CN204516741U - A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits - Google Patents
A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits Download PDFInfo
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- CN204516741U CN204516741U CN201520212809.0U CN201520212809U CN204516741U CN 204516741 U CN204516741 U CN 204516741U CN 201520212809 U CN201520212809 U CN 201520212809U CN 204516741 U CN204516741 U CN 204516741U
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Abstract
The utility model discloses a kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits, bag ltcc substrate, support aluminium sheet and aluminium cavity, supporting aluminium sheet upper surface is bonded on ltcc substrate lower surface, support aluminium sheet lower surface bonds in the cavity of aluminium cavity, described support aluminium sheet is the aluminium frame of middle hollow out.The utility model is simple for assembly process, and aligning accuracy requires low, and mechanical strength is high, and encapsulation volume is little.
Description
Technical field
The utility model belongs to the small-sized encapsulated technical field of microwave or millimetre-wave circuit and system, particularly relates to a kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits.
Background technology
Microwave Micro-package technique (MMCM) realizes complete electronic set miniaturization, lightweight, high-performance and highly reliable key technology, LTCC(LTCC) substrate is because microwave signal transmission performance is good, can realize the substrate embedded set of passive device, and the technology therefore based on ltcc substrate and micro-assembling is the important channel realizing microwave module and system compact.In order to reduce volume further, improve packaging density, the Micro-package technique (3D-MMCM) of three-dimension packaging becomes the focus of domestic and international investigation and application.
At present, the main implementation of 3D-MMCM has two classes: cartridge-type and substrate joining type.
Cartridge-type 3D-MMCM first forms 2D-MMCM module in chips welding to substrate, more multiple 2D-MMCM module is vertically inserted on one piece of public substrate, forms a subsystem or system.But cartridge-type has high, the vertical microstrip line of packaging technology requirement and the shortcoming such as horizontal microstrip line not easily welds, encapsulation volume is larger.
Namely substrate joining formula 3D-MMCM is first welded to various chips on substrate and forms 2D-MMCM module, more multiple 2D-MMCM module is overlapped together, and forms a subsystem or system.The mode of soldered ball is adopted to realize machinery and electrical connection between common levels substrate, but the shortcoming such as this kind of mode has complex process, soldered ball aligning accuracy requires mechanical strength that high and soldered ball connects low.
Utility model content
In order to overcome the defect that packaging technology is complicated and encapsulation volume is larger of above-mentioned existing cartridge-type and the existence of substrate joining type, the microwave circuit three-dimension packaging structure that the utility model provides a kind of ltcc substrate stacking, this encapsulating structure is simple for assembly process, and aligning accuracy requires low, mechanical strength is high.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits, it is characterized in that: comprise ltcc substrate, support aluminium sheet and aluminium cavity, supporting aluminium sheet upper surface is bonded on ltcc substrate lower surface, support aluminium sheet lower surface bonds in the cavity of aluminium cavity, described support aluminium sheet is the aluminium frame of middle hollow out.
Described ltcc substrate upper surface and lower surface are provided with microwave circuit, substrate are provided with the through hole running through substrate, are filled with metal in through hole, and ltcc substrate lower surface is silver-colored in form circuit stratum apart from platinum plating within the scope of edge 2mm.
Described ltcc substrate upper surface has bare chip and attached device to realize the circuit function of microwave circuit by conductive adhesive, and bare chip and attached device realize the connection between bare chip and microstrip line and bare chip by gold wire bonding; Described substrate is embedded with electronic component, and electronic component adopts type metal in substrate to burn formation altogether, and electronic component is connected with the microwave circuit of substrate upper and lower surface by the filling metal in the through hole that arranges in substrate.
Described ltcc substrate is by 5-30 layer, and every layer thickness is low temperature co-firedly to form at 850 DEG C-900 DEG C after the ferro A6s material layer consolidation of 0.094mm.
Described support aluminium sheet upper surface on ltcc substrate lower surface, supports aluminium sheet lower surface by conductive adhesive by conductive adhesive in the cavity of aluminium cavity.
The peripheral lengths of described support aluminium sheet is consistent with ltcc substrate with width, supports the thick 0.5mm in position of aluminium sheet corresponding ltcc substrate lower surface microwave circuit cabling.
Described aluminium cavity is had multiple for electric(al) insulator and multiple isolator by conductive adhesive.
The utility model has following beneficial effect:
The utility model, owing to supporting the setting of aluminium sheet, at ltcc substrate upper and lower surface cloth circuits, can effectively can improve microwave circuit packaging density, have the less advantage of volume relative to the circuit layout of single side.This structure adopts common ltcc substrate process technology, common aluminium sheet machining technique and common conductive adhesive technology to realize, and therefore has the simple advantage of technique.Adopt the through hole running through substrate, fill the connection that metal is used for signal between positive and negative circuit in through hole, so no longer need extra microwave assembly technology for the connection of positive and negative circuit in follow-up assembling, simplify packaging technology.The support aluminium sheet adopted and substrate bonding realize seamless mechanical connection, and contact area rate soldered ball connected mode is larger, have mechanical strength height and the better advantage of ground connection.
Accompanying drawing explanation
Fig. 1 is the utility model overall structure schematic diagram.
Mark 1 in figure, ltcc substrate, 2, support aluminium sheet, 3, aluminium cavity, 4, through hole (with through hole just because I describes in through hole the technical characteristic being filled with metal), 5, bare chip.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with accompanying drawing, the utility model is further described.
The utility model comprises:
The LTCC(LTCC of one piece of thickness about 2mm) substrate 1, low temperature co-firedly to form at 850 DEG C-900 DEG C after this ltcc substrate 1 adopts the ferro A6s material layer consolidation of some layers (5-30 layer) 0.094mm thick (thickness in monolayer), ltcc substrate 1 upper and lower surface forms the microwave circuit with certain function by microwave assembly technology, be filled with metal in the through hole 4 running through ltcc substrate 1, the effect being filled with the through hole 4 of metal connects for the circuit of ltcc substrate upper and lower surface (positive and negative) microwave board.Ltcc substrate lower surface is silver-colored in form circuit stratum apart from platinum plating within the scope of edge 2mm;
One piece supports aluminium sheet 2, and this support aluminium sheet 2 is the rectangular aluminum frame of hollow out in the middle of, thick 3mm, wide 2mm, outer frame length and width and LTCC(LTCC) substrate 1 is consistent.The thick 0.5mm in position of the surperficial corresponding ltcc substrate 1 lower surface circuit trace of this support aluminium sheet 2.This support aluminium sheet 2 upper surface is bonding with ltcc substrate 1 by conducting resinl, support aluminium sheet 2 lower surface bonding with the aluminium cavity 3 of encapsulation by conducting resinl, make ltcc substrate 1 upper and lower surface have sufficient space for the circuit arrangement of microwave circuit, make that LTCC circuit ground is functional, three-dimension packaging construction machine intensity is high simultaneously;
Multiple bare chip 5 for realizing microwave circuit and attached device, bare chip 5 and attached device are used for realizing circuit function, adopt conductive adhesive on ltcc substrate 1, realize the connection between bare chip and microstrip line and bare chip by spun gold or gold ribbon bonding.Ltcc substrate 1 upper and lower surface has corresponding microwave function circuit;
Multiple ltcc substrate 1 embedded set electronic component for realizing microwave circuit, as filter, resistance, electric capacity, inductance etc., this electronic component adopts type metal in ltcc substrate to burn formation altogether, fills metal be connected with the circuit of the microwave circuit of upper and lower surface by ltcc substrate inner via hole;
An aluminium cavity for circuit package and cover plate, this aluminium cavity 3 provides encapsulation and grounding function for ltcc substrate 1, is provide support for electric(al) insulator and isolator simultaneously.Support aluminium sheet 2 lower surface by conductive adhesive in aluminium cavity 3;
Multiple for electric(al) insulator, external circuit or tester by this confession electric(al) insulator for encapsulating structure internal circuit provides direct current supply signal and modulation signal.Insulator is fixed on aluminium cavity 3 by conductive adhesive, and insulator pin is connected with internal circuit by wrapping up in gold ribbon crimping;
Multiple isolator, external circuit or tester by this isolator for encapsulating structure internal circuit provides microwave signal to input or output.Insulator is fixed on aluminium cavity 3 by conductive adhesive, and insulator pin is connected with internal circuit by wrapping up in gold ribbon crimping.
Wherein, LTCC(LTCC for positive and negative cloth circuits) substrate, adopt some layers of ferro A6s green bed of material consolidation, low temperature co-firedly to form at 850 DEG C-900 DEG C again, every layer thickness is about 0.094mm, and usual manufacturer can provide the lamination sintering process of 5 to 30 layer materials, needs and determine according to design, be generally and ensure substrate mechanical strength, substrate thickness is chosen for about 2mm.Substrate intermediate layer and upper and lower surface can printed metal layer thus form circuitous pattern structure.After LTCC (LTCC) substrate production is good, bare chip and other devices are fixed on substrate relevant position by conductive adhesive, connected by technique realizing circuit such as gold wire bondings again, thus form the circuit with certain circuit function, related circuit can be distributed according to integrated circuit function at substrate positive and negative.Base lower surface requires that within the scope of edge 2mm platinum plating silver is to form circuit stratum.Lower surface edge requires that platinum plating silver is to form electrical connection with support aluminium sheet thus forming good earth, because stratum is very important for microwave circuit.
Support aluminium sheet 2 and add by machine the rectangular aluminum frame that technology forms a middle hollow out, its size is mainly considered with the contact area of substrate moderate, and thickness will ensure that substrate back circuit has sufficient space simultaneously.The status requirement hollow out of this surface of aluminum plate corresponding ltcc substrate lower surface circuit trace thus do not affect the circuit trace of base lower surface.This aluminium sheet is bonding with substrate and cavity by conducting resinl, thus ensures combining closely of structure, and mechanical strength is high.
Run through the connection of through hole (being filled with metal) for the microwave signal between positive and negative circuit, direct current supply signal, modulation signal etc. of substrate.Through hole and the collaborative design of ltcc substrate circuit, formed when ltcc substrate burns altogether.Because this through hole and ltcc substrate are formed jointly, ensure that the connection of ltcc substrate positive and negative circuit, so no longer need extra microwave assembly technology for the connection of positive and negative circuit in follow-up assembling, there is the simple advantage of technique.
Aluminium cavity 3 for circuit package adds technology by machine and is formed, and this aluminium cavity size is determined according to the size of three-dimensional circuit encapsulating structure, and Main Function is for the circuit of three-dimensional structure provides support and protects.Realize the connection of internal circuit and external circuit or tester, this function is by being fixed to realizing for electric(al) insulator and isolator on aluminium cavity simultaneously.Support metal aluminium sheet lower surface by conductive adhesive on encapsulation aluminium cavity.
As an example, utilize this structural design microwave amplification filtering mixting circuit three-dimension packaging module.Ltcc substrate upper surface comprises an amplifier and a filter, and ltcc substrate lower surface comprises an amplifier and a frequency mixer, and the signal between substrate upper and lower surface circuit is connected by the golden through hole running through substrate, is filled with metal in through hole.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Ferro A6s material is a kind of conventional LTCC (LTCC) material, and its dielectric constant is about 5.9, is a kind of good microwave circuit plate material.
Claims (7)
1. the microwave circuit three-dimension packaging structure of a ltcc substrate positive and negative cloth circuits, it is characterized in that: comprise ltcc substrate, support aluminium sheet and aluminium cavity, supporting aluminium sheet upper surface is bonded on ltcc substrate lower surface, support aluminium sheet lower surface bonds in the cavity of aluminium cavity, described support aluminium sheet is the aluminium frame of middle hollow out.
2. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 1, it is characterized in that: described ltcc substrate upper surface and lower surface are provided with microwave circuit, substrate is provided with the through hole running through substrate, be filled with metal in through hole, ltcc substrate lower surface is silver-colored in form circuit stratum apart from platinum plating within the scope of edge 2mm.
3. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 2, it is characterized in that: described ltcc substrate upper and lower surface all has bare chip and attached device to realize the circuit function of microwave circuit by conductive adhesive, bare chip and attached device realize the connection between bare chip and microstrip line and bare chip by gold wire bonding; Described substrate is embedded with electronic component, and electronic component adopts type metal in substrate to burn formation altogether, and electronic component is connected with the microwave circuit of substrate upper and lower surface by the filling metal in the through hole that arranges in substrate.
4. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 1,2 or 3, it is characterized in that: described ltcc substrate is by 5-30 layer, every layer thickness is low temperature co-firedly to form at 850 DEG C-900 DEG C after the ferro A6s material layer consolidation of 0.094mm.
5. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 1,2 or 3, it is characterized in that: described support aluminium sheet upper surface on ltcc substrate lower surface, supports aluminium sheet lower surface by conductive adhesive by conductive adhesive in the cavity of aluminium cavity.
6. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 1, it is characterized in that: the peripheral lengths of described support aluminium sheet is consistent with ltcc substrate with width, support the thick 0.5mm in position of aluminium sheet corresponding ltcc substrate lower surface microwave circuit cabling.
7. the microwave circuit three-dimension packaging structure of a kind of ltcc substrate positive and negative cloth circuits according to claim 1, is characterized in that: described aluminium cavity is had multiple for electric(al) insulator and multiple isolator by conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520212809.0U CN204516741U (en) | 2015-04-10 | 2015-04-10 | A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520212809.0U CN204516741U (en) | 2015-04-10 | 2015-04-10 | A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits |
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| CN204516741U true CN204516741U (en) | 2015-07-29 |
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| CN201520212809.0U Expired - Fee Related CN204516741U (en) | 2015-04-10 | 2015-04-10 | A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766833A (en) * | 2015-04-10 | 2015-07-08 | 中国工程物理研究院电子工程研究所 | Microwave circuit three-dimensional encapsulation structure with circuits arranged on front-back surface of LTCC base plate |
-
2015
- 2015-04-10 CN CN201520212809.0U patent/CN204516741U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766833A (en) * | 2015-04-10 | 2015-07-08 | 中国工程物理研究院电子工程研究所 | Microwave circuit three-dimensional encapsulation structure with circuits arranged on front-back surface of LTCC base plate |
| CN104766833B (en) * | 2015-04-10 | 2017-11-14 | 中国工程物理研究院电子工程研究所 | A kind of microwave circuit three-dimension packaging structure of ltcc substrate positive and negative cloth circuits |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20160410 |