TWI411390B - Devices in series for continuous cooling/ heating - Google Patents
Devices in series for continuous cooling/ heating Download PDFInfo
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- TWI411390B TWI411390B TW99124603A TW99124603A TWI411390B TW I411390 B TWI411390 B TW I411390B TW 99124603 A TW99124603 A TW 99124603A TW 99124603 A TW99124603 A TW 99124603A TW I411390 B TWI411390 B TW I411390B
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本發明係與溫度傳導裝置有關，特別有關於一種具有致冷晶片的溫度傳導裝置。 The present invention relates to temperature conducting devices, and more particularly to a temperature conducting device having a cooled wafer.
傳統空調裝置需使用冷煤，然，冷煤在製造與回收上會帶來嚴重的環境污染問題，因此已出現有利用熱電致冷晶片(Thermoelectric Cooling Chip)取代使用冷媒之空調機的想法。 Conventional air-conditioning units require the use of cold coal. However, cold coal causes serious environmental pollution problems in manufacturing and recycling. Therefore, there has been an idea of using a thermoelectric cooling chip to replace an air conditioner using a refrigerant.
由於熱電致冷晶片(以下簡稱致冷晶片)具有體積小、無噪音、不使用冷煤、無環保公害等優點，故已有不少熱電致冷晶片的應用實例，如將其應用在電腦CPU的冷卻、除濕箱、車用行動冷藏箱等等裝置上；另外，如中華民國申請之第I270650號專利，係揭示一種快速致冷雙溫散熱器件，其具有一致冷晶片、兩導熱塊至少一支以上或一或兩組若干超導熱管和兩散熱鰭片構成，該致冷晶片的其中一側產生冷溫溫度，而於另一側則相對產生熱溫溫度，並分別直接傳導至其兩側的導熱塊上，隨即再傳導至插裝在各該導熱塊中的超導熱管的先端，將該冷、熱溫度分別快速導達、移熱至該各超導熱管先端的散熱鰭片上，俾分別作散熱或冷卻之用。 Since thermoelectrically cooled wafers (hereinafter referred to as cryogenic wafers) have the advantages of small size, no noise, no use of cold coal, no environmental pollution, and so on, there are many application examples of thermoelectric cooling chips, such as applying them to computer CPUs. In the case of the cooling, dehumidification tank, the vehicle's mobile refrigerator, and the like; in addition, as disclosed in the Patent No. I270650 of the Republic of China, a rapid cooling double temperature radiator member having a uniform cold wafer and at least one heat conducting block is disclosed. One or more sets of superconducting heat pipes and two heat dissipating fins, one side of the refrigerating wafer generates a cold temperature, and the other side generates a relative temperature and is directly transmitted to the two The heat conducting block on the side is then re-conducted to the front end of the superconducting heat pipe inserted in each of the heat conducting blocks, and the cold and hot temperatures are respectively quickly guided and transferred to the heat radiating fins of the front ends of the superconducting heat pipes.俾Use for heat dissipation or cooling separately.
上揭專利係欲以熱電致冷晶片而達到的致冷和散熱效果，惟，其致冷和散熱效果不佳的原因在於：該熱電致冷晶片的溫度無法降低至所要求的溫度，進而無法達到所要求的散熱要求或致冷溫度。 The above patents are intended to be cooled and dissipated by thermoelectrically cooled wafers. However, the reason for the poor cooling and heat dissipation is that the temperature of the thermoelectrically cooled wafer cannot be lowered to the required temperature, and thus cannot be Meet the required heat dissipation requirements or cooling temperatures.
有鑑於此，本發明人為改善並解決上述之缺失，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本發明。 In view of the above, the present inventors have made great efforts to improve and solve the above-mentioned shortcomings, and have finally made a proposal to rationally and effectively improve the above-mentioned defects.
本發明之一目的，在於提供一種串聯型連續降溫及升溫裝置，係將複數氣冷式散熱器予以串聯，藉以持續降低致冷的溫度，進而達到所要求的致冷效果。 An object of the present invention is to provide a series-type continuous cooling and temperature increasing device in which a plurality of air-cooled radiators are connected in series to continuously reduce the temperature of the cooling, thereby achieving the desired cooling effect.
本發明之另一目的，在於提供一種串聯型連續降溫及升溫裝置，係將複數氣冷式散熱器予以串聯，藉以持續提高致熱的溫度，進而達到所要求的致熱效果。 Another object of the present invention is to provide a series-type continuous cooling and temperature increasing device in which a plurality of air-cooled heat sinks are connected in series to continuously increase the heating temperature to achieve the desired heating effect.
為了達成上述之目的，本發明係為一種串聯型連續降溫及升溫裝置，包括液冷式冷卻器、複數致冷晶片及複數氣冷式散熱器；液冷式冷卻器包含複數水冷座、連接管、水冷排及輸水管，各水冷分別具有一出水口及一入水口，連接管以串聯方式連通任二相鄰水冷座的出水口和入水口，水冷排配置在水冷座的一側邊，輸水管連通水冷座及水冷排；每一致冷晶片具有相對的冷端面及熱端面，冷端面貼接在水冷座上；氣冷式散熱器對應致冷晶片配設，每一氣冷式散熱器包含基座、超導管及多數鰭片，基座貼接在熱端面上，超導管固定在基座中，多數鰭片套接在超導管上。 In order to achieve the above object, the present invention is a series continuous cooling and temperature increasing device, comprising a liquid cooled cooler, a plurality of cryogenic wafers and a plurality of air cooled radiators; the liquid cooled cooler comprises a plurality of water cooling seats and connecting pipes Water cooling pipe and water pipe, each water cooling has a water outlet and a water inlet, and the connecting pipe is connected in series to the water outlet and the water inlet of any two adjacent water cooling seats, and the water cooling row is arranged on one side of the water cooling seat, and the water cooling row is arranged on one side of the water cooling seat. The water pipe is connected to the water cooling seat and the water cooling row; each of the uniform cold chips has opposite cold end faces and hot end faces, and the cold end faces are attached to the water cooling seat; the air cooled heat sinks are arranged corresponding to the cooling fins, and each air cooled radiator comprises a base. Seat, supercatheter and most fins, the base is attached to the hot end face, the supercatheter is fixed in the base, and most fins are sleeved on the supercatheter.
本發明之再一目的，在於提供一種使用少量電力的串聯型連續降溫及升溫裝置，其可在一般壓縮機無法使用的惡劣環境溫度下使用，進而替代冷煤的使用，以徹底解決因冷煤所造成的環境污染及溫室效應問題，並能大量節省能源。 A further object of the present invention is to provide a series-type continuous cooling and temperature increasing device using a small amount of electric power, which can be used in a harsh ambient temperature that cannot be used by a general compressor, thereby replacing the use of cold coal to completely solve the problem of cold coal. The resulting environmental pollution and greenhouse effect problems can save a lot of energy.
相較於習知，本發明之串聯型連續降溫及升溫裝置，經由連通管，並以串聯方式連通任二相鄰水冷座的該出水口和入水口，藉此持續地降低致冷溫度，進而達到所要求的致冷效果，另一方面，其散熱器亦將持續升高的致熱溫度送出，進而達到所要求的致熱效果；再者，其超導管的超導液體由氫氧化鈉、鉻酸鉀、乙醇及水等物質的混合物依不同比例所組成，汽化後係藉由分子間的相互推擠、碰撞而將熱自熱端傳遞至冷端，使該超導液體不需回流而無能量損耗；另外，超導液體的能量傳遞快、能快速帶走致冷晶片大量的熱，故其致冷晶片具有極佳的致冷效果，進而達到所要求的致冷溫度，增加本發明之實用性；此外，相較於習知需使用大電量的壓縮機等元件的空調裝置，本發明僅需提供小量的電力(供置冷晶片及風扇)即可運作，可節省大量的能源及電費，更符合環保性及經濟性。 Compared with the prior art, the series continuous cooling and temperature increasing device of the present invention continuously connects the water outlet and the water inlet of any two adjacent water cooling seats via a connecting pipe, thereby continuously reducing the cooling temperature, thereby further reducing the cooling temperature. To achieve the required cooling effect, on the other hand, the radiator is also sent out at a rising heating temperature to achieve the required heating effect; further, the superconducting superconducting liquid of the superconducting tube is made of sodium hydroxide, The mixture of potassium chromate, ethanol and water is composed of different proportions. After vaporization, the hot self-heating end is transferred to the cold end by mutual pushing and collision between molecules, so that the superconducting liquid does not need to be reflowed. No energy loss; in addition, the superconducting liquid has fast energy transfer and can quickly take away a large amount of heat of the cooled wafer, so that the cooled wafer has an excellent cooling effect, thereby achieving the required cooling temperature, and increasing the present invention. In addition, compared with conventional air conditioning devices that require components such as large-capacity compressors, the present invention only needs to provide a small amount of power (for cooling chips and fans) to operate, and can save a lot of energy. And electricity , More environmentally friendly and economy.
1、1’‧‧‧串聯型連續降溫及升溫裝置 1, 1'‧‧‧ series continuous cooling and temperature rising device
10a~10c‧‧‧致冷晶片 10a~10c‧‧‧Cold wafer
11a、11b‧‧‧冷端面 11a, 11b‧‧‧ cold end face
12a、12b‧‧‧熱端面 12a, 12b‧‧‧ hot end face
20‧‧‧液冷式冷卻器 20‧‧‧ liquid cooled cooler
21a~21c‧‧‧水冷座 21a~21c‧‧‧Water Cooling Block
211a、211b‧‧‧入水口 211a, 211b‧‧‧ water inlet
212a、212b‧‧‧出水口 212a, 212b‧‧‧ water outlet
22、22a‧‧‧連接管 22, 22a‧‧‧ connecting pipe
23‧‧‧水冷排 23‧‧‧Water-cooled row
2301‧‧‧入水端 2301‧‧‧ into the water
2302‧‧‧出水端 2302‧‧‧ water outlet
231‧‧‧水冷鰭片 231‧‧‧Water-cooled fins
232‧‧‧銅管 232‧‧‧Bronze tube
24‧‧‧輸水管 24‧‧‧Water pipes
241‧‧‧出水管 241‧‧‧Outlet
242‧‧‧入水管 242‧‧‧Water inlet
25‧‧‧水泵 25‧‧‧Water pump
26‧‧‧送冷風扇 26‧‧‧Send cooling fan
30a~30c‧‧‧氣冷式散熱器 30a~30c‧‧‧Air-cooled radiator
31a~31c‧‧‧基座 31a~31c‧‧‧Base
311a‧‧‧溝槽 311a‧‧‧ trench
32a~32c‧‧‧超導管 32a~32c‧‧‧Supercatheter
321a‧‧‧金屬管 321a‧‧‧Metal tube
322a‧‧‧超導液體 322a‧‧‧Superconducting liquid
323a‧‧‧毛細結構 323a‧‧‧Capillary structure
324a‧‧‧金屬網 324a‧‧‧Metal net
33a~33c‧‧‧鰭片 33a~33c‧‧‧Fins
34a~34c‧‧‧風扇 34a~34c‧‧‧fan
第一圖 係 本發明 串聯型連續降溫及升溫裝置之立體分解圖；第二圖 係 本發明 串聯型連續降溫及升溫裝置之立體外觀示意；第三圖 係 本發明 串聯型連續降溫及升溫裝置之超導管的剖視圖； 第四圖 係 本發明 串聯型連續降溫及升溫裝置之使用示意圖；以及第五圖 係 本發明 串聯型連續降溫及升溫裝置之第二實施例。 The first figure is a perspective exploded view of the series continuous cooling and temperature increasing device of the present invention; the second drawing is a three-dimensional appearance of the series continuous cooling and temperature increasing device of the present invention; and the third figure is the series continuous cooling and temperature increasing device of the present invention. a cross-sectional view of the supercatheter; Fig. 4 is a schematic view showing the use of the series continuous cooling and temperature increasing device of the present invention; and a fifth embodiment of the second embodiment of the series continuous cooling and temperature increasing device of the present invention.
有關本發明之詳細說明及技術內容，配合圖式說明如下，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參第一圖及第二圖，係分別為本發明串聯型連續降溫及升溫裝置之立體分解圖及立體外觀示意圖；本發明之串聯型連續降溫及升溫裝置1係包含一液冷式冷卻器20、複數致冷晶片10a、10b及複數氣冷式散熱器30a、30b。 Please refer to FIG. 1 and FIG. 2 respectively, which are respectively a perspective exploded view and a stereoscopic appearance view of the series continuous cooling and temperature increasing device of the present invention; the series continuous cooling and temperature increasing device 1 of the present invention comprises a liquid cooling cooler. 20. A plurality of cooled wafers 10a, 10b and a plurality of air-cooled heat sinks 30a, 30b.
該液冷式冷卻器20包含複數水冷座21a、21b及一連接管22、一水冷排23與一輸水管24，各水冷座21a、21b分別具有一入水口211a、211b及一出水口212a、212b，該連接管22以串聯方式連通任二相鄰該水冷座的該出水口和該入水口，本實施例中，該連接管22係穿接水冷座21a的出水口212a及另一相鄰水冷座21b的入水口211b；此外，該二水冷座21a、21b的一側邊配置有該水冷排23，該水冷排23由複數水冷鰭片231及彎折穿設在該些水冷鰭片231中的一銅管232所組成，該水冷排23具有一入水端2301及一出水端2302，其係藉由該輸水管24而與該二水冷座21a、21b串接連通，該輸水管24中裝填有一冷卻液體(圖未示)，該冷卻液體可作為傳導介質而在該二水冷座21a、21b及該水冷排23之間流動，另外，該輸水管24上可加設有一水泵25，用以加壓該冷卻液體，使該冷卻液體可快速、連續地在該輸水管24中流動。 The liquid-cooled cooler 20 includes a plurality of water-cooling seats 21a, 21b and a connecting pipe 22, a water-cooling row 23 and a water pipe 24, and each of the water-cooling seats 21a, 21b has a water inlet 211a, 211b and a water outlet 212a, 212b, respectively. The connecting pipe 22 is connected in series to the water outlet of the water-cooling seat and the water inlet. In the embodiment, the connecting pipe 22 is connected to the water outlet 212a of the water-cooling seat 21a and another adjacent water-cooling. The water inlet 211b of the seat 21b; and the water-cooling row 23 disposed on one side of the two water-cooling seats 21a and 21b, the water-cooling row 23 is inserted into the water-cooling fins 231 by a plurality of water-cooling fins 231 and bending The water-cooling row 23 has a water inlet end 2301 and a water outlet end 2302 which are connected in series with the two water-cooling blocks 21a, 21b by the water pipe 24, and the water pipe 24 is filled. There is a cooling liquid (not shown), which can be used as a conductive medium to flow between the two water-cooling seats 21a, 21b and the water-cooling row 23. In addition, a water pump 25 can be added to the water pipe 24 for Pressurizing the cooling liquid so that the cooling liquid can be quickly and continuously in the water pipe 24 flow.
該輸水管24可分為一出水管241及一入水管242，該出水管241連接該水冷座21a的入水口211a及該水冷排23的出水端2302，該入水管242則連接該水冷座21b的出水口212b及該水冷排23的入水端2301，較佳地，該水泵25係裝設在該出水管241上，然而，裝設在該入水管242上亦無不可，在該水冷排23的水冷鰭片231一側端上可裝設有一送冷風扇26，藉由該送冷風扇26可將該些水冷鰭片231的冷吹送出去。 The water distribution pipe 24 can be divided into an outlet pipe 241 and a water inlet pipe 242. The water outlet pipe 241 is connected to the water inlet 211a of the water-cooling seat 21a and the water outlet end 2302 of the water-cooling row 23. The water inlet pipe 242 is connected to the water-cooling seat 21b. The water outlet 212b and the water inlet end 2301 of the water-cooling row 23 are preferably installed on the water outlet pipe 241. However, it is not necessary to be installed on the water inlet pipe 242. A cooling fan 26 can be disposed on one end of the water-cooling fin 231. The cold-cooling fins 231 can be used to cool the water-cooling fins 231.
該致冷晶片10a、10b由熱電轉換材料所構成，在提供電流運轉後，其一端面的溫度會升高形成一冷端面，另一端面溫度則降低而形成一熱端面，因此，該致冷晶片10a具有相對的一冷端面11a及一熱端面12a，同樣地，另一致冷晶片10b具有相對的一冷端面11b及一熱端面12b，該二致冷晶片10a、10b的冷端面11a、11b上分別貼接在該二水冷座21a、21b上。 The refrigerating wafers 10a, 10b are composed of a thermoelectric conversion material. After the current supply operation, the temperature of one end surface thereof rises to form a cold end surface, and the temperature of the other end surface decreases to form a thermal end surface. Therefore, the cooling is performed. The wafer 10a has a pair of cold end faces 11a and a hot end face 12a. Similarly, the other refrigerant chip 10b has opposite cold end faces 11b and a hot end face 12b. The cold end faces 11a, 11b of the two cooled wafers 10a, 10b. The upper surfaces are attached to the two water cooling seats 21a and 21b, respectively.
此外，複數氣冷式散熱器30a、30b係對應該等致冷晶片10a、10b配設，每一氣冷式散熱器30a、30b的設置皆為相同，在此以氣冷式散熱器30a為例說明其組合結構，另一傳導模組30b的組設方式亦為相同，該氣冷式散熱器30a包含一基座31a、一超導管32a、複數鰭片33a及一風扇34a，該基座31a貼接在該致冷晶片10a的熱端面12a上，該基座31a由導熱性佳的材質構成，其底面設有複數溝槽311a，該溝槽311a中嵌設有該超導管32a，該超導管32a的一端固定在該基座31a，其另一端則穿設在該些鰭片33a中，此外，該些鰭片33a的一側端上裝設有該風扇34a，藉由該風扇34a可將該些鰭片33a的熱吹送出去。 In addition, the plurality of air-cooled heat sinks 30a, 30b are disposed corresponding to the equal-cooling wafers 10a, 10b, and the arrangement of each of the air-cooled heat sinks 30a, 30b is the same. Here, the air-cooled heat sink 30a is taken as an example. The combined structure of the other conductive module 30b is also the same. The air-cooled heat sink 30a includes a base 31a, a supercavity 32a, a plurality of fins 33a and a fan 34a. The base 31a Attached to the hot end surface 12a of the chilled wafer 10a, the pedestal 31a is made of a material having good thermal conductivity, and a plurality of grooves 311a are formed on the bottom surface thereof, and the supercatheter 32a is embedded in the groove 311a. One end of the duct 32a is fixed to the base 31a, and the other end is disposed in the fins 33a. The fan 34a is mounted on one end of the fins 33a. The heat of the fins 33a is blown out.
同理，另一氣冷式散熱器30b的設置方式亦相同，其包含有一基座31b、一超導管32b、複數鰭片33b及一風扇34b，其中，該基座31b係貼接在該致冷晶片10b的熱端面12b上。 Similarly, the other air-cooled heat sink 30b is disposed in the same manner, and includes a base 31b, a super-duct 32b, a plurality of fins 33b, and a fan 34b, wherein the base 31b is attached to the cooling On the hot end face 12b of the wafer 10b.
請續參第三圖，係為本發明串聯型連續降溫及升溫裝置之超導管的剖視圖；該超導管32a、32b的結構大致相同，在第三圖中以該超導管32a為例而說明其結構，該超導管32a為一金屬管321a，其材質可由銅或鋁構成，該超導管32a的內部具有一超導液體322a，該超導液體322a為氫氧化鈉、鉻酸鉀、乙醇及水等物質的混合物，該超導液體322a在吸熱汽化後會充滿在該金屬管321a內，藉由分子間的相互推擠移動而將熱自熱端傳遞至冷端，且因各混合物之凝結溫度的不同，該超導液體322a不需回流而以分子碰撞的方式作單向能量傳遞，此外，本發明中填裝有該超導液體322a的超導管32a可在0℃至-34℃的環境溫度下不結冰，又，其可運作的環境溫度低於50℃即可；再者，該超導管32a的內部更可設置一毛細結構323a，該毛細結構323a可由金屬粉末與一金屬網324a燒結而成(由銅或鋁所構成)，該金屬網324a係置設在該金屬粉末的內側，藉由該毛細結構323a的設置，可增加該超導管32a的傳導效率。 Please refer to the third drawing, which is a cross-sectional view of the supercatheter of the series continuous cooling and temperature increasing device of the present invention; the superconducting tubes 32a, 32b have substantially the same structure, and the supercavity 32a is taken as an example in the third figure. The supercatheter 32a is a metal tube 321a made of copper or aluminum. The superconducting tube 32a has a superconducting liquid 322a inside, and the superconducting liquid 322a is sodium hydroxide, potassium chromate, ethanol and water. a mixture of substances, the superconducting liquid 322a is filled in the metal tube 321a after the endothermic vaporization, and transfers the heat from the hot end to the cold end by the mutual pushing movement between the molecules, and the condensation temperature of each mixture The superconducting liquid 322a is unidirectional energy transfer in a molecular collision manner without refluxing. Further, the supercatheter 32a filled with the superconducting liquid 322a in the present invention can be in an environment of 0 ° C to -34 ° C. The temperature does not freeze, and the operable ambient temperature is lower than 50 ° C; in addition, the interior of the supercavity 32a can be further provided with a capillary structure 323a, which can be made of metal powder and a metal mesh 324a. Sintered (by copper or aluminum As), the metal lines 324a disposed inside the opposing metal powder, which is provided by the capillary structure 323a, which may increase the efficiency of the super-conducting conduit 32a.
請參第四圖，係為本發明串聯式溫度傳導裝置之使用示意圖；上述串聯型連續降溫及升溫裝置1可應用在冷暖機、冰淇淋機、或冷藏室等設備內，設置時，該些氣冷式散熱器30a、30b係設置在設備外部，以作為散熱之用，並將該送冷風扇26裝設在設備的內部，以持續地將該液冷式冷卻器20所產生的致冷效果吹送到設 備內部，以達到所要求的冷度，另一方面，該些氣冷式散熱器30a、30b亦將持續升高的致熱溫度送出，進而達到所要求的致熱效果。 Please refer to the fourth figure, which is a schematic diagram of the use of the serial temperature conduction device of the present invention; the serial continuous cooling and temperature increasing device 1 can be applied to equipment such as a heating and cooling machine, an ice cream machine, or a refrigerating room, and when set, the gas is provided. The cold radiators 30a, 30b are disposed outside the apparatus for heat dissipation, and the cooling fan 26 is installed inside the apparatus to continuously cool the liquid-cooled cooler 20. Blowing to the set The interior is prepared to achieve the required degree of cooling. On the other hand, the air-cooled heat sinks 30a, 30b also deliver a continuously elevated heating temperature to achieve the desired heating effect.
請參第五圖，係為本發明串聯型連續降溫及升溫裝置之第二實施例；本實施例之串聯型連續降溫及升溫裝置1’與第一實施例大致相同，其不同之處係在於該二氣冷式散熱器30a、30b之間插設有另一氣冷式散熱器30c，以於該送冷風扇26處送出溫度更低的冷風；該氣冷式散熱器30c的組合結構與另二氣冷式散熱器30a、30b相同，包含有一基座31c、一超導管32c、複數鰭片33c及一風扇34c，此外，該串聯型連續降溫及升溫裝置1’另包含有一致冷晶片10c、一水冷座21c及一連接管22a，該二連接管22、22a分別用以串接相鄰的二水冷座21b、21c與水冷座21c、21a的出、入水口。 Referring to FIG. 5, it is a second embodiment of the series continuous cooling and temperature increasing device of the present invention; the series continuous cooling and temperature increasing device 1' of the present embodiment is substantially the same as the first embodiment, and the difference is that Another air-cooled heat sink 30c is interposed between the two air-cooled heat sinks 30a and 30b to send a cold air with a lower temperature at the cooling fan 26; the combined structure of the air-cooled heat sink 30c and the other The two air-cooled heat sinks 30a, 30b are identical, and include a base 31c, a supercavity 32c, a plurality of fins 33c, and a fan 34c. In addition, the series continuous cooling and temperature increasing device 1' further includes a uniform cold wafer 10c. A water-cooling seat 21c and a connecting pipe 22a for respectively connecting the water-cooling seats 21b and 21c of the adjacent water-cooling seats 21b and 21c and the water-cooling seats 21c and 21a.
以上所述僅為本發明之較佳實施例，非用以限定本發明之專利範圍，其他運用本發明之專利精神之等效變化，均應俱屬本發明之專利範圍。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.
1‧‧‧串聯型連續降溫及升溫裝置 1‧‧‧Series continuous cooling and temperature rising device
10a、10b‧‧‧致冷晶片 10a, 10b‧‧‧ cold chip
11a、11b‧‧‧冷端面 11a, 11b‧‧‧ cold end face
12a、12b‧‧‧熱端面 12a, 12b‧‧‧ hot end face
20‧‧‧液冷式冷卻器 20‧‧‧ liquid cooled cooler
21a、21b‧‧‧水冷座 21a, 21b‧‧‧ water cooled seat
211a、211b‧‧‧入水口 211a, 211b‧‧‧ water inlet
212a、212b‧‧‧出水口 212a, 212b‧‧‧ water outlet
22‧‧‧連接管 22‧‧‧Connecting tube
23‧‧‧水冷排 23‧‧‧Water-cooled row
2301‧‧‧入水端 2301‧‧‧ into the water
2302‧‧‧出水端 2302‧‧‧ water outlet
231‧‧‧水冷鰭片 231‧‧‧Water-cooled fins
232‧‧‧銅管 232‧‧‧Bronze tube
24‧‧‧輸水管 24‧‧‧Water pipes
241‧‧‧出水管 241‧‧‧Outlet
242‧‧‧入水管 242‧‧‧Water inlet
25‧‧‧水泵 25‧‧‧Water pump
26‧‧‧送冷風扇 26‧‧‧Send cooling fan
30a、30b‧‧‧氣冷式散熱 30a, 30b‧‧‧ air-cooled cooling
31a、31b‧‧‧基座 31a, 31b‧‧‧ Pedestal
32a、32b‧‧‧超導管 32a, 32b‧‧‧ supercatheter
33a、33b‧‧‧鰭片 33a, 33b‧‧‧ fins
34a、34b‧‧‧風扇 34a, 34b‧‧‧ fan
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| TW99124603A TWI411390B (en) | 2010-07-26 | 2010-07-26 | Devices in series for continuous cooling/ heating |
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| Application Number | Priority Date | Filing Date | Title |
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| TW99124603A TWI411390B (en) | 2010-07-26 | 2010-07-26 | Devices in series for continuous cooling/ heating |
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| TW201206326A TW201206326A (en) | 2012-02-01 |
| TWI411390B true TWI411390B (en) | 2013-10-01 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI626530B (en) * | 2015-09-11 | 2018-06-11 | 訊凱國際股份有限公司 | Electronic system and external auxiliary heat dissipation device thereof |
| US10080309B2 (en) | 2015-09-10 | 2018-09-18 | Cooler Master Co., Ltd. | Electronic system and external auxiliary heat dissipation device thereof |
| TWI663903B (en) * | 2015-12-30 | 2019-06-21 | 微星科技股份有限公司 | Thermoelectric cooling module and heat dissipation apparatus including the same |
| TWI771096B (en) * | 2021-07-06 | 2022-07-11 | 技嘉科技股份有限公司 | Notebook computer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200815968A (en) * | 2006-09-28 | 2008-04-01 | Jun-Guang Luo | Phase change heat dissipation device and method |
| TW200909989A (en) * | 2007-08-20 | 2009-03-01 | Benq Corp | Projection device and heat dissipation method |
-
2010
- 2010-07-26 TW TW99124603A patent/TWI411390B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200815968A (en) * | 2006-09-28 | 2008-04-01 | Jun-Guang Luo | Phase change heat dissipation device and method |
| TW200909989A (en) * | 2007-08-20 | 2009-03-01 | Benq Corp | Projection device and heat dissipation method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10080309B2 (en) | 2015-09-10 | 2018-09-18 | Cooler Master Co., Ltd. | Electronic system and external auxiliary heat dissipation device thereof |
| TWI626530B (en) * | 2015-09-11 | 2018-06-11 | 訊凱國際股份有限公司 | Electronic system and external auxiliary heat dissipation device thereof |
| TWI663903B (en) * | 2015-12-30 | 2019-06-21 | 微星科技股份有限公司 | Thermoelectric cooling module and heat dissipation apparatus including the same |
| TWI771096B (en) * | 2021-07-06 | 2022-07-11 | 技嘉科技股份有限公司 | Notebook computer |
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| TW201206326A (en) | 2012-02-01 |
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