CN202387642U - Automatic dispensing and curing device - Google Patents
Automatic dispensing and curing device Download PDFInfo
- Publication number
- CN202387642U CN202387642U CN2011205368219U CN201120536821U CN202387642U CN 202387642 U CN202387642 U CN 202387642U CN 2011205368219 U CN2011205368219 U CN 2011205368219U CN 201120536821 U CN201120536821 U CN 201120536821U CN 202387642 U CN202387642 U CN 202387642U
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Abstract
The utility model relates to the technical field of dispensing equipment, and in particular relates to an automatic dispensing and curing device. The automatic dispensing and curing device comprises a frame, a conveying mechanism arranged on the frame, lifting mechanisms arranged at two ends of the frame, a printed circuit board (PCB) compacting mechanism, a jig positioning mechanism, a dispensing mechanism, a curing mechanism and a jig loaded with a PCB product, wherein the PCB compacting mechanism, the jig positioning mechanism, the dispensing mechanism and the curing mechanism are sequentially arranged on the frame according to the conveying direction of the product; the jig is fixed on a transmission chain; and the conveying mechanism, the lifting mechanisms, the PCB compacting mechanism, the jig positioning mechanism, the dispensing mechanism and the curing mechanism are electrically connected with an automatic control device. By adopting the automatic dispensing and curing device, continuous automatic control of the whole dispensing and curing device can be realized, manual operation is not required, the production efficiency is greatly improved, and the production cost is reduced; and the automatic dispensing and curing device is stable and reliable in quality, and can meet the requirements of enterprises for large-scale production at the same time.
Description
Technical field
The utility model relates to the spot gluing equipment technical field, concrete a kind of automatically dropping glue and the solidification equipment of relating to.
Background technology
PCB is used to provide being electrically connected each other of each part on it, and along with electronic equipment becomes increasingly complex, circuit and the part of PCB are also more and more intensive, therefore, requires also higher to the PCB processing technology.In the manufacture process of the PCB of electronic product, need carry out sticking electronic element again behind the glue to PCB.And in the prior art, adopt the some glue mode of hand mostly, and perhaps one by one product is put on the measurement jig earlier by the operating personnel, then measurement jig being put into point glue equipment carries out a glue, and some glue is intact to be transported to solidification equipment with product one by one again and to be cured.In this production procedure; All processing stations all lean on manually-operated, take a large amount of human resources, and manual operations is prone to cause the PCB location to be forbidden, put the glue difficult quality guarantee; Thereby influenced the performance of PCB; And, greatly reduce production efficiency because automaticity is low, can't satisfy the large batch of production demand of modern enterprise.
Therefore, to deficiency of the prior art, needing badly provides a kind of automatically dropping glue and the solidification equipment that can realize automation control, dependable performance, saving manpower, high, the suitable pipelining of production efficiency.
Summary of the invention
The purpose of the utility model is to avoid weak point of the prior art and provides a kind of and can realize that automation control, dependable performance, saving manpower, production efficiency are high, is fit to the automatically dropping glue and the solidification equipment of pipelining.
The purpose of the utility model realizes through following technical scheme:
A kind of automatically dropping glue and solidification equipment are provided; Include frame; Said frame is provided with conveying mechanism, be arranged at the elevating mechanism at frame two ends, be set in turn in PCB hold-down mechanism, tool detent mechanism, glue applying mechanism and the curing mechanism of frame by the product direction of transfer; Said conveying mechanism includes driving chain and servo motor, and said driving chain is connected with said servo motor driven;
Said automatically dropping glue and solidification equipment also include the tool that loads the PCB product, and said tool is fixed in said driving chain;
Said conveying mechanism, elevating mechanism, PCB hold-down mechanism, tool detent mechanism, glue applying mechanism and curing mechanism are electrically connected with automaton respectively.
Wherein,The air cylinder fixed plate that said PCB hold-down mechanism includes the fixed head that is arranged at frame, is slidingly connected with said fixed head, and the pressure PCB assembly that is arranged at said air cylinder fixed plate, said fixed head is connected with servo motor driven.
Wherein,Said fixed head is provided with optoelectronic switch a, and said air cylinder fixed plate is provided with sensing chip a, and said sensing chip a is electrically connected with said optoelectronic switch a.
Wherein,Said pressure PCB assembly includes driving cylinder, inductor and the pressure head that is arranged at said air cylinder fixed plate; Said driving cylinder is provided with slide rail; Said slide rail is provided with briquetting; Said pressure head is connected with said pressure head through the briquetting fixed head, and said inductor is connected with said air cylinder fixed plate through the inductor holder;
Said briquetting fixed head is provided with sensing chip c, and said sensing chip c is electrically connected with said inductor.
Wherein,Said tool detent mechanism include positioning cylinder, with the location-plate that said positioning cylinder is connected, said positioning cylinder is connected with said frame through the positioning cylinder holder, said location-plate is provided with alignment pin a.
Wherein,Said tool offers the trepanning that can insert said alignment pin a.
Wherein,Said glue applying mechanism includes the holder that is arranged at said frame, the axial slide plate of Y that is slidingly connected with said holder, the X axis slide plate that is connected with the axial slide plate slides of said Y; Said holder is connected with the axial servo motor driven of Y; Said X axis slide plate connects X axis and drives cylinder; Said X axis slide plate is provided with Z and axially drives cylinder, and said Z axially drives cylinder and is provided with slide rail, and said slide rail is connected with glue bucket holder; Said glue bucket holder is provided with the glue bucket, and the output of said glue bucket connects Glue dripping head;
The output channel of said glue bucket is provided with diaphragm valve.
Wherein,Said holder is provided with optoelectronic switch b, and the axial slide plate of said Y is provided with sensing chip b.
Wherein,Said curing mechanism includes the big air cylinder fixed plate that is arranged at said frame, the big cylinder that is arranged at said big air cylinder fixed plate; And the little air cylinder fixed plate that is connected with said big cylinder; Said little air cylinder fixed plate evenly is provided with little cylinder, and the lower end of each little cylinder is connected with can insert the plug that PCB solidifies locating hole;
Said little cylinder is connected with baffle plate through solidifying the locating piece holder, and said curing locating piece holder is provided with the curing locating piece, and the lower end of said curing locating piece is connected with alignment pin b.
Wherein,Said automatically dropping glue and solidification equipment also include blocking mechanism; Said blocking mechanism include be arranged at said frame stop the cylinder holder, be arranged at said stop the cylinder holder stop cylinder and photoelectric sensor; The said cylinder that stops is connected with stopper, and said blocking mechanism is electrically connected with said automaton.
The beneficial effect of the utility model:
A kind of automatically dropping glue and the solidification equipment of the utility model, automaton are during according to predefined program start, and preceding elevating mechanism is delivered to the place, seat in the plane with unloaded tool; The PCB product that operator will be put glue at place, last seat in the plane is packed in the tool, and tool is transported to the station that PCB compresses through driving chain, and the PCB hold-down mechanism compresses the PCB product and puts in place; Tool flow to the station of a glue then, and detent mechanism confirms that tool is positioned at the setting position of glue applying mechanism, and then glue applying mechanism begins the PCB product in the tool is carried out an Instant cement; After having put Instant cement, then, the station that tool flows into curing mechanism is cured operation; Tool arrives seat in the plane down after solidifying completion; Operator takes out the PCB product from tool, last, and unloaded tool gets into rear lifting mechanism and turns back to preceding elevating mechanism again; Preceding elevating mechanism is delivered to the seat in the plane with unloaded tool, so accomplishes a circulation.Wherein the action of each station is all carried out simultaneously, thereby realizes the continuous and automatic control of whole glue and solidification equipment, need not manually-operated; Improved production efficiency greatly; Reduce production costs, and stable and reliable product quality, satisfy the needs of enterprise's large-scale production.
Description of drawings
Fig. 1 is automatically dropping glue and the structural representation of solidification equipment of the embodiment 1 of the utility model.
Fig. 2 is the structural representation of PCB hold-down mechanism of the embodiment 2 of the utility model.
Fig. 3 is the structural representation of detent mechanism of the embodiment 3 of the utility model.
Fig. 4 is the structural representation of tool of the embodiment 3 of the utility model.
Fig. 5 is the structural representation of glue applying mechanism of the embodiment 4 of the utility model.
Fig. 6 is the structural representation of curing mechanism of the embodiment 5 of the utility model.
Fig. 7 is the structural representation of blocking mechanism of the embodiment 6 of the utility model.
Include among Fig. 1 to Fig. 7:
Frame 1, conveying mechanism 2;
Elevating mechanism 3, preceding elevating mechanism 31, rear lifting mechanism 32;
PCB hold-down mechanism 4, fixed head 41, optoelectronic switch a 411, bearing 412;
Press PCB assembly 44, drive cylinder 441, inductor 442, pressure head 443, briquetting 444;
Briquetting fixed head 445, sensing chip c4451, inductor holder 446;
Tool detent mechanism 5, positioning cylinder 51, location-plate 52, alignment pin a 521, positioning cylinder holder 53;
The axial servo motor of glue applying mechanism 6, holder 61, Y 611, optoelectronic switch b 612;
The axial slide plate of Y 62, sensing chip b 621;
X axis slide plate 63, X axis drive cylinder 631;
Z axially drives cylinder 64, glue bucket 65, glue bucket holder 651, diaphragm valve 652;
Curing mechanism 7, big air cylinder fixed plate 71, big cylinder 711;
Little air cylinder fixed plate 72, stingy cylinder 721;
Blocking mechanism 9, stop cylinder holder 91, stop cylinder 92, stopper 93;
Automaton 10.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing the utility model is described in further detail, but the embodiment of the utility model is not limited thereto.
Embodiment 1
A kind of automatically dropping glue of the utility model and the embodiment 1 of solidification equipment are extremely shown in Figure 7 like Fig. 1; Include frame 1, be arranged at frame 1 conveying mechanism 2, be arranged at the elevating mechanism 3 at frame 1 two ends, be set in turn in PCB hold-down mechanism 4, tool detent mechanism 5, glue applying mechanism 6 and the curing mechanism 7 of frame 1 by the product direction of transfer; Conveying mechanism 2 includes driving chain and servo motor; Driving chain is connected with servo motor driven, and elevating mechanism 3 comprises preceding elevating mechanism 31 that is positioned at frame 1 front end and the rear lifting mechanism 32 that is positioned at frame 1 rear end;
Automatically dropping glue and solidification equipment also include the tool 8 that loads the PCB product, and tool 8 is fixed in driving chain;
Operation principle is following:
Automaton 10 is according to predefined program, and during startup, preceding elevating mechanism 31 is delivered to the place, seat in the plane with unloaded tool 8; Operator will be put glue at place, last seat in the plane the PCB product tool 8 of packing into, tool 8 is transported to the station that PCB compresses through driving chain, and 4 pairs of PCB products of PCB hold-down mechanism compress and put in place; Tool 8 flow to the station of a glue then; Detent mechanism 5 confirms that tools 8 are positioned at the setting position of glue applying mechanism 5, and then glue applying mechanism 5 begins the PCB product in the tool 8 is carried out an Instant cement, put Instant cement after; Then the station of tool 8 inflow curing mechanisms 7 is cured; The tool 8 that solidifies after accomplishing arrives seat in the plane down, and operator takes out the PCB product from tool 8, elevating mechanism 31 before unloaded tool 8 entering rear lifting mechanisms 32 turn back to again; Preceding elevating mechanism 31 is delivered to the seat in the plane with unloaded tool 8, so accomplishes a circulation.Wherein the action of each station is all carried out simultaneously, thereby realizes the automation control of whole point gum machine and curing process, need not manually-operated; Improved production efficiency greatly; Reduce production costs, and stable and reliable product quality, satisfy the needs of enterprise's large-scale production.
A kind of automatically dropping glue of present embodiment and solidification equipment are referring to Fig. 2, and on the basis of embodiment 1, unaccounted in the present embodiment characteristic adopts the explanation among the embodiment 1, no longer gives unnecessary details at this.The difference of present embodiment and embodiment 1 is:
PCB hold-down mechanism 4 includes the fixed head 41 that is arranged at frame 1, the air cylinder fixed plate 43 that is slidingly connected with fixed head 41, the pressure PCB assembly 44 that is arranged at air cylinder fixed plate 43; Fixed head 41 drives with servo motor 42 and is connected, and fixed head 41 is fixed in frame 1 through bearing 412.
Fixed head 41 is provided with optoelectronic switch a 411; Air cylinder fixed plate 43 is provided with sensing chip a431; Sensing chip a411 is electrically connected with optoelectronic switch a 411, because air cylinder fixed plate 43 can move forward and backward along fixed head 41, optoelectronic switch a 411 can be separately positioned on front portion, rear portion and the middle part of fixed head 41; When promptly receiving, the position that sensing chip a411 moves to optoelectronic switch a 411 stops movable signal; Wherein, the position of the optoelectronic switch a 411 of the front and rear of fixed head 41 is set at the limiting value of air cylinder fixed plate 43 front and back displacements respectively, and the position of the optoelectronic switch a 411 at the middle part of fixed head 41 is set at the null value that air cylinder fixed plate 43 is returned the original place.
Press PCB assembly 44 to include driving cylinder 441, inductor 442 and the pressure head 443 that is arranged at air cylinder fixed plate 43; Drive cylinder 43 and be provided with slide rail; Slide rail is provided with briquetting 444; Briquetting 444 is connected with pressure head 443 through briquetting fixed head 445, and inductor 442 is connected with air cylinder fixed plate 43 through inductor holder 446.
Briquetting fixed head 445 is provided with sensing chip c4451, and sensing chip c4451 is electrically connected with inductor 442.During work, drive cylinder 441 drive briquetting 444 along slide rail to lower slider, inductor 442 can receive position signalling that sensing chip sends pressure head 443 when guaranteeing to press down and inserts PCB and compress simultaneously, compresses operation thereby accomplish PCB.
Move down and fail to insert PCB like pressure head 443, then inductor 442 can detect corresponding position signalling and send warning: red led is bright.
Embodiment 3
A kind of automatically dropping glue of present embodiment and solidification equipment are referring to Fig. 3 and Fig. 4, and on the basis of embodiment 1, unaccounted in the present embodiment characteristic adopts the explanation among the embodiment 2, no longer gives unnecessary details at this.The difference of present embodiment and embodiment 2 is:
The location-plate 52 that tool detent mechanism 5 includes positioning cylinder 51, is connected with positioning cylinder 51, positioning cylinder 51 is connected with frame 1 through positioning cylinder holder 53, and location-plate 52 is provided with alignment pin a521.
Embodiment 4
A kind of automatically dropping glue of present embodiment and solidification equipment are referring to Fig. 5, and on the basis of embodiment 3, unaccounted in the present embodiment characteristic adopts the explanation among the embodiment 3, no longer gives unnecessary details at this.The difference of present embodiment and embodiment 3 is:
The axial slide plate of the Y that glue applying mechanism 6 includes the holder 61 that is arranged at frame 1, be slidingly connected with holder 61 62, the X axis slide plate 63 that is slidingly connected with the axial slide plate 62 of Y; Holder 61 drives with the axial servo motor 611 of Y and is connected, and X axis slide plate 63 connects X axis and drives cylinder 631;
X axis slide plate 63 is provided with Z and axially drives cylinder 64, and Z axially drives cylinder 64 and is provided with slide rail, and slide rail is connected with glue bucket holder 651, and glue bucket holder 651 is provided with glue bucket 65, and the output of glue bucket 65 connects Glue dripping head.
The output channel of glue bucket 65 is provided with diaphragm valve 652, with the output flow of control glue.
Further, holder 61 is provided with optoelectronic switch b 612, and the axial slide plate 62 of Y is provided with sensing chip b 621.
During work; When tool 8 after some glue station is accomplished the location; The axial servo motor of Y 611 drives the axial slide plate of Y 62 and moves axially along Y, and the position signalling control of the optoelectronic switch b 612 that receives according to sensing chip b 621 its along the axial shift position of Y, X axis drives cylinder 631 and drives X axis slide plates 63 along the axial shift position of Y; Z axially drives the PCB point glue position that cylinder 64 Glue dripping heads are moved downward in the tool 8 and carries out a glue; Export the flow of glues through diaphragm valve 652 controlled glue buckets 65, thereby accomplish the operation of automatically dropping glue, and get into next step curing process.
Embodiment 5
A kind of automatically dropping glue of present embodiment and solidification equipment are referring to Fig. 6, and on the basis of embodiment 4, unaccounted in the present embodiment characteristic adopts the explanation among the embodiment 4, no longer gives unnecessary details at this.The difference of present embodiment and embodiment 4 is:
The little air cylinder fixed plate 72 that curing mechanism 7 includes the big air cylinder fixed plate 71 that is arranged at frame 1, the big cylinder 711 that is arranged at big air cylinder fixed plate 71, is connected with big cylinder 711; Little air cylinder fixed plate 72 is provided with stingy cylinder 721 equably, and the lower end of each stingy cylinder 721 is connected with can insert the plug 73 that PCB solidifies locating hole;
Because plug 73 is in plug process up and down, the solid gum that easily PCB is solidified on the locating hole is taken out of, and baffle plate 75 can play the effect that stops.
When tool 8 is accomplished some glue entering curing process; Big cylinder 711 drives little air cylinder fixed plate 72 and moves down; The trepanning 81 that alignment pin b inserts tool 8 positions, and stingy then cylinder 721 drives plug 73 and inserts in the curing locating hole of PCB, accomplishes curing process again.
A kind of automatically dropping glue of present embodiment and solidification equipment are referring to Fig. 7, and on the basis of embodiment 1, unaccounted in the present embodiment characteristic adopts the explanation among the embodiment 1, no longer gives unnecessary details at this.The difference of present embodiment and embodiment 1 is:
Automatically dropping glue and solidification equipment also include blocking mechanism 9; Blocking mechanism 9 include be arranged at frame 1 stop cylinder holder 91, be arranged at stop cylinder holder 91 stop cylinder 92 and photoelectric sensor; Stop that cylinder 92 is connected with stopper 93, blocking mechanism 9 is electrically connected with automaton 10.
Blocking mechanism 9 can be arranged at detent mechanism 5, glue applying mechanism 6 and curing mechanism 7 respectively, and resistance is used to prevent that tool 8 from taking place when the operation that completion is not located, some glue perhaps solidifies mobile.During work, when tool 8 is not accomplished above-mentioned operation and moved with driving chain, photoelectric sensor is with signal feedback to automaton, and control stops that cylinder 92 drives stoppers 93 and slides then, stops it to move thereby block tool 8.
Should be noted that at last; Above embodiment is only in order to explain the technical scheme of the utility model; But not to the restriction of the utility model protection domain, although with reference to preferred embodiment the utility model has been done explanation at length, those of ordinary skill in the art is to be understood that; Can make amendment or be equal to replacement the technical scheme of the utility model, and not break away from the essence and the scope of the utility model technical scheme.
Claims (10)
1. automatically dropping glue and solidification equipment; Include frame; It is characterized in that: said frame is provided with conveying mechanism, be arranged at the elevating mechanism at frame two ends, be set in turn in PCB hold-down mechanism, tool detent mechanism, glue applying mechanism and the curing mechanism of frame by the product direction of transfer; Said conveying mechanism includes driving chain and servo motor, and said driving chain is connected with said servo motor driven;
Said automatically dropping glue and solidification equipment also include the tool that loads the PCB product, and said tool is fixed in said driving chain;
Said conveying mechanism, elevating mechanism, PCB hold-down mechanism, tool detent mechanism, glue applying mechanism and curing mechanism are electrically connected with automaton respectively.
2. a kind of automatically dropping glue according to claim 1 and solidification equipment; It is characterized in that: the air cylinder fixed plate that said PCB hold-down mechanism includes the fixed head that is arranged at frame, is slidingly connected with said fixed head; And the pressure PCB assembly that is arranged at said air cylinder fixed plate, said fixed head is connected with servo motor driven.
3. a kind of automatically dropping glue according to claim 2 and solidification equipment is characterized in that: said fixed head is provided with optoelectronic switch a, and said air cylinder fixed plate is provided with sensing chip a, and said sensing chip a is electrically connected with said optoelectronic switch a.
4. a kind of automatically dropping glue according to claim 2 and solidification equipment; It is characterized in that: said pressure PCB assembly includes driving cylinder, inductor and the pressure head that is arranged at said air cylinder fixed plate; Said driving cylinder is provided with slide rail; Said slide rail is provided with briquetting, and said pressure head is connected with said pressure head through the briquetting fixed head, and said inductor is connected with said air cylinder fixed plate through the inductor holder;
Said briquetting fixed head is provided with sensing chip c, and said sensing chip c is electrically connected with said inductor.
5. a kind of automatically dropping glue according to claim 1 and solidification equipment; It is characterized in that: the location-plate that said tool detent mechanism includes positioning cylinder, is connected with said positioning cylinder; Said positioning cylinder is connected with said frame through the positioning cylinder holder, and said location-plate is provided with alignment pin a.
6. a kind of automatically dropping glue according to claim 5 and solidification equipment is characterized in that: said tool offers the trepanning that can insert said alignment pin a.
7. a kind of automatically dropping glue according to claim 1 and solidification equipment; It is characterized in that: said glue applying mechanism includes the holder that is arranged at said frame, the axial slide plate of Y that is slidingly connected with said holder, the X axis slide plate that is connected with the axial slide plate slides of said Y; Said holder is connected with the axial servo motor driven of Y, and said X axis slide plate connects X axis and drives cylinder, and said X axis slide plate is provided with Z and axially drives cylinder; Said Z axially drives cylinder and is provided with slide rail; Said slide rail is connected with glue bucket holder, and said glue bucket holder is provided with the glue bucket, and the output of said glue bucket connects Glue dripping head;
The output channel of said glue bucket is provided with diaphragm valve.
8. a kind of automatically dropping glue according to claim 7 and solidification equipment is characterized in that: said holder is provided with optoelectronic switch b, and the axial slide plate of said Y is provided with sensing chip b.
9. a kind of automatically dropping glue according to claim 1 and solidification equipment; It is characterized in that: said curing mechanism includes the big air cylinder fixed plate that is arranged at said frame, the big cylinder that is arranged at said big air cylinder fixed plate; And the little air cylinder fixed plate that is connected with said big cylinder; Said little air cylinder fixed plate evenly is provided with little cylinder, and the lower end of each little cylinder is connected with can insert the plug that PCB solidifies locating hole;
Said little cylinder is connected with baffle plate through solidifying the locating piece holder, and said curing locating piece holder is provided with the curing locating piece, and the lower end of said curing locating piece is connected with alignment pin b.
10. a kind of automatically dropping glue according to claim 1 and solidification equipment; It is characterized in that: said automatically dropping glue and solidification equipment also include blocking mechanism; Said blocking mechanism include be arranged at said frame stop the cylinder holder, be arranged at said stop the cylinder holder stop cylinder and photoelectric sensor; The said cylinder that stops is connected with stopper, and said blocking mechanism is electrically connected with said automaton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205368219U CN202387642U (en) | 2011-12-20 | 2011-12-20 | Automatic dispensing and curing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205368219U CN202387642U (en) | 2011-12-20 | 2011-12-20 | Automatic dispensing and curing device |
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| CN202387642U true CN202387642U (en) | 2012-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011205368219U Expired - Fee Related CN202387642U (en) | 2011-12-20 | 2011-12-20 | Automatic dispensing and curing device |
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| CN102794252A (en) * | 2012-08-24 | 2012-11-28 | 张家港市天奇自动化机械制造有限公司 | Automatic glue-coating device |
| CN102842335A (en) * | 2012-09-24 | 2012-12-26 | 昆山迈致治具科技有限公司 | Burn jig |
| CN103008188A (en) * | 2012-12-27 | 2013-04-03 | 英凯模金属网有限公司 | Rectification device and spray coating device with same |
| CN103129108A (en) * | 2013-02-06 | 2013-06-05 | 苏州长城开发科技有限公司 | Tool clamp of upper board of connecting-board printing |
| CN103386388A (en) * | 2013-08-20 | 2013-11-13 | 铜陵富仕三佳机器有限公司 | Full-automatic visual LED (light emitting diode) dispensing machine |
| CN103447194A (en) * | 2013-08-29 | 2013-12-18 | 东莞市冠佳电子设备有限公司 | Automatic dispensing curing equipment and automatic production line for chargers |
| CN103464337A (en) * | 2013-08-13 | 2013-12-25 | 昆山龙腾光电有限公司 | Dispensing curing device |
| CN103506261A (en) * | 2013-09-26 | 2014-01-15 | 苏州安洁科技股份有限公司 | Automated dispensing method |
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| CN104822230A (en) * | 2015-05-12 | 2015-08-05 | 珠海智新自动化科技有限公司 | Novel multifunctional PCB production automation system |
| CN105214898A (en) * | 2015-10-25 | 2016-01-06 | 合肥市航嘉电子技术有限公司 | Automatic glue filling machine |
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| CN106206379A (en) * | 2016-07-28 | 2016-12-07 | 苏州高登威科技股份有限公司 | The automatically dropping glue solidification equipment of a kind of monocrystal silicon and automatically dropping glue curing |
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| CN109158260A (en) * | 2016-07-20 | 2019-01-08 | 东莞理工学院 | A kind of feeding mechanism for Y capacitance dispensing processing |
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| CN110027751A (en) * | 2014-08-08 | 2019-07-19 | 万润科技股份有限公司 | Electronic component liquid material applies method and device |
| CN110102449A (en) * | 2019-05-16 | 2019-08-09 | 苏州尚华智造自动化科技有限公司 | A kind of product solidification pressure holding mechanism |
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Cited By (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794252A (en) * | 2012-08-24 | 2012-11-28 | 张家港市天奇自动化机械制造有限公司 | Automatic glue-coating device |
| CN102842335A (en) * | 2012-09-24 | 2012-12-26 | 昆山迈致治具科技有限公司 | Burn jig |
| CN102842335B (en) * | 2012-09-24 | 2015-07-29 | 昆山迈致治具科技有限公司 | Burning jig |
| CN103008188A (en) * | 2012-12-27 | 2013-04-03 | 英凯模金属网有限公司 | Rectification device and spray coating device with same |
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