CN202549924U - Novel light-emitting diode (LED) device - Google Patents
Novel light-emitting diode (LED) device Download PDFInfo
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- CN202549924U CN202549924U CN2012201435505U CN201220143550U CN202549924U CN 202549924 U CN202549924 U CN 202549924U CN 2012201435505 U CN2012201435505 U CN 2012201435505U CN 201220143550 U CN201220143550 U CN 201220143550U CN 202549924 U CN202549924 U CN 202549924U
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Abstract
The utility model discloses a novel light-emitting diode (LED) device which comprises a packaging bracket carrier, wherein a plurality of independent reflection cups are arranged on the packaging bracket carrier; at least one LED luminous chip for die bonding wires and pads which correspond to die bonding wires are arranged in each reflection cup; and colloid is covered on the surfaces of the luminous chips. The application functions of the LED are increased, the service life of the LED is prolonged, the light extraction efficiency is high, and multiple white-light colors are packaged.
Description
Technical field
The utility model relates to a kind of New LED device.
Background technology
Because LED has energy-saving and environmental protection, in light weight, plurality of advantages such as the life-span is long, volume is little, stable performance, obtains a lot of extensive applications; Along with the development of whole industry, LED in the application of lighting field more and more widely and has multiple advantage, is regarded as one of main light source of following illumination, will play an important role at lighting field.
The packing forms of present LED; Normally on metallic support or substrate, penetrate PPA or engineering plastics; Form an optics bowl cup (reflector); At one or more LED wafers of optics bowl cup internal fixation, and carry out the wafer connection in series-parallel in optics bowl cup inside through plain conductor and connect, in optics bowl cup, fill the colloid that is mixed with fluorescent material then.This packing forms can only be realized the color of single white light in single LEDs, and heat is too concentrated and each wafer does not have independent passage of heat in plurality of LEDs wafer package process, and during polycrystalline sheet encapsulation simultaneously, bright dipping is disturbed mutually between wafer and the wafer.So strengthening the application function of LED will be following important topic with the life-span, the light extraction efficiency that improve LED.
Summary of the invention
When overcoming in the prior art encapsulation of polycrystalline sheet, the problem that bright dipping is disturbed mutually between wafer and the wafer, the utility model provides a kind of New LED device.
The technical scheme that the utility model adopts is:
The New LED device; It is characterized in that: comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors; At least be provided with in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.
Further, the wavelength of the luminescent wafer in said each reflector can be different.
Further, said pad can be gone here and there in said reflector inside and connects according to design demand.
Further, low pattern between senior middle school around the final light-emitting window of said reflector can be designed to.
Further, be coated with colloid in the low centre between senior middle school around said, can realize that the abundant mixed light of the light that is sent in each reflector realizes the uniformity and the soften of hot spot, can improve the whole light extraction efficiency of the LED in all reflectors simultaneously.
Further, the wavelength of the luminescent wafer in said each reflector can be any wavelength in all band scope.
Further, the colloid of said luminescent wafer surface coverage coats all plain conductors in LED wafer and the reflector.
The beneficial effect of the utility model is embodied in: during the encapsulation of polycrystalline sheet, bright dipping is not disturbed mutually between wafer and the wafer, has strengthened the application function of LED, and the life-span, the light extraction efficiency that have improved LED are high.
Description of drawings
Fig. 1 is the utility model embodiment two structural representations.
Fig. 2 is the utility model embodiment three structural representations.
Fig. 3 is the utility model embodiment four structural representations.
Embodiment
Embodiment one
The New LED device; Comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors, be provided with at least in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.
Further, the wavelength of the luminescent wafer in said each reflector can be different.
Further, said pad can be gone here and there in said reflector inside and connects according to design demand.
Further, low pattern between senior middle school around the final light-emitting window of said reflector can be designed to.
Further, be coated with colloid in the low centre between senior middle school around said, can realize that the abundant mixed light of the light that is sent in each reflector realizes the uniformity and the soften of hot spot, can improve the whole light extraction efficiency of the LED in all reflectors simultaneously.
Further, the wavelength of the luminescent wafer in said each reflector can be any wavelength in all band scope.
Further, the colloid of said luminescent wafer surface coverage coats all plain conductors in LED wafer and the reflector.
Embodiment two
As shown in Figure 1; The New LED device; Comprise a package support carrier 100, said support carrier is provided with two independently reflectors 40,41, is fixed on the LED luminescent wafer 30,32 in the said reflector; The LED luminescent wafer adopts the heat-conducting glue hydropexis in said reflector 40,41, and the heat that in work, produced of luminescent wafer 30,32 can externally conduct through support pin 10 independently. Fluorescent glue 50,51 covers on the luminescent wafer 30,32, and luminescent wafer 30,32 is can wavelength different; Can allocate corresponding fluorescent glue 50,51 according to the wavelength of luminescent wafer 30,32, fluorescent glue can adopt the mode of spraying, the mode that point is annotated, the mode of printing to cover on the luminescent wafer 30,32 simultaneously.
During use; Can pass through luminescent wafer 30,32 corresponding pins 10; Light luminescent wafer 30,32 respectively and excite the fluorescent glue 50,51 that covers in the reflector on the luminescent wafer sheet 30,32 40,41; Realize that two kinds of white light color LED are luminous, when lighting luminescent wafer 30,32 simultaneously, luminescent wafer 30,32 excites simultaneously and covers the fluorescent glue 50,51 in the reflector 40,41 on the luminescent wafer 30,32; Luminescent wafer 30,32 excites and covers the light that the fluorescent glues in the reflector on the luminescent wafer 30,32 40,41 were sent at 50,51 o'clock and carry out mixed light, realizes that other a kind of white light color LED is luminous.Therefore, this kind encapsulating structure can be implemented in the LED device package of multiple white light color on single LEDs support carrier.
Embodiment three
As shown in Figure 2, the embodiment three of the LED device that provides for the utility model embodiment, wherein identical parts adopt identical reference numerals to represent with embodiment two, the difference of embodiment three and embodiment two be in:
On package support carrier 100, set up reflector 42, in reflector 42, can fix and the different luminescent wafer 31 of reflector 40,41 wavelength, luminescent wafer 31 can be any wafer in the visible wavelength range.
In use; Control luminescent wafer 30,31,32 corresponding pins 10 respectively; Light luminescent wafer 30,31,32 respectively and excite the fluorescent glue 51,52,50 that covers in the reflector on the luminescent wafer 30,31,32 41,42,40, realize that the LED of multiple color is luminous.
Among the utility model embodiment, when putting the luminescent wafer 31 of non-blue wave band admittedly in the reflector 42, the fluorescent glues 52 that cover in the optics reflector on the luminescent wafer 31 42 will be the transparent colloids that does not mix fluorescent material.
Among the utility model embodiment; When in reflector 42, putting the luminescent wafer 31 of red wave band admittedly; Its luminescent wafer 31 can be distinguished mixed lights with luminescent wafer 30,32; Realize the white light LEDs of high light efficiency, high color rendering index (CRI), solve in the conventional package mode red spectral band wafer and blue wave band wafer are placed on the low problem of light efficiency that is packaged into white-light LED with high color rendering index in the same optical reflection cup admittedly.
Among the utility model embodiment; When the luminescent wafer 31 of in the anti-body cup 42 of optics, putting yellow wave band admittedly; On luminescent wafer 31, cover the transparent colloid that does not mix fluorescent material in the optics reflector 42; Realize the encapsulation of the yellow led of low colour temperature, solve blue wafer excitated fluorescent powder and encapsulate the low problem of light efficiency when hanging down colour temperature.
Embodiment four
As shown in Figure 3, the embodiment four of the LED device that provides for the utility model embodiment, wherein identical parts adopt identical reference numerals to represent with embodiment two, three, the difference of embodiment four and embodiment two, three be in:
Set up a reflector 60 on the package support carrier 100 again, reflector 60 is in the periphery of reflector 40,41,42, and promptly reflector 40,41,42 is arranged on the inside of reflector 60.
Among the utility model embodiment; The reflector 60 inner colloids 20 that have scattering particles that cover; The light that can the luminescent wafers 32,30,31 in the reflector 40,41,42 be sent carry out mixed light, and the light that finally sends in the reflector 60 is more even, soft, simultaneously with the colloid 20 of scattering particles; Can improve the output of light, strengthen the light extraction efficiency of this encapsulating structure.
The described content of this specification embodiment only is enumerating the way of realization of inventive concept; Should not being regarded as of the protection range of the utility model only limits to the concrete form that embodiment states, the protection range of the utility model also reach in those skilled in the art according to the utility model design the equivalent technologies means that can expect.
Claims (7)
1. New LED device; It is characterized in that: comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors; At least be provided with in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.
2. New LED device as claimed in claim 1 is characterized in that: the wavelength of the luminescent wafer in said each reflector can be different.
3. New LED device as claimed in claim 2 is characterized in that: said pad can be gone here and there in said reflector inside and connects according to design demand.
4. New LED device as claimed in claim 3 is characterized in that: low pattern between senior middle school around the final light-emitting window of said reflector can be designed to.
5. New LED device as claimed in claim 4 is characterized in that: be coated with colloid in the low centre between senior middle school around said.
6. New LED device as claimed in claim 5 is characterized in that: the wavelength of the luminescent wafer in said each reflector can be any wavelength in all band scope.
7. New LED device as claimed in claim 6 is characterized in that: the colloid of said luminescent wafer surface coverage coats all plain conductors in LED wafer and the reflector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012201435505U CN202549924U (en) | 2012-04-06 | 2012-04-06 | Novel light-emitting diode (LED) device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012201435505U CN202549924U (en) | 2012-04-06 | 2012-04-06 | Novel light-emitting diode (LED) device |
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CN202549924U true CN202549924U (en) | 2012-11-21 |
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CN2012201435505U Expired - Lifetime CN202549924U (en) | 2012-04-06 | 2012-04-06 | Novel light-emitting diode (LED) device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102623625A (en) * | 2012-04-06 | 2012-08-01 | 浙江中宙光电股份有限公司 | Novel LED (light-emitting diode) device |
CN107479252A (en) * | 2017-08-31 | 2017-12-15 | 深圳市华星光电技术有限公司 | LED lamp bead and back light, backlight module |
-
2012
- 2012-04-06 CN CN2012201435505U patent/CN202549924U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102623625A (en) * | 2012-04-06 | 2012-08-01 | 浙江中宙光电股份有限公司 | Novel LED (light-emitting diode) device |
CN107479252A (en) * | 2017-08-31 | 2017-12-15 | 深圳市华星光电技术有限公司 | LED lamp bead and back light, backlight module |
CN107479252B (en) * | 2017-08-31 | 2020-11-13 | 深圳市华星光电技术有限公司 | LED lamp bead, backlight source and backlight module |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20121121 |