CN103464337B - Point glue solidify device - Google Patents
Point glue solidify device Download PDFInfo
- Publication number
- CN103464337B CN103464337B CN201310351106.1A CN201310351106A CN103464337B CN 103464337 B CN103464337 B CN 103464337B CN 201310351106 A CN201310351106 A CN 201310351106A CN 103464337 B CN103464337 B CN 103464337B
- Authority
- CN
- China
- Prior art keywords
- side plate
- heat conduction
- conduction support
- glue solidify
- solidify device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 title claims abstract description 84
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical group [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 9
- 239000000693 micelle Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of some glue solidify device comprises base plate, heat conduction support, surrounding edge and heating element heater.Base plate has first surface, is arranged at first surface.Surrounding edge is arranged at first surface and around heat conduction support.There is between surrounding edge and heat conduction support air guide annular groove, and there is the air inlet guide hole and guide hole of giving vent to anger that are communicated with air guide annular groove.Heat conduction support is highly less than second height of surrounding edge relative to first surface relative to first of first surface.Heating element heater is arranged in heat conduction support.This glue solidify device can realize the rapid curing of colloid, thus is conducive to the efficiency of hoist point glue process.
Description
Technical field
The present invention relates to a kind of display panels manufacture technology field, and in particular to the some glue solidify device that the some glue process in a kind of display panels manufacturing process uses.
Background technology
In recent years, along with the development of Display Technique, liquid crystal display is applied in the display device as the Portable movable such as smart mobile phone, panel computer electronic product more and more widely.In the manufacturing process of display panels; after giving the good external circuits plate of display panels pressing, before assembling backlight module; need to apply one deck solidification glue in the terminal region of display panels; in order to protect terminal region circuit, can prevent foreign conducting matter from dropping between terminal, cause its short circuit, avoid terminal region to expose for a long time causing portion of terminal pin corrosion etc. in atmosphere.
At present, tower non-(Tuffy) glue uses one of more solidification glue during display panels makes.Tuffy glue is dissolved in by macromolecular material methyl cyclohexane the colloid that organic solvent butyl acetate formed, be curable film-forming after organic solvent butyl acetate heat absorption volatilization in Tuffy micelle colloid, therefore the volatilization accelerating butyl acetate organic solvent is the key improving colloid curing rate.But, the existing solidification equipment using the some glue process of Tuffy glue not have particularly suitable is cured it, display panels after a glue is placed on the mode of naturally drying in room temperature environment by main employing, therefore, the hardening time of current use Tuffy glue is longer, the usual needs time of about 5 ~ 6 minutes, thus cause the production efficiency of a glue process lower.
Summary of the invention
The object of the invention is to, provide a kind of some glue solidify device, the rapid curing of colloid particularly Tuffy micelle colloid can be realized, thus be conducive to the efficiency of hoist point glue process.
It is adopt following technical scheme to realize that the present invention solves its technical problem.
The present invention proposes a kind of some glue solidify device and comprises base plate, heat conduction support, surrounding edge and heating element heater.Base plate has first surface.Heat conduction support is arranged at first surface.Surrounding edge is arranged at first surface and around heat conduction support.There is between surrounding edge and heat conduction support air guide annular groove, and there is the air inlet guide hole and guide hole of giving vent to anger that are communicated with air guide annular groove.Heat conduction support is highly less than second height of surrounding edge relative to first surface relative to first of first surface.Heating element heater is arranged in heat conduction support.
In preferred embodiment of the present invention, above-mentioned surrounding edge comprises head and the tail successively and connects the first side plate, the second side plate, the 3rd side plate, the 4th side plate.First side plate is relative with the 3rd side plate, and the second side plate is relative with the 4th side plate.Air inlet guide hole and guide hole of giving vent to anger are arranged at the first side plate and the 3rd side plate respectively.
In preferred embodiment of the present invention, above-mentioned second side plate comprises multiple protuberance, the plurality of protuberance protrudes towards the side away from the 4th side plate, and the second side plate also has the multiple openings towards the 4th side plate, multiple opening corresponding multiple protuberance being connected with air guide annular groove respectively.
In preferred embodiment of the present invention, above-mentioned heat conduction support has supporting surface, and has multiple vacuum absorption holes of through supporting surface.
In preferred embodiment of the present invention, above-mentioned multiple vacuum absorption holes is interconnected in the inside of heat conduction support.
In preferred embodiment of the present invention, above-mentioned some glue solidify device also comprises vacuum tube, and this vacuum tube is connected with multiple vacuum absorption holes.
In preferred embodiment of the present invention, above-mentioned heating element heater comprises resistance wire.
In preferred embodiment of the present invention, above-mentioned resistance wire is nickel-chromium resistance wire.
In preferred embodiment of the present invention, above-mentioned some glue solidify device also comprises air induction conduit and outtake tube, is arranged at air inlet guide hole respectively and gives vent to anger in guide hole.
In preferred embodiment of the present invention, above-mentioned air inlet pipe is provided with pneumatic control valve.
The invention has the beneficial effects as follows, the heat conduction support of of the present invention some glue solidify device is less than the height of edge part relative to first surface relative to the height of first surface, there is air guide annular groove between surrounding edge and heat conduction support, air guide annular groove provides the space of gas flowing, utilizes the heating element heater of heat conduction support inside to heat the gas in air guide annular groove further.After a glue product is positioned over heat conduction support and covers air guide annular groove, by the gas that heats can air guide annular groove in from air inlet guide hole towards guide hole flowing of giving vent to anger, thus the volatilization of organic solvent in colloid on the glue product of acceleration point, and then accelerate colloid solidification, shorten hardening time with the efficiency of hoist point glue process.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of description, and can become apparent to allow above and other object of the present invention, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Figure 1 shows that the top view of the some glue solidify device of first embodiment of the invention.
Figure 2 shows that the sectional view of some glue solidify device along II-II line of the first embodiment of the invention shown in Fig. 1.
Figure 3 shows that the some glue solidify device using state schematic diagram of the first embodiment of the invention shown in Fig. 1.
Figure 4 shows that the top view of the some glue solidify device of second embodiment of the invention.
Figure 5 shows that the top view of the some matrix plate of the some glue solidify device of corresponding second embodiment of the invention.
Detailed description of the invention
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the detailed description of the invention proposed according to the present invention, structure, feature and effect thereof, be described in detail as follows:
Aforementioned and other technology contents, Characteristic for the present invention, can know and present in the detailed description of following cooperation with reference to graphic preferred embodiment.By the explanation of detailed description of the invention, when can to the present invention for the technological means reaching predetermined object and take and effect be able to more deeply and concrete understanding, however institute's accompanying drawings be only to provide with reference to and the use of explanation, be not used for being limited the present invention.
Figure 1 shows that the top view of the some glue solidify device of first embodiment of the invention.Figure 2 shows that the sectional view of some glue solidify device along II-II line of the first embodiment of the invention shown in Fig. 1.Please with reference to Fig. 1 and Fig. 2, in the present embodiment, some glue solidify device 100 comprises base plate 110 and is arranged at heat conduction support 120, surrounding edge 130 and the heating element heater 140 on base plate 110.
Particularly, in the present embodiment, base plate 110 is such as rectangular, but not as limit, the shape and size of base plate can change according to a glue product and determine.Base plate 110 has relative first surface 111 and second surface 112.The first surface 111 of base plate 110 has the first central area 113 and the peripheral regions 114 around central area 113.Heat conduction support 120, surrounding edge 130 and heating element heater 140 are all arranged on the first surface 111 of base plate 110.The second surface 112 of base plate 110 is fixed on the surface of corresponding workbench for a glue solidify device 100, thus makes invocation point glue solidify device 100 can be fixed on the surface of corresponding workbench.In addition, the material of base plate 110 such as can select refractory metal material.
Heat conduction support 120 is arranged at the first surface 111 of base plate 110, and is positioned at the central area 113 of first surface 111.Heat conduction support 120 has the first height H 1 relative to the first surface 111 of base plate 110.The material of heat conduction support 120 is such as the Heat Conduction Materials such as metal, is not particularly limited at this.Heat conduction support 120 has supporting surface 121 back side relative with supporting surface 121 122 and connects and side 123 between supporting surface 121 and the back side 122.Supporting surface 121 and the back side 122 are all surfaces parallel with the first surface 111 of base plate 110, and side 123 is vertical with the first surface 111 of base plate.Wherein, the back side 122 of heat conduction support 120 is arranged at the first surface 111 of base plate 110.
In order to avoid a glue product is moved on the supporting surface 121 of heat conduction support 120, the present embodiment is fixed on the supporting surface 121 of heat conduction support 120 by a glue product by the mode of vacuum suction, but not as limit.In the present embodiment, heat conduction support 120 has multiple vacuum absorption holes 124 of through supporting surface 121.Multiple vacuum absorption holes 124 is evenly distributed on supporting surface 121, arranges in array, but not as limit, as long as can vacuum suction fixing point glue product.It is worth mentioning that, multiple vacuum absorption holes 124 can be such as eachly be connected to device for vacuum generation such as vavuum pump etc. separately through vacuum tube.In order to simplification device structure, in the present embodiment, multiple vacuum absorption holes 124 is interconnected in the inside of heat conduction support 120, the guide hole 115 be communicated with vacuum absorption holes 124 is provided with in base plate 110, vacuum tube 125 is arranged in guide hole 115, and multiple vacuum absorption holes 124 is connected to device for vacuum generation (not shown) such as vavuum pump etc. by vacuum tube 125.
Surrounding edge 130 is arranged at the first surface 111 of base plate 110, and the peripheral regions 114 being positioned at first surface 111 is with around heat conduction support 120.The material of surrounding edge 130 such as can select refractory metal material.In the present embodiment, surrounding edge 130 comprises head and the tail successively and connects the first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134.First side plate 131 is relative with the 3rd side plate 133, and the second side plate 132 is relative with the 4th side plate 134.Namely heat conduction support 120 is be arranged in the space that the first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134 enclose formation.The space projection that first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134 enclose can be determined according to a glue product to the shape and size of first surface 11, be not limited to the rectangle of the present embodiment, be advisable to match with a shape and size for glue product.
Between the side 123 of surrounding edge 130 and heat conduction support 120, tool is at regular intervals, thus forms air guide annular groove 105 between surrounding edge 130 and heat conduction support 120.It should be noted that, the shape of air guide annular groove 105 is not limited to the rectangle annular groove of the present embodiment, air guide annular groove 105 can design according to the distribution of the some micelle colloid on a glue product and position, is fully exposed in air guide annular groove 105 is advisable to make a micelle colloid.In the present embodiment, the first side plate 131, second side plate 132, the 3rd side plate 133, distance between the 4th side plate 134 and the side 123 of heat conduction support 120 are equal.In other detailed description of the invention, the first side plate 131, second side plate 132, the 3rd side plate 133, distance between the 4th side plate 134 and the side 123 of heat conduction support 120 also can be unequal.
In addition, in the present embodiment, first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134 are equal relative to the height of the first surface 111 of base plate 110, thus surrounding edge 130 has the second height H 2 relative to the first surface 111 of base plate 110.And heat conduction support 120 is less than second height H 2 of surrounding edge 130 relative to the first surface 111 of base plate 110 relative to the first height H 1 of the first surface 111 of base plate 110.The height difference of the second height H 2 and the first height H 1 can be determined by a thickness of glue product, and the height difference of usual second height H 2 and the first height H 1 is more than or equal to a thickness of glue product and is advisable.In addition, the space projection enclosed due to the first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134 matches to the shape and size of first surface 11 and the shape and size of some glue product, like this, when a glue product is positioned over heat conduction support 120, can effectively coordinate surrounding edge 130, make air guide annular groove 105 form relatively airtight space.
For the ease of the turnover of ambient atmos, surrounding edge 130 also has the air inlet guide hole 135 and guide hole 136 of giving vent to anger that are communicated with air guide annular groove 105.In the present embodiment, air inlet guide hole 135 and guide hole 136 of giving vent to anger are arranged at the first side plate 133 and the 3rd side plate 134 respectively, in order to be imported from air inlet guide hole 135 by ambient atmos, after flowing through air guide annular groove 105, then derive from guide hole 136 of giving vent to anger.Importing and exporting for the ease of gas, preferably, can arrange air induction conduit 106 and outtake tube 107 respectively in air inlet guide hole 135 and guide hole 136 of giving vent to anger.Further, in order to the air pressure carrying out conductor air-flow controls, air inlet pipe 106 can be provided with pneumatic control valve 108.
In the present embodiment, heat conduction support 120 inside is also provided with heating element heater 140, for providing thermal source, and is heated the gas in the air guide annular groove 105 around heat conduction support 120 side 123 by heat conduction support 120 heat conduction.In the present embodiment, heating element heater 140 comprises the resistance wire being embedded at heat conduction support 120 inside, and it carries out electrified regulation by built-in or external power supply (not shown).Usually, required heating-up temperature can be different because of the difference of a micelle colloid, and for Tuffy glue, heating-up temperature is such as control at about 50 DEG C.According to resistance wire heating element 130, additional predetermined voltage, can reach required heating-up temperature after the conduction time of setting.Particularly, conduction time can according to formula (1) Q=Ct*m* Δ T=I
2* R*t calculates, and wherein Ct is specific heat capacity, and m is quality, and Δ T is the variations in temperature before and after energising, and I is electric current, and R is resistance, and t is conduction time.For example, resistance wire as heating element heater 140 can be such as nickel-chromium resistance wire (Cr20Ni80), diameter is about 2mm, and length is about 0.5m, and specific heat capacity is about 0.45J/ (Kg* DEG C), quality is 0.02639Kg/m, resistance is 0.347 Ω/m, if initial temperature is 30 DEG C, heating-up temperature is 50 DEG C, when power-on voltage is 3V, conduction time t can be calculated by formula (1) and be about 10 seconds.In other words, employing initial temperature is that the nickel-chromium resistance wire of 30 DEG C heats as heating element heater 140, within about about 10 seconds, can reach required heating-up temperature 50 DEG C.In order to avoid heating-up temperature is too high, power-off can be carried out to heating element heater 140 after the conduction time of setting, again according to heating the conduction time of setting when needing, or calculate according to required heating-up temperature and resistance wire parameter again and heat conduction time.
Figure 3 shows that the some glue solidify device 100 using state schematic diagram of the first embodiment of the invention shown in Fig. 1.Please refer to Fig. 3, point glue solidify device 100 is such as the display panels 200 after a glue for solidification point glue product, point glue solidify device 100 matches with the shape and size of the display panels 200 after some glue, especially, the some micelle colloid 210 on the display panels 200 after putting glue is fully exposed in air guide annular groove 105.Display panels 200 after a glue is positioned in heat conduction support 120, and be fixed by the vacuum suction of vacuum absorption holes 124, now, the size of the display panels 200 after some glue is greater than heat conduction support 120, therefore air guide annular groove 105 can be covered, and be resisted against surrounding edge 130(first side plate 131, second side plate 132, the 3rd side plate 133 and the 4th side plate 134), thus make air guide annular groove 105 form relatively airtight annular flow space.Gas flows into air guide annular groove 105 from air inlet guide hole 135 and flows, and flows to through air guide annular groove 105 guide hole 136 of giving vent to anger and flow out.When concrete curing operation, utilize the heating element heater 140 being built in heat conduction support 120 inside to heat, heat can be heated the flowing gas in the air guide annular groove 105 around heat conduction support 120 side 123 by the conduction of heat conduction support 120.Like this, the heated air of flowing just can the volatilization of organic volatile solvent in the micelle colloid of acceleration point, thus the solidification of acceleration point micelle colloid is to shorten hardening time about 50%, and then the efficiency of hoist point glue process.
Figure 4 shows that the top view of the some glue solidify device of second embodiment of the invention.Figure 5 shows that the top view of the some matrix plate of the some glue solidify device of corresponding second embodiment of the invention.Please with reference to Fig. 4 and Fig. 5, the point glue solidify device 100a of the present embodiment is roughly the same with the structure of the some glue solidify device 100 of the first embodiment, the difference of the two is, second side plate 132 of the surrounding edge 130 of some glue solidify device 100a comprises the multiple protuberances 137 protruded towards the side away from the 4th side plate 134, second side plate 132 also has the multiple openings 138 towards the 4th side plate 134, multiple opening 138 is corresponding with multiple protuberance 137 respectively, and extend in corresponding protuberance 137, multiple opening 138 is connected with air guide annular groove 105.In fact, the structure of some glue solidify device 100a is the structure in order to points of engagement glue product, particularly, air guide annular groove 105, multiple protuberance 137 and multiple opening 138 design according to the distribution of the some micelle colloid in a structure of glue product and some glue product and position, is fully exposed in air guide annular groove 105 to make a micelle colloid.
Figure 5 shows that the top view of the display panels after the some glue of the some glue solidify device of corresponding second embodiment of the invention.In the present embodiment, the display panels 200a after some glue comprises display panels main body 201a and is connected to multiple flexible joint 202a such as flexible circuit board (Flexibleprintedcircuit, FPC) of display panels main body 201a.When the display panels 200a after a glue is positioned in heat conduction support 120, and be fixed by the vacuum suction of vacuum absorption holes 124, now, the size of the display panels 200a after some glue is greater than heat conduction support 120, therefore air guide annular groove 105 can be covered, and be resisted against surrounding edge 130(first side plate 131, second side plate 132, 3rd side plate 133 and the 4th side plate 134), simultaneously multiple flexible joint 202a can cover multiple opening 138 against multiple protuberance 137 respectively, thus make air guide annular groove 105 form relative airtight annular flow space with multiple opening 138.Heated air stream can flow to multiple opening 138 further to carry out rapid curing to the some micelle colloid of display panels main body 201a and flexible joint 202a junction or flexible joint 202a.
Above provided by the present invention some glue solidify device is described in detail, apply specific case herein to set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a some glue solidify device, it is characterized in that, it comprises:
Base plate, has first surface;
Heat conduction support, is arranged on this first surface;
Surrounding edge, to be arranged on this first surface and around this heat conduction support, there is between this surrounding edge and this heat conduction support air guide annular groove, and have the air inlet guide hole and guide hole of giving vent to anger that are communicated with this air guide annular groove, and this heat conduction support is highly less than second height of this surrounding edge relative to this first surface relative to first of this first surface; And
Heating element heater, is arranged in this heat conduction support, and this heating element heater is heated the gas in this air guide annular groove by this heat conduction support heat conduction.
2. put glue solidify device as claimed in claim 1, it is characterized in that, this surrounding edge comprises head and the tail successively and connects the first side plate, the second side plate, the 3rd side plate, the 4th side plate, this first side plate is relative with the 3rd side plate, this second side plate is relative with the 4th side plate, and this air inlet guide hole and this guide hole of giving vent to anger are arranged at this first side plate and the 3rd side plate respectively.
3. put glue solidify device as claimed in claim 2, it is characterized in that, this second side plate comprises multiple protuberance, the plurality of protuberance protrudes towards the side away from the 4th side plate, this second side plate also has the multiple openings towards the 4th side plate, the plurality of opening corresponding the plurality of protuberance being connected with this air guide annular groove respectively.
4. put glue solidify device as claimed in claim 1, it is characterized in that, this heat conduction support has supporting surface, and has multiple vacuum absorption holes of this supporting surface through.
5. put glue solidify device as claimed in claim 4, it is characterized in that, the plurality of vacuum absorption holes is interconnected in the inside of this heat conduction support.
6. put glue solidify device as claimed in claim 4, it is characterized in that, this glue solidify device also comprises vacuum tube, and this vacuum tube is connected with the plurality of vacuum absorption holes.
7. put glue solidify device as claimed in claim 1, it is characterized in that, this heating element heater comprises resistance wire.
8. put glue solidify device as claimed in claim 7, it is characterized in that, this resistance wire is nickel-chromium resistance wire.
9. put glue solidify device as claimed in claim 1, it is characterized in that, this glue solidify device also comprises air induction conduit and outtake tube, is arranged at this air inlet guide hole respectively and this is given vent to anger in guide hole.
10. put glue solidify device as claimed in claim 9, it is characterized in that, this air induction conduit is provided with pneumatic control valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310351106.1A CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310351106.1A CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103464337A CN103464337A (en) | 2013-12-25 |
| CN103464337B true CN103464337B (en) | 2016-02-24 |
Family
ID=49789506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310351106.1A Active CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103464337B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105032711A (en) * | 2015-07-09 | 2015-11-11 | 北京中电科电子装备有限公司 | Dispensing device |
| CN105855134A (en) * | 2016-06-03 | 2016-08-17 | 杭州奥克光电设备有限公司 | Optical fiber core inserting, dispensing and curing integrated manufacture assembly line |
| CN105964514A (en) * | 2016-06-30 | 2016-09-28 | 锐嘉（宜兴）科技有限公司 | Mobile phone shell assembling glue drying device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0954049A2 (en) * | 1998-04-28 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| CN201346523Y (en) * | 2009-01-06 | 2009-11-18 | 思林菲加热器材(东莞)有限公司 | Dispensing system |
| CN101951731A (en) * | 2010-10-18 | 2011-01-19 | 卓盈微电子（昆山）有限公司 | Improved heating platform for glue curing |
| CN202387642U (en) * | 2011-12-20 | 2012-08-22 | 东莞市冠佳电子设备有限公司 | Automatic dispensing and curing device |
| CN102688831A (en) * | 2012-05-31 | 2012-09-26 | 中天宽带技术有限公司 | Constant temperature heating device for automatic gelatine grouter |
| CN202762604U (en) * | 2012-08-15 | 2013-03-06 | 吴江市博众精工科技有限公司 | Adhesive dispensing and curing device |
-
2013
- 2013-08-13 CN CN201310351106.1A patent/CN103464337B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0954049A2 (en) * | 1998-04-28 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| CN201346523Y (en) * | 2009-01-06 | 2009-11-18 | 思林菲加热器材(东莞)有限公司 | Dispensing system |
| CN101951731A (en) * | 2010-10-18 | 2011-01-19 | 卓盈微电子（昆山）有限公司 | Improved heating platform for glue curing |
| CN202387642U (en) * | 2011-12-20 | 2012-08-22 | 东莞市冠佳电子设备有限公司 | Automatic dispensing and curing device |
| CN102688831A (en) * | 2012-05-31 | 2012-09-26 | 中天宽带技术有限公司 | Constant temperature heating device for automatic gelatine grouter |
| CN202762604U (en) * | 2012-08-15 | 2013-03-06 | 吴江市博众精工科技有限公司 | Adhesive dispensing and curing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103464337A (en) | 2013-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103464337B (en) | Point glue solidify device | |
| KR101214292B1 (en) | Heat Releasing Semiconductor Package, Method for manufacturing the same and Display Apparatus including the same | |
| CN103947292A (en) | Method for producing organic EL panel and device for sealing organic EL panel | |
| CN205385096U (en) | Car lithium battery heating piece and lithium cell | |
| US20120006400A1 (en) | Solar module device and edge sealing coating method thereof | |
| CN102709511A (en) | Electrolyte filling device of lithium ion batteries | |
| CN108624280A (en) | A kind of preparation method of high-capacity optical fiber laser heat-conducting glue | |
| CN104270892B (en) | A kind of flexible printed circuit board manufacturing process | |
| CN209901623U (en) | Sealing and gluing equipment for graphite bipolar plate of hydrogen-oxygen fuel cell | |
| TWI537538B (en) | Glue-thermal curing equipment | |
| CN107231760A (en) | A kind of high-precision mold encapsulating method of circuit board assemblies | |
| CN103743239B (en) | Quartz clamping device and manufacturing method thereof and OLED high temperature furnace with quartz clamping device | |
| CN204361090U (en) | A kind of IGBT module | |
| US20120006496A1 (en) | Edge sealing glue head for bonding substrate assembly in solar module device | |
| CN103096624B (en) | Steel disc reinforcement installation sticking machine of flexible circuit board in manufacture procedure | |
| CN110437755A (en) | High temperature resistant acrylate protective film | |
| CN106313425A (en) | Manufacturing method for glass cover plate assembly, glass cover plate assembly and mobile terminal | |
| CN105098101B (en) | The solidification of OLED packaging line and device aging system | |
| CN205182623U (en) | Energy -conserving heating magnetic stirrers | |
| CN210560721U (en) | Vacuum deposition system sample warm table | |
| CN202278156U (en) | Sand box moulding plastic coating heater for V-process casting | |
| CN210560730U (en) | Microelectrode sample heating table of vacuum deposition system | |
| CN207883839U (en) | A kind of cold and hot press mechanism of battery core | |
| CN203275733U (en) | Energy-saving optical cable fiber paste heating device | |
| CN206224093U (en) | Heat wind circulation heating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: InfoVision Optoelectronics(Kunshan)Co.,Ltd. Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd. |