CN206302629U - Silver paste cross-line printed wiring board - Google Patents
Silver paste cross-line printed wiring board Download PDFInfo
- Publication number
- CN206302629U CN206302629U CN201621424041.4U CN201621424041U CN206302629U CN 206302629 U CN206302629 U CN 206302629U CN 201621424041 U CN201621424041 U CN 201621424041U CN 206302629 U CN206302629 U CN 206302629U
- Authority
- CN
- China
- Prior art keywords
- layer
- wiring board
- substrate
- graphite radiating
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model is related to a kind of silver paste cross-line printed wiring board, including substrate, and copper conductor, separation layer and ink layer are disposed with substrate, and silver slurry layer is set between the separation layer and ink layer, and base plate bottom is provided with graphite radiating layer and PI films；The graphite radiating layer is bonded in base plate bottom by bonding agent；The PI films are bonded in graphite radiating layer bottom by bonding agent；The thickness of the thickness less than substrate of the graphite radiating layer.The utility model is by silver slurry layer come the circuit of connection line plate, it is to avoid electrical connection is subject to electromagnetic interference.Graphite radiating layer is set in base plate bottom, and is protected by PI films, improve the radiating effect of wiring board, and then improve the service life of circuit board.
Description
Technical field
The utility model is related to a kind of wiring board, more particularly to a kind of silver paste cross-line printed wiring board.
Background technology
Printed wiring board is typically served to as each component provides necessary support in circuit in the electronic device, is easy to each
Individual component inserting, realizes that it is electrically connected.Widely used in an electronic.But the more sensitive unit of electromagnetic induction
Device, can easily receive electromagnetic interference.And wiring board easily generates heat in use, radiating is also the influence wiring board life-span
Key factor.
The content of the invention
The purpose of this utility model is to provide a kind of electrical connection for avoiding component to be subject to electromagnetic interference, improves radiating effect
Really, the silver paste cross-line printed wiring board of wiring board service life is improved.
In order to achieve the above object, the technical solution of the utility model is：A kind of silver paste cross-line printed wiring board, including base
Plate, is disposed with copper conductor, separation layer and ink layer on substrate, silver slurry layer is set between the separation layer and ink layer, and
Base plate bottom is provided with graphite radiating layer and PI films.
The graphite radiating layer is bonded in base plate bottom by bonding agent.
The PI films are bonded in graphite radiating layer bottom by bonding agent.
The thickness of the thickness less than substrate of the graphite radiating layer.
After said structure, the utility model is by silver slurry layer come the circuit of connection line plate, it is to avoid electrical connection is subject to
Electromagnetic interference.Graphite radiating layer is set in base plate bottom, and is protected by PI films, improve the radiating effect of wiring board,
And then improve the service life of circuit board.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
The utility model is described in further detail below in conjunction with the embodiment that accompanying drawing is given.
It is shown in Figure 1, a kind of silver paste cross-line printed wiring board, including substrate 1, it is disposed with copper conductor on substrate 1
2nd, separation layer 3 and ink layer 5, set silver slurry layer 4 between the separation layer 3 and ink layer 5, and the bottom of substrate 1 is provided with graphite
Heat dissipating layer 6 and PI films 7.
Shown in Figure 1, the graphite radiating layer 6 is bonded in the bottom of substrate 1 by bonding agent.The PI films 7 are by viscous
Connect agent and be bonded in 6 bottom of graphite radiating layer.Such connected mode Simplified flowsheet, improves degree of being connected firmly.
It is shown in Figure 1, the thickness of the thickness less than substrate 1 of the graphite radiating layer 6.Avoid wiring board blocked up and bring
A series of ill effects, and also act as radiating ensure.
Shown in Figure 1, separation layer of the present utility model 3 plays insulation effect, and silver slurry layer 4 will for connecting copper conductor 2
Wiring board each circuit electrical connection, graphite linings 5 can play a protective role, and graphite radiating layer 6 is bonded in the bottom of substrate 1, rises
To the thermolysis to substrate, PI films 7 play a part of to protect graphite linings 6.
Above-described is only preferred embodiment of the present utility model, it is noted that for the ordinary skill of this area
For personnel, on the premise of the utility model creation design is not departed from, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.
Claims (4)
1. a kind of silver paste cross-line printed wiring board, including substrate (1), is disposed with copper conductor (2), separation layer on substrate (1)
And ink layer (5) (3), it is characterised in that：Silver slurry layer (4), and substrate (1) are set between the separation layer (3) and ink layer (5)
Bottom is provided with graphite radiating layer (6) and PI films (7).
2. silver paste cross-line printed wiring board according to claim 1, it is characterised in that：Graphite radiating layer (6) passes through
Bonding agent is bonded in substrate (1) bottom.
3. silver paste cross-line printed wiring board according to claim 1, it is characterised in that：The PI films (7) are by bonding agent
It is bonded in graphite radiating layer (6) bottom.
4. silver paste cross-line printed wiring board according to claim 1, it is characterised in that：The thickness of graphite radiating layer (6)
Thickness of the degree less than substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424041.4U CN206302629U (en) | 2016-12-22 | 2016-12-22 | Silver paste cross-line printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424041.4U CN206302629U (en) | 2016-12-22 | 2016-12-22 | Silver paste cross-line printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206302629U true CN206302629U (en) | 2017-07-04 |
Family
ID=59204941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621424041.4U Expired - Fee Related CN206302629U (en) | 2016-12-22 | 2016-12-22 | Silver paste cross-line printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206302629U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134014A (en) * | 2018-01-25 | 2018-06-08 | 上海天马有机发光显示技术有限公司 | Display module and display device |
-
2016
- 2016-12-22 CN CN201621424041.4U patent/CN206302629U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134014A (en) * | 2018-01-25 | 2018-06-08 | 上海天马有机发光显示技术有限公司 | Display module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20191222 |