CN204560112U - A kind of heat-conducting pad of enlarge active surface - Google Patents
A kind of heat-conducting pad of enlarge active surface Download PDFInfo
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- CN204560112U CN204560112U CN201520261448.9U CN201520261448U CN204560112U CN 204560112 U CN204560112 U CN 204560112U CN 201520261448 U CN201520261448 U CN 201520261448U CN 204560112 U CN204560112 U CN 204560112U
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- heat
- conducting pad
- conducting
- wire
- silica gel
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Abstract
The utility model discloses a kind of heat-conducting pad of enlarge active surface, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove (1) matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer (2) and is arranged at the glass reinforced layer (3) of heat-conducting layer (2) side, groove (1) is arranged at the surface of heat-conducting layer (2), and described heat-conducting layer (2) comprises silica gel matrix (4) and is filled in the wire (5) in silica gel matrix (4).The beneficial effects of the utility model are: groove can fit tightly median plane and the peripheral side of euthermic chip, thus the heat in the face that respectively generated heat by euthermic chip conducts, solve the heat dissipation problem of high heating power euthermic chip well, the wire of filling is continuous distribution in silica gel matrix, define through heat transfer path, therefore improve the heat conductivility of heat-conducting layer body.
Description
Technical field
The utility model relates to euthermic chip technical field of heat dissipation, particularly a kind of heat-conducting pad of enlarge active surface.
Background technology
The profile of current euthermic chip mostly is higher, the highly lower type shape of center height around, and central authorities are about 1 ~ 2mm with the difference of height of surrounding.The housing contacted due to heat conductive pad during assembling has level altitude.If during for pasting heat-conducting pad above euthermic chip, the central authorities of euthermic chip or the around wherein thickness highly selecting heat-conducting pad only can be coordinated.This just causes significantly reducing the heat transfer area of heating new product or makes heat-conducting pad blocked up, produces assembling interference problem.
Summary of the invention
The purpose of this utility model is the shortcoming overcoming prior art, provides a kind of heat euthermic chip respectively being generated heat face to carry out conducting, the heat-conducting pad of enlarge active surface.
The purpose of this utility model is achieved through the following technical solutions: a kind of heat-conducting pad of enlarge active surface, be covered in the surface of the convex shape of euthermic chip, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer and is arranged at the glass reinforced layer of heat-conducting layer side, groove is arranged at the surface of heat-conducting layer, and described heat-conducting layer comprises silica gel matrix and is filled in the wire in silica gel matrix.Described wire is filamentary silver, copper wire or aluminium wire.Described diameter wiry is 0.5mm ~ 1mm, and the volumetric filling ratio of wire in silica gel matrix is 20 ~ 60%.Inventor found through experiments diameter wiry and the volumetric filling ratio of wire in silica gel matrix is all the factor affecting heat-conducting pad heat conductivility, further, diameter wiry is larger, when then wire content does not reach very high values, obviously reducing appears in the elasticity of heat-conducting pad, and the minimizing of content wiry makes the thermal conductivity of heat-conducting pad reduce, suitable reduction diameter wiry effectively can reduce wire content and reduce the flexible impact of heat-conducting pad, but meticulous wire is difficult to form through heat conduction path, also the thermal conductivity of heat-conducting pad is affected.Inventor by scientific research, when finding that diameter wiry is 0.5mm ~ 1mm, can ensure to form through heat conduction path, and can remain on again when having higher metal silk content, heat-conducting pad entirety has preferably elasticity.Described wire extends along perpendicular to the direction of heat-conducting pad in silica gel matrix, thus each wire forms a through heat conduction path.The shape of described heat-conducting pad is square or circular.Described groove is rectangular channel.The utility model has the following advantages: groove of the present utility model can fit tightly median plane and the peripheral side of euthermic chip, thus the heat in the face that respectively generated heat by euthermic chip conducts, and there is not assembling interference problem, compare existing heat-conducting pad, energy effective temperature-reducing more than 5 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.The utility model is compounded with layer of glass fiber reinforced layer on heat-conducting pad, the mechanical strength of heat-conducting pad is improve under the prerequisite not increasing heat-conducting pad thickness and thermal resistance, there is good tear-proof and anti-puncture performance, can not be stung by stitch, avoid the generation of electronic product short circuit problem.In heat-conducting pad, fill wire, the wire of filling is continuous distribution in silica gel matrix, defines through heat transfer path, therefore improves the heat conductivility of heat-conducting layer body.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, 1-groove, 2-heat-conducting layer, 3-glass reinforced layer, 4-silica gel matrix, 5-wire.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described:
As shown in Figure 1, a kind of heat-conducting pad of enlarge active surface, be covered in the surface of the convex shape of euthermic chip, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove 1 matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer 2 and is arranged at the glass reinforced layer 3 of heat-conducting layer 2 side, and groove 1 is arranged at the surface of heat-conducting layer 2, the wire 5 that described heat-conducting layer 2 comprises silica gel matrix 4 and is filled in silica gel matrix 4.
Described wire 5 is filamentary silver, copper wire or aluminium wire.
The diameter of described wire 5 is 0.5mm ~ 1mm, and the volumetric filling ratio of wire 5 in silica gel matrix 4 is 20 ~ 60%.Inventor found through experiments the diameter of wire 5 and the volumetric filling ratio of wire 5 in silica gel matrix 4 is all the factor affecting heat-conducting pad heat conductivility, further, the diameter of wire 5 is larger, when then wire 5 content does not reach very high values, obviously reducing appears in the elasticity of heat-conducting pad, and the minimizing of the content of wire 5 makes the thermal conductivity of heat-conducting pad reduce, the diameter of suitable reduction wire 5 effectively can reduce wire 5 content and reduce the flexible impact of heat-conducting pad, but meticulous wire 5 is difficult to form through heat conduction path, also the thermal conductivity of heat-conducting pad is affected.Inventor by scientific research, when the diameter finding wire 5 is 0.5mm ~ 1mm, can ensure to form through heat conduction path, and can remain on again when having higher metal silk 5 content, heat-conducting pad entirety has preferably elasticity.
Described wire 5 extends along the direction perpendicular to heat-conducting pad in silica gel matrix 4, thus the heat conduction path that each wire 5 formation one is through.The shape of described heat-conducting pad is square or circular.Described groove 1 is rectangular channel.
Groove 1 can fit tightly median plane and the peripheral side of euthermic chip, thus the heat in the face that respectively generated heat by euthermic chip conducts, and there is not assembling interference problem, compare existing heat-conducting pad, energy effective temperature-reducing more than 5 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.Heat-conducting pad is compounded with layer of glass fiber reinforced layer 3, the mechanical strength of heat-conducting pad is improve under the prerequisite not increasing heat-conducting pad thickness and thermal resistance, there is good tear-proof and anti-puncture performance, can not be stung by stitch, avoid the generation of electronic product short circuit problem.In heat-conducting pad, fill wire 5, the wire 5 of filling is continuous distribution in silica gel matrix 4, defines through heat transfer path, therefore improves the heat conductivility of heat-conducting layer 2 body.
Claims (6)
1. the heat-conducting pad of an enlarge active surface, it is characterized in that: comprise heat-conducting pad body, heat-conducting pad body is provided with the groove (1) matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer (2) and is arranged at the glass reinforced layer (3) of heat-conducting layer (2) side, groove (1) is arranged at the surface of heat-conducting layer (2), and described heat-conducting layer (2) comprises silica gel matrix (4) and is filled in the wire (5) in silica gel matrix (4).
2. the heat-conducting pad of a kind of enlarge active surface according to claim 1, is characterized in that: described wire (5) is filamentary silver, copper wire or aluminium wire.
3. the heat-conducting pad of a kind of enlarge active surface according to claim 1, is characterized in that: the diameter of described wire (5) is 0.5mm ~ 1mm, and the volumetric filling ratio of wire (5) in silica gel matrix (4) is 20 ~ 60%.
4. the heat-conducting pad of a kind of enlarge active surface according to claim 1, is characterized in that: described wire (5) extends along the direction perpendicular to heat-conducting pad in silica gel matrix (4).
5. the heat-conducting pad of a kind of enlarge active surface according to claim 1, is characterized in that: the shape of described heat-conducting pad is square or circular.
6. the heat-conducting pad of a kind of enlarge active surface according to claim 1, is characterized in that: described groove (1) is rectangular channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520261448.9U CN204560112U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of enlarge active surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520261448.9U CN204560112U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of enlarge active surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204560112U true CN204560112U (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520261448.9U Expired - Fee Related CN204560112U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of enlarge active surface |
Country Status (1)
| Country | Link |
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| CN (1) | CN204560112U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109350047A (en) * | 2018-11-08 | 2019-02-19 | 青岛光电医疗科技有限公司 | A kind of biopotential electrode product and preparation method |
| CN109691242A (en) * | 2016-10-14 | 2019-04-26 | 欧姆龙株式会社 | Electronic device and its manufacturing method |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
-
2015
- 2015-04-28 CN CN201520261448.9U patent/CN204560112U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109691242A (en) * | 2016-10-14 | 2019-04-26 | 欧姆龙株式会社 | Electronic device and its manufacturing method |
| CN109350047A (en) * | 2018-11-08 | 2019-02-19 | 青岛光电医疗科技有限公司 | A kind of biopotential electrode product and preparation method |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
| CN112420636B (en) * | 2020-11-19 | 2022-09-06 | 四川长虹空调有限公司 | Chip heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20180428 |
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| CF01 | Termination of patent right due to non-payment of annual fee |