CN210117425U - Manufacturing device for sectional electroplating diamond cutting line and manufactured cutting line - Google Patents
Manufacturing device for sectional electroplating diamond cutting line and manufactured cutting line Download PDFInfo
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- CN210117425U CN210117425U CN201920765988.9U CN201920765988U CN210117425U CN 210117425 U CN210117425 U CN 210117425U CN 201920765988 U CN201920765988 U CN 201920765988U CN 210117425 U CN210117425 U CN 210117425U
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- 238000009713 electroplating Methods 0.000 title claims abstract description 75
- 238000005520 cutting process Methods 0.000 title claims abstract description 47
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 42
- 239000010432 diamond Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000007747 plating Methods 0.000 claims description 34
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 23
- 239000010936 titanium Substances 0.000 claims description 23
- 229910052719 titanium Inorganic materials 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 230000007704 transition Effects 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- 239000004576 sand Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 241001391944 Commicarpus scandens Species 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 14
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
The utility model relates to a manufacturing device of a sectional electroplating diamond cutting line and the cutting line manufactured by the same, belonging to the technical field of diamond cutting line production equipment, wherein the manufacturing device comprises an electroplating power supply, a sanding component and a conductive component, the output current of the electroplating power supply is rectangular pulse current, the sanding component comprises an electroplating bath filled with electroplating solution, a first shielding plate and a second shielding plate inside the electroplating bath are arranged oppositely and at intervals to form a gap for a base line to pass through at a constant speed, a plurality of through holes are arranged on the first shielding plate and the second shielding plate, the conductive component is respectively electrically connected with a cathode and an anode of the electroplating power supply, the sanding component of the utility model has no moving parts or parts, avoids the abrasion of diamond grinding materials in the electroplating solution to the moving parts, has reliable operation, can realize the sectional sanding of the base line, has small impact in the cutting process and is not easy to break, the cutting efficiency is improved, and the cutting line can be stably used for a long time.
Description
Technical Field
The utility model belongs to the technical field of diamond cut line production facility, specifically speaking relates to a diamond cut line manufacturing installation is electroplated to segmentation and line of cut of manufacturing.
Background
The electroplated diamond cutting line is a cutting tool formed by consolidating diamond micro powder on a steel wire by adopting an electro-deposition nickel method, and is mainly used for cutting and processing hard and brittle materials such as silicon crystals, sapphire and the like.
The main production process of the electroplated diamond cutting wire is as follows: pre-processing, pre-plating, sanding and thickening of the steel wire. The pretreatment mainly refers to the processes of alkali washing, acid washing, cleaning and the like of the steel wire, and the impurities such as oil stains, rust layers and the like on the surface of the steel wire are removed. The preplating is to preplate a layer of nickel on the surface of the steel wire so as to improve the binding force between the plating layer and the steel wire. Sanding refers to the preliminary consolidation of diamond abrasives to a steel wire substrate by electrodeposition of metallic nickel. Thickening refers to firmly holding the preliminarily consolidated diamond in the sand on the steel wire substrate by further electrodepositing metal. The production process of the electroplated diamond cutting wire is generally carried out continuously, and the surface of the produced electroplated diamond cutting wire is provided with a coating containing diamond particles which are distributed continuously, and the diamond cutting wire can be called a cutting wire with the diamond particles distributed continuously. The cutting wire with the diamond particles distributed continuously mainly has the following problems during the use process: (1) the chip containing space is small, and the chip containing space formed among the diamond particles is easy to block in the cutting process, so the cutting efficiency is low; (2) the cutting wire has a low fluid carrying capacity and the lubrication and cooling of the cutting zone is insufficient.
The diamond cutting line coated with sand in sections refers to that an electroplated layer containing diamond particles on the diamond cutting line is discontinuous and is divided into an electroplated section and an unplated section, wherein a diamond particle plated layer is consolidated on the upper surface of the electroplated section, and no diamond particles are consolidated on the unplated section. The electroplating sections and the non-electroplating sections are distributed at intervals. The plating section plays a role of cutting, and the non-plating section mainly plays a role of chip containing and carrying cutting fluid. Therefore, the cutting efficiency of the diamond cutting line with sand on the segments is high, and the cutting area is cooled sufficiently. The existing subsection sanding method mainly comprises three methods, one method is to adopt a covering method to separate a non-sanding electroplating section from electroplating solution, and the application number is as follows: CN201410136210, the operation of the steel wire in the electroplating solution is intermittent during the operation, the production efficiency is low, the equipment is complex, and the mechanism for driving the covering mold in the electroplating bath is easily damaged by the diamond in the electroplating solution. The second method is to apply insulating coating on the non-electroplating section to realize sand coating on the section, such as application number: CN201710683794, the scrap-containing capacity of the non-electroplating section is reduced. The third is to prevent the sand on the non-plating section by the insulation shielding device moving together with the cutting line, as the application number: CN201410329088, although the disadvantages of the above two methods are solved, the sanding device has more moving parts, complex equipment and poor reliability of continuous operation, and the electroplated section and the non-electroplated section of the produced electroplated diamond cutting line have obvious diameter difference, so that the cutting process has large impact and is easy to break.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, a device for manufacturing a segment-plated diamond cutting wire, a method for using the same, and a cutting wire manufactured by the same are provided.
In order to achieve the above object, the utility model provides a following technical scheme:
a segmented electroplated diamond cutting line manufacturing apparatus, comprising:
the electroplating power supply is a unidirectional pulse power supply, and the output current of the electroplating power supply is rectangular pulse current;
the sand feeding assembly comprises a plating bath filled with electroplating solution, a first shielding plate and a second shielding plate are arranged in the plating bath, the first shielding plate and the second shielding plate are arranged oppositely and at intervals to form a gap for the base line to pass through at a constant speed, and a plurality of through holes are formed in the first shielding plate and the second shielding plate at equal intervals along the length direction of the plating bath;
and the conductive components are respectively electrically connected with the cathode and the anode of the electroplating power supply.
Preferably, the first shielding plate and the second shielding plate are arranged along the length direction of the electroplating bath, and the end parts of the first shielding plate and the second shielding plate are fixedly connected with the end part of the electroplating bath respectively.
Preferably, the via holes are arranged at equal intervals along the length direction of the electroplating bath, the via holes on the first shielding plate and the second shielding plate are correspondingly arranged, and the base line in the gap is opposite to the via holes.
Preferably, an inlet auxiliary groove and an outlet auxiliary groove communicated with the electroplating bath are respectively arranged at two ends of the electroplating bath, the electroplating bath is communicated with the liquid injection pipe, and the inlet auxiliary groove and the outlet auxiliary groove are respectively communicated with the liquid outlet pipe.
Preferably, the conductive assembly comprises a conductive wheel electrically connected with the cathode of the electroplating power supply and an anode titanium basket electrically connected with the anode of the electroplating power supply, the base line enters the sanding assembly through the conductive wheel, the anode titanium basket containing metallic nickel is positioned in the electroplating bath, and the anode titanium basket is arranged in parallel with the first shielding plate and the second shielding plate.
Preferably, the number of the conductive wheels is 2, and the 2 conductive wheels are respectively positioned in the inlet auxiliary groove and the outlet auxiliary groove.
Preferably, the number of the anode titanium baskets is 2, 2 anode titanium baskets are respectively arranged corresponding to the first shielding plate and the second shielding plate, and the 2 anode titanium baskets are respectively positioned on the wall of the plating bath.
In addition, the utility model also provides a method for using of segmentation electroplating diamond cutting line manufacturing installation, includes the following steps:
s1: switching on an electroplating power supply, enabling the base line to enter the electroplating bath through the conductive wheel and pass through the through holes in the first shielding plate and the second shielding plate at a constant speed;
s2: the rectangular pulse current output by the electroplating power supply is matched, when the base line passes through the through hole, the current passes through the anode titanium basket and the base line, nickel is deposited on the base line under the action of electrodeposition, and diamond in contact with the base line is fixedly bonded on the base line to form an electroplating section;
s3: when the base line is positioned between the adjacent 2 through holes, no current passes between the anode titanium basket and the base line due to the action of the first shielding plate and the second shielding plate, and the nickel and the diamond cannot be solidified on the base line to form an electroless plating section;
s4: steps S2-S3 are repeated until the baseline output plating bath.
In addition, the utility model also provides a by the line of cut that segmentation electroplated diamond line of cut manufacturing installation was made, section and non-electroplating section are electroplated to line of cut surface spaced equipartition, electroplate the section and include the cylinder section and be the changeover portion of taper, the changeover portion is 2 sections, and 2 sections changeover portions are located the both ends of cylinder section respectively.
Preferably, the length of the plating section is Ld, the length of the non-plating section is Lf, the length of the transition section is Lg, the baseline running speed is Vs, the energizing time and the de-energizing time of the rectangular pulse current are Ton and Toff, the length of the via holes is L1, and the distance between every two adjacent via holes is L2, then L1 is Ld-Lg;
L2＝Lf+Lg；
Ton＝(L1-Lg)/Vs；
Toff＝(L2+Lg)/Vs。
the utility model has the advantages that:
simple structure does not have moving part or part in the last sand subassembly, has avoided the diamond abrasive material in the plating solution to the wearing and tearing of moving part, and the operation is reliable, simultaneously, through preferring the electric hole length, adjacent 2 cross the distance between the electric hole and adopt the pulse discharge that the electroplating power formed certain period to realize the segmentation of baseline and go up sand, and the impact is little among the cutting process, and difficult broken string improves cutting efficiency for the line of cut can realize long-term stable use.
Drawings
FIG. 1 is a front view of the overall structure of the present invention;
fig. 2 is a top view of the overall structure of the present invention;
fig. 3 is a schematic structural view of a first shield plate;
FIG. 4 is a schematic diagram of a rectangular pulse current;
fig. 5 is a schematic view of the structure of the cutting line.
In the drawings: 1-electroplating power supply, 2-base line, 3-conductive wheel, 4-wire through hole, 5-sanding component, 501-inlet auxiliary groove, 502-electroplating groove, 503-liquid injection pipe, 504-liquid outlet pipe, 505-outlet auxiliary groove, 6-first shielding plate, 7-anode titanium basket, 8-electroplating hole, 9-first conducting wire, 10-second conducting wire, 11-electroplating section, 1101-transition section, 1102-cylindrical section, 12-non-electroplating section, 13-diamond abrasive material and 14-second shielding plate.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following description, together with the drawings of the present invention, clearly and completely describes the technical solution of the present invention, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without creative efforts shall all belong to the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustration and not for limitation of the present invention.
The first embodiment is as follows:
as shown in figures 1 and 2, the manufacturing device of the segmented electroplated diamond cutting line comprises an electroplating power supply 1, a sanding component 5 and a conductive component. Specifically, the electroplating power supply 1 is a unidirectional pulse power supply, and the output current thereof is a rectangular pulse current, as shown in fig. 4.
The sanding assembly 5 includes a plating bath 502 containing a plating solution with diamond abrasives mixed therein. The plating tank 502 is internally provided with a first shielding plate 6 and a second shielding plate 14, the first shielding plate 6 and the second shielding plate 14 are arranged along the length direction of the plating tank 502, and the end parts of the first shielding plate 6 and the second shielding plate 14 are fixedly connected with the end part of the plating tank 502 respectively. The end of the electroplating bath 502 is provided with a wire passing hole 4 through which the baseline 2 passes at a constant speed, and meanwhile, the first shielding plate 6 and the second shielding plate 14 are arranged oppositely and at intervals to form a gap through which the baseline 2 passes at a constant speed, as shown in fig. 3, a plurality of current passing holes 8 are arranged on the first shielding plate 6 and the second shielding plate 14 at equal intervals along the length direction of the electroplating bath 502, the current passing holes 8 on the first shielding plate 6 and the second shielding plate 14 are correspondingly arranged, and the baseline 2 in the gap is arranged opposite to the current passing holes 8.
The conductive assembly comprises a conductive wheel 3 electrically connected with the cathode of the electroplating power supply 1 through a first lead 9, and an anode titanium basket 7 electrically connected with the anode of the electroplating power supply 1 through a second lead 10, the base line 2 enters the sanding assembly 5 through the conductive wheel 3, the anode titanium basket 7 containing metallic nickel is positioned in the electroplating bath 502, and the anode titanium basket 7 is arranged in parallel with the first shielding plate 6 and the second shielding plate 14. In this embodiment, an inlet sub-tank 501 and an outlet sub-tank 505 communicated with the plating tank 502 are respectively disposed at two ends of the plating tank 502, and the plating tank 502 is communicated with a liquid injection pipe 503 to realize liquid feeding of the plating solution. The inlet auxiliary tank 501 and the outlet auxiliary tank 505 are respectively communicated with the liquid outlet pipe 504, so that the electroplating liquid is discharged. The number of the conductive wheels 3 is 2, and 2 conductive wheels 3 are respectively located in the inlet sub-tank 501 and the outlet sub-tank 505, and correspondingly, the number of the anode titanium baskets 7 is 2, 2 anode titanium baskets 7 are respectively arranged corresponding to the first shielding plate 6 and the second shielding plate 14, and 2 anode titanium baskets 7 are respectively located on the tank wall of the electroplating tank 502.
The use method of the manufacturing device of the segmented electroplated diamond cutting line comprises the following steps:
s1: the electroplating power supply 1 is switched on, the base line 2 enters the electroplating bath 502 through the conductive wheel 3 and the wire passing hole 4 and passes through the through holes 8 on the first shielding plate 6 and the second shielding plate 14 at a constant speed;
s2: when the base line 2 passes through the through hole 8 in cooperation with the rectangular pulse current output by the electroplating power supply 1, the electroplating power supply 1 is in a power-on state of outputting the rectangular pulse current, current passes between the anode titanium basket 7 and the base line 2, and under the action of electrodeposition, nickel is deposited on the base line 2 and diamond grinding materials 13 in contact with the base line 2 are fixedly bonded on the base line 2 to form an electroplating section;
s3: when the base line 2 is positioned between the adjacent 2 through holes 8, no current passes between the anode titanium basket 7 and the base line 2 due to the action of the first shielding plate 6 and the second shielding plate 14, so that the electrodeposition process cannot be realized, and the nickel and diamond grinding materials 13 cannot be fixedly bonded on the base line 2 to form an electroless plating section;
s4: steps S2 to S3 are repeated until the base wire 2 is discharged from the plating bath 502, that is, the base wire 2 is continuously and uniformly operated while the first shielding plate 6 and the second shielding plate 14 are fixed in the plating bath 502 during the whole process.
Example two:
as shown in fig. 5, the uniformly-distributed electroplating section 11 and the non-electroplating section 12 are arranged on the surface of the cutting line at intervals, the electroplating section 11 includes a cylindrical section 1102 and a transition section 1101, since the base line 2 runs continuously and at a constant speed, and the first shielding plate 6 and the second shielding plate 14 are fixed in the electroplating tank 502, the transition section 1101 is in a tapered shape with a gradually changing thickness, the transition section 1101 is 2 sections, and the 2 sections of the transition section 1101 are respectively located at two ends of the cylindrical section 1102.
Meanwhile, as shown in fig. 3-5, the length of the plating section 11 is Ld, the length of the non-plating section 12 is Lf, the length of the transition section 1101 is Lg, the running speed of the baseline 2 is Vs, the energization time of the rectangular pulse current is Ton, the deenergization time is Toff, the length of the over-current hole 8 is L1, and the distance between two adjacent over-current holes 8 is L2, so that L1 is Ld-Lg;
L2＝Lf+Lg；
Ton＝(L1-Lg)/Vs；
Toff＝(L2+Lg)/Vs。
that is, the staged sanding of the base wire 2 is achieved by optimizing the via hole 8 length, the distance between adjacent 2 via holes 8, and the use of the plating power supply 1 to create a periodic pulsed discharge.
Example three:
parts of this embodiment that are the same as the embodiment are not described again, except that:
the length of the electroplating section 11 is 10mm, the length of the non-electroplating section 12 is 10mm, the length of the transition section 1101 is 2mm, the running speed of the base line 2 is 100mm/s, the length of the through holes 8 is 8mm, the distance between the 2 through holes 8 is 12mm, the power-on time of the rectangular current output by the electroplating power supply 1 is 0.06s, and the power-off time is 0.14 s.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, i.e. the present invention is intended to cover all equivalent variations and modifications within the scope of the present invention.
Claims (9)
1. A segmented electroplated diamond cutting line manufacturing device, comprising:
the electroplating power supply is a unidirectional pulse power supply, and the output current of the electroplating power supply is rectangular pulse current;
the sand feeding assembly comprises a plating bath filled with electroplating solution, a first shielding plate and a second shielding plate are arranged in the plating bath, the first shielding plate and the second shielding plate are arranged oppositely and at intervals to form a gap for the base line to pass through at a constant speed, and a plurality of electricity passing holes are formed in the first shielding plate and the second shielding plate;
and the conductive components are respectively electrically connected with the cathode and the anode of the electroplating power supply.
2. The apparatus of claim 1, wherein the first and second shielding plates are disposed along a length direction of the electroplating bath, and ends of the first and second shielding plates are fixedly connected to ends of the electroplating bath.
3. The apparatus of claim 1, wherein the via holes are disposed at equal intervals along the length of the electroplating bath, the via holes on the first shielding plate and the second shielding plate are disposed correspondingly, and the base line in the gap is disposed opposite to the via holes.
4. The apparatus as claimed in claim 2 or 3, wherein the plating bath has an inlet sub-bath and an outlet sub-bath at opposite ends thereof, the plating bath is in communication with the liquid injection pipe, and the inlet sub-bath and the outlet sub-bath are in communication with the liquid outlet pipe.
5. The apparatus as claimed in claim 4, wherein the conductive assembly comprises a conductive wheel electrically connected to a cathode of the electroplating power supply, and an anode titanium basket electrically connected to an anode of the electroplating power supply, the base string is fed into the sanding assembly through the conductive wheel, the anode titanium basket containing metallic nickel is disposed in the electroplating bath, and the anode titanium basket is disposed in parallel with the first shielding plate and the second shielding plate.
6. The apparatus as claimed in claim 5, wherein the number of the conductive wheels is 2, and the 2 conductive wheels are respectively located at the inlet sub-groove and the outlet sub-groove.
7. The apparatus as claimed in claim 6, wherein the number of the anode titanium baskets is 2, 2 anode titanium baskets are respectively disposed corresponding to the first shielding plate and the second shielding plate, and 2 anode titanium baskets are respectively disposed on a wall of the plating bath.
8. The cutting line manufactured by the manufacturing device of the segmented electroplated diamond cutting line of any one of claims 1 to 7, wherein the electroplated section and the non-electroplated section are uniformly distributed on the surface of the cutting line at intervals, the electroplated section comprises a cylindrical section and a conical transition section, the transition section is 2 sections, and the 2 transition sections are respectively positioned at two ends of the cylindrical section.
9. The cutting line as set forth in claim 8, wherein the plating section has a length Ld, the non-plating section has a length Lf, the transition section has a length Lg, the base line operating speed is Vs, the energization time and the deenergization time of the rectangular pulse current are Ton and Toff, the via hole has a length L1, and the distance between adjacent 2 via holes is L2, then L1 is Ld-Lg;
L2＝Lf+Lg；
Ton＝(L1-Lg)/Vs；
Toff＝(L2+Lg)/Vs。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920765988.9U CN210117425U (en) | 2019-05-24 | 2019-05-24 | Manufacturing device for sectional electroplating diamond cutting line and manufactured cutting line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920765988.9U CN210117425U (en) | 2019-05-24 | 2019-05-24 | Manufacturing device for sectional electroplating diamond cutting line and manufactured cutting line |
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| Publication Number | Publication Date |
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| CN210117425U true CN210117425U (en) | 2020-02-28 |
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| CN201920765988.9U Active CN210117425U (en) | 2019-05-24 | 2019-05-24 | Manufacturing device for sectional electroplating diamond cutting line and manufactured cutting line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110055568A (en) * | 2019-05-24 | 2019-07-26 | 长治高测新材料科技有限公司 | A kind of segmentation electroplated diamond cutting line manufacturing device and application method and cutting line |
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2019
- 2019-05-24 CN CN201920765988.9U patent/CN210117425U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110055568A (en) * | 2019-05-24 | 2019-07-26 | 长治高测新材料科技有限公司 | A kind of segmentation electroplated diamond cutting line manufacturing device and application method and cutting line |
| CN110055568B (en) * | 2019-05-24 | 2023-10-17 | 长治高测新材料科技有限公司 | Manufacturing device and using method of segmented electroplated diamond cutting line and cutting line |
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Effective date of registration: 20240611 Address after: 266114 No. 66 Chongsheng Road, High tech Zone, Qingdao, Shandong Patentee after: QINGDAO GAOCE TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 047300 Jidian Xiang Beihuang Cun, Huguan County, Changzhi City, Shanxi Province Patentee before: Huguan high test new material technology Co.,Ltd. Country or region before: China |