CN202297813U - Plating-solution voltage stabilization shunting device - Google Patents
Plating-solution voltage stabilization shunting device Download PDFInfo
- Publication number
- CN202297813U CN202297813U CN2011203675551U CN201120367555U CN202297813U CN 202297813 U CN202297813 U CN 202297813U CN 2011203675551 U CN2011203675551 U CN 2011203675551U CN 201120367555 U CN201120367555 U CN 201120367555U CN 202297813 U CN202297813 U CN 202297813U
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- Prior art keywords
- electroplate liquid
- fluid
- plate
- voltage stabilizing
- part flow
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Abstract
The utility model relates to a plating-solution voltage stabilization shunting device and mainly provides a plating-solution voltage stabilization shunting device which can cause a plating solution to be uniformly sprayed on the surface of a workpiece. The plating-solution voltage stabilization shunting device is characterized in that a plating-solution recovery tank is provided with a shunting box, and one side of a box body of the shunting box is provided with at least one solution inlet. A solution outlet plate is covered at an opening of the box body, and at least one shunting plate is arranged between the solution inlet and the solution outlet plate. The plating solution entering the shunting box can be uniformly dispersed and then passes through shunting holes of the shunting plate to be propelled to the direction of the solution outlet plate, the plating solution is released out from solution outlet holes of the solution outlet plate after the flow speed of the plating solution is stable, and therefore the purpose that the plating solution is uniformly sprayed on the surface of the workpiece is achieved.
Description
Technical field
The relevant a kind of electroplate liquid feeding mechanism that is applied in plating tank of the utility model is meant that especially a kind of electroplate liquid that can let evenly sprays the electroplate liquid voltage stabilizing part flow arrangement that is distributed in workpiece surface.
Background technology
The general main electrolytic process that sees through of processing of electroplating; Behind input voltage between anode and negative electrode, attract the metals ion in the electroplate liquid to swim, and plating on the plated body that continues in negative electrode after the reduction to negative electrode; The metal that anode continued simultaneously dissolves again; Provide electroplate liquid more metals ion, make electrolytic process continue to carry out, till depositing enough coating on the plated body.
Common plating condition is nothing more than current density, stirring, current waveform, plating position (distribution of current) etc.; For example; According to the concentration overvoltage equation; Analyse plating speed in order to improve current density with increase, must improve limit current density, according to the limiting current equation; Can reduce thickness of diffusion layer to improve limit current density by stirring, the method that improves limit current density also can be via promoting concentration to increase ionic activity or to improve temperature to increase ionic diffusion coefficient.
Moreover; With regard to the operation of electroplating precious metal; How generally to adopt selective electroplating worker method; General selective electroplating worker method is mainly utilized the part that insulating material covers does not need plated metal (for example adhesive tape of paste or photoresist on the part zone of circuit card), carrying out electroplating process, by pressurizing device electroplate liquid is sprayed to the zone that workpiece is not covered by insulating material; Make the zone that not covered by insulating material electroplated metal, so relatively the mode of operation of the complete immersion plating liquid of workpiece is saved the cost of precious metal.
Yet; The many mode of operation that directly electroplate liquid sprayed cloth by shower nozzle towards workpiece of similar selective electroplating operation; It does not perhaps have the uneven phenomenon of pressure distribution to miniature workpiece, but the powerful electroplate liquid of its pressure directly acts on the anxiety that has the insulating material of causing to peel off on the workpiece; Especially, when workpiece receive surfacing long-pending when big, it is inhomogeneous and influence whole electroplating quality then can to spray cloth because of electroplate liquid.
The utility model content
The technical problem that the utility model solved is promptly providing a kind of electroplate liquid that can let evenly spray the electroplate liquid voltage stabilizing part flow arrangement that is distributed in workpiece surface.
The technical scheme of the utility model is: the electroplate liquid voltage stabilizing part flow arrangement of the utility model has consisted essentially of: an electroplate liquid accumulator tank, and a current divider box; Wherein, This current divider box is located in this electroplate liquid accumulator tank relatively; This current divider box has the casing of a predetermined volume; Be provided with the fluid inlet that at least one confession is connected with the pipeline of carrying electroplate liquid in a side of this casing, the opening part in this casing top be covered with one be densely covered with plural fluid hole the fluid plate, between this box house is corresponding to this fluid inlet and this fluid plate, at least one spreader plate that is densely covered with plural tap hole is set.
Utilize the said structure characteristic; Can be under the effect of this at least one spreader plate; Between the fluid inlet of this at least one spreader plate and this current divider box, form shunting layer, the space that makes the electroplate liquid that gets into current divider box be able to be dispersed to uniformly each shunting layer advances towards fluid plate direction via tap hole again, and under the effect of this fluid plate; Form a voltage stabilizing layer in this fluid plate below, the flow velocity of using the stable electrical plating bath makes electroplate liquid disengage from fluid hole again; Let electroplate liquid evenly spray the purpose that is distributed in workpiece surface in order to do reaching.
According to above-mentioned primary structure characteristic, the place, fluid plate top corresponding to this current divider box is provided with the feeding assembly that workpiece is accepted in a confession to said electroplate liquid voltage stabilizing part flow arrangement in this electroplate liquid accumulator tank inside.
The conveying belt that above-mentioned feeding assembly is located at these fluid plate both sides by two groups of correspondences constitutes.
According to above-mentioned primary structure characteristic, said electroplate liquid accumulator tank bottom is provided with at least one electroplate liquid refluxing opening.
According to above-mentioned primary structure characteristic, the fluid hole of said fluid plate and the tap hole of each spreader plate are that elongated groove opening is good.
According to above-mentioned primary structure characteristic, the fluid hole aperture of said fluid plate is good less than the tap hole aperture of this at least one spreader plate relatively.
According to above-mentioned primary structure characteristic, said current divider box inside is corresponding between this fluid inlet and this fluid plate a plurality of spreader plates being set.
The fluid hole aperture of above-mentioned fluid plate is relatively less than the tap hole aperture of each spreader plate; And, relatively more near the shunting aperture of the spreader plate of fluid plate relatively more more away from the tap hole aperture of the spreader plate of fluid plate little be good.
According to above-mentioned primary structure characteristic, said fluid plate can be provided with the column jecket of a tool predetermined height in each fluid hole place.
The beneficial effect of the electroplate liquid voltage stabilizing stream device of the utility model is following.
1. can let electroplate liquid evenly spray and be distributed in workpiece surface, promote whole electroplating activity quality relatively.
2. can reduce the usage quantity of electroplate liquid relatively, be applicable to the electroplating activity of noble metal especially.
3. can form the ionic activity that a perturbation action helps to increase electroplate liquid to electroplate liquid, and improve electroplating efficiency.
4. can under the limit row arrangement of plural groups electroplate liquid voltage stabilizing stream device, satisfy the processing production capacity of continuous electroplating operation.
Description of drawings
Fig. 1 is the electroplate liquid voltage stabilizing part flow arrangement appearance assumption diagram of the utility model one preferred embodiment.
Fig. 2 is the electroplate liquid voltage stabilizing part flow arrangement structure sectional view of the utility model.
Fig. 3 is the three-dimensional arrangement sectional view of current divider box in the utility model.
Fig. 4 is the current divider box two dimensional structure sectional view of the utility model first embodiment.
Fig. 5 is the current divider box two dimensional structure sectional view of the utility model second embodiment.
Fig. 6 is that the electroplate liquid voltage stabilizing part flow arrangement of the utility model uses the configuration reference drawing.
The figure number explanation:
10 electroplate liquid accumulator tanks
11 electroplate liquid refluxing openings
20 current divider boxs
21 casings
211 fluid inlets
22 fluid plates
221 fluid holes
222 column jeckets
23 spreader plates
231 tap holes
30 feeding assemblies
31 conveying belt
40 workpiece.
Embodiment
Shown in the three-dimensional arrangement sectional view of current divider box in the electroplate liquid voltage stabilizing part flow arrangement structure sectional view of the electroplate liquid voltage stabilizing part flow arrangement appearance assumption diagram of Fig. 1 the utility model one preferred embodiment, Fig. 2 the utility model, Fig. 3 the utility model; The electroplate liquid voltage stabilizing part flow arrangement of the utility model has consisted essentially of: an electroplate liquid accumulator tank 10, and a current divider box 20.
Wherein: this electroplate liquid accumulator tank 10 can be PP welding cell body; The moulding of whole electroplate liquid accumulator tank 10 with square be good; And be provided with an electroplate liquid refluxing opening 11 in these electroplate liquid accumulator tank 10 bottoms and supply to connect the pipeline of carrying electroplate liquid, make to let electroplate liquid be repeated recycle.
This current divider box 20 is located in this electroplate liquid accumulator tank 10 relatively; This current divider box 20 has the casing 21 of a predetermined volume; Side in this casing 21 is provided with the fluid inlet 211 that at least one confession is connected with the pipeline of carrying electroplate liquid; Opening part in these casing 21 tops be covered with one be densely covered with plural fluid hole 221 fluid plate 22, at least one spreader plate 23 that is densely covered with plural tap hole 231 is set between these casing 21 inside are corresponding to this fluid inlet 211 and this fluid plate 22.
When implementing, the fluid hole 221 of this fluid plate 22 and the tap hole of this at least one spreader plate 23 231 are elongated groove opening, and fluid hole 211 apertures of this fluid plate 22 are good less than tap hole 231 apertures of this at least one spreader plate 23 relatively.Certainly, these current divider box 20 inside are corresponding to being provided with a plurality of spreader plates 23 between this fluid inlet 211 and this fluid plate 22, to increase the shunting effect to electroplate liquid; Same, fluid hole 221 apertures of this fluid plate 22 are relatively less than tap hole 231 apertures of each spreader plate 23; And, relatively more near tap hole 231 apertures of the spreader plate 23 of fluid plate 22 relatively more more away from tap hole 231 apertures of the spreader plate 23 of fluid plate 22 little be good.
Please cooperate simultaneously with reference to shown in Figure 4; The electroplate liquid voltage stabilizing part flow arrangement of the utility model is when using; Can under the effect of this at least one spreader plate 23, between the fluid inlet 211 of this at least one spreader plate 23 and this current divider box 20, form shunting layer, the space that makes the electroplate liquid that gets into current divider box 20 be able to be dispersed to uniformly each shunting layer advances towards fluid plate 22 directions via tap hole 231 again; And under the effect of this fluid plate 22; Form a voltage stabilizing layer in these fluid plate 22 belows, the flow velocity of using the stable electrical plating bath makes electroplate liquid disengage from fluid hole 221 again, lets electroplate liquid evenly spray the purpose that is distributed in workpiece 40 surfaces to reach.
As for, the electroplate liquid that is disengaged by current divider box 20 can be reclaimed by current divider box 20 peripheral electroplate liquid accumulator tanks 10, and the electroplate liquid that this electroplate liquid accumulator tank 10 is accumulated then flows into the pipeline of carrying electroplate liquid from electroplate liquid refluxing opening 11, makes to be repeated recycle; Moreover above-mentioned fluid plate 22 can be as shown in Figure 5, is provided with the column jecket 222 of a tool predetermined height in each fluid hole 221 place, makes under the progradation of column jecket 222, to increase the spray cloth effect that electroplate liquid is produced workpiece 40.
Commonly using structure with tradition compares; The electroplate liquid voltage stabilizing stream device of the utility model can let electroplate liquid evenly spray really and be distributed in workpiece surface; Relatively promote whole electroplating activity quality, and the usage quantity that reduces electroplate liquid relatively, be applicable to the electroplating activity of noble metal especially.Especially, can form the ionic activity that a perturbation action helps to increase electroplate liquid, and improve electroplating efficiency electroplate liquid.
What deserves to be mentioned is that as shown in Figure 2, the electroplate liquid voltage stabilizing part flow arrangement of the utility model can further the place, fluid plate 22 tops corresponding to this current divider box 20 be provided with the feeding assembly 30 that workpiece is accepted in a confession in these electroplate liquid accumulator tank 10 inside; This feeding assembly 30 can be made up of the conveying belt 31 that two groups of correspondences are located at these fluid plate 22 both sides; When practical application, can be as shown in Figure 6 under the limit row arrangement of plural groups electroplate liquid voltage stabilizing stream device, satisfy the processing production capacity of continuous electroplating operation.
Claims (9)
1. an electroplate liquid voltage stabilizing part flow arrangement is characterized in that, includes:
One electroplate liquid accumulator tank;
One current divider box; Be located at relatively in this electroplate liquid accumulator tank; This current divider box has a casing; Be provided with the fluid inlet that at least one confession is connected with the pipeline of carrying electroplate liquid in a side of this casing, the opening part in this casing top be covered with one be densely covered with plural fluid hole the fluid plate, between this box house is corresponding to this fluid inlet and this fluid plate, at least one spreader plate that is densely covered with plural tap hole is set.
2. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 1 is characterized in that, the place, fluid plate top corresponding to this current divider box is provided with the feeding assembly that workpiece is accepted in a confession to this electroplate liquid voltage stabilizing part flow arrangement in this electroplate liquid accumulator tank inside.
3. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 2 is characterized in that the conveying belt that this feeding assembly is located at these fluid plate both sides by two groups of correspondences constitutes.
4. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 1 is characterized in that, this electroplate liquid accumulator tank bottom is provided with at least one electroplate liquid refluxing opening.
5. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 1 is characterized in that the fluid hole of this fluid plate and the tap hole of each spreader plate are elongated groove opening.
6. like claim 1 or 5 described electroplate liquid voltage stabilizing part flow arrangements, it is characterized in that the fluid hole aperture of this fluid plate is relatively less than the tap hole aperture of this at least one spreader plate.
7. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 1 is characterized in that, this current divider box inside is corresponding between this fluid inlet and this fluid plate a plurality of spreader plates being set.
8. electroplate liquid voltage stabilizing part flow arrangement as claimed in claim 7 is characterized in that, the fluid hole aperture of this fluid plate is relatively less than the tap hole aperture of each spreader plate; And, little away from the tap hole aperture of the spreader plate of fluid plate relatively more more near the shunting aperture of the spreader plate of fluid plate relatively more.
9. like claim 1 or 5 described electroplate liquid voltage stabilizing part flow arrangements, it is characterized in that this fluid plate is provided with a tool column jecket in each fluid hole place.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203675551U CN202297813U (en) | 2011-09-30 | 2011-09-30 | Plating-solution voltage stabilization shunting device |
| TW101210502U TWM443711U (en) | 2011-09-30 | 2012-05-31 | Continuous electroplating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203675551U CN202297813U (en) | 2011-09-30 | 2011-09-30 | Plating-solution voltage stabilization shunting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202297813U true CN202297813U (en) | 2012-07-04 |
Family
ID=46366747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203675551U Expired - Fee Related CN202297813U (en) | 2011-09-30 | 2011-09-30 | Plating-solution voltage stabilization shunting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202297813U (en) |
| TW (1) | TWM443711U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
| CN113718305A (en) * | 2021-08-31 | 2021-11-30 | 东莞奥美特科技有限公司 | Electroplating equipment and electroplating bath for integrated circuit lead frame |
-
2011
- 2011-09-30 CN CN2011203675551U patent/CN202297813U/en not_active Expired - Fee Related
-
2012
- 2012-05-31 TW TW101210502U patent/TWM443711U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
| CN113718305A (en) * | 2021-08-31 | 2021-11-30 | 东莞奥美特科技有限公司 | Electroplating equipment and electroplating bath for integrated circuit lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM443711U (en) | 2012-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20130930 |