CN203707177U - LED ceramic packaging substrate capable of sensing temperature - Google Patents
LED ceramic packaging substrate capable of sensing temperature Download PDFInfo
- Publication number
- CN203707177U CN203707177U CN201420039506.9U CN201420039506U CN203707177U CN 203707177 U CN203707177 U CN 203707177U CN 201420039506 U CN201420039506 U CN 201420039506U CN 203707177 U CN203707177 U CN 203707177U
- Authority
- CN
- China
- Prior art keywords
- led
- chip
- power supply
- ceramic
- ntc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 abstract description 3
- 238000004020 luminiscence type Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an LED ceramic packaging substrate capable of sensing the temperature. The ceramic packaging substrate comprises a ceramic substrate, an LED power supply positive electrode and an LED power supply negative electrode, wherein the LED power supply positive electrode and the LED power supply negative electrode are printed on the ceramic substrate. The LED ceramic packaging substrate is characterized in that a chip bonding pad used for mounting an NTC chip is printed between the LED power supply positive electrode and the LED power supply negative electrode, the NTC chip is mounted on the chip bonding pad and close to a position which is reserved for mounting an LED bare chip, and a positive electrode outgoing line and a negative electrode outgoing line, which are electrically connected with the NTC chip, are further printed on the ceramic substrate. According to the utility model, the chip bonding pad used for mounting the NTC chip is printed between the LED power supply positive electrode and the LED power supply negative electrode, and the NTC chip is arranged close to the position which is reserved for mounting the LED bare chip, thereby not only enabling the LED ceramic packaging substrate to have a temperature sensing function and be capable of outputting temperature signals of the LED bare chip, but also ensuring the reliability of temperature sensing. Furthermore, the positive electrode outgoing line and the negative electrode outgoing line are additionally arranged, the outgoing lines can be finished directly together with other circuits without additional procedures.
Description
Technical field
The utility model relates to COB encapsulation field, relates in particular to a kind of LED ceramic packaging substrate that can sensing temperature.
Background technology
COB encapsulates (chip On board), exactly bare chip is sticked on interconnect substrates by conduction or non-conductive adhesive, then carries out Bonding and realizes its electrical connection, then chip and bonding wire are encapsulated with glue.
Pottery COB encapsulates because of its high density, high-power, advantage has become the important model of LED encapsulation cheaply.At present, on the market conventional ceramic COB base plate for packaging as shown in Figure 3, be directly on ceramic substrate 20 silk-screen have the ag paste electrode of two arcs, i.e. LED positive source 21 and LED power cathode 22.Because LED device has negative temperature coefficient, need to adopt the driving power of constant current output, or adopt positive temperature coefficient compensation scheme, preventing that LED chip is overheated burns or reduces the life-span because of overheated.Adopt above-mentioned type of drive not as adopting voltage source to drive that cost is low, efficiency is high, but voltage source need to suitably be adjusted voltage according to the temperature of LED chip and always works in below safe temperature to ensure LED light source.
Summary of the invention
For the weak point existing in above-mentioned technology, the LED ceramic packaging substrate that the utility model provides that a kind of cost is low, work safety, operation simply can sensing temperatures, has ensured the reliability of thermometric.
For achieving the above object, the utility model provides a kind of LED ceramic packaging substrate that can sensing temperature,
Comprise ceramic substrate and LED positive source and the LED power cathode of difference silk-screen on ceramic substrate; Between described LED positive source and LED power cathode, silk-screen is useful on the chip bonding pad that mounts NTC chip, described NTC chip attachment mounts on the position of LED nude film on chip bonding pad and near predetermined, and on described ceramic substrate, going back silk-screen has the positive outside wire and the negative outside wire that are electrically connected with NTC chip.
Wherein, one end of described positive outside wire is welded on chip bonding pad; Described NTC chip is electrically connected with negative outside wire by bonding wire.
Wherein, described NTC chip is mounted on chip bonding pad by conducting resinl.
Compared with prior art, what the utility model provided can sensing temperature LED ceramic packaging substrate, there is following beneficial effect: silk-screen is useful on the chip bonding pad that mounts NTC chip between LED positive source and LED power cathode, and NTC chip arranges near the predetermined position that mounts LED nude film, not only make this LED ceramic packaging substrate there is temperature sensing function, can export the temperature signal of LED nude film, and ensure the reliability of thermometric, simplify the assembling of LED luminescence component, the induced signal of LED working temperature is provided with cheap cost; Further, set up positive outside wire and negative outside wire, this lead-out wire can directly complete together with All other routes, without separately adding operation.The utlity model has that cost is low, work safety, assembling is convenient, operation is simple, sensing temperature is accurate, practical, applied widely and extended the features such as the useful life of LED nude film.
Brief description of the drawings
Fig. 1 is the structure chart of the LED ceramic packaging substrate that the utility model can sensing temperature;
Fig. 2 has mounted LED nude film and has completed the structure chart after Bonding in Fig. 1.
Main element symbol description is as follows:
10, ceramic substrate 11, LED positive source
12, LED power cathode 13, NTC chip
14, chip bonding pad 15, LED nude film
16, positive outside wire 17, negative outside wire
18, bonding wire
Fig. 3 is the structure chart of existing LED ceramic packaging substrate.
Main element symbol description is as follows:
20, ceramic substrate 21, LED positive source
22, LED power cathode
Embodiment
In order more clearly to explain the utility model, below in conjunction with accompanying drawing, the utility model is further described.
Refer to Fig. 1, what the utility model provided can sensing temperature LED ceramic packaging substrate, comprise ceramic substrate 10 and LED positive source 11 and the LED power cathode 12 of silk-screen on ceramic substrate 10 respectively; Between LED positive source 11 and LED power cathode 12, silk-screen is useful on the chip bonding pad 14 that mounts NTC chip 13, NTC chip 13 is mounted on chip bonding pad 14 and near predetermined and mounts on the position of LED nude film 15, and on ceramic substrate 10, going back silk-screen has the positive outside wire 16 and the negative outside wire 17 that are electrically connected with NTC chip 13.
In the present embodiment, one end of positive outside wire 16 is welded on chip bonding pad 14; NTC chip 13 is electrically connected with negative outside wire 17 by bonding wire 18.
In the present embodiment, NTC chip 13 is mounted on chip bonding pad 14 by conducting resinl (not shown).Certainly, the utility model is not limited to that to realize the two by conducting resinl bonding, can also be by other modes such as conduction seccotines, if the change to bonding way all falls in protection range of the present utility model.
Please further consult Fig. 2, what the utility model provided can sensing temperature LED ceramic packaging substrate, its LED nude film 15 its manufacture methods are as follows: LED nude film 15 is mounted on ceramic substrate 10, be that multiple LED nude films 15 are arranged in to matrix, be mounted between the LED positive source 11 of arc and the LED power cathode 12 of arc; After solidifying, adopt bonding wire 18 by between electrode and LED nude film 15, between LED nude film 15 and LED nude film 15, and the positive outside wire 16 of NTC chip 13 and negative outside wire 17 couple together.Complete Bonding operation, and detect qualified after, adopt the translucent COB packaging plastic LED nude film 15, NTC chip 13 and bonding wire 18 are sealed on ceramic substrate 10 together, so far completed can temperature-sensitive the installation of LED luminescence component on ceramic COB base plate for packaging.
What the utility model provided can sensing temperature LED ceramic packaging substrate, there is following advantage:
1) between LED positive source 11 and LED power cathode 12, silk-screen is useful on the chip bonding pad 14 that mounts NTC chip 13, and NTC chip 13 is set, not only make this LED ceramic packaging substrate there is temperature sensing function, can export the temperature signal of LED nude film 15, the working temperature of LED nude film 15 is converted to the signal of telecommunication and export to driving power, make it according to the temperature regulation output voltage of LED nude film 15, ensure that LED light source always works in below safe temperature, also can compensate the impact of line voltage variation and variation of ambient temperature, guarantee the reliability of LED light source work.
2) NTC chip 13 arranges near the predetermined position that mounts LED nude film 15, has ensured the reliability of thermometric, has simplified the assembling of LED luminescence component, and the induced signal of LED working temperature is provided with cheap cost.
3) further, set up positive outside wire 16 and negative outside wire 17, this lead-out wire can directly complete together with All other routes, without separately adding operation, NTC chip 13 completes together with LED nude film 15 pastes die bond and Bonding operation, do not increasing on the basis of process costs, making LED assembly possess temperature sensing function.
4) the utility model not only can be used for the COB encapsulation of LED luminescence component, and can be used for the ceramic printed circuit board that other need temperature detection, to meet the needs of high power density electronic building brick.
5) the utlity model has that cost is low, work safety, assembling is convenient, operation is simple, sensing temperature is accurate, practical, applied widely and extended the features such as the useful life of LED nude film 15.
Disclosed is above only several specific embodiment of the present utility model, but the utility model is not limited thereto, and the changes that any person skilled in the art can think of all should fall into protection range of the present utility model.
Claims (3)
1. a LED ceramic packaging substrate that can sensing temperature, comprises ceramic substrate and LED positive source and the LED power cathode of silk-screen on ceramic substrate respectively; It is characterized in that, between described LED positive source and LED power cathode, silk-screen is useful on the chip bonding pad that mounts NTC chip, described NTC chip attachment mounts on the position of LED nude film on chip bonding pad and near predetermined, and on described ceramic substrate, going back silk-screen has the positive outside wire and the negative outside wire that are electrically connected with NTC chip.
2. LED ceramic packaging substrate that can sensing temperature according to claim 1, is characterized in that, one end of described positive outside wire is welded on chip bonding pad; Described NTC chip is electrically connected with negative outside wire by bonding wire.
3. LED ceramic packaging substrate that can sensing temperature according to claim 1, is characterized in that, described NTC chip is mounted on chip bonding pad by conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039506.9U CN203707177U (en) | 2014-01-22 | 2014-01-22 | LED ceramic packaging substrate capable of sensing temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420039506.9U CN203707177U (en) | 2014-01-22 | 2014-01-22 | LED ceramic packaging substrate capable of sensing temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203707177U true CN203707177U (en) | 2014-07-09 |
Family
ID=51057575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420039506.9U Expired - Lifetime CN203707177U (en) | 2014-01-22 | 2014-01-22 | LED ceramic packaging substrate capable of sensing temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203707177U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105258058A (en) * | 2015-11-04 | 2016-01-20 | 安徽湛蓝光电科技有限公司 | LED (Light-Emitting Diode) light source for vehicles |
| CN110797268A (en) * | 2019-11-05 | 2020-02-14 | 启明星半导体技术(西安)有限公司 | Diode with NTC temperature detection and preparation method thereof |
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
| CN112798928A (en) * | 2020-12-29 | 2021-05-14 | 中国电子科技集团公司第十四研究所 | Chip testing method based on ceramic slide |
-
2014
- 2014-01-22 CN CN201420039506.9U patent/CN203707177U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105258058A (en) * | 2015-11-04 | 2016-01-20 | 安徽湛蓝光电科技有限公司 | LED (Light-Emitting Diode) light source for vehicles |
| CN110797268A (en) * | 2019-11-05 | 2020-02-14 | 启明星半导体技术(西安)有限公司 | Diode with NTC temperature detection and preparation method thereof |
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
| CN112798928A (en) * | 2020-12-29 | 2021-05-14 | 中国电子科技集团公司第十四研究所 | Chip testing method based on ceramic slide |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518111 Guangdong City, Longgang District, Pinghu street Pinghu community Fumin Industrial Zone, Beverly Road, No. 65, building two, No. 43 to the four floor Patentee after: SHENZHEN AMPRON TECHNOLOGY Corp. Address before: 518111 building 2-4, west block, Fukang Road, Fumin Industrial Zone, Longgang District, Shenzhen, Guangdong, Pinghu, China Patentee before: SHENZHEN AMPRON SENSTIVE COMPONENTS CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140709 |
|
| CX01 | Expiry of patent term |