CN202738270U - Plasma processor for PTFE - Google Patents

Plasma processor for PTFE Download PDF

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Publication number
CN202738270U
CN202738270U CN 201220291124 CN201220291124U CN202738270U CN 202738270 U CN202738270 U CN 202738270U CN 201220291124 CN201220291124 CN 201220291124 CN 201220291124 U CN201220291124 U CN 201220291124U CN 202738270 U CN202738270 U CN 202738270U
Authority
CN
China
Prior art keywords
vacuum cavity
plasma
frequency
vacuum
ptfe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220291124
Other languages
Chinese (zh)
Inventor
董晓俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Awel Circuit (shenzhen) Co Ltd
Original Assignee
Awel Circuit (shenzhen) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Awel Circuit (shenzhen) Co Ltd filed Critical Awel Circuit (shenzhen) Co Ltd
Priority to CN 201220291124 priority Critical patent/CN202738270U/en
Application granted granted Critical
Publication of CN202738270U publication Critical patent/CN202738270U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a plasma processor for PTFE and a high-frequency copper-free hole problem of PCB production is processed by adopting the plasma processor. Process and efficiency of manufacturing a high frequency board are improved. The disclosed plasma processor comprises a processor housing. A vacuum cavity, a high-frequency plasmatron, a vacuum pump, an inflator pump and a control circuit are arranged in the housing. The vacuum cavity is connected with the vacuum pump and the inflator pump by a gas pipeline. The high-frequency plasmatron is connected with the vacuum cavity. The control circuit is connected with the high-frequency plasmatron. The vacuum cavity is provided with a plasma spraying pipeline.

Description

The plasma processor that is used for PTFE
Technical field
The utility model relates to a kind of plasma processor, belongs to pcb board and makes the production equipment field.
Background technology
At present, manufacture in the factory at most of PCB, processing for PTFE high frequency plate all is the method that adopts the chemical medicinal liquid immersion treatment, penetrate except removing the PCB circuit board that Yin Gaowen causes melt polymer material at the glue slag of hole wall metal covering in the boring by chemical immersion at machine drilling and anchor, yet this method is brought tired rich for the production of the Kong Wutong problem of high frequency plate, existing chemicals is difficult to enter on the laser drilling aperture, has affected progress and efficient that the high frequency plate is made.
Summary of the invention
For the defective of prior art, the utility model discloses a kind of plasma processor for PTFE, be a kind of high frequency plate treatment facility for PTFE, overcome the defective of traditional chemical immersion method, can effectively improve manufacturing schedule and efficient.
For achieving the above object, the utility model is achieved through the following technical solutions:
The plasma processor that is used for PTFE, comprise body fuselage, vacuum cavity, Radio-frequency plasma torch, vacuum pump, inflator pump, control circuit are installed in its housing, wherein vacuum cavity is connected inflator pump by gas pipeline and is connected with vacuum pump, Radio-frequency plasma torch is connected with vacuum cavity, control circuit is connected with Radio-frequency plasma torch, and vacuum cavity is provided with the plasma jet pipeline.
In use, utilize vacuum pump vacuum cavity to be vacuumized the vacuum degree that reaches 0.02-0.03mbar, use Radio-frequency plasma torch by control circuit, under its effect, gas is ionized, form plasma, thereby can the high frequency plasma line that form be sprayed to pcb board to be processed by the plasma jet pipeline, remove the PCB circuit board and penetrate at machine drilling and anchor that Yin Gaowen causes melt polymer material at the glue slag of hole wall metal covering in the boring, be specially adapted to high frequency and process application on the laser drilling aperture that chemicals is difficult to enter in the production of polytetrafluoroethylene (PTFE) plate.After being used to complete, can use the inflator pump inflation.
Wherein, described Radio-frequency plasma torch is apparent to those skilled in the art, the device that is normally formed by the high-frequency plasma power supply that is linked into the insulating electrode in the vacuum cavity and be connected with electrode, by starting the plasma electrical source exciting electrode so that vacuum cavity produces plasma.
For the ease of the speed that adjusting vacuumizes and inflates, described gas pipeline is provided with valve.
For the ease of understanding the actual working state of machine, described control circuit is connected with display screen, by the display screen operating personnel can the Real Time Observation machine operating state, such as vacuum degree, vacuum pumping rate etc.
Processor of the present utility model replaces traditional chemical liquid immersion process by the mode of utilizing plasma treatment, improves the Kong Wutong problem of high frequency plate, and it is unimpeded that high frequency PTFE plate is produced, and promotes the PCB product yield.
Description of drawings
Fig. 1 is the structural representation of the utility model processor.
Embodiment
With reference to figure 1, plasma processor of the present utility model comprises vacuum cavity 1 in the enclosure, and vacuum cavity 1 is provided with plasma jet pipeline 11; Vacuum cavity 1 is connected with vacuum pump 2 by gas pipeline 41, is provided with valve 51 at this portion gas pipeline; Vacuum cavity 1 is connected with inflator pump 3 by gas pipeline 42, is provided with valve 52. by vacuum pump and inflator pump at this section of tubing, the inflation of realization vacuum cavity and bleeding.Vacuum cavity 1 is connected with Radio-frequency plasma torch 6, and the insulating electrode of Radio-frequency plasma torch can be so that produce plasma under the driving of its plasma electrical source in the vacuum cavity.The operation of Radio-frequency plasma torch 6 is by control circuit 7 controls.
For the ease of display working condition, thereby also being connected with display screen 8, control circuit 7 is convenient to observe.

Claims (3)

1. the plasma processor that is used for PTFE, comprise body fuselage, it is characterized in that being equipped with in the shell vacuum cavity, Radio-frequency plasma torch, vacuum pump, inflator pump, control circuit, wherein vacuum cavity is connected inflator pump by gas pipeline and is connected with vacuum pump, Radio-frequency plasma torch is connected with vacuum cavity, control circuit is connected with Radio-frequency plasma torch, and vacuum cavity is provided with the plasma jet pipeline.
2. the plasma processor for PTFE according to claim 1 is characterized in that described gas pipeline is provided with valve.
3. the plasma processor for PTFE according to claim 1 is characterized in that described control circuit is connected with display screen.
CN 201220291124 2012-06-20 2012-06-20 Plasma processor for PTFE Expired - Fee Related CN202738270U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220291124 CN202738270U (en) 2012-06-20 2012-06-20 Plasma processor for PTFE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220291124 CN202738270U (en) 2012-06-20 2012-06-20 Plasma processor for PTFE

Publications (1)

Publication Number Publication Date
CN202738270U true CN202738270U (en) 2013-02-13

Family

ID=47663916

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220291124 Expired - Fee Related CN202738270U (en) 2012-06-20 2012-06-20 Plasma processor for PTFE

Country Status (1)

Country Link
CN (1) CN202738270U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107343359A (en) * 2017-06-07 2017-11-10 惠州市金百泽电路科技有限公司 A kind of processing method of the pcb board mechanical hole of PTFE material
CN108856170A (en) * 2018-05-12 2018-11-23 合肥杰硕真空科技有限公司 A kind of intermediate frequency plasma body cleaning device
CN110945975A (en) * 2017-07-24 2020-03-31 怀斯股份有限公司 Method and apparatus for processing board
CN113133305A (en) * 2021-06-03 2021-07-16 常州井芯半导体设备有限公司 Reflow soldering apparatus equipped with plasma generating device and reflow soldering method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107343359A (en) * 2017-06-07 2017-11-10 惠州市金百泽电路科技有限公司 A kind of processing method of the pcb board mechanical hole of PTFE material
CN110945975A (en) * 2017-07-24 2020-03-31 怀斯股份有限公司 Method and apparatus for processing board
CN108856170A (en) * 2018-05-12 2018-11-23 合肥杰硕真空科技有限公司 A kind of intermediate frequency plasma body cleaning device
CN113133305A (en) * 2021-06-03 2021-07-16 常州井芯半导体设备有限公司 Reflow soldering apparatus equipped with plasma generating device and reflow soldering method
CN113133305B (en) * 2021-06-03 2023-11-10 常州井芯半导体设备有限公司 Reflow soldering equipment and reflow soldering method with plasma generating device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130213

Termination date: 20210620