CN206947325U - A kind of graphite copper foil heat sink compound - Google Patents
A kind of graphite copper foil heat sink compound Download PDFInfo
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- CN206947325U CN206947325U CN201720160491.5U CN201720160491U CN206947325U CN 206947325 U CN206947325 U CN 206947325U CN 201720160491 U CN201720160491 U CN 201720160491U CN 206947325 U CN206947325 U CN 206947325U
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- copper foil
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Abstract
The utility model belongs to fin technical field, more particularly to a kind of graphite copper foil heat sink compound, including netted copper foil, and the graphite film being compounded in by calendering formation technology at least one side of netted copper foil, the porosity of netted copper foil is 40~80%, and pore size is 0.002~2mm.Compared to prior art, graphite film is compounded on netted copper foil by the utility model using calendering technology, due to without using bonding agent, therefore interface resistance is greatly reduced, heat sink compound is effectively avoided to produce interlayer degumming phenomenon simultaneously, so that heat sink compound has excellent mechanical performance and heat conduction and heat radiation performance, and improve the service life of heat sink compound；If in addition, the too high mechanical strength that can influence copper foil of porosity of the present utility model, the too low bond strength then influenceed between copper foil and graphite film of porosity；And mesh crosses conference and graphite film can not be combined closely with copper foil, mesh is too small to cause the adhesion of graphite film and copper foil insufficient.
Description
Technical field
The utility model belongs to fin technical field, more particularly to a kind of graphite copper foil heat sink compound.
Background technology
With the development of large scale integrated circuit and encapsulation technology, electronic component and electronic equipment are to thin, light, small direction
Develop, the integrated level more and more higher of electronic product, the quantity of the electronic component in unit area increases in geometric progression amount, radiating
As very distinct issues, if heat has little time to remove component operating temperature will be caused to raise, can also made when serious
Electronic component failure, directly influence the life and reliability of the various high-precision equipments using them.Therefore, heat
How to distribute problem and have become miniaturization of electronic products, integrated bottleneck.
Existing market portioned product carries out heat conduction and heat radiation, especially copper and aluminium by metal group material, although the heat conduction of copper
Coefficient is 398W/mK, but weight is big, oxidizable etc. to limit its application, and the thermal conductivity factor of aluminium is 237W/mK, it is difficult to full
Demand of the sufficient existing product to heat conduction and heat radiation.
And in the material available for radiating, carbon material has excellent heat conductivility and turns into research emphasis.As carbon is received
Mitron has very big draw ratio, and heat exchange performance alongst is very high, and thermal conductivity is more than 10 times of argent,
Higher heat conductivility can be obtained in the case where addition number is less；Grapheme material, it is most thin material in the world at present
Material, only a carbon atom thickness；And graphene is highly stable, and heat conductor being used as, the thermal conductivity of graphene is about 4000W/mK,
It is 5 times of copper.With deepening continuously for research, carbon material in heat conduction field by as ideal material, for computer
The fields such as technology, communication, electronics, it is a kind of heat sink material most with prospects in recent years.
But existing carbon material also has weak point, the folding resistance such as grapheme material is poor, and the intensity of material is weak, can be light
Easily tear or because adhere to position is subjected to displacement produce breakage and entry material come off, simultaneously as the knot of material in itself
Structure characteristic, CNT and graphene longitudinal direction Z thermal conductivity factor are relatively low, general 5~30W/mK.
Therefore, in order to effectively keep the original high-cooling property of carbon material, while and can makes it have excellent mechanical property
Energy and high longitudinal heat conductivility, in the prior art, it is common practice to, carbon material is passed through into double faced adhesive tape and copper foil complex
Into the heat sink compound of copper foil-double faced adhesive tape-graphite；As the U of Chinese patent CN 205685874 disclose a kind of Nanometer Copper carbon graphite
Piece, the graphite flake by cover layer, acrylic glue layer, nanometer carbon coating, copper foil, nanometer carbon coating, acrylic glue layer and
Mould release membrance forms.In addition, also the A of Chinese patent CN 103476227 disclose a kind of copper carbon heat sink compound and its preparation side
Method, especially by bonding agent copper foil coated on both sides carbon heat-conducting layer.
Although above-mentioned copper carbon heat sink compound is deposited with certain tensile strength and good heat conduction and heat radiation performance
In following defect：Firstth, copper foil and graphite are bonded together by the copper carbon heat sink compound by adhesive layer, and due to gluing
The heat conductivility of agent is poor, can hinder distributing for heat, so greatly reduces the radiating effect of heat sink compound；Secondth, copper
The heat sink compound of paper tinsel-double faced adhesive tape-graphite-structure is normally only applied to the radiating of small-power product at present, such as mobile phone, miniature member
Device etc.；The radiating in high-power product (such as electric automobile) can not be applied；When the 3rd, being bonded using adhesive, its layer
Cohesive force between layer is too low, it is easy to causes interlayer degumming, so as to influence the heat dispersion of heat sink compound and using the longevity
Life.
In view of this, it is necessory to be improved further to existing heat sink compound, excellent heat conduction is made it have
While heat dispersion, moreover it is possible to the effective scope of application and service life for widening heat sink compound.
Utility model content
The purpose of this utility model is：In view of the shortcomings of the prior art, a kind of graphite copper foil heat sink compound is provided,
With low, the narrow application range that solves existing heat sink compound radiating efficiency, interlayer degumming easily occurs, the problem of service life is short.
To achieve the above object, the utility model adopts the following technical scheme that：
A kind of graphite copper foil heat sink compound, including netted copper foil, and netted copper is compounded in by calendering formation technology
Graphite film at least one side of paper tinsel, the porosity of the netted copper foil is 40~80%, the pore size of the netted copper foil
For 0.002~2mm.Wherein, the porosity of netted copper foil and pore size are most important in the utility model, if porosity is too high
The mechanical strength of copper foil can be influenceed；The too low bond strength then influenceed between copper foil and graphite film of porosity；If in addition, mesh mistake
Conference makes graphite film can not be combined closely with copper foil；Mesh is too small to cause the adhesion of graphite film and copper foil insufficient.
One kind as the utility model graphite copper foil heat sink compound is improved, the porosity of the netted copper foil for 50~
70%.
One kind as the utility model graphite copper foil heat sink compound is improved, and the pore size of the netted copper foil is
0.01~1mm.
One kind as the utility model graphite copper foil heat sink compound is improved, the horizontal direction heat conduction system of the fin
Number is 1500~2500W/mK, and vertical direction thermal conductivity factor is 500~1000W/mK.Pass through netted copper foil and graphite film
Roll it is compound after so that the heat conduction and heat radiation performance of fin horizontally and vertically is effectively improved.
One kind as the utility model graphite copper foil heat sink compound is improved, the thickness of the netted copper foil for 0.01~
2mm.If the thickness of copper foil is excessively thin, the tensile strength of heat sink compound can be substantially reduced；, can be big if the thickness of copper foil is blocked up
It is big to reduce the pliability of heat sink compound, and increase material cost.
One kind as the utility model graphite copper foil heat sink compound is improved, the thickness of the graphite film for 0.01~
1mm.If the thickness of graphite film is excessively thin, the thermal conductivity factor of heat sink compound can be substantially reduced；If the thickness of graphite film is blocked up, can
The adhesion of graphite film and copper foil is substantially reduced, and influences the service life of heat sink compound.
One kind as the utility model graphite copper foil heat sink compound is improved, and the mesh form of the netted copper foil is circle
Shape, ellipse or polygon.
One kind as the utility model graphite copper foil heat sink compound is improved, and the graphite film is artificial graphite film or day
Right graphite film；Preferably electrographite film, because the thermal conductivity of electrographite film is 3~5 times of natural stone ink film, while its is easy
Processed in cross cutting, and with the prominent characteristic of horizontal quick heat radiating from point to surface.
One kind as the utility model graphite copper foil heat sink compound is improved, and its preparation method comprises the following steps：
Step 1: selection high molecular film material is positioned in carbide furnace as raw material and is warming up to carburizing temperature, carry out carbon
Change, then the material being carbonized is moved to graphitization is carried out in graphitizing furnace, carry out rolling obtained graphite film after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil；
Handled Step 3: graphite film made from step 1 is uniformly laid in through step 2 on obtained netted copper foil,
Then through stage calendering, that is, described graphite copper foil heat sink compound is obtained.
One kind as the utility model graphite copper foil heat sink compound is improved, and the pressure rolled in step 3 is 20
~60kg/cm3, roll rotational speed is 0.5~2.5m/min.
One kind as the utility model graphite copper foil heat sink compound is improved, in step 1 carburizing temperature be 800~
1400 DEG C, carbonization time is 5~10h；Graphitization temperature is 2200~2800 DEG C, and graphitization time is 5~10h.
One kind as the utility model graphite copper foil heat sink compound is improved, and the high molecular film material is that polyamides is sub-
At least one of amine, polyamide, polybenzoxazole, poly- benzo-dioxazole and polythiazole, preferably polyimides.
The beneficial effects of the utility model are：A kind of graphite copper foil heat sink compound of the utility model, including netted copper
Paper tinsel, and the graphite film being compounded in by calendering formation technology at least one side of netted copper foil, the hole of the netted copper foil
Rate is 40~80%, and pore size is 0.002~2mm.Compared to prior art, the utility model uses calendering technology by graphite
Film is compounded on netted copper foil, due to without using bonding agent, therefore greatly reduces interface resistance, while effectively avoid compound
Fin produces interlayer degumming phenomenon, so that heat sink compound has excellent mechanical performance and heat conduction and heat radiation performance；And
And the porosity and pore size of netted copper foil are most important, according to copper foil of the densification without mesh, between copper foil and graphite film
Adhesion it is poor；And can then copper foil be set to be closely linked by mesh and graphite film using netted copper foil；If porosity
The too high mechanical strength that can influence copper foil；The too low bond strength then influenceed between copper foil and graphite film of porosity；If in addition, net
Conference is crossed in hole makes graphite film can not be combined closely with copper foil；Mesh is too small to cause the adhesion of graphite film and copper foil insufficient.
Brief description of the drawings
Fig. 1 is one of structural representation of the present utility model.
Fig. 2 is the two of structural representation of the present utility model.
In figure：The netted copper foils of 1-；2- graphite films.
Embodiment
With reference to embodiment and Figure of description, the utility model is described in further detail, but this
The embodiment not limited to this of utility model.
Embodiment 1
As shown in figure 1, a kind of graphite copper foil heat sink compound, including netted copper foil 1, and answered by calendering formation technology
The graphite film 2 in netted copper foil 1 is closed, wherein, the thickness of netted copper foil 1 is 0.5mm, and the thickness of graphite film 2 is 0.05mm；It is netted
The porosity of copper foil 1 is 60%, pore size 0.01mm；The horizontal direction thermal conductivity factor of the heat sink compound is 2000W/
MK, vertical direction thermal conductivity factor are 800W/mK.
The preparation method of the heat sink compound comprises the following steps：
Step 1: selection polyimides is positioned in carbide furnace and is carbonized as raw material, carburizing temperature is 1000 DEG C,
Carbonization time is 8h；Then the material being carbonized is moved to and graphitization is carried out in graphitizing furnace, graphitization temperature is 2500 DEG C, stone
The inkization time is 8h, carries out rolling obtained graphite film 2 after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil 1；
Step 3: graphite film made from step 12 is uniformly laid in obtained netted copper foil 1 is handled through step 2
On, then through stage calendering, the pressure of calendering is 40kg/cm3, roll rotational speed 1.0m/min, that is, obtain graphite copper foil and answer
Close fin.
Comparative example 1
As different from Example 1, the heat sink compound in this comparative example makes graphite film be compounded in copper foil using binding agent
Surface, formed copper foil-adhesive linkage-graphite film sandwich-like structure heat sink compound.
Embodiment 2
As shown in Fig. 2 a kind of graphite copper foil heat sink compound, including netted copper foil 1, and answered by calendering formation technology
Graphite film 2 on the two sides of netted copper foil 1 is closed, wherein, the thickness of netted copper foil 1 is 0.01mm, the thickness of mono-layer graphite film 2
For 0.01mm；The porosity of netted copper foil 1 is 40%, pore size 0.002mm；The horizontal direction heat conduction of the heat sink compound
Coefficient is 1500W/mK, and vertical direction thermal conductivity factor is 500W/mK.
The preparation method of the heat sink compound comprises the following steps：
Step 1: selection polybenzoxazole is positioned in carbide furnace and is carbonized as raw material, carburizing temperature is 800 DEG C,
Carbonization time is 5h；Then the material being carbonized is moved to and graphitization is carried out in graphitizing furnace, graphitization temperature is 2200 DEG C, stone
The inkization time is 5h, carries out rolling obtained graphite film 2 after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil 1；
Step 3: graphite film made from step 12 is uniformly laid in obtained netted copper foil 1 is handled through step 2
On, then through stage calendering, the pressure of calendering is 20kg/cm3, roll rotational speed 0.5m/min, that is, obtain graphite copper foil and answer
Close fin.
Comparative example 2
As different from Example 2, the heat sink compound in this comparative example makes graphite film be compounded in copper foil using binding agent
Two surfaces, formed graphite film-adhesive linkage-copper foil-adhesive linkage-graphite membrane structure heat sink compound.
Embodiment 3
As shown in Fig. 2 a kind of graphite copper foil heat sink compound, including netted copper foil 1, and answered by calendering formation technology
The graphite film 2 on the two sides of netted copper foil 1 is closed, wherein, the thickness of netted copper foil 1 is 2mm, and the thickness of mono-layer graphite film 2 is
1mm；The porosity of netted copper foil 1 is 80%, pore size 2mm；The horizontal direction thermal conductivity factor of the heat sink compound is
2500W/mK, vertical direction thermal conductivity factor are 1000W/mK.
The preparation method of the heat sink compound comprises the following steps：
Step 1: selection polyimides is positioned in carbide furnace and is carbonized as raw material, carburizing temperature is 1400 DEG C,
Carbonization time is 10h；Then the material being carbonized being moved to and graphitization is carried out in graphitizing furnace, graphitization temperature is 2800 DEG C,
Graphitization time is 10h, carries out rolling obtained graphite film 2 after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil 1；
Step 3: graphite film made from step 12 is uniformly laid in obtained netted copper foil 1 is handled through step 2
On, then through stage calendering, the pressure of calendering is 60kg/cm3, roll rotational speed 2.5m/min, that is, obtain graphite copper foil and answer
Close fin.
Comparative example 3
As different from Example 3, the heat sink compound in this comparative example makes graphite film be compounded in copper foil using binding agent
Two surfaces, formed graphite film-adhesive linkage-copper foil-adhesive linkage-graphite membrane structure heat sink compound.
Embodiment 4
As shown in Fig. 2 a kind of graphite copper foil heat sink compound, including netted copper foil 1, and answered by calendering formation technology
Graphite film 2 on the two sides of netted copper foil 1 is closed, wherein, the thickness of netted copper foil 1 is 0.1mm, the thickness of mono-layer graphite film 2
For 0.02mm；The porosity of netted copper foil 1 is 50%, pore size 0.5mm；The horizontal direction heat conduction system of the heat sink compound
Number is 1800W/mK, and vertical direction thermal conductivity factor is 700W/mK.
The preparation method of the heat sink compound comprises the following steps：
Step 1: selection polyimides is positioned in carbide furnace and is carbonized as raw material, carburizing temperature is 1200 DEG C,
Carbonization time is 7h；Then the material being carbonized is moved to and graphitization is carried out in graphitizing furnace, graphitization temperature is 2400 DEG C, stone
The inkization time is 9h, carries out rolling obtained graphite film 2 after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil 1；
Step 3: graphite film made from step 12 is uniformly laid in obtained netted copper foil 1 is handled through step 2
On, then through stage calendering, the pressure of calendering is 50kg/cm3, roll rotational speed 2.0m/min, that is, obtain graphite copper foil and answer
Close fin.
Comparative example 4
As different from Example 4, the heat sink compound in this comparative example makes graphite film be compounded in copper foil using binding agent
Two surfaces, formed graphite film-adhesive linkage-copper foil-adhesive linkage-graphite membrane structure heat sink compound.
Embodiment 5
As shown in Fig. 2 a kind of graphite copper foil heat sink compound, including netted copper foil 1, and answered by calendering formation technology
The graphite film 2 on the two sides of netted copper foil 1 is closed, wherein, the thickness of netted copper foil 1 is 1mm, and the thickness of mono-layer graphite film 2 is
0.5mm；The porosity of netted copper foil 1 is 70%, pore size 0.1mm；The horizontal direction thermal conductivity factor of the heat sink compound
For 2200W/mK, vertical direction thermal conductivity factor is 900W/mK.
The preparation method of the heat sink compound comprises the following steps：
Step 1: selection polyimides is positioned in carbide furnace and is carbonized, carburizing temperature is 900 DEG C, carbon as raw material
The change time is 6h；Then the material being carbonized is moved to and graphitization is carried out in graphitizing furnace, graphitization temperature is 2300 DEG C, graphite
The change time is 7h, carries out rolling obtained graphite film 2 after taking-up；
Step 2: first carrying out surface cleaning processing to copper foil, processing is then punched out, obtains netted copper foil 1；
Step 3: graphite film made from step 12 is uniformly laid in obtained netted copper foil 1 is handled through step 2
On, then through stage calendering, the pressure of calendering is 30kg/cm3, roll rotational speed 1.5m/min, that is, obtain graphite copper foil and answer
Close fin.
Comparative example 5
As different from Example 5, the heat sink compound in this comparative example makes graphite film be compounded in copper foil using binding agent
Two surfaces, formed graphite film-adhesive linkage-copper foil-adhesive linkage-graphite membrane structure heat sink compound.
Heat conductivility and Mechanics Performance Testing are carried out to the heat sink compound of embodiment 1~5 and comparative example 1~5 respectively, surveyed
Test result is shown in Table 1.
The heat conductivility and mechanical experimental results of the heat sink compound of the embodiment of table 1 and comparative example
From the test result of table 1, copper foil and graphite film is set to bond shape compared to bonding agent is used in comparative example 1~5
Into heat sink compound, graphite copper foil heat sink compound of the present utility model has more excellent heat conductivility and mechanical property
Energy.Its reason is that the utility model, which employs calendering formation technology, makes graphite film 2 closely be compounded on netted copper foil 1, due to nothing
Bonding agent need to be used, therefore greatly reduces interface resistance, while effectively avoids heat sink compound from producing interlayer degumming phenomenon, from
And cause heat sink compound that there is excellent mechanical mechanics property and heat conduction and heat radiation performance.
The announcement and teaching of book according to the above description, the utility model those skilled in the art can also be to above-mentioned realities
The mode of applying is changed and changed.Therefore, the utility model is not limited to above-mentioned embodiment, every this area skill
It is new that art personnel any conspicuously improved, replacement or modification made on the basis of the utility model belong to this practicality
The protection domain of type.In addition, although used some specific terms in this specification, but these terms are intended merely to conveniently say
It is bright, any restrictions are not formed to the utility model.
Claims (8)
- A kind of 1. graphite copper foil heat sink compound, it is characterised in that：It is compound including netted copper foil, and by calendering formation technology Graphite film at least one side of netted copper foil, the porosity of the netted copper foil is 40~80%, the netted copper foil Pore size is 0.002~2mm.
- 2. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The porosity of the netted copper foil is 50~70%.
- 3. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The pore size of the netted copper foil For 0.01~1mm.
- 4. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The horizontal direction of the fin is led Hot coefficient is 1500~2500W/mK, and vertical direction thermal conductivity factor is 500~1000W/mK.
- 5. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The thickness of the netted copper foil is 0.01~2mm.
- 6. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The thickness of the graphite film is 0.01 ~1mm.
- 7. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The mesh form of the netted copper foil For circular, ellipse or polygon.
- 8. graphite copper foil heat sink compound according to claim 1, it is characterised in that：The graphite film is artificial graphite film Or natural stone ink film.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720160491.5U CN206947325U (en) | 2017-02-22 | 2017-02-22 | A kind of graphite copper foil heat sink compound |
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| CN201720160491.5U CN206947325U (en) | 2017-02-22 | 2017-02-22 | A kind of graphite copper foil heat sink compound |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847767A (en) * | 2017-02-22 | 2017-06-13 | 东莞市鸿亿导热材料有限公司 | A kind of graphite Copper Foil heat sink compound |
| CN114014679A (en) * | 2021-11-16 | 2022-02-08 | 江西柔顺科技有限公司 | Reinforced graphite film and preparation method thereof |
| CN114434894A (en) * | 2022-02-21 | 2022-05-06 | 江西柔顺科技有限公司 | Copper foil graphite film and preparation method thereof |
-
2017
- 2017-02-22 CN CN201720160491.5U patent/CN206947325U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847767A (en) * | 2017-02-22 | 2017-06-13 | 东莞市鸿亿导热材料有限公司 | A kind of graphite Copper Foil heat sink compound |
| CN114014679A (en) * | 2021-11-16 | 2022-02-08 | 江西柔顺科技有限公司 | Reinforced graphite film and preparation method thereof |
| CN114434894A (en) * | 2022-02-21 | 2022-05-06 | 江西柔顺科技有限公司 | Copper foil graphite film and preparation method thereof |
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