CN202888147U - Intelligent power module - Google Patents
Intelligent power module Download PDFInfo
- Publication number
- CN202888147U CN202888147U CN2012205522983U CN201220552298U CN202888147U CN 202888147 U CN202888147 U CN 202888147U CN 2012205522983 U CN2012205522983 U CN 2012205522983U CN 201220552298 U CN201220552298 U CN 201220552298U CN 202888147 U CN202888147 U CN 202888147U
- Authority
- CN
- China
- Prior art keywords
- power module
- intelligent power
- wiring
- shrinkage pool
- metal line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model is suitable for the technical field of electronic devices and provides an intelligent power module. The intelligent power module comprises a metal substrate, wherein an insulating layer, a circuit cable and a circuit element are sequentially arranged on the metal substrate, a gold layer is arranged on the surface of the circuit cable, the circuit element is connected with the circuit cable through metal wires, and the circuit cable is connected with a lead pin; the metal wires include parallel metal wires and vertical metal wires; at least one face(with the circuit cable) of the metal substrate is sealed by a packaging structure; and at least one concave hole reaching the insulating layer or the gold layer is formed in the packaging structure and located in one side of the vertical metal wires, close to a glue injection hole. According to the intelligent power module, the concave hole is formed by a depression bar in the packaging process, and the depression bar is capable of effectively preventing impact of packaging materials on the vertical metal wires and improving the safety of the intelligent power module; and the surface of the circuit cable is covered with the gold layer, and the concave hole formed by the depression bar after packaging reaches the gold layer, so that the metal substrate cannot be corroded by water vapor, and the safety of the intelligent power module is further improved.
Description
Technical field
The utility model belongs to technical field of electronic devices, particularly a kind of Intelligent Power Module.
Background technology
Intelligent Power Module (Intelligent Power Module, IPM) is a kind of power drive series products with power electronics and integrated circuit technique combination.IPM integrates device for power switching and high-voltage driving circuit, and in be provided with overvoltage, overcurrent and the failure detector circuit such as overheated.IPM receives the control signal of MCU on the one hand, drives subsequent conditioning circuit work, sends the state detection signal of system back to MCU on the other hand.Compare with the discrete scheme of tradition, IPM wins increasing market with advantages such as its high integration, high reliability, being particularly suitable for frequency converter and the various inverter of drive motors, is a kind of desirable power electronic device of frequency control, metallurgical machinery, electric traction, servo-drive, frequency-conversion domestic electric appliances.
Chinese patent application CN02125143.6 discloses a kind of existing IPM structure, such as Fig. 1,2, IPM comprises circuit substrate 101, insulating barrier 102 and wiring 103, wiring 103 is provided with circuit element 104, circuit element 104 is connected in wiring 103 by metal wire 105, wiring 103 also is connected with some pins 106, and whole IPM is by hermetically-sealed construction 107 sealings.The method of sealing comprises that the injection mould that uses thermoplastic resin is molded and uses the transfer die of thermosetting resin molded.For small-sized Intelligent Power Module, usually use the form of transfer die to encapsulate.
Because Intelligent Power Module is had relatively high expectations to thermal conductivity, so extremely important to the Position Control of circuit substrate 101 when encapsulation.Such as Fig. 3, in when encapsulation, be typically provided with pad 110 on the mould, carry out the location of circuit substrate 101 by the part that is pressed in circuit substrate 101 and does not establish wiring 103 and circuit element 104 by making pad 110.After encapsulation was finished, the zone that pad 110 inserts in the encapsulating structure can form hole 111.The staff can confirm the position of circuit substrate 101 in encapsulating material by the depth and place of confirming hole 111, eliminates processing for the underproof product of package position.But because the existence in hole 111, will inevitably affect the compactness of Intelligent Power Module encapsulation, in long-term the use, steam can be by the exposed portions serve of hole 111 open circuit potential substrates 101, and the slit after being corroded by hole 111 and 101 of circuit substrates enters other hermetic units of circuit substrate 101, destroys easily wiring 103 and circuit element 104, also can be short-circuited or open circuit when serious, Intelligent Power Module was lost efficacy, thereby cause the device damage of using Intelligent Power Module.
In addition, when circuit structure is complicated, the metal wire 105 that is used for connecting circuit element 104 and wiring 103 is complicated, its orientation not only has and is parallel to the material feeding direction, also have perpendicular with the material feeding direction, this metal wire perpendicular to the material feeding direction is breasted the tape when material feeding easily and is out of shape, and the metal wire of this distortion fracture very easily in long-term the use causes Intelligent Power Module to lose efficacy.
The utility model content
The purpose of this utility model is to provide a kind of Intelligent Power Module, and be intended to solve traditional intelligence power model corrosion-vulnerable and lost efficacy, and the problem of metal wire easy fracture.
The utility model is to realize like this, a kind of Intelligent Power Module, comprise metal substrate, lamination is provided with insulating barrier successively on described metal substrate, the surface is provided with golden layer wiring, and circuit element, described circuit element is connected with described wiring by metal wire, and described wiring is connected with pin;
Described metal wire comprises the parallel metal lines that the material feeding direction when encapsulating with described Intelligent Power Module parallels, and with the perpendicular vertical metal line of described material feeding direction;
The one side that described metal substrate has described wiring is at least sealed by encapsulating structure;
Has the shrinkage pool that at least one leads to described insulating barrier or gold layer on the described encapsulating structure, a side of the gum-injecting port when described shrinkage pool is positioned at described vertical metal line and encapsulates near described Intelligent Power Module.
As optimal technical scheme of the present utility model:
The orientation of described pin parallels with described material feeding direction.
Described shrinkage pool is positioned at diameter less than a side of the vertical metal line of 400 μ m, or is positioned at and the distance of the described gum-injecting port side less than the vertical metal line of 25mm.
The width of described shrinkage pool is greater than the length of described vertical metal line.
The width of described shrinkage pool is 0.5 ± 0.1mm.
Described shrinkage pool is 0.5 ± 0.1mm near the edge of described vertical metal line and the distance between the described vertical metal line.
The thickness of described gold layer is less than 100 μ m.
The thickness that described surface is provided with the wiring of gold layer is 45～150 μ m.
The one side that described metal substrate has described wiring is sealed by encapsulating structure.
The integral body of described metal substrate is sealed by encapsulating structure.
The utility model has shrinkage pool in a side of the close gum-injecting port of vertical metal line, this shrinkage pool is to be formed by the press strip that is arranged on the encapsulating mould when encapsulation, this press strip is suppressed in the side of vertical metal line near gum-injecting port, can prevent effectively that encapsulating material is to the impact of vertical metal line, avoid vertical metal line generation bending, and then improve the fail safe of Intelligent Power Module;
In addition, the surface coverage of wiring has the gold layer, the shrinkage pool that is stayed by press strip after the encapsulation leads to gold layer or insulating barrier, because gold layer and insulating barrier have extremely strong anti-oxidant, corrosion resistance, especially the gold layer has extremely stable chemical property, therefore even have steam to enter from shrinkage pool, also can't corroding metal substrate and circuit structure thereof, the fail safe that has further improved Intelligent Power Module.
Description of drawings
Fig. 1 is the stereogram of Intelligent Power Module in the prior art;
Fig. 2 is the cutaway view of Intelligent Power Module in the prior art;
Fig. 3 is the method for packing schematic diagram of Intelligent Power Module in the prior art;
Fig. 4 is the stereogram of the utility model embodiment Intelligent Power Module;
Fig. 5 is the cross-sectional view of the utility model embodiment Intelligent Power Module;
Fig. 6 is the electrical block diagram of the utility model embodiment Intelligent Power Module;
Fig. 7 is the method for packing schematic diagram of the utility model embodiment Intelligent Power Module.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Below in conjunction with specific embodiment specific implementation of the present utility model is described in detail:
With reference to the accompanying drawings 4,5,6, this Intelligent Power Module comprises metal substrate 1, on metal substrate 1 successively lamination be provided with the wiring 3 that insulating barrier 2, surface are provided with gold layer 31, and circuit element 4, circuit element 4 is connected with wiring 3 by metal wire 5, and wiring 3 is connected with pin 6.Wherein, metal wire 5 comprises the parallel metal lines 51 that the material feeding direction when encapsulating with Intelligent Power Module parallels, and with the perpendicular vertical metal line 52 of material feeding direction.The one side that this metal substrate 1 has wiring 3 is at least sealed by encapsulating structure 7, and has the shrinkage pool 8 that at least one leads to insulating barrier 2 or gold layer 31 on the encapsulating structure 7, and it is positioned at vertical metal line 52 near a side of the gum-injecting port of encapsulating mould.
Shrinkage pool 8 in the present embodiment forms when metal substrate 1 is encapsulated; with reference to the accompanying drawings 7; when package metals substrate 1; it is positioned in the encapsulating mould 20; avoid the impact of injection material in order to protect vertical metal line 52; inside at the patrix 201 of encapsulating mould is provided with press strip 202; and the position of press strip 202 is according to the set positions of vertical metal line 52 to be protected; press strip 202 can stop that on the one hand injection material impacts vertical metal line 52, also can be used for the vertical position of metal substrate 1 is positioned.After encapsulation was finished, press strip 202 was extracted out, just can stay shrinkage pool 8 at encapsulating structure 7.Be appreciated that not necessarily each vertical metal line 52 need to be blocked by press strip 202, greater than 400 μ m, or surpass 25mm apart from gum-injecting port such as wire diameter, perhaps material is very hard, as adopting the very large aluminum steel of hardness, does not then need to arrange press strip 202.Therefore, the shrinkage pool in the present embodiment 8 is arranged at the side apart from the vertical metal line that gum-injecting port is near, wire diameter is less or material is softer usually.Specifically can be positioned at diameter less than 400 μ m or with the distance of gum-injecting port less than the vertical metal line of the 25mm side near gum-injecting port.
In the present embodiment, can also form some pads 32 at wiring 3, be used for connecting the pin 6 that is arranged side by side.Can weld by conductive adhesives such as scolding tin between pin 6 and the pad 32.
In the present embodiment, circuit element 4 can adopt active element or the passive components such as electric capacity or resistance such as transistor or diode.In addition, also can be fixed on the metal substrate 1 by the radiator element that the caloric values such as power component is large of being made by copper etc.
In the present embodiment, when encapsulating, the gum-injecting port of encapsulating mould 20 and pin 6 are positioned at one group of opposite side of mould usually separately, i.e. material feeding direction is identical with the orientation of pin 6, and like this, shrinkage pool 8 is usually located at vertical metal line 52 away from a side of pin 6.
Further; the width of shrinkage pool 8 is the width of press strip 202; this width is larger; the protection effect is better; therefore the width of shrinkage pool 8 is more preferably greater than the length of vertical metal line 52, but width is larger, and area occupied is also larger; two kinds of factors of integrated protection effect and area occupied, the width of the preferred shrinkage pool 8 of present embodiment is 0.5 ± 0.1mm.
Further, if shrinkage pool 8 is long with the distance of vertical metal line 52, mean that then press strip 202 is far away apart from vertical metal line 52, its cushioning effect is less, and distance is when too short, and vertical metal line 52 is too near shrinkage pool 8, be vulnerable to the impact of outside moisture, therefore consider amid all these factors that present embodiment preferably is made as 0.5 ± 0.1mm with this distance, to satisfy security requirement and to solve the problem of breasting the tape.
Further, in order to guarantee corrosion resistance and manufacturing cost, the thickness of gold layer 31 can be controlled in the 100 μ m, and the gross thickness that has covered the wiring 3 of golden layer 31 can be controlled in 45～150 μ m.
In addition, metal wire 5 can be selected aluminum steel, gold thread or copper cash, because the surface of wiring 3 is coated with gold layer 31, so metal wire 5 preferred gold threads.
Preferably, the metal wire that can also adopt same material in binding metal wire 5 couples together metal substrate 1 and wiring 3 or circuit element 4, so that the current potential of metal substrate 1 and wiring 3 or circuit element 4 is approximate, reduce the harmful effect that circuit noise produces circuit element.
In the present embodiment, metal substrate 1 is preferably aluminium base.Insulating barrier 2 can adopt the material such as epoxy resin to make, and can be in epoxide resin material the materials such as aluminium oxide of doped with high concentration, to improve its thermal conductivity.
In the present embodiment, can carry out single face encapsulation or double-faced packaging to metal substrate 1, the single face encapsulation only will be provided with the face sealing of circuit structure, and the back side of metal substrate 1 is exposed, and can improve radiating effect.Double-faced packaging is with whole metal substrate 1 sealing, can improve the compactness of its encapsulation, prevents that substrate from making moist, and can select according to actual needs packaged type when actual fabrication.
The utility model has shrinkage pool in a side of the close gum-injecting port of vertical metal line, this shrinkage pool is to be formed by the press strip that is arranged on the encapsulating mould when encapsulation, this press strip can prevent effectively that encapsulating material is to the impact of vertical metal line, avoid vertical metal line generation bending, and then improve the fail safe of Intelligent Power Module; In addition, the surface coverage of wiring has the gold layer, the shrinkage pool that is stayed by press strip after the encapsulation leads to the gold layer, because the gold layer has extremely strong anti-oxidant, corrosion resistance, even therefore have steam to enter from shrinkage pool, also can't corroding metal substrate and circuit structure thereof, the fail safe that has further improved Intelligent Power Module.And, because the surface of wiring is provided with the gold layer, the gold layer can effectively prevent the Copper Foil oxidation, so the welding quality between metal wire and the wiring is better than the quality that direct and not gold-plated Copper Foil welds, and then has further improved the quality of Intelligent Power Module.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. Intelligent Power Module, it is characterized in that, comprise metal substrate, lamination is provided with insulating barrier successively on described metal substrate, the surface is provided with golden layer wiring, and circuit element, described circuit element is connected with described wiring by metal wire, and described wiring is connected with pin;
Described metal wire comprises the parallel metal lines that the material feeding direction when encapsulating with described Intelligent Power Module parallels, and with the perpendicular vertical metal line of described material feeding direction;
The one side that described metal substrate has described wiring is at least sealed by encapsulating structure;
Has the shrinkage pool that at least one leads to described insulating barrier or gold layer on the described encapsulating structure, a side of the gum-injecting port when described shrinkage pool is positioned at described vertical metal line and encapsulates near described Intelligent Power Module.
2. Intelligent Power Module as claimed in claim 1 is characterized in that, the orientation of described pin parallels with described material feeding direction.
3. Intelligent Power Module as claimed in claim 1 is characterized in that, described shrinkage pool is positioned at diameter less than a side of the vertical metal line of 400 μ m, or is positioned at and the distance of the described gum-injecting port side less than the vertical metal line of 25mm.
4. such as claim 1,2 or 3 described Intelligent Power Module, it is characterized in that the width of described shrinkage pool is greater than the length of described vertical metal line.
5. Intelligent Power Module as claimed in claim 4 is characterized in that, the width of described shrinkage pool is 0.5 ± 0.1mm.
6. such as claim 1,2 or 3 described Intelligent Power Module, it is characterized in that described shrinkage pool is 0.5 ± 0.1mm near the edge of described vertical metal line and the distance between the described vertical metal line.
7. such as claim 1,2 or 3 described Intelligent Power Module, it is characterized in that the thickness of described gold layer is less than 100 μ m.
8. Intelligent Power Module claimed in claim 7 is characterized in that, the thickness that described surface is provided with the wiring of gold layer is 45～150 μ m.
9. such as claim 1,2 or 3 described Intelligent Power Module, it is characterized in that the one side that described metal substrate has described wiring is sealed by encapsulating structure.
10. such as claim 1,2 or 3 described Intelligent Power Module, it is characterized in that the integral body of described metal substrate is sealed by encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205522983U CN202888147U (en) | 2012-10-25 | 2012-10-25 | Intelligent power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205522983U CN202888147U (en) | 2012-10-25 | 2012-10-25 | Intelligent power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888147U true CN202888147U (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205522983U Expired - Lifetime CN202888147U (en) | 2012-10-25 | 2012-10-25 | Intelligent power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888147U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10536047B2 (en) | 2016-04-21 | 2020-01-14 | Regal Beloit America, Inc. | Electric motor controller for high-moisture applications and method of manufacture |
-
2012
- 2012-10-25 CN CN2012205522983U patent/CN202888147U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10536047B2 (en) | 2016-04-21 | 2020-01-14 | Regal Beloit America, Inc. | Electric motor controller for high-moisture applications and method of manufacture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130417 |