CN202111940U - Embedded type component circuit board - Google Patents
Embedded type component circuit board Download PDFInfo
- Publication number
- CN202111940U CN202111940U CN2011202514406U CN201120251440U CN202111940U CN 202111940 U CN202111940 U CN 202111940U CN 2011202514406 U CN2011202514406 U CN 2011202514406U CN 201120251440 U CN201120251440 U CN 201120251440U CN 202111940 U CN202111940 U CN 202111940U
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- China
- Prior art keywords
- circuit board
- component circuit
- electronic components
- type component
- embedded
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- Expired - Fee Related
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Abstract
The utility model discloses an embedded type component circuit board. The component circuit board comprises a base plate provided with insertion holes and used for accommodating electronic components, a filler used for filling gaps between the electronic components and the insertion holes, and connection layers overlapped with the base plate and contacted with poles; the connection layers are provided with circuits; and the thickness of the base plate is matched with the height of the electronic components. The embedded type component circuit board can improve the reliability of the encapsulation, lowers the cost, and realizes that a large amount of embedded passive components can be embedded into a PCB, thereby shortening the line among the electronic components, improving electrical characteristics, enlarging the effective encapsulation area of the PCB, and reducing a great number of welding points on the surface of the PCB, so that the reliability of the encapsulation is improved, and the cost is lowered.
Description
Technical field
The utility model relates to the circuit board technology field, specifically is a kind of flush type components and parts circuit board.
Background technology
Along with increasing suddenly of the portable electronic products and the digital product of receiving and sending messages at a high speed, High Density Packaging Technology more and more demonstrates its importance.It mainly acts on can make exactly that the complicated electronic product is small-sized, light weight, slim and high-performance, multifunction.In order constantly to satisfy the demand of this development trend, electronic component trends towards microminiature and ultrathin type more, and printed circuit board trends towards high-accuracy figure and slim multiple stratification more.To on such printed circuit board plate face, arrange a large amount of element more and more difficult is installed; At present; Passive component is in the great majority in generally about the various electronic components of printed circuit board assembling; Passive component quantity and active element quantity ratios are (15～20): 1, and the increase of the raising of As IC integrated level and I/O number thereof, passive component quantity also can continue to increase sharply.Therefore; Be embedded to the passive component that to imbed in a large number in the printed circuit intralamellar part, just can shorten element line length each other, improve electrical characteristic; Improve effective printed circuit board package area; Reduce the pad of a large amount of printed circuit board plate faces, thereby improve the reliability of encapsulation, and reduce cost.So embedded element is very desirable a kind of installation form and technology.
The utility model content
To the problems referred to above, the utility model aims to provide a kind of reliability that improves encapsulation, improves the circuit board of electrical characteristic.
For realizing this technical purpose; The scheme of the utility model is: a kind of flush type components and parts circuit board; Comprise the substrate that jack is arranged that is used to hold electronic component, also comprise the filler that is used to fill gap between electronic component and the jack, and; Overlap the articulamentum that contacts with electrode on the substrate, on the said articulamentum circuit is arranged; The thickness of said substrate and the matched of electronic component.
As preferably, said substrate is a copper clad laminate, and said electronic component is a passive component.
The flush type element circuitry plate of this programme can improve the reliability of encapsulation, and reduces cost, and is embedded to the passive component that can imbed in a large number in the printed circuit intralamellar part; Just can shorten element line length each other; Improve electrical characteristic, improve effective printed circuit board package area, reduce the pad of a large amount of printed circuit board plate faces; Thereby improve the reliability of encapsulation, and reduce cost.
Description of drawings
Fig. 1 is the sectional structure chart of the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is explained further details.
Flush type passive component manufacturing technology mainly is the internal layer technology that combines multilayer; With etching or print process resistance, electric capacity, inductance are made on the inner plating; Imbed intralamellar part through pressing and technology for preparing plywood flow process then; Be used for replacing welding passive component required on the panel, the active element assembling and the wiring degree of freedom are improved.
Imbedding resistance all is the material of high resistivity with material, and can be made into the planar resistor of different shape and different resistance values.Resistance material has nickel-phosphorus alloy, nonmetallic materials (like carbon, graphite, Buddha's warrior attendant powder), the compound of form slurry (printing ink) that also can be metal powder and non-metallic fillers (like silicon powder, glass dust) with modulation such as resin bonding, dispersant, smooth and level dose.
As shown in Figure 1; A kind of flush type components and parts circuit board of the utility model; Comprise the substrate that jack is arranged 1 that is used to hold electronic component 4, also comprise the filler 5 that is used to fill gap between electronic component 4 and the jack, and; Overlap the articulamentum 2 that contacts with electrode on the substrate, on the said articulamentum 2 circuit is arranged; The thickness of said substrate 1 and the matched of electronic component.Said substrate 1 is a copper clad laminate, articulamentum 2 overlap lay respectively at copper clad laminate 2 on cover copper layer 31 with under cover on the copper layer 32, said electronic component 4 is passive components.
Below only adopt and imbed resistive technologies and briefly introduce with regard to most preferred embodiment.The resistive technologies of etching alloying metal.This technology is at first to adopt to electroplate or sputter at alligatoring copper-clad surface formation electric resistance alloy genus layer (like nickel-phosphorus alloy Nip, nichrome NiCr, tantalum nitrogen alloy TaN, chrome-silicon alloy CrSi, a titanium-tungsten TiW etc.), makes it then to form the foil laminate that covers of making internal layer with other dielectric materials.When making circuit, utilize multiexposure, multiple exposure and etching technique, form required film resistor at ad-hoc location.Its technological process is following:
Plate face clean → pad pasting → exposure → development → etch copper → etching nickel-phosphorus alloy (or NiCr, RaN etc.) → striping → oxidation → secondary pad pasting → re-expose → redevelopment → deoxidation → second etch copper → secondary striping → detection.
About imbedding capacitance technology, imbedding electric capacity technology has the method that adopts the dielectric film, and the method that forms thick film or thin-film dielectric body method and adopt the big high temperature sintering inventive thick film paste of dielectric constant is arranged.
About imbedding inductor, imbedding inductor is to form shapes such as helical form, bending through etching Copper Foil or copper facing, perhaps utilizes the interlayer conduction hole to form the spiral sandwich construction.Its characteristic depends on the structure of base material and graphics shape etc.Present inductance value only have tens receive enjoy about.Be main still now to use high-frequency model.
Claims (2)
1. flush type components and parts circuit board; Comprise the substrate that jack is arranged that is used to hold electronic component, it is characterized in that: also comprise the filler that is used to fill gap between electronic component and the jack, and; Overlap the articulamentum that contacts with electrode on the substrate, on the said articulamentum circuit is arranged; The thickness of said substrate and the matched of electronic component.
2. circuit board according to claim 1 is characterized in that: said substrate is a copper clad laminate, and said electronic component is a passive component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202514406U CN202111940U (en) | 2011-07-15 | 2011-07-15 | Embedded type component circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202514406U CN202111940U (en) | 2011-07-15 | 2011-07-15 | Embedded type component circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202111940U true CN202111940U (en) | 2012-01-11 |
Family
ID=45437388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202514406U Expired - Fee Related CN202111940U (en) | 2011-07-15 | 2011-07-15 | Embedded type component circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202111940U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103643085A (en) * | 2013-11-13 | 2014-03-19 | 中国科学院深圳先进技术研究院 | Embedded film resistor material and its preparation method |
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
| CN105657971A (en) * | 2014-11-14 | 2016-06-08 | 欣兴电子股份有限公司 | Embedded element packaging structure and manufacturing method thereof |
-
2011
- 2011-07-15 CN CN2011202514406U patent/CN202111940U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103643085A (en) * | 2013-11-13 | 2014-03-19 | 中国科学院深圳先进技术研究院 | Embedded film resistor material and its preparation method |
| CN103643085B (en) * | 2013-11-13 | 2015-09-30 | 中国科学院深圳先进技术研究院 | Embed type film resistor material and preparation method thereof |
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
| CN105657971A (en) * | 2014-11-14 | 2016-06-08 | 欣兴电子股份有限公司 | Embedded element packaging structure and manufacturing method thereof |
| CN105657971B (en) * | 2014-11-14 | 2018-11-20 | 欣兴电子股份有限公司 | Built-in type component packaging structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINGZHIGUANG INDUSTRIAL DEVELOPMENT CO., Free format text: FORMER NAME: SHENZHEN XINGZHIGUANG INDUSTRIAL CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Longgang District of Shenzhen City, Guangdong province Longgang town 518000 village wells Tin Road No. three or four layer Patentee after: Shenzhen Xingzhiguang Industrial Development Co., Ltd. Address before: Longgang District of Shenzhen City, Guangdong province Longgang town 518000 village wells Tin Road No. three or four layer Patentee before: Shenzhen Xingzhiguang Industrial Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20150715 |
|
| EXPY | Termination of patent right or utility model |