CN203261617U - Metal wire heat-conducting gasket - Google Patents
Metal wire heat-conducting gasket Download PDFInfo
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- CN203261617U CN203261617U CN 201320164248 CN201320164248U CN203261617U CN 203261617 U CN203261617 U CN 203261617U CN 201320164248 CN201320164248 CN 201320164248 CN 201320164248 U CN201320164248 U CN 201320164248U CN 203261617 U CN203261617 U CN 203261617U
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- heat
- wire
- silica gel
- conducting pad
- pad
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Abstract
The utility model relates to a metal wire heat-conducting gasket. The metal wire heat-conducting gasket is characterized in that the metal wire heat-conducting gasket is composed of silica gel, solid high-heat-conductivity particles and metal wires, wherein the silica gel is the base material, both the solid high-heat-conductivity particles and the metal wires are fillers, the solid high-heat-conductivity particles are discretely filled in the silica gel, and the metal wires are distributed in a linear array shape or in a mesh shape. The metal wires adopted by metal wire heat-conducting gasket are high in heat conductivity, so that the problem that the heat conductivity of the solid discrete particles is difficult to increase is effectively solved. In addition, the metal wires are good in flexibility, are discretely distributed, and have no influence on the elasticity of the heat-conducting gasket. The metal wire heat-conducting gasket provided by the utility model is high in heat conductivity and elasticity, low in contacting thermal resistance, high in heat transferring performance and wide in application such as the fields of LEDs, power electronics, aerospace and the like.
Description
Technical field
The present invention relates to a kind of heat-conducting pad, particularly a kind of heat-conducting pad that utilizes flexible fine wire to promote thermal conductivity can be widely used in field of radiating.
Background technology
Heat-conducting pad is the key component of cooling electronic component.Have imperceptible rough space between electronic device surface and radiator, if they are directly installed on together, the real contact area between them approximately only has 10% of foot of radiator area, and all the other are the air gap.Because air is the non-conductor of heat, will form contact heat resistance between electronic component and radiator, reduce the usefulness of radiator.Heat-conducting pad is by being filled between electronic heater members and the radiator to get rid of air wherein, and sets up betwixt effective thermal conduction path, reduces contact heat resistance, promotes heat transfer property.
Contact effect and thermal conductivity are two principal elements that affect the heat-conducting pad heat transfer property, so heat-conducting pad need possess high resiliency and high heat conductance simultaneously.Existing heat-conducting pad is mostly take silica gel as basis material, to wherein blending high heat conductance solid particle.Yet the high heat conductance solid particle is discrete phase and distributes (Fig. 1) in silica gel, still have the bad silica gel of a large amount of heat conductivilitys between particle and the particle, and the lifting of thermal conductivity is not remarkable.In order further to promote thermal conductivity, the filling rate of solid particle has had a strong impact on the elasticity of pad up to more than 70% in the present heat-conducting pad, and high filling rate like this, also is difficult to make the thermal conductivity of pad to surpass 7 W/ (m*K).
For a difficult problem that is solid particle that discrete phase distributes and is difficult to promote the pad thermal conductivity, the present invention proposes a kind of wire heat-conducting pad, continuous fine wire is filled in the silica gel, to promote thermal conductivity and the elasticity of pad.Its typical advantages is as follows: (1) thermal conductivity is high.Compare the discrete solid particle that distributes in the silica gel matrix, fine wire is continuous distribution in the silica gel matrix, has formed the heat transfer path that connects, so the comprehensive heat conductivility of pad is excellent.(2) flexible high.The fine wire diameter is little, preferably flexibility is arranged, thereby the filling of fine wire can not affect the elasticity of pad.(3) with low cost.A lot of high heat conductance solid particles are expensive, and such as graphite, nano particle, diamond, and fine wire obtains easily and be cheap, is conducive to large-scale commercial Application.
Summary of the invention
The object of the present invention is to provide a kind of wire heat-conducting pad, thin diameter metal silk is filled in the silica gel matrix, to promote thermal conductivity and the elasticity of heat-conducting pad.
Technical scheme of the present invention is as follows:
A kind of wire heat-conducting pad provided by the invention, as shown in Figure 2, it is composed as follows:
Silica gel 1; Described silica gel 1 is the basis material of heat-conducting pad;
Solid high heat conductance particle 2; Described solid high heat conductance particle 2 is filled in the described silica gel 1;
Described solid high heat conductance particle 2 is silver powder, copper powder, carborundum powder, carbon nano-particle or diamond dust.
Described solid high heat conductance particle 2 is discrete the distribution in described silica gel 1, and the volume filling rate of described solid high heat conductance particle 2 is 1% ~ 90%.
Described wire 3 is filamentary silver, copper wire, aluminium wire or stainless steel wire.
The diameter of described wire 3 is 0.001 ~ 2mm, and the volume filling rate is 1% ~ 90%.
Described wire 3 is the linear array shape in described silica gel 1, mesh-like distributes.
In actual use, wire heat-conducting pad provided by the invention is filled between electronic device heating face and the radiator, make both that good contact effect be arranged, and the heat of the face that will generate heat is passed to radiator efficiently.
Wire heat-conducting pad provided by the invention, its advantage is:
(1) thermal conductivity is high.Compare the discrete solid particle that distributes in the silica gel matrix, fine wire is continuous distribution in the silica gel matrix, forms the heat conduction approach that connects, so the comprehensive heat conductivility of pad is excellent.
(2) flexible high.The fine wire diameter is little, preferably flexibility is arranged, thereby a large amount of fillings of fine wire can not affect the elasticity of pad.
(3) with low cost.A lot of high heat conductance solid particles are expensive, and such as graphite, nano particle, diamond, and fine wire obtains easily and be cheap, is conducive to large-scale commercial Application.
The present invention can be widely used in needing to reduce the occasion of contact heat resistance, is particularly useful for the heat radiation of the high performance components such as laser, LED, computer, high-low pressure frequency converter, satellite.
Description of drawings
Fig. 1 is traditional heat-conducting pad end view;
Fig. 2 is wire heat-conducting pad end view among the embodiment 1;
Fig. 3 is wire heat-conducting pad vertical view among the embodiment 1;
Fig. 4 is wire heat-conducting pad end view among the embodiment 2.
Embodiment
Further describe the present invention below in conjunction with drawings and the specific embodiments.
As shown in Figure 2, the wire heat-conducting pad of present embodiment is comprised of silica gel 1, solid high heat conductance particle 2 and wire 3.
The silica gel 1 of present embodiment is the basis material of heat-conducting pad, and solid high heat conductance particle 2 and wire 3 are filler.
Solid high heat conductance particle 2 is carborundum powder, is scattered in the silica gel 1.
Wire 3 is copper wire, and diameter 0.4mm is linear array and distributes in silica gel 1.
Whole heat-conducting pad is of a size of 40*40*4mm,, the volume filling rate of solid high heat conductance particle 2 in silica gel 1 is 12%, the volume filling rate of wire 3 in silica gel 1 is 10%.
The below adopts the thermal resistance series and parallel connection method specifically to calculate the equivalent thermal conductivity of wire heat-conducting pad:
An existing traditional heat-conducting pad, size is identical with above-mentioned pad, is 40*40*4mm, only fills alumina powder in this pad, and the volume filling rate is 15%, and the pad thermal conductivity is 1W/ (m*K), and its thermal resistance can be calculated with following formula:
Wherein
K 1Be the thermal conductivity of this tradition heat-conducting pad, L is the pad height, and S is the pad cross-sectional area.
Wire heat-conducting pad in the present embodiment, overall size is 40*40*4mm, fill 15% alumina powder and 10% copper wire in its basis material silica gel 1, the copper wire thermal conductivity is 397 W/ (m*K), and its thermal resistance is the result that silicon gel part and copper wire partly are in parallel:
Wherein,
K 1Be the thermal conductivity of pad silicon gel part, identical with above-mentioned conventional spacers, be 1 W/ (m*K),
K 2Be the copper wire thermal conductivity, L is the pad height, and S is the pad cross-sectional area.
Because thermal conductivity and thermal resistance are reciprocal relation, the equivalent thermal conductivity of wire heat-conducting pad is in the present embodiment as can be known:
As seen, the filling of copper wire is so that the pad thermal conductivity has had larger lifting, solid particle is the discrete phase distribution in the conventional spacers in silica gel, even filling rate reaches 70% when above, thermal conductivity still is difficult to break through 7W/ (m*K), and the higher pad elasticity of filling rate is poorer, can make thermal conductivity be promoted to 41.6 W/ (m*K) and fill copper wire 10% in the present embodiment, and the thin copper wire diameter is little, and filling rate is low, thereby can too much not affect the elasticity of pad.
As shown in the figure, the wire heat-conducting pad of present embodiment is comprised of silica gel 1, solid high heat conductance particle 2 and wire 3.
The silica gel 1 of present embodiment is the basis material of heat-conducting pad, and solid high heat conductance particle 2 and wire 3 are filler.
Solid high heat conductance particle 2 is silver powder, is scattered in the silica gel 1.
Wire 3 is aluminium wire, and diameter 0.2mm is mesh-like and distributes in silica gel 1.
Whole heat-conducting pad is of a size of 70*70*5mm,, the volume filling rate of solid high heat conductance particle 2 in silica gel 1 is 10%, the volume filling rate of wire 3 in silica gel 1 is 12%.
In actual use, the wire heat-conducting pad that present embodiment provides is filled between electronic device heating face and the radiator, make both that good contact effect be arranged, and the heat of the face that will generate heat is passed to radiator efficiently.
It should be noted that at last above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although with reference to embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that, technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (2)
1. wire heat-conducting pad is characterized in that it is composed as follows:
Silica gel; Described silica gel is the basis material of heat-conducting pad;
Solid high heat conductance particle; Described solid high heat conductance is particles filled in described silica gel;
Wire; Described wire is the filler of heat-conducting pad.
2. by wire heat-conducting pad claimed in claim 1, it is characterized in that described solid high heat conductance particle is silver powder, copper powder, carborundum powder, carbon nano-particle or diamond dust.
By wire heat-conducting pad claimed in claim 1, it is characterized in that 3, described solid high heat conductance particle is discrete the distribution in described silica gel, the volume filling rate of described solid high heat conductance particle is 1% ~ 90%.
4, by wire heat-conducting pad claimed in claim 1, it is characterized in that described wire 3 is filamentary silver, copper wire, aluminium wire or stainless steel wire.
5, by wire heat-conducting pad claimed in claim 1, it is characterized in that described diameter wiry is 0.001 ~ 2mm, the volume filling rate is 1% ~ 90%.
By wire heat-conducting pad claimed in claim 1, it is characterized in that 6, described wire is the linear array shape in described silica gel, mesh-like distributes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320164248 CN203261617U (en) | 2013-04-04 | 2013-04-04 | Metal wire heat-conducting gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320164248 CN203261617U (en) | 2013-04-04 | 2013-04-04 | Metal wire heat-conducting gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203261617U true CN203261617U (en) | 2013-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320164248 Expired - Fee Related CN203261617U (en) | 2013-04-04 | 2013-04-04 | Metal wire heat-conducting gasket |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105577033A (en) * | 2016-01-07 | 2016-05-11 | 李文华 | Wireless charging smart watch capable of being charged by body temperature |
| CN107163918A (en) * | 2017-06-01 | 2017-09-15 | 惠州春兴精工有限公司 | A kind of quick-frozen liquid of low-expansion coefficient and its application |
| CN110591658A (en) * | 2019-08-20 | 2019-12-20 | 深圳市博恩实业有限公司 | Channel type flexible composite material high heat conductor and preparation method thereof |
| CN110621135A (en) * | 2018-06-19 | 2019-12-27 | 青岛海信移动通信技术股份有限公司 | Shell of terminal equipment and processing method thereof |
| CN111065242A (en) * | 2019-12-25 | 2020-04-24 | 常州大学 | Flexible heat conducting pad with composite structure |
-
2013
- 2013-04-04 CN CN 201320164248 patent/CN203261617U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105577033A (en) * | 2016-01-07 | 2016-05-11 | 李文华 | Wireless charging smart watch capable of being charged by body temperature |
| CN107163918A (en) * | 2017-06-01 | 2017-09-15 | 惠州春兴精工有限公司 | A kind of quick-frozen liquid of low-expansion coefficient and its application |
| CN110621135A (en) * | 2018-06-19 | 2019-12-27 | 青岛海信移动通信技术股份有限公司 | Shell of terminal equipment and processing method thereof |
| CN110591658A (en) * | 2019-08-20 | 2019-12-20 | 深圳市博恩实业有限公司 | Channel type flexible composite material high heat conductor and preparation method thereof |
| CN111065242A (en) * | 2019-12-25 | 2020-04-24 | 常州大学 | Flexible heat conducting pad with composite structure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20170404 |
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| CF01 | Termination of patent right due to non-payment of annual fee |