CN203386752U - Integrated block for analog quantity conversion circuit - Google Patents

Integrated block for analog quantity conversion circuit Download PDF

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Publication number
CN203386752U
CN203386752U CN201320498936.2U CN201320498936U CN203386752U CN 203386752 U CN203386752 U CN 203386752U CN 201320498936 U CN201320498936 U CN 201320498936U CN 203386752 U CN203386752 U CN 203386752U
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CN
China
Prior art keywords
analog
upper cover
substrate
analog quantity
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320498936.2U
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Chinese (zh)
Inventor
涂坚
时剑
吴国辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI AEROSPACE HAIHONG TEST & CONTROL Co Ltd
Original Assignee
JIANGXI AEROSPACE HAIHONG TEST & CONTROL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGXI AEROSPACE HAIHONG TEST & CONTROL Co Ltd filed Critical JIANGXI AEROSPACE HAIHONG TEST & CONTROL Co Ltd
Priority to CN201320498936.2U priority Critical patent/CN203386752U/en
Application granted granted Critical
Publication of CN203386752U publication Critical patent/CN203386752U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to an integrated block for an analog quantity conversion circuit, and the integrated block comprises an upper cover and a base which is connected with the upper cover. The periphery of the base is provided with bonding pads. The interior of the upper cover is fixedly equipped with a substrate. One surface of the substrate is equipped with an IC chip and an electronic element, and the other surface of the substrate is equipped with a film formation resistor. The IC chip, the electronic element and the film formation resistor and the bonding pads are connected together through gold wires. The method of thick film integration is used in the utility model, and the analog quantity conversion and an acquisition circuit are integrated in a packaging structure, thereby reducing the occupied area. The conversion circuit carries out electric isolation for an analog voltage signal which is inputted externally, and the analog voltage signal is converted into a normalized voltage signal which is outputted through an internal one way selected from an eight-way analog switch. Therefore, the occupied area of the conversion and collection of multi-way analog signals is reduced.

Description

Analog quantity translation circuit integrated package
Technical field
The utility model relates to a kind of integrated package, is applicable to the Acquisition Circuit of multi-analog signal, particularly analog quantity translation circuit integrated package.
Background technology
When can not analog signals altogether being gathered for input and output signal, after needing to adopt discharge circuit to be isolated and it being transformed to normalized voltage signal, by analog switching circuit, switch and gathered.While can not analog signals altogether being gathered for many roads, will use a lot of discharge circuits and analog switching circuit, be to adopt amplifier IC device, analog switch device and resistance capacitance etc. to make printed board (PCB) is upper to the prior art of multichannel isolated variable signals collecting.Because the discrete component that adopts the outsourcing finished product is made in printed board, the area taken is larger, is unfavorable for, in limited space (particularly at space industry), a large amount of analog signalses is converted to collection.
The utility model content
Technical problem to be solved in the utility model is, reduces the area occupied that the conversion of multi-analog signal gathers, and can be useful in the conversion collection that multichannel analog signals is carried out in limited space.
For achieving the above object, the utility model is taked following technical scheme, analog quantity translation circuit integrated package, comprise upper cover and the base be connected with upper cover, the surrounding of base is provided with pad, in upper cover, substrate fixedly is housed, and the one side of substrate is equipped with IC chip and electronic component, another side is equipped with into film resistance, between IC chip, electronic component, one-tenth film resistance and pad, by spun gold, connects.
The utility model adopts the integrated method of thick film, the analog quantity conversion is integrated in encapsulating structure with Acquisition Circuit, thereby the area that reduces to take, the analog voltage signal of outside input is carried out to electricity through this circuit and isolate and be transformed into normalized voltage signal, reduce the area occupied that the conversion of multi-analog signal gathers.
The accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Fig. 2 is bottom view of the present utility model.
Fig. 3 is the utility model ceramic substrate circuit configuration front view.
Fig. 4 is the utility model ceramic substrate circuit configuration rear view.
Tu5Shi eight tunnel analog quantity conversion and collection signal circuit theory diagrams.
In figure: 1. upper cover, 2. base, 3. pad, 4. substrate, 5. become film resistance, 6.IC chip, 7. electronic component ,8. eight tunnel analog quantity isolated variable circuit ,9. eight road gating analog switches.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail, referring to Fig. 1 to Fig. 4, analog quantity translation circuit integrated package, comprise upper cover 1 and the base 2 be connected with upper cover 1, the surrounding of base 2 is provided with pad 3, the interior substrate 4 that fixedly is equipped with of upper cover 1, and the one side of substrate 4 is equipped with IC chip 6 and electronic component 7, another side is equipped with into film resistance 5, between IC chip 6, electronic component 7, one-tenth film resistance 5 and pad 3, by spun gold, connects.
embodiment:a better embodiment of the present utility model is, analog quantity translation circuit integrated package is made into to castle type simulated quantity set and becomes circuit block, base 2 soldering circuit are drawn pad 3, can be welded on printed circuit board, its structure comprises upper cover 1, and base 2 connects as one with upper cover 1, substrate 4 adopts ceramic substrate, burn altogether formation substrate 4 at the inner low temperature multi-layer ceramics that adopts of LCC encapsulation, the back side silk screen printing of substrate 1 becomes film resistance, the laser cutting moulding.Positive IC chip 6 and the electronic component 7 pasted of substrate 1, realize that with the spun gold welding internal electrical connects, and adopts the soldering becket on substrate 4, and adopt the parallel seam welding technology to complete.
The utility model is applied to eight tunnel analog quantity conversion and collection signal circuit, see Fig. 5, its function is eight road analog voltage signals of outside input to be carried out to electricity through eight tunnel analog quantity isolated variable circuit 8 isolate and be transformed into normalized voltage signal, through eight road gating analog switch 9 gating one tunnels of inside, exports.The required area of former technology is greater than 15cm 2, after adopting thick film integrated, required area is only 4.5 cm 2.

Claims (1)

1. analog quantity translation circuit integrated package, comprise upper cover and the base be connected with upper cover, the surrounding of base is provided with pad, it is characterized in that, substrate fixedly is housed in described upper cover, the one side of substrate is equipped with IC chip and electronic component, and another side is equipped with into film resistance, between IC chip, electronic component, one-tenth film resistance and pad, by spun gold, connects.
CN201320498936.2U 2013-08-16 2013-08-16 Integrated block for analog quantity conversion circuit Expired - Lifetime CN203386752U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320498936.2U CN203386752U (en) 2013-08-16 2013-08-16 Integrated block for analog quantity conversion circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320498936.2U CN203386752U (en) 2013-08-16 2013-08-16 Integrated block for analog quantity conversion circuit

Publications (1)

Publication Number Publication Date
CN203386752U true CN203386752U (en) 2014-01-08

Family

ID=49875207

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320498936.2U Expired - Lifetime CN203386752U (en) 2013-08-16 2013-08-16 Integrated block for analog quantity conversion circuit

Country Status (1)

Country Link
CN (1) CN203386752U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110060985A (en) * 2019-04-26 2019-07-26 西安微电子技术研究所 A kind of small-sized integrated multipath analog switch

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110060985A (en) * 2019-04-26 2019-07-26 西安微电子技术研究所 A kind of small-sized integrated multipath analog switch
CN110060985B (en) * 2019-04-26 2021-07-23 西安微电子技术研究所 Small-sized integrated multi-channel analog switch

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20140108

CX01 Expiry of patent term