CN106206379A - The automatically dropping glue solidification equipment of a kind of monocrystal silicon and automatically dropping glue curing - Google Patents
The automatically dropping glue solidification equipment of a kind of monocrystal silicon and automatically dropping glue curing Download PDFInfo
- Publication number
- CN106206379A CN106206379A CN201610600935.2A CN201610600935A CN106206379A CN 106206379 A CN106206379 A CN 106206379A CN 201610600935 A CN201610600935 A CN 201610600935A CN 106206379 A CN106206379 A CN 106206379A
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- Prior art keywords
- silicon
- solidification
- automatically dropping
- silicon chip
- dropping glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention provides automatically dropping glue solidification equipment and the automatically dropping glue curing of a kind of monocrystal silicon, described automatically dropping glue solidification equipment includes monocrystal silicon automatic sticking machine and control system, described monocrystal silicon automatic sticking machine includes discharge end, described automatically dropping glue solidification equipment also includes the solidification equipment solidifying described silicon chip, described solidification equipment includes the primary solidification device being connected with described discharge end, silicon chip after primary solidification device primary solidification is carried out the curing room of secondary solidification and silicon chip is moved the arm-and-hand system to curing room from primary solidification device；Described primary solidification device includes support, installs transport unit on the bracket and drive the driving means of described transport unit, and described silicon chip runs extremely described transport unit from described transport unit near one end of described discharge end and completes away from primary solidification behind one end of described discharge end；To realize the full-automatic production of silicon chip, save human cost and avoid the damage of silicon chip, causing damage.
Description
Technical field
The present invention relates to a kind of monocrystal silicon splicing machine, particularly relate to a kind of for realizing monocrystal silicon in unmanned workshop
The automatically dropping glue solidification equipment of automatically dropping glue solidification and automatically dropping glue curing.
Background technology
When manufacturing silicon chip, need the crystal silicon fixture, resin and the monocrystal silicon that are used for fixing monocrystal silicon are passed through glue
Water is bonded together in order.At present, typically by bonding to described crystal silicon fixture, resin and monocrystal silicon be all by manually completing
So that the production efficiency of silicon chip is low, cost of labor is higher, is unfavorable for realizing the large-scale production of silicon chip.
Meanwhile, when described silicon chip is just produced, glue solidifies the most completely, now, and the silicon being bonded on resin
Sheet is easy to because of the effect of external force (such as operation the touching of employee, handling process and the collision gently of other objects) by mistake crooked,
Reduce the qualification rate of silicon chip.
In view of this, it is necessary to automatically dropping glue solidification equipment and the automatically dropping glue solidification side of a kind of new monocrystal silicon are provided
Method, to solve the problems referred to above.
Summary of the invention
It is an object of the invention to provide a kind of automatically dropping glue solidification equipment for realizing monocrystal silicon and operational approach thereof.
For achieving the above object, the present invention adopts the following technical scheme that the automatically dropping glue solidification dress of a kind of monocrystal silicon
Put, including monocrystal silicon automatic sticking machine and control for crystal silicon fixture, resin and monocrystal silicon being bonded together into silicon chip
System processed, it is described that described monocrystal silicon automatic sticking machine includes that discharge end, described automatically dropping glue solidification equipment also include solidifying
The solidification equipment of silicon chip, described solidification equipment includes the primary solidification device being connected with described discharge end, to through primary solidification
Silicon chip after device primary solidification carries out the curing room of secondary solidification and is moved to curing room from primary solidification device by silicon chip
Interior arm-and-hand system；Described primary solidification device includes support, installs transport unit on the bracket and drive described
The driving means of transport unit, described silicon chip from described transport unit near one end of described discharge end run to described transport unit away from
Behind one end of described discharge end, primary solidification completes.
As further improved technical scheme of the present invention, described automatically dropping glue solidification equipment includes multiple being set up in parallel
Monocrystal silicon automatic sticking machine, the discharge end of each described monocrystal silicon automatic sticking machine is all connected with described transport unit.
Extension as further improved technical scheme of the present invention, the bearing of trend of described transport unit and described discharge end
Direction is perpendicular.
As further improved technical scheme of the present invention, described automatically dropping glue solidification equipment also include being positioned at described tentatively
The transition bench that solidification equipment is middle with described curing room, described arm-and-hand system is connected and described machine with described control system communication
Tool hand system includes that the silicon chip after removing the crystal silicon fixture on the silicon chip after primary solidification and removing described crystal silicon fixture moves
The first mechanical hand of moving to transition bench and the silicon chip after crystal silicon fixture being removed be transferred in curing room from transition bench the
Two mechanical hands.
As further improved technical scheme of the present invention, have in described curing room and multiple treat that secondary solidifies in order to placing
The solidification lattice of silicon chip, described solidification equipment includes sensing no the first sensor being in blank state of described solidification lattice,
Described first sensor is connected with described control system communication, and described control system is according to consolidating that described first sensor senses
The state changing lattice controls described second mechanical hand.
As further improved technical scheme of the present invention, described solidification equipment includes identifying that the solidification of silicon chip secondary is
No the second sensor completed, described automatically dropping glue solidification equipment also includes in order to the silicon chip removal after being solidified by secondary described solid
Change the 3rd mechanical hand of room；Described second sensor and described 3rd mechanical hand are all connected with described control system communication.
As further improved technical scheme of the present invention, described transport unit is made up of some rollers, described driving means
For the motor driving some described rollers to rotate.
For achieving the above object, the present invention also provides for the automatically dropping glue solidification side of a kind of automatically dropping glue solidification equipment
Method, described automatically dropping glue curing comprises the steps:
S1: crystal silicon fixture, resin and monocrystal silicon are bonded together into silicon chip；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on described silicon chip, and carries out secondary in described silicon chip is transferred to curing room
Solidification 4h.
As further improved technical scheme of the present invention, described control system includes judging that the solidification of fixture secondary is
No the second sensor completed, described automatically dropping glue solidification equipment also includes in order to the silicon chip removal after being solidified by secondary described solid
Change the 3rd mechanical hand of room；Described second sensor and described 3rd mechanical hand are all connected with described control system communication；Institute
Stating after automatically dropping glue curing also comprises the steps: that secondary has solidified, the 3rd mechanical hand takes out in described curing room
Described silicon chip.
As further improved technical scheme of the present invention, described monocrystal silicon automatic sticking machine includes monocrystal silicon feeding system
System, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, described step S1 specifically includes as follows
Step:
S11: to described monocrystal silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding；
S12: open described some colloid system, to described crystal silicon fixture glue spraying；
S13: capture a piece of resin and be positioned on described crystal silicon fixture；
S14: open described some colloid system, to glue spraying on described resin；
S15: capture a piece of monocrystal silicon and be positioned on described resin.
S16: described silicon chip is delivered to discharge end through discharge system.
The invention has the beneficial effects as follows: the transmission that the primary solidification device of the present invention is connected with discharge end by setting
Portion, is carried out tentatively so that being directly entered transport unit after the silicon chip of the bonding formation of monocrystal silicon automatic sticking machine is delivered to discharge end
Solidification, moves to one end away from described discharge end of transport unit at described silicon chip, and primary solidification completes；It addition, the present invention
Automatically dropping glue solidification equipment is additionally provided with and the silicon chip after primary solidification carries out the curing room of secondary solidification and will consolidate through preliminary
Silicon chip after change is transferred to the arm-and-hand system in curing room, to move to described transport unit away from described discharging at described silicon chip
Behind one end of end, described silicon chip is transferred to curing room by described arm-and-hand system automatically, and the course of processing of whole silicon chip is without people
Work operates, and to realize the full-automatic production of automatically dropping glue and the solidification of monocrystal silicon, i.e. silicon chip, has saved human cost and can
Avoid causing the damage of the silicon chip just produced due to artificial operation in process of production, cause damage.
Accompanying drawing explanation
Fig. 1 is the flow chart of the automatically dropping glue curing of the present invention.
Detailed description of the invention
Describe the present invention below with reference to each embodiment shown in the drawings, refer to shown in Fig. 1, for this
The better embodiment of invention.
The present invention provides the automatically dropping glue solidification equipment of a kind of monocrystal silicon, in order to realize the full-automatic production of silicon chip, from
And reduce human cost and avoid causing the damage of the silicon chip just produced due to artificial operation in process of production, make
Become loss.
Described automatically dropping glue solidification equipment includes automatically crystal silicon fixture, resin, monocrystal silicon being bonded together into silicon chip
Monocrystal silicon automatic sticking machine, the solidification equipment that the described silicon chip produced is solidified and automatic with described monocrystal silicon
The control system that the equal communication of splicing machine, solidification equipment connects.
Described monocrystal silicon automatic sticking machine include crystal silicon fixture feeding system, resin feeding system, monocrystal silicon feeding system,
Operating system and discharge system.Described operating system and described crystal silicon fixture feeding system, resin feeding system and monocrystalline
Silicon feeding system matches to realize described crystal silicon fixture, resin, the automatic adhesive of monocrystal silicon.
Described crystal silicon fixture feeding system includes crystal silicon fixture stock shelf and is arranged on described crystal silicon fixture stock shelf
Transporter.Described transporter includes that feed end, described discharge system are oppositely arranged with described feed end, and described discharging
System has the discharge end away from described feed end, so that the silicon chip of bonding formation can be transferred to described through described discharge system
Discharge end.
Described resin feeding system is provided with the resin clamp for placing described resin, and operator can be by manual
Resin is positioned in described resin clamp.
Described operating system includes a colloid system and feeding manipulator system.Described feeding manipulator system includes track
Module and the first feeding manipulator being arranged on described rail module, described first feeding manipulator can be along described track
Module slides to capture resin or monocrystal silicon.
Use monocrystal silicon automatic sticking machine time, the most respectively to described crystal silicon fixture feeding system, resin feeding system,
Monocrystal silicon feeding system feeding, it may be assumed that described monocrystal silicon is positioned on the transporter of monocrystal silicon feeding system, by crystal silicon fixture
It is positioned over the feed end of crystal silicon fixture feeding system, described resin is positioned on described resin clamp.Described monocrystal silicon is in institute
The intersection of this transporter and described operating system is moved under the effect of the transporter stating monocrystal silicon feeding system, described
Monocrystal silicon fixture moves to described crystal silicon fixture feeding system and institute under the effect of the transporter of crystal silicon fixture feeding system
State the intersection of operating system.Then, described some colloid system is to described crystal silicon fixture glue spraying, then, and described first feeding machinery
A piece of resin, and the surface moved again to described crystal silicon fixture are caught in the surface that hands moves to described resin feeding system,
Being positioned over by resin on described crystal silicon fixture, so, resin is just bonded on described crystal silicon fixture.And then, described some glue system
System is again to described resin glue spraying, and a piece of monocrystalline is caught in the surface that the most described first feeding manipulator moves to described monocrystal silicon
Silicon, and described monocrystal silicon is placed on described resin, so, described monocrystal silicon is together with described resin bonding, thus reality
Having showed the most bonding formation silicon chip of crystal silicon fixture, resin and monocrystal silicon, last described silicon chip is at the work of described discharge system
Described discharge end is moved under with.
Described automatically dropping glue solidification equipment includes multiple monocrystal silicon automatic sticking machine being set up in parallel, with can be simultaneously to many
Individual crystal silicon fixture carries out a glue operation to increase the work efficiency of described automatically dropping glue solidification equipment.In present embodiment, described
Automatically dropping glue solidification equipment includes three the monocrystal silicon automatic sticking machines being set up in parallel.
Described solidification equipment includes bonding silicon chip carrying out the primary solidification device of primary solidification, to through primary solidification
After silicon chip carry out the curing room of secondary solidification, the transition bench being located between primary solidification device and curing room and with described control
System processed communicate connect arm-and-hand system.
Described primary solidification device includes support, installs transport unit on the bracket and drive described transport unit
Driving means.The discharge end of multiple described monocrystal silicon automatic sticking machines is all connected with described transport unit, makes to pass through discharge system
The silicon chip delivering to discharge end is automatically transferred to described transport unit to carry out primary solidification.
Described transport unit is made up of some rollers, and described driving means is the motor driving described roller to rotate.By control
Make the velocity of rotation of described roller, make described silicon chip run to described transmission near one end of described discharge end from described transport unit
Portion needs 2 hours away from one end of described discharge end, i.e. make described silicon chip primary solidification 2 hours.
Specifically, the bearing of trend of described transport unit is perpendicular with the bearing of trend of described discharge system, from each described
Discharge end moves silicon chip all slow movement 2 hours in described transport unit to described transport unit, on the one hand, complete described silicon
The primary solidification of sheet；On the other hand, when described silicon chip is just produced, glue solidifies the most completely, it is to avoid described silicon chip because of
Translational speed is too fast, causes described silicon chip to produce crooked, reduces the qualification rate of described silicon chip.
Crystal silicon fixture that described arm-and-hand system includes removing on the silicon chip after primary solidification also will be removed described
The first mechanical hand that silicon chip after crystal silicon fixture moves to transition bench and the silicon chip that will be located on described transition bench are transferred to
The second mechanical hand in curing room.Described first mechanical hand, the second mechanical hand are all connected with described control system communication.
Having multiple solidification lattice in order to place the silicon chip treating that secondary solidifies in described curing room, described solidification equipment also wraps
Include to sense whether described solidification lattice are in the first sensor of blank state, described first sensor and described control system
Communication connects.
The information of the described solidification lattice being in blank state sensed is fed back to described control by described first sensor
System, when carrying out secondary solidification in described second mechanical hand needs described silicon chip is transferred to described solidification lattice, described control
System controls described second mechanical hand and is transferred to be in the solidification lattice of blank state by described silicon chip.
Further, described solidification equipment also includes identifying the second the sensing whether solidification of described silicon chip secondary completes
Device, described automatically dropping glue solidification equipment also includes the 3rd machinery removing described solidification lattice in order to the silicon chip after being solidified by secondary
Hands.
Described second sensor and described 3rd mechanical hand are all connected with described control system communication.Described second sensing
The time that device is placed in described solidification lattice by identifying described silicon chip judges whether secondary has solidified described silicon chip, i.e.
When described silicon chip put into time of described solidification lattice reach 4 little constantly, represent that described silicon chip secondary has solidified.
Silicon chip in described second sensor recognizes certain solidification lattice has been after secondary solidify, feed back to described in
Control system, described control system controls described 3rd mechanical hand and by this silicon chip extracting and is positioned in warehouse, at described silicon chip
After being positioned in described warehouse, then this silicon chip has produced.
As it is shown in figure 1, the automatically dropping glue curing of the present invention comprises the steps:
S1: crystal silicon fixture, resin and monocrystal silicon are bonded together into silicon chip；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on described silicon chip, and carries out secondary in described silicon chip is transferred to curing room
Solidification 4h.
S4: after secondary has solidified, the 3rd mechanical hand takes out described silicon chip in described curing room.
Above-mentioned steps S1 specifically includes following steps:
S11: to described monocrystal silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding；
S12: open described some colloid system, to described crystal silicon fixture glue spraying；
S13: capture a piece of resin and be positioned on described crystal silicon fixture；
S14: open described some colloid system, to glue spraying on described resin；
S15: capture a piece of monocrystal silicon and be positioned on described resin.
S16: described silicon chip is delivered to discharge end through discharge system.
In sum, the transport unit that the primary solidification device of the present invention is connected with discharge end by setting, so that warp
The silicon chip of the bonding formation of monocrystal silicon automatic sticking machine is directly entered transport unit after being delivered to discharge end and carries out primary solidification, described
Silicon chip moves to one end away from described discharge end of transport unit, and primary solidification completes；It addition, the automatically dropping glue solidification of the present invention
Device is additionally provided with and the silicon chip after primary solidification carries out the curing room of secondary solidification and is turned by the silicon chip after primary solidification
Move to the arm-and-hand system in curing room, to move to one end away from described discharge end of described transport unit at described silicon chip,
Described silicon chip is transferred to curing room by described arm-and-hand system automatically, and the course of processing of whole silicon chip is without manual operation, with reality
The automatically dropping glue of existing monocrystal silicon and the full-automatic production of solidification, i.e. silicon chip, saved human cost and it can be avoided that produced
During cause the damage of the silicon chip just produced due to artificial operation, cause damage.
It is to be understood that, although this specification is been described by according to embodiment, but the most each embodiment only comprises one
Individual independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should will say
Bright book is as an entirety, and the technical scheme in each embodiment can also be through appropriately combined, and forming those skilled in the art can
With other embodiments understood.
The a series of detailed description of those listed above is only for the feasibility embodiment of the present invention specifically
Bright, they also are not used to limit the scope of the invention, all equivalent implementations made without departing from skill of the present invention spirit
Or change should be included within the scope of the present invention.
Claims (10)
1. an automatically dropping glue solidification equipment for monocrystal silicon, including for bonding together crystal silicon fixture, resin and monocrystal silicon
Forming monocrystal silicon automatic sticking machine and the control system of silicon chip, described monocrystal silicon automatic sticking machine includes discharge end, its feature
Be: described automatically dropping glue solidification equipment also includes solidifying the solidification equipment of described silicon chip, described solidification equipment include with
Primary solidification device that described discharge end is connected, the silicon chip after primary solidification device primary solidification is carried out secondary solidification
Curing room and silicon chip is moved the arm-and-hand system to curing room from primary solidification device；Described primary solidification device includes
Support, installing transport unit on the bracket and drive the driving means of described transport unit, described silicon chip is from described transmission
Portion runs extremely described transport unit and completes away from primary solidification behind one end of described discharge end near one end of described discharge end.
2. automatically dropping glue solidification equipment as claimed in claim 1, it is characterised in that: described automatically dropping glue solidification equipment includes many
The individual monocrystal silicon automatic sticking machine being set up in parallel, the discharge end of each described monocrystal silicon automatic sticking machine all with described transport unit phase
Connect.
3. automatically dropping glue solidification equipment as claimed in claim 2, it is characterised in that: the bearing of trend of described transport unit is with described
The bearing of trend of discharge end is perpendicular.
4. automatically dropping glue solidification equipment as claimed in claim 1, it is characterised in that: described automatically dropping glue solidification equipment also includes
It is positioned at the transition bench that described primary solidification device is middle with described curing room, described arm-and-hand system and described control system communication
Connect and described arm-and-hand system includes the crystal silicon fixture removed on the silicon chip after primary solidification and will remove described crystal silicon folder
The first mechanical hand that silicon chip after tool moves to transition bench and the silicon chip after removing crystal silicon fixture are transferred to from transition bench
The second mechanical hand in curing room.
5. automatically dropping glue solidification equipment as claimed in claim 4, it is characterised in that: have multiple in order to put in described curing room
Putting the solidification lattice of the silicon chip treating that secondary solidifies, described solidification equipment includes sensing whether described solidification lattice are in blank state
The first sensor, described first sensor is connected with described control system communication, described control system according to described first sense
The state surveying the solidification lattice that device senses controls described second mechanical hand.
6. automatically dropping glue solidification equipment as claimed in claim 1, it is characterised in that: described solidification equipment includes identifying silicon
Sheet secondary solidifies the second sensor whether completed, and described automatically dropping glue solidification equipment also includes in order to the silicon after being solidified by secondary
Sheet removes the 3rd mechanical hand of described curing room；Described second sensor and described 3rd mechanical hand all with described control system
Communication connects.
7. automatically dropping glue solidification equipment as claimed in claim 1, it is characterised in that: described transport unit is made up of some rollers,
Described driving means is the motor driving some described rollers to rotate.
8. the automatically dropping glue curing of an automatically dropping glue solidification equipment, it is characterised in that: described automatically dropping glue curing
Comprise the steps:
S1: crystal silicon fixture, resin and monocrystal silicon are bonded together into silicon chip；
S2: primary solidification 2 hours；
S3: arm-and-hand system removes the crystal silicon fixture on described silicon chip, and carries out secondary in described silicon chip is transferred to curing room
Solidification 4h.
9. automatically dropping glue curing as claimed in claim 8, it is characterised in that: described control system includes judging folder
Tool secondary solidifies the second sensor whether completed, and described automatically dropping glue solidification equipment also includes in order to the silicon after being solidified by secondary
Sheet removes the 3rd mechanical hand of described curing room；Described second sensor and described 3rd mechanical hand all with described control system
Communication connects；After described automatically dropping glue curing also comprises the steps: that secondary has solidified, the 3rd mechanical hand is from described solid
Change the indoor described silicon chip of taking-up.
10. automatically dropping glue curing as claimed in claim 8, it is characterised in that: described monocrystal silicon automatic sticking machine includes
Monocrystal silicon feeding system, crystal silicon fixture feeding system, resin feeding system, operating system and discharge system, described step S1
Specifically include following steps:
S11: to described monocrystal silicon feeding system, crystal silicon fixture feeding system, resin feeding system feeding；
S12: open described some colloid system, to described crystal silicon fixture glue spraying；
S13: capture a piece of resin and be positioned on described crystal silicon fixture；
S14: open described some colloid system, to glue spraying on described resin；
S15: capture a piece of monocrystal silicon and be positioned on described resin.
S16: described silicon chip is delivered to discharge end through discharge system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600935.2A CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600935.2A CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
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| Publication Number | Publication Date |
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| CN106206379A true CN106206379A (en) | 2016-12-07 |
| CN106206379B CN106206379B (en) | 2019-02-22 |
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| CN201610600935.2A Expired - Fee Related CN106206379B (en) | 2016-07-28 | 2016-07-28 | A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108816669A (en) * | 2018-08-20 | 2018-11-16 | 苏州高登威科技股份有限公司 | The automatically dropping glue curing system and automatically dropping glue curing method of silicon rod |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964389A (en) * | 2010-08-12 | 2011-02-02 | 木林森电子有限公司 | Chip integrated high-power LED packaging process and product thereof |
| CN202366834U (en) * | 2011-10-26 | 2012-08-08 | 赫比（上海）家用电器产品有限公司 | Automatic adhesive dispensing and ultraviolet (UV) solidifying machine |
| CN202387642U (en) * | 2011-12-20 | 2012-08-22 | 东莞市冠佳电子设备有限公司 | Automatic dispensing and curing device |
| CN103258775A (en) * | 2013-01-10 | 2013-08-21 | 苏州工业园区高登威科技有限公司 | Stationary fixture |
| CN103267050A (en) * | 2013-04-28 | 2013-08-28 | 苏州工业园区高登威科技有限公司 | Automatic monocrystal silicon bonding machine |
| CN103745938A (en) * | 2014-02-08 | 2014-04-23 | 华进半导体封装先导技术研发中心有限公司 | Manufacture method of fan-out wafer level package |
| JP2014098976A (en) * | 2012-11-13 | 2014-05-29 | Toshiba Mach Co Ltd | Molding production system and molding production method |
| CN103922114A (en) * | 2013-01-10 | 2014-07-16 | 苏州工业园区高登威科技有限公司 | Crystalline silicon clamp feeding system |
| CN204331121U (en) * | 2014-12-24 | 2015-05-13 | 宁波舜宇车载光学技术有限公司 | A kind of laminator automatically |
| CN204469997U (en) * | 2014-12-22 | 2015-07-15 | 昆山沃椿电子科技有限公司 | A kind of LED lamp tube automatically dropping glue make-up machine |
| JP2015522427A (en) * | 2012-07-19 | 2015-08-06 | ミウォン プレシジョン インダストリー カンパニー，リミテッド | Automatic press molding production system using a double robot line for tandem press lines |
| CN103447194B (en) * | 2013-08-29 | 2016-02-24 | 东莞市冠佳电子设备有限公司 | A kind of automatically dropping glue curing apparatus and charger automatic assembly line |
-
2016
- 2016-07-28 CN CN201610600935.2A patent/CN106206379B/en not_active Expired - Fee Related
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964389A (en) * | 2010-08-12 | 2011-02-02 | 木林森电子有限公司 | Chip integrated high-power LED packaging process and product thereof |
| CN202366834U (en) * | 2011-10-26 | 2012-08-08 | 赫比（上海）家用电器产品有限公司 | Automatic adhesive dispensing and ultraviolet (UV) solidifying machine |
| CN202387642U (en) * | 2011-12-20 | 2012-08-22 | 东莞市冠佳电子设备有限公司 | Automatic dispensing and curing device |
| JP2015522427A (en) * | 2012-07-19 | 2015-08-06 | ミウォン プレシジョン インダストリー カンパニー，リミテッド | Automatic press molding production system using a double robot line for tandem press lines |
| JP2014098976A (en) * | 2012-11-13 | 2014-05-29 | Toshiba Mach Co Ltd | Molding production system and molding production method |
| CN103258775A (en) * | 2013-01-10 | 2013-08-21 | 苏州工业园区高登威科技有限公司 | Stationary fixture |
| CN103922114A (en) * | 2013-01-10 | 2014-07-16 | 苏州工业园区高登威科技有限公司 | Crystalline silicon clamp feeding system |
| CN103267050A (en) * | 2013-04-28 | 2013-08-28 | 苏州工业园区高登威科技有限公司 | Automatic monocrystal silicon bonding machine |
| CN103447194B (en) * | 2013-08-29 | 2016-02-24 | 东莞市冠佳电子设备有限公司 | A kind of automatically dropping glue curing apparatus and charger automatic assembly line |
| CN103745938A (en) * | 2014-02-08 | 2014-04-23 | 华进半导体封装先导技术研发中心有限公司 | Manufacture method of fan-out wafer level package |
| CN204469997U (en) * | 2014-12-22 | 2015-07-15 | 昆山沃椿电子科技有限公司 | A kind of LED lamp tube automatically dropping glue make-up machine |
| CN204331121U (en) * | 2014-12-24 | 2015-05-13 | 宁波舜宇车载光学技术有限公司 | A kind of laminator automatically |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108816669A (en) * | 2018-08-20 | 2018-11-16 | 苏州高登威科技股份有限公司 | The automatically dropping glue curing system and automatically dropping glue curing method of silicon rod |
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