CN113133305A - Reflow soldering apparatus equipped with plasma generating device and reflow soldering method - Google Patents
Reflow soldering apparatus equipped with plasma generating device and reflow soldering method Download PDFInfo
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- CN113133305A CN113133305A CN202110617062.7A CN202110617062A CN113133305A CN 113133305 A CN113133305 A CN 113133305A CN 202110617062 A CN202110617062 A CN 202110617062A CN 113133305 A CN113133305 A CN 113133305A
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- reflow soldering
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- plasma generating
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- 238000005476 soldering Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 238000012545 processing Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007789 gas Substances 0.000 claims description 57
- 239000011261 inert gas Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides reflow soldering equipment with a plasma generating device and a reflow soldering method, and relates to the technical field of circuit board manufacturing. The reflow soldering equipment comprises a vacuum cavity, a heating device and a plasma generating device. Plasma generating device sets up in the vacuum cavity, is filled with the gas that can be aroused plasma by plasma generating device in the vacuum cavity, and the product of treating processing can be held to the vacuum cavity, and plasma generating device sets up in the both sides of treating the product of processing, and heating device is connected with the vacuum cavity and is used for carrying out reflow soldering processing to the product after removing the oxide film. The reflow soldering equipment is matched with a corresponding reflow soldering method, plasma gas is excited in the vacuum cavity to remove oxides of a circuit board and components by utilizing the reducibility of the plasma gas, reflow soldering is carried out by hot air circulation heating of the heating device, reflow soldering without fluxing agent is realized, the voidage of soldering tin is reduced by the vacuum effect of the vacuum cavity, and the product quality after reflow soldering is guaranteed.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to reflow soldering equipment with a plasma generating device and a reflow soldering method.
Background
During reflow soldering of the circuit board, soldering paste with soldering flux is often used, the soldering flux is heated to a certain temperature to remove oxide films on the surfaces of the circuit board and the components, and then the soldering tin is melted to realize connection of the components and the circuit board. The use of scaling powder can bring two problems, one is that the volatilization of scaling powder can lead to the inside voidage of soldering tin higher, influences the electric property and the intensity of connection, and the other is that the scaling powder can remain on the circuit board surface, and most circuit boards can clear away the residue through modes such as washing, but to the circuit board that has sensor, high-accuracy device, can't further wash. Therefore, it is important to develop a reflow soldering technique for circuit board without flux.
Disclosure of Invention
The invention aims to provide reflow soldering equipment with a plasma generating device, which can solve the problem that the existing reflow soldering needs to depend on soldering flux.
Another object of the present invention is to provide a reflow soldering method using the above-mentioned reflow soldering apparatus equipped with a plasma generation device, which can perform reflow soldering without using flux.
The embodiment of the invention is realized by the following steps:
an embodiment of the present invention provides a reflow soldering apparatus equipped with a plasma generation device, including: the device comprises a vacuum cavity, a heating device and a plasma generating device; plasma generating device set up in the vacuum cavity, be filled with in the vacuum cavity can by plasma generating device excites the gas of plasma, the product of processing can be treated to the holding by the vacuum cavity, plasma generating device sets up in the both sides of treating the product of processing and is used for getting rid of the oxide film of treating the product of processing, heating device with the vacuum cavity is connected and is used for carrying out reflow soldering processing to the product after removing the oxide film.
In addition, the reflow soldering device provided with the plasma generating device provided by the embodiment of the invention can also have the following additional technical characteristics: in an alternative embodiment of the present invention, the plasma generating device includes a high voltage electrode, a ground electrode, and a plasma power source, and the high voltage electrode and the ground electrode are respectively arranged at the left and right sides of the product to be processed and electrically connected to the plasma power source.
In an alternative embodiment of the present invention, the plasma power supply is a radio frequency power supply, and provides a radio frequency signal of 10MHz to 100MHz to the high voltage electrode and the ground electrode.
In an optional embodiment of the invention, a material rack is arranged in the vacuum cavity, the material rack comprises a plurality of support columns, and part or all of the support columns support the product to be processed together.
In an alternative embodiment of the present invention, the gas is an inert gas or a mixed gas of an inert gas and a reducing gas; when the gas is the mixed gas, the reducing gas accounts for 1-20% of the mixed gas.
In an optional embodiment of the invention, the heating device comprises a heating cavity and a heating element, the heating cavity is communicated with the vacuum cavity and can transfer hot air heated by the heating element into the vacuum cavity so as to perform reflow soldering through hot air circulation heating.
In an alternative embodiment of the present invention, the reflow soldering apparatus equipped with the plasma generation device further includes a cooling device for reducing the temperature within the vacuum chamber.
In an alternative embodiment of the present invention, the reflow soldering apparatus equipped with the plasma generating device includes a vacuum pump, and the vacuum chamber is evacuated by the vacuum pump.
In an optional embodiment of the present invention, the reflow soldering apparatus equipped with the plasma generation device further includes a pressure controller and a vacuum gauge, and the pressure controller is capable of adjusting an air intake and/or an air exhaust speed in the vacuum chamber according to the vacuum gauge to maintain a preset vacuum degree.
An embodiment of the present invention provides a reflow soldering method using any one of the above reflow soldering apparatuses equipped with a plasma generation device, the method including: vacuumizing the vacuum cavity and filling a first gas to a first rated pressure;
starting the plasma generating device to excite plasma; closing the plasma generating device and continuously filling the first gas to a second rated pressure; starting a heating device and raising the temperature in the vacuum cavity to be higher than the melting point of the soldering tin; after the soldering tin is melted, further exhausting the vacuum cavity to remove second gas in the soldering tin; charging the first gas to the second nominal pressure and cooling.
The invention has the beneficial effects that: the reflow soldering equipment provided with the plasma generating device is matched with the corresponding reflow soldering method, plasma gas is excited in the vacuum cavity, so that oxides of the circuit board and components are removed by the reducibility of the plasma gas, reflow soldering is carried out by the heated air circulation heating of the heating device, reflow soldering without fluxing agents is realized, the voidage of soldering tin is reduced by the vacuum effect of the vacuum cavity, and the product quality after reflow soldering is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a reflow soldering apparatus equipped with a plasma generation device according to an embodiment of the present invention;
FIG. 2 is an isometric view of a component of a reflow soldering apparatus equipped with a plasma generating device, with portions hidden;
fig. 3 is a schematic view of a reflow soldering apparatus equipped with a plasma generating device provided with a cooling device.
Icon: 1-vacuum chamber; 2-heating chamber; 21-a heating element; 3-a high voltage electrode; 4-a ground electrode; 5-a material rack; 51-a roller; 6-a circuit board; 7-a vacuum pump; 8-inert gas; 9-a temperature measuring probe; 10-a plasma power supply; 12-opening and closing the door; 13-an observation window; 14-a cooling device; 15-a pressure controller; 16-vacuum gauge.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, the first feature may be present on or under the second feature in direct contact with the first and second feature, or may be present in the first and second feature not in direct contact but in contact with another feature between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.
Examples
Referring to fig. 1, an embodiment of the present invention provides a reflow soldering apparatus equipped with a plasma generating device, including: vacuum chamber 1, heating device and plasma generating device.
Plasma generating device sets up in vacuum cavity 1, is filled with the gas that can be aroused plasma by plasma generating device in vacuum cavity 1, and vacuum cavity 1 can the holding treat the processing product, and plasma generating device sets up in the both sides of treating the processing product and is used for getting rid of the oxide film of treating the processing product, and heating device is connected with vacuum cavity 1 and is used for carrying out reflow soldering processing to the product after removing the oxide film.
The reflow soldering equipment provided with the plasma generating device comprises a vacuum pump 7, and the vacuum cavity 1 is vacuumized through the vacuum pump 7.
As for the vacuum chamber 1, it may be a square chamber, a ball chamber or a cylindrical chamber. Referring to fig. 2, the present embodiment is a square cavity, which is provided with a switch door 12 and a viewing window 13. The inner space of the vacuum chamber 1 can accommodate a product to be processed.
Further, be equipped with work or material rest 5 in the vacuum cavity 1 of this embodiment, work or material rest 5 includes many spinal branchs frame posts, and partial or whole spinal branchs frame post supports jointly and treats the processing product. In this embodiment, 4 support columns are adopted, and the 4 support columns can form supports at four corners of the circuit board 6. It is understood that when the circuit board 6 has different shapes, different numbers of support posts may be provided for circuit boards 6 having different shapes.
It can be understood that a plurality of support columns can be arranged in advance according to the external dimension of the circuit board 6 which is processed frequently, one circuit board 6 can be supported by a plurality of support columns, and when the other circuit board 6 is replaced by another circuit board 6, the other support columns can be used for supporting, and certainly, all the support columns can also be supported together. Different circuit boards 6 have different arrangements as long as the support can be ensured and the gas flow is not affected.
In addition, the support columns can be connected with each other, and the bottom of each support column is provided with a roller 51, so that the circuit board 6 can be conveniently driven to enter and exit the vacuum cavity 1 together. A plurality of slots can be arranged in the vacuum cavity 1 in advance, and the circuit board 6 can be placed after the support columns are inserted and fixed. Furthermore, the positions of the slots can be set according to the external dimensions of the circuit board 6 to be processed, and when one circuit board 6 is to be processed, only a corresponding number of support columns can be inserted, so that the universality of the support columns is increased, unnecessary use of the support columns can be reduced, and the influence on the gas flow is further avoided.
In addition, the support column of the embodiment can support multiple layers of circuit boards 6, so that more circuit boards 6 can be processed at one time, and the product productivity is improved.
With continuing reference to fig. 1, in the present embodiment, the plasma generating apparatus includes a high voltage electrode 3, a ground electrode 4 and a plasma power source 10, wherein the high voltage electrode 3 and the ground electrode 4 are respectively arranged on the left side and the right side of the product to be processed and are electrically connected to the plasma power source 10.
Wherein, this embodiment still includes pressure controller 15 and vacuometer 16, and pressure controller 15 can adjust the air admission and/or the speed of bleeding in vacuum cavity 1 according to vacuometer 16 in order to maintain preset vacuum, when plasma arouses, keeps vacuum, avoids influencing plasma's stability.
In detail, the surfaces of the high voltage electrode 3 and the ground electrode 4 in this embodiment are provided with an oxide film or an insulating coating to prevent the metal components of the high voltage electrode 3, the ground electrode 4 and the circuit board 6 from generating an arc, and further prevent the components from being damaged.
It should be noted that the high voltage electrode 3 and the ground electrode 4 of the present embodiment are vertically disposed and the product to be processed is disposed between the high voltage electrode 3 and the ground electrode 4. This eliminates the need to place the circuit board 6 vertically. The vertical placement of the circuit board 6 is not conducive to accurate flow of the solder after melting because the solder will flow downward under the action of gravity, resulting in defects.
In detail, the plasma power supply 10 of the present embodiment is a radio frequency power supply, and provides a radio frequency signal of 10MHz to 100MHz for the high voltage electrode 3 and the ground electrode 4. Of course, the range of the radio frequency signal is an example, and the radio frequency signal in the range is not limited to be used.
The position of the plasma power source 10 in fig. 1 is illustrative, and it is not to be understood that the plasma power source is necessarily disposed outside the vacuum chamber 1, and may be disposed inside the vacuum chamber 1.
The gas that can be used to excite the plasma by the plasma generator is the inert gas 8 or a mixed gas of the inert gas 8 and the reducing gas. A gas source is shown in fig. 1.
Wherein, when the gas is mixed gas, the proportion of the reducing gas in the mixed gas is 1-20%.
In detail, the inert gas 8 may be nitrogen, argon, helium, or the like. The mixed reducing gas may be hydrogen or CF4Or SF6And the like.
When the gas is the inert gas 8, a mixture of a plurality of inert gases 8 may be used, and there is no limitation that only one inert gas is used.
Referring to fig. 1 or fig. 3, the heating apparatus of the present embodiment includes a heating cavity 2 and a heating element 21, the heating cavity 2 is communicated with the vacuum cavity 1 and can transfer hot air heated by the heating element 21 into the vacuum cavity 1, so as to perform reflow soldering by hot air circulation heating.
A temperature probe 9 is arranged in the vacuum cavity 1 to confirm the temperature condition in the vacuum cavity 1.
Referring to fig. 3, the reflow soldering apparatus equipped with the plasma generator may further include a cooling device 14, wherein the cooling device 14 is used for reducing the temperature in the vacuum chamber 1. The temperature inside the vacuum chamber 1 can be rapidly cooled by air circulation, for example.
Based on the reflow soldering equipment provided with the plasma generating device, the embodiment of the invention provides a reflow soldering method, which comprises the following steps: vacuumizing the vacuum cavity 1 and filling a first gas to a first rated pressure; starting a plasma generating device to excite plasma; closing the plasma generating device and continuously filling the first gas to a second rated pressure; starting the heating device and raising the temperature in the vacuum cavity 1 to be higher than the melting point of the soldering tin; after the soldering tin is melted, further exhausting the vacuum cavity 1 to remove second gas in the soldering tin; charging the first gas to a second rated pressure and cooling.
The first gas is the above-mentioned inert gas 8 or a mixed gas of the inert gas 8 and a reducing gas. The second gas may have the same composition as the first gas or may be a gas containing an impurity gas in the solder, and it is important that the gas in the solder is exhausted and not its composition. The void ratio of the soldering tin can be reduced and the product quality can be improved by discharging the gas in the soldering tin.
The first rated pressure may be 200Pa, or may be other pressure values, and an operator may select or test a suitable pressure value as the first rated pressure of different circuit boards 6 according to the processing requirement. Accordingly, the second rated pressure of the present embodiment is the standard atmospheric pressure, and when there are different pressure value requirements, other pressure values may also be set, and the standard atmospheric pressure adopted in the present embodiment is only for example.
The principle of the embodiment is as follows:
by evacuating and filling inert gas 8, plasma is generated, and these gases do not generate oxidation, and even reducing gases such as hydrogen can be added to improve the reduction of the metal oxide film and thus enhance the wetting of the solder to the circuit board 6. Meanwhile, the solder can be further vacuumized after being melted, so that gas in the solder can escape to reduce the void ratio.
In addition, in the embodiment, hot air is used for backflow, so that the temperature uniformity is improved, and the uniform heating of the multilayer circuit board can be realized. In addition, the material rack 5 of the embodiment is designed into 4 support columns, the periphery of the circuit board 6 is not blocked, the flowing of hot air is met, and the temperature is more uniform. Meanwhile, the generation and the flow of plasma are facilitated, and the uniform treatment of the circuit board 6 is realized.
To sum up, the corresponding reflow soldering method of the reflow soldering equipment cooperation that is equipped with plasma generating device of this application excites plasma gas in vacuum cavity 1 to utilize plasma gas's reductibility to get rid of the oxide of circuit board 6 and components and parts, then the heated air circulation heating through heating device carries out reflow soldering, realizes the reflow soldering of no fluxing agent, and has reduced the void ratio of soldering tin through vacuum cavity 1's vacuum effect, ensures the product quality after reflow soldering.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A reflow soldering apparatus equipped with a plasma generating device, comprising: the device comprises a vacuum cavity, a heating device and a plasma generating device; plasma generating device set up in the vacuum cavity, be filled with in the vacuum cavity can by plasma generating device excites the gas of plasma, the product of processing can be treated to the holding by the vacuum cavity, plasma generating device sets up in the both sides of treating the product of processing and is used for getting rid of the oxide film of treating the product of processing, heating device with the vacuum cavity is connected and is used for carrying out reflow soldering processing to the product after removing the oxide film.
2. The reflow apparatus equipped with a plasma generating device according to claim 1, wherein the plasma generating device includes a high voltage electrode, a ground electrode and a plasma power supply, the high voltage electrode and the ground electrode being respectively arranged at left and right sides of a product to be processed and electrically connected to the plasma power supply.
3. The reflow apparatus having a plasma generation device in accordance with claim 2, wherein the plasma power source is a radio frequency power source supplying a radio frequency signal of 10MHz to 100MHz to the high voltage electrode and the ground electrode.
4. The reflow soldering apparatus equipped with a plasma generation device according to claim 1, wherein a rack is provided in the vacuum chamber, the rack comprises a plurality of support columns, and part or all of the support columns support the product to be processed.
5. The reflow apparatus equipped with a plasma generation device according to claim 1, wherein the gas is an inert gas or a mixed gas of an inert gas and a reducing gas;
when the gas is the mixed gas, the reducing gas accounts for 1-20% of the mixed gas.
6. The reflow soldering apparatus equipped with a plasma generation device according to claim 1, wherein the heating device comprises a heating chamber and a heating element, the heating chamber is communicated with the vacuum chamber and can transfer hot air heated by the heating element into the vacuum chamber for reflow soldering through hot air circulation heating.
7. The plasma generating apparatus equipped reflow soldering apparatus according to claim 1, further comprising a cooling apparatus for reducing a temperature within the vacuum chamber.
8. The plasma generating apparatus equipped reflow soldering apparatus according to claim 1, wherein the plasma generating apparatus equipped reflow soldering apparatus includes a vacuum pump, and the vacuum chamber is evacuated by the vacuum pump.
9. The plasma generating apparatus equipped reflow soldering apparatus according to claim 1, further comprising a pressure controller and a vacuum gauge, wherein the pressure controller is capable of adjusting an air intake and/or air exhaust speed in the vacuum chamber according to the vacuum gauge to maintain a preset vacuum degree.
10. A reflow soldering method using the reflow soldering apparatus equipped with the plasma generation device according to any one of claims 1 to 9, the method comprising: vacuumizing the vacuum cavity and filling a first gas to a first rated pressure; starting the plasma generating device to excite plasma; closing the plasma generating device and continuously filling the first gas to a second rated pressure; starting a heating device and raising the temperature in the vacuum cavity to be higher than the melting point of the soldering tin; after the soldering tin is melted, further exhausting the vacuum cavity to remove second gas in the soldering tin; charging the first gas to the second nominal pressure and cooling.
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| CN202110617062.7A CN113133305B (en) | 2021-06-03 | 2021-06-03 | Reflow soldering equipment and reflow soldering method with plasma generating device |
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| CN202110617062.7A CN113133305B (en) | 2021-06-03 | 2021-06-03 | Reflow soldering equipment and reflow soldering method with plasma generating device |
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