of insulation protection with input to the upper surface that independent separate sheet metal is fixed on the rack body
The integrated all-metal LED package support of output electrode；LED chip is fixed on into the upper surface of the spill reflector, it is described
Two sheet metals form electrical connection between one end of LED chip and LED chip；Or with either physically or chemically in institute
Stating the upper surface Direct precipitation of spill reflector can do the coating being electrically connected with the LED chips.The support of the LED support
The gluing knot of high temperature insulation is adopted between body and electrode, because the thermal conductivity of the gluing knot of high temperature insulation is very low, can still become it
The short slab of heat conduction, heat cannot be effectively delivered on the electrode contact of pcb board point, and heat-conducting effect is not good.
In addition responsible LED go out the reflecting surface of light in addition to internal electrode silver coating remaining be exactly by LED bowl materials（I.e.
The materials such as above-mentioned PPA, PCT, EMC）To realize, although these materials be white have reflecting effect, its reflectivity be coated with
The material of metallic reflector is compared or much lower, has thus resulted in the light efficiency of whole LED/light source than relatively low.
Utility model content
The utility model aims to provide a kind of LED package supports, and the rack body of the LED support is made with metal and made
For the electrode of the package support, the area of heat transfer is considerably increased, and plating sets specular layer on reflector, increases anti-
Rate is penetrated, it is low to solve the problems, such as existing LED patch supports poor radiation and reflectivity.
Concrete scheme is as follows：
A kind of LED package supports, including the rack body with spill reflector is made with metal, reflector sets on bottom surface
A through hole is equipped with, a sheet metal is provided with the through hole, sheet metal the week side of boss is coated with insulating materials, the insulating materials is by metal
Electrode and rack body electrical isolation and sheet metal is fixed on rack body, is all plated on the rack body and sheet metal
There are solderable metal layers.
Preferably, it is coated with specular layer on the reflector.
Preferably, the rack body is made of copper, and is plated with the outer surface of the spill reflector on the rack body
Nickel dam, is coated with minute surface silver layer on nickel dam.
Preferably, the insulating materials is modified poly- terephthalate p-phenylenediamine, poly terephthalic acid Isosorbide-5-Nitrae-hexamethylene two
One kind in methyl alcohol ester, epoxy molding material.
Preferably, the cross section of the spill reflector is the one kind in rectangle, square and circle.
Preferably, the angle between the side and bottom surface of the spill reflector is obtuse angle.
The utility model additionally provides a kind of LED illuminator, including LED chip and LED package supports, the LED encapsulation
Support is any one above-mentioned LED package support, and the LED chip is arranged in spill reflector, an electricity of LED chip
Pole is connected with rack body, and another electrode is connected with sheet metal；Packaging plastic is also coated with LED chip or is mixed with glimmering
The packaging plastic of light powder.
A kind of LED package supports that the utility model is provided have compared with prior art advantages below：
1st, the rack body of the LED package supports that the utility model is provided all is made of metal, and the rack body
Directly can be directed on pcb board from rack body upload as one of electrode of paster light source, therefore the heat that chip is produced,
And the heat transfer between air also can increase, therefore the LED package supports have good radiating effect.
2nd, specular layer, therefore its are coated with the outer surface of the reflector of the LED package supports that the utility model is provided
Reflectivity is high relative to existing package support, therefore the light extraction efficiency of the LED package supports is high, thus encapsulates
The light efficiency for forming LED/light source is higher.
Description of the drawings
Fig. 1 shows the top view of LED package supports.
Fig. 2 shows the generalized section of LED package supports.
Fig. 3 shows the schematic diagram of LED package support coating.
Fig. 4 shows another schematic diagram of LED package supports.
Fig. 5 shows the another schematic diagram of LED package supports.
Fig. 6 shows the schematic diagram of LED illuminator.
Fig. 7 shows that LED illuminator is welded on the schematic diagram on pcb board.
Specific embodiment
To further illustrate each embodiment, the utility model is provided with accompanying drawing.These accompanying drawings are in the utility model is disclosed
A part for appearance, it is mainly to illustrate embodiment, and the running that the associated description of specification can be coordinated to explain embodiment is former
Reason.Coordinate and refer to these contents, those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new
The advantage of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
As depicted in figs. 1 and 2, a kind of LED package supports, including making the support with spill reflector 100 with metal
Body 10, is provided with a through hole on reflector bottom surface, a sheet metal 20 is provided with the through hole, and sheet metal the week side of boss is coated with absolutely
Edge material 30, the insulating materials is fixed on rack body by metal electrode and rack body electrical isolation and by sheet metal
10, it is plated with solderable metal layers on the rack body and sheet metal.Wherein as the package support of rack body
Electrode, used as another electrode, rack body 10 can be made up sheet metal of sheet metal punch forming, in order to increase reflector
Reflectivity, specular layer can be set in the plated surface of reflector.With reference to Fig. 3, rack body is made of copper, outside reflector
Nickel dam is plated with surface, minute surface silver layer is set in plating on nickel dam, the reflectivity of reflector can be greatly improved, and due to silver
Belong to solderable metal, therefore gold thread, silver wire or alloy wire directly can be welded on silver layer by bonding equipment, it is not necessary to it is extra
Increase pad point, the bottom surface of rack body for mutually welding with pcb board, because copper falls within solderable metal, can not
Solderable metal coating is done again, it is also possible to increase solderable metal coating on bottom surface.Insulating barrier between sheet metal and rack body
Material can be the insulating materials for the poly- terephthalate p-phenylenediamine that is modified（PPA）, poly terephthalic acid 1,4- hexamethylenes
Diformazan alcohol ester（PCT）, epoxy molding material（EMC）In one kind.
The cross section of spill reflector with reference to described in Fig. 1, Fig. 4 and Fig. 5 can be rectangle, square or circular, together
Sample, the size of rack body can be the size of the existing patch supports such as 2835,3535,5050.
With reference to Fig. 2, the angle between the side and bottom surface of the spill reflector is obtuse angle, the folder between side and bottom surface
Angle can increase rising angle for obtuse angle.
With reference to Fig. 6, the utility model additionally provides a kind of LED illuminator, and the LED illuminator includes LED chip and encapsulation
Support, package support is above-mentioned LED package supports, and LED chip 40 is arranged in spill reflector 100, and LED chip is wherein
One electrode is connected with rack body 10, and another electrode is connected with sheet metal 20.LED chip can be blue light, gold-tinted, red
One kind in light, orange light or its combination, LED chip structure can be positive assembling structure, inverted structure or vertical stratification, Fig. 6
In be illustrated that the schematic diagram of positive assembling structure, the LED chip of positive assembling structure can be fixed on reflective by crystal-bonding adhesive or elargol
On cup 100, then with gold thread, either the both positive and negative polarity of LED chip is connected respectively to rack body and metal by silver wire or alloy wire
On piece, electrical connection is formed.It is being coated with packaging plastic 50 or is being mixed with the packaging plastic of fluorescent material in LED chip.Encapsulation
The organic silica gel of the preferred high transmission rate of glue and high index of refraction.If the glow color of the LED illuminator is white, can be using indigo plant
The combination of yellow fluorescent powder or yellow fluorescent powder and red fluorescence powder is coated in light LED chip, to realize that white light LEDs light
Body.
With reference to Fig. 7, the radiating schematic diagram of the LED illuminator, the LED illuminator is welded on pcb board 70, the package support
Rack body 10 bottom surface and sheet metal 20 bottom surface distribution fit with the positive and negative electrode on pcb board, due to rack body
10 are had made by metal, and the area fitted with pcb board is big, therefore the heat that LED chip 40 is produced can be transferred to faster
On pcb board 70.And because rack body 10 is had made by metal, therefore the heat that LED chip is produced can also be transferred to
On whole rack body, and heat transfer is produced with air, it is further to accelerate radiating in transferring heat to air.And it is anti-
The surface of light cup 100 is coated with specular layer, therefore the light overwhelming majority that LED chip sends all can be by the reflection of the reflector
Out, increased the light efficiency of the LED illuminator.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, in the spirit and scope of the present utility model limited without departing from appended claims, in form and details
On the utility model can be made a variety of changes, be protection domain of the present utility model.
Claims (7)
1. a kind of LED package supports, it is characterised in that：It is reflective including the rack body with spill reflector is made with metal
Cup is provided with a through hole on bottom surface, and a sheet metal is provided with the through hole, and sheet metal the week side of boss is coated with insulating materials, the insulation
Material is fixed on rack body by metal electrode and rack body electrical isolation and by sheet metal, the rack body and gold
Solderable metal layers, wherein two electrodes of rack body, sheet metal as the package support are plated with category piece.
2. a kind of LED package supports according to claim 1, it is characterised in that：Mirror-reflection is coated with the reflector
Layer.
3. a kind of LED package supports according to claim 1 and 2, it is characterised in that：The rack body is made of copper,
Nickel dam is plated with the outer surface of the spill reflector on the rack body, minute surface silver layer is coated with nickel dam.
4. a kind of LED package supports according to claim 1 and 2, it is characterised in that：The insulating materials is modified poly- right
One kind in the acyl p-phenylenediamine of benzene two, poly terephthalic acid 1,4 cyclohexane dimethanol ester, epoxy molding material.
5. a kind of LED package supports according to claim 1, it is characterised in that：The cross section of the spill reflector is
One kind in rectangle, square and circle.
6. a kind of LED package supports according to claim 5, it is characterised in that：The side and bottom of the spill reflector
Angle between face is obtuse angle.
7. a kind of LED illuminator, including LED chip and LED package supports, it is characterised in that：The LED package supports are right
Require the arbitrary described LED package supports of 1-6, the LED chip is arranged in spill reflector, LED chip one of them
It is connected with rack body, another electrode is connected with sheet metal；Packaging plastic is also coated with LED chip or is mixed with glimmering
The packaging plastic of light powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621233532.0U CN206163520U (en) | 2016-11-17 | 2016-11-17 | LED packaging bracket and LED luminous body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621233532.0U CN206163520U (en) | 2016-11-17 | 2016-11-17 | LED packaging bracket and LED luminous body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206163520U true CN206163520U (en) | 2017-05-10 |
Family
ID=58660290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621233532.0U Expired - Fee Related CN206163520U (en) | 2016-11-17 | 2016-11-17 | LED packaging bracket and LED luminous body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206163520U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
-
2016
- 2016-11-17 CN CN201621233532.0U patent/CN206163520U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
| CN107256922B (en) * | 2017-07-14 | 2023-05-26 | 湖南粤港模科实业有限公司 | Aluminum foil type radiator and chip packaging integrated light source structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20211117 |