CN202585414U - Light emitting diode device - Google Patents
Light emitting diode device Download PDFInfo
- Publication number
- CN202585414U CN202585414U CN2012202420545U CN201220242054U CN202585414U CN 202585414 U CN202585414 U CN 202585414U CN 2012202420545 U CN2012202420545 U CN 2012202420545U CN 201220242054 U CN201220242054 U CN 201220242054U CN 202585414 U CN202585414 U CN 202585414U
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- China
- Prior art keywords
- emitting diode
- light
- substrate
- backlight unit
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 description 10
- 238000000605 extraction Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Led Device Packages (AREA)
Abstract
The utility model discloses a light emitting diode device which includes a substrate, a support, and light emitting diode chips. The substrate is provided with an insulating layer and a conducting layer arranged on the insulating layer. The support is provided with a recessed opening and cooperates with the substrate to form a light opening of a cup structure of the light emitting diode device. The light emitting diode chips are arranged on the substrate and are electrically connected with the conducting layer. The substrate is provided with multiple grooves, and the multiple light emitting diode chips are correspondingly arranged into the multiple grooves. The light emitting diode device has the advantages of flexible chip design, high light emitting efficiency, and simple design and production.
Description
Technical field
The utility model relates to light-emitting diode assembly, especially relate to a kind of simple in structure, the light-emitting diode assembly that luminous efficiency is high.
Background technology
Light-emitting diode (LED) light source has that luminous efficiency height, power consumption are few, long service life, safe and reliable and environmentally friendly advantage, therefore obtains application more and more widely.
Along with the expansion of LED range of application, the application of the LED matrix of high brightness is also more and more.Mostly by a plurality of led chip assembled package, a plurality of led chips influence each other luminous and complicated circuit the high-brightness LED device.Thereby the design of high-brightness LED device and the production of conventional art are complicated, and light source interior lights loss amount is big, and luminous efficiency is not high.
Therefore, be necessary to provide a kind of new light-emitting diode assembly to overcome above-mentioned defective.
The utility model content
The utility model technical problem to be solved provides a kind of simple in structure, the high-brightness LED device that luminous efficiency is high.
The utility model adopts following technical scheme to achieve these goals: a kind of light-emitting diode assembly comprises: substrate, said substrate are provided with insulating barrier and are arranged on the conductive layer on the said insulating barrier; Support, said support form the indent opening and cooperate the light projector mouth that forms said light-emitting diode assembly bowl cup structure with said substrate; Light-emitting diode chip for backlight unit, said light-emitting diode chip for backlight unit are arranged on the said substrate and are electrically connected said conductive layer; And said light-emitting diode chip for backlight unit is a plurality of, and said substrate correspondence is provided with a plurality of grooves, and said a plurality of light-emitting diode chip for backlight unit place said a plurality of groove.
As optimized technical scheme, said light-emitting diode chip for backlight unit is at least 3, and corresponding with it, said groove also is at least 3.
As optimized technical scheme, the light-emitting diode chip for backlight unit in said a plurality of grooves adopts a kind of mode in parallel connection, series connection, string and three kinds of modes of series-parallel connection to be electrically connected.
The design of a plurality of led chips makes LED matrix can realize luminous brightness, and, because corresponding a plurality of led chips are provided with a plurality of grooves on the substrate; Led chip places in the said groove, can avoid absorbing each other between the led chip light or block light and propagate, and has improved the light extraction efficiency of LED matrix; Simultaneously; Led chip can adopt modes such as parallel connection, series connection, string and series-parallel connection to be electrically connected, and circuit design is simple, thereby makes LED matrix simple in structure; And improved the flexibility of chip design, be easy to produce and realize.Therefore, the utlity model has design and produce simply the advantage that light extraction efficiency is high.
Description of drawings
Fig. 1 is the utility model light-emitting diode assembly embodiment one cutaway view.
Fig. 2 is a light-emitting diode assembly vertical view shown in Figure 1.
Fig. 3 is the utility model light-emitting diode assembly embodiment two vertical views.
Fig. 4 is the utility model light-emitting diode assembly embodiment three vertical views.
Embodiment
Below in conjunction with accompanying drawing, specify the utility model light-emitting diode assembly.
Embodiment one: see also Fig. 1, the utility model LED matrix comprises: substrate 1, substrate 1 comprise insulating barrier and the conductive layer that is arranged at the insulating barrier top, and conductive layer is electrically connected with external circuit; Support 2, support 2 form the indent openings and cooperate the light projector mouth of formation light-emitting diode assembly bowl cup structure with substrate 1; Light-emitting diode chip for backlight unit 3, light-emitting diode chip for backlight unit 3 is arranged on the substrate 1, and is electrically connected with substrate 1 conductive layer, and in order to guarantee the antioxygenic property of electric conductivity and lead, present embodiment adopts gold thread to be electrically connected light-emitting diode chip for backlight unit 3 and substrate 1 conductive layer; Glue-line 5, glue-line 5 is filled said bowl cup structure and is coated light-emitting diode chip for backlight unit 3, and the luminous needs according to LED matrix are mixed with fluorescent material in the glue-line 5.Wherein, in order to guarantee the luminosity of LED matrix, light-emitting diode chip for backlight unit 3 is a plurality of, and is no less than three, and light-emitting diode chip for backlight unit 3 is 3 in the present embodiment.
On the substrate 1, respective leds chip 3 is provided with groove 4, and in the present embodiment, because light-emitting diode chip for backlight unit 3 is 3, groove 4 also is 3, and light-emitting diode chip for backlight unit 3 adopts solid brilliant technology to be fixedly arranged in the groove 4.As shown in Figure 2,3 light-emitting diode chip for backlight unit are transversely arranged, are electrically connected in substrate 1 conductive layer after 3 light-emitting diode chip for backlight unit are electrically connected again, and promptly adopt the mode of series connection to be electrically connected between the light-emitting diode chip for backlight unit 3, and circuit structure is simple.
3 chips 3 are provided with the luminosity that has guaranteed the utility model light-emitting diode assembly in the present embodiment; Simultaneously; Because 3 chips place in three grooves 4, avoided between the light-emitting diode chip for backlight unit 3 absorption of light with each other the stopping of light ray propagation circuit improved luminous efficiency.
Embodiment two: present embodiment and embodiment one difference only are electric connection mode between the light-emitting diode chip for backlight unit 3.
As shown in Figure 3,3 light-emitting diode chip for backlight unit 3 are vertically arranged, and are corresponding with it, and 3 substrate recess 4 are also vertically arranged, and 3 light-emitting diode chip for backlight unit 3 are electrically connected with substrate 1 conductive layer respectively, promptly adopt the mode of parallel connection to be electrically connected between the light-emitting diode chip for backlight unit.
Adopt the parallel connection design between the light-emitting diode chip for backlight unit 3, avoided the influencing each other of operating state between luminous two chips 3, improved the utility model light-emitting diode assembly stability.
Embodiment three: present embodiment and above-mentioned two embodiment difference also are electric connection mode between the light-emitting diode chip for backlight unit 3.
As shown in Figure 4; 3 light-emitting diode chip for backlight unit 3 are divided into two groups; Wherein two light-emitting diode chip for backlight unit interconnect earlier and are electrically connected with substrate 1 conductive layer; I.e. these two light-emitting diode chip for backlight unit series connection, a remaining light-emitting diode chip for backlight unit is electrically connected with substrate 1 conductive layer, the led chip parallel connection of promptly connecting with above-mentioned two.Corresponding 3 light-emitting diode dies 3 also are provided with 3 grooves 4, and light-emitting diode die 3 places in the groove 4.
In the present embodiment, the string and the electric connection mode of series-parallel connection can effectively improve the flexibility of chip design between the light-emitting diode chip for backlight unit 3, and circuit structure is simple and can avoid influencing each other of operating state between the light-emitting diode die 3 to a certain extent.
More than among three embodiment, a plurality of led chips 3 have guaranteed the luminosity of LED matrix, and the groove 4 that corresponding led chip 3 is provided with holds led chip 3, avoids 3 pairs of influences of light each other of led chip, has improved light extraction efficiency.Led chip 3 adopts the mode of series, parallel or string and series-parallel connection to be electrically connected, and has improved the flexibility of led chip design, has also simplified circuit design, is convenient to produce and implements.
Should know, more than three embodiment only between the led chip electric connection mode different, the utility model LED matrix is implemented and is produced and realize not having influence, all can demonstrate fully the utility model LED matrix advantage.
More than be merely the utility model case study on implementation, be not limited to the utility model,, all should include in the protection range of putting down in writing in claims as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed.
Claims (3)
1. light-emitting diode assembly comprises:
Substrate, said substrate are provided with insulating barrier and are arranged on the conductive layer on the said insulating barrier;
Support, said support form the indent opening and cooperate the light projector mouth that forms said light-emitting diode assembly bowl cup structure with said substrate;
Light-emitting diode chip for backlight unit, said light-emitting diode chip for backlight unit are arranged on the said substrate and are electrically connected said conductive layer;
It is characterized in that: said light-emitting diode chip for backlight unit is a plurality of, and said substrate correspondence is provided with a plurality of grooves, and said a plurality of light-emitting diode chip for backlight unit place said a plurality of groove.
2. light-emitting diode assembly according to claim 1 is characterized in that: said light-emitting diode chip for backlight unit is at least 3, and corresponding with it, said groove also is at least 3.
3. light-emitting diode assembly according to claim 1 and 2 is characterized in that: the light-emitting diode chip for backlight unit in said a plurality of grooves adopts a kind of mode in parallel connection, series connection, string and three kinds of modes of series-parallel connection to be electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202420545U CN202585414U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202420545U CN202585414U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202585414U true CN202585414U (en) | 2012-12-05 |
Family
ID=47254796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202420545U Expired - Lifetime CN202585414U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202585414U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304794A (en) * | 2015-10-30 | 2016-02-03 | 东莞市光宇实业有限公司 | High-power LED encapsulation structure |
| CN112736071A (en) * | 2019-10-29 | 2021-04-30 | 深圳第三代半导体研究院 | High-power chip embedded packaging heat dissipation structure and preparation method thereof |
-
2012
- 2012-05-28 CN CN2012202420545U patent/CN202585414U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304794A (en) * | 2015-10-30 | 2016-02-03 | 东莞市光宇实业有限公司 | High-power LED encapsulation structure |
| CN112736071A (en) * | 2019-10-29 | 2021-04-30 | 深圳第三代半导体研究院 | High-power chip embedded packaging heat dissipation structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |
|
| CX01 | Expiry of patent term |