CN202839604U - Light-emitting diode device - Google Patents
Light-emitting diode device Download PDFInfo
- Publication number
- CN202839604U CN202839604U CN2012204854587U CN201220485458U CN202839604U CN 202839604 U CN202839604 U CN 202839604U CN 2012204854587 U CN2012204854587 U CN 2012204854587U CN 201220485458 U CN201220485458 U CN 201220485458U CN 202839604 U CN202839604 U CN 202839604U
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- bowl
- cup
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses a light-emitting diode device. The light-emitting diode device comprises a substrate, wherein a conductive electrode is arranged on the insulation layer; a bracket, wherein concave openings are formed on the bracket and cooperated with the substrate to form bowl-shaped structures of the light-emitting diode device; a light-emitting diode chip, wherein the light-emitting diode chip is arranged on the substrate; a fluorescence glue, wherein the light-emitting diode chip is coated by the fluorescence glue and the bowl-shaped structures of the light-emitting diode device are filled by the fluorescence glue, simultaneously the bracket and the substrate form several bowl-shaped structures; the light-emitting diode chips are respectively arranged in the bowl-shaped structures; a plurality of conductive electrodes corresponding to the bowl-shaped structures are arranged on the substrate, and the light-emitting diode chips in the bowl-shaped structures are respectively and electrically connected with the conductive electrodes corresponding to the bowl-shaped structures, and the conductive electrodes are electrically and respectively connected with an external electronic circuit. The light-emitting diode device has the advantages of low cost, flexible utilization and high reliability.
Description
Technical field
The utility model relates to the light-emitting diode diode apparatus, especially relates to a kind of luminous flux large, and low cost of manufacture is used flexibly the light-emitting diode assembly that reliability is high.
Background technology
Light-emitting diode (Light Emitting Diode, LED) is as a kind of green light source, has that luminous efficiency is high, power consumption is few, a long service life, safe and reliable and environmentally friendly advantage.Along with the lifting of people's environmental consciousness, LED matrix more and more receives people's concern.Along with the extensive use of LED matrix, the high-power LED device demand is increasing.But the high-power LED chip cost is high, directly causes traditional high-power LED device manufacturing cost high, and simultaneously, how improving luminous flux also is the problem that traditional high-power LED device will be considered.
Therefore, be necessary to propose a kind of improvement to overcome the defective of traditional high-power LED device.
The utility model content
It is large that technical problem to be solved in the utility model provides a kind of luminous flux, and low cost of manufacture is used flexibly the light-emitting diode assembly that reliability is high.
To achieve these goals, the utility model is by the following technical solutions:
A kind of light-emitting diode assembly comprises: substrate is provided with insulating barrier and is arranged on conductive electrode on the described insulating barrier on the described substrate; Support, described support form the indent opening and cooperate formation light-emitting diode assembly bowl cup structure with described substrate; Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are arranged on the described substrate; Fluorescent glue, described fluorescent glue coats described light-emitting diode chip for backlight unit, and fills described light-emitting diode bowl cup structure; Simultaneously, the bowl cup structure of described support and described substrate formation is a plurality of; Be respectively arranged with described light-emitting diode chip for backlight unit in the described a plurality of bowls of cup structures; The corresponding described bowl of a described substrate cup structure is provided with a plurality of described conductive electrodes, and the light-emitting diode chip for backlight unit in the described a plurality of bowls of cup structures is electrically connected respectively with to conductive electrode that should the bowl cup, and described a plurality of conductive electrodes are electrically connected with external electronic circuits respectively.
As a kind of preferred technical scheme, the light-emitting diode chip for backlight unit that arranges in the described a plurality of bowls of cup structures is the different capacity chip.
As a kind of preferred technical scheme, fill respectively different fluorescent colloids in the described a plurality of bowls of cup structures.
As a kind of preferred technical scheme, light-emitting diode chip for backlight unit can simultaneously luminously also can be distinguished luminous separately in the described a plurality of bowls of cup structures.
As a kind of preferred technical scheme, not of uniform size the causing of described a plurality of bowls of cup structures.
As a kind of preferred technical scheme, described a plurality of bowls of cup structures are two.
The utility model light-emitting diode assembly owing to adopting a plurality of bowls of cup structures, is respectively arranged with light-emitting diode chip for backlight unit in the bowl cup structure, can be in the situation that guaranteed output effectively reduces the light-emitting diode assembly manufacturing cost; The luminous flux of many bowls of cup structures is higher than the luminous flux of single bowl cup structure chip light emitting; The bowl cup has independent circuits control, can design connection in series-parallel or independent control by outside line, can select to light simultaneously use during use and also can light respectively, uses flexibly; The heat radiation of many bowls of cups, circuit independent design can avoid being superimposed with of heat to be beneficial to the useful life that prolongs product, improve product reliability.Therefore, the utlity model has low cost of manufacture, use flexibly the advantage that reliability is high.
Description of drawings
Fig. 1 is the utility model embodiment vertical view.
Fig. 2 is the utility model embodiment cutaway view.
Embodiment
Below in conjunction with accompanying drawing, introduce in detail the utility model light-emitting diode assembly structure.
As depicted in figs. 1 and 2, the utility model light-emitting diode assembly comprises substrate 1, and substrate 1 includes insulating barrier and is arranged on conductive electrode on the insulating barrier; Support 2, support 2 forms the indent opening, and forms the bowl cup structure with substrate 1, and support 2 forms first bowl of cup 41 and second bowl of cup 42 with substrate 1, and substrate 1 corresponding first bowl of cup 41 and second bowl of cup 42 are provided with the first conductive electrode 11 and the second conductive electrode 12; Light-emitting diode chip for backlight unit, the first light-emitting diode chip for backlight unit 31 is arranged in first bowl of cup 41, the second light-emitting diode chip for backlight unit 32 is arranged in second bowl of cup 42, the first light-emitting diode chip for backlight unit 31 is electrically connected with the first conductive electrode 11, and the second light-emitting diode chip for backlight unit 32 is electrically connected with the second conductive electrode 12; Fluorescent glue is filled with in first bowl of cup 41 in 51, the second bowls of cups of the first fluorescent glue and is filled with the second fluorescent glue 52.The present embodiment only is used for explanation the utility model structure, in actual applications, can be provided with a plurality of bowls of cup structures as required, does not affect the utility model enforcement and application.
The first light-emitting diode chip for backlight unit 31 and the second light-emitting diode chip for backlight unit 32 can be the different capacity chip.The cost of two lower powered light-emitting diode chip for backlight unit is lower than a high-power light-emitting diode chip for backlight unit cost, and therefore, the utility model light-emitting diode assembly can effectively reduce production costs in the situation of the Integral luminous power that guarantees the light-emitting diode device.The luminous flux that luminous flux when the first light-emitting diode chip for backlight unit 31 and 32 work of the second light-emitting diode chip for backlight unit also sends greater than a high power LED chip, therefore, the utility model light-emitting diode assembly has advantages of that luminous flux is large.
As depicted in figs. 1 and 2, first bowl of cup 41 is less than second bowl of cup 42, simultaneously, the first light-emitting diode chip for backlight unit 31 is arranged at first bowl of cup 41 and second bowl of cup, 42 relative middle positions with the second light-emitting diode chip for backlight unit 32 correspondences, with luminously not stopping and absorption between mutually of guaranteeing chip in the bowl cup, thereby improve luminous flux output.
The first conductive electrode 11 and the second conductive electrode 12 are electrically connected with external circuit respectively, thereby make the first light-emitting diode chip for backlight unit 31 and the second light-emitting diode chip for backlight unit 32 can be as required, adopt the modes such as parallel connection, series connection, independent control to be electrically connected, thereby make the first light-emitting diode chip for backlight unit 31 and the second light-emitting diode chip for backlight unit 32 as required, luminous or simultaneously luminous separately, the utility model light-emitting diode assembly is used flexibly, can satisfy different light demands.
The first fluorescent glue 51 and the second fluorescent glue 52 are filled in first bowl of cup 41 and second bowl of cup 42 interior resolution, in order to satisfy different luminous requirements, the first fluorescent glue 51 can be different fluorescent glues with the second fluorescent glue 52, thereby the light that first bowl of cup 41 sent is photochromic different from the light that second bowl of cup 42 sends, and further increases the application of the utility model light-emitting diode assembly and uses flexibility ratio.
This light-emitting diode assembly, owing to having adopted two bowls of cup structures, the heat radiation of two bowls of cups, the equal independent design of circuit can be avoided the stack of heat, are conducive to prolong the useful life of product.Simultaneously when light-emitting diode chip for backlight unit goes wrong (short interruption etc.) in the bowl cup, light-emitting diode chip for backlight unit still can work in another bowl cup, can guarantee that whole module or light fixture still can normally use needn't maintain and replace, is conducive to guarantee the reliability and stability of product.
Be the utility model case study on implementation only below, be not limited to the utility model, as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (6)
1. light-emitting diode assembly comprises:
Substrate is provided with insulating barrier and is arranged on conductive electrode on the described insulating barrier on the described substrate;
Support, described support form the indent opening and cooperate the described light-emitting diode assembly bowl cup structure of formation with described substrate;
Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are arranged on the described substrate;
Fluorescent glue, described fluorescent glue coats described light-emitting diode chip for backlight unit, and fills described light-emitting diode bowl cup structure;
It is characterized in that: the bowl cup structure that described support and described substrate form is a plurality of; Be respectively arranged with described light-emitting diode chip for backlight unit in the described a plurality of bowls of cup structures; The corresponding described bowl of a described substrate cup structure is provided with a plurality of described conductive electrodes, and the light-emitting diode chip for backlight unit in the described a plurality of bowls of cup structures is electrically connected respectively with to conductive electrode that should the bowl cup, and described a plurality of conductive electrodes are electrically connected with external electronic circuits respectively.
2. light-emitting diode assembly according to claim 1 is characterized in that: the light-emitting diode chip for backlight unit that arranges in the described a plurality of bowls of cup structures is the different capacity chip.
3. light-emitting diode assembly according to claim 1 is characterized in that: fill respectively different fluorescent colloids in the described a plurality of bowls of cup structures.
4. light-emitting diode assembly according to claim 1 is characterized in that: light-emitting diode chip for backlight unit can simultaneously luminously also can be distinguished luminous separately in the described a plurality of bowls of cup structures.
5. light-emitting diode assembly according to claim 1 is characterized in that: not of uniform size the causing of described a plurality of bowls of cup structures.
6. light-emitting diode assembly according to claim 1 or 5, it is characterized in that: described a plurality of bowls of cup structures are two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204854587U CN202839604U (en) | 2012-09-22 | 2012-09-22 | Light-emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204854587U CN202839604U (en) | 2012-09-22 | 2012-09-22 | Light-emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839604U true CN202839604U (en) | 2013-03-27 |
Family
ID=47951244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204854587U Expired - Lifetime CN202839604U (en) | 2012-09-22 | 2012-09-22 | Light-emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202839604U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856315A (en) * | 2012-09-22 | 2013-01-02 | 歌尔声学股份有限公司 | Light-emitting diode device |
| CN106876555A (en) * | 2017-04-17 | 2017-06-20 | 惠州雷曼光电科技有限公司 | Surface mount type LED support and adopting surface mounted LED device |
| CN109075184A (en) * | 2016-05-03 | 2018-12-21 | 首尔伟傲世有限公司 | Light emitting diode |
| CN114335290A (en) * | 2019-08-13 | 2022-04-12 | 光宝光电(常州)有限公司 | Packaging structure |
-
2012
- 2012-09-22 CN CN2012204854587U patent/CN202839604U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856315A (en) * | 2012-09-22 | 2013-01-02 | 歌尔声学股份有限公司 | Light-emitting diode device |
| CN109075184A (en) * | 2016-05-03 | 2018-12-21 | 首尔伟傲世有限公司 | Light emitting diode |
| CN109075184B (en) * | 2016-05-03 | 2023-07-21 | 首尔伟傲世有限公司 | Light emitting diode |
| CN106876555A (en) * | 2017-04-17 | 2017-06-20 | 惠州雷曼光电科技有限公司 | Surface mount type LED support and adopting surface mounted LED device |
| CN114335290A (en) * | 2019-08-13 | 2022-04-12 | 光宝光电(常州)有限公司 | Packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: GOERTEK Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |