CN201804862U - 单颗三芯片led颗粒 - Google Patents

单颗三芯片led颗粒 Download PDF

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Publication number
CN201804862U
CN201804862U CN 201020150437 CN201020150437U CN201804862U CN 201804862 U CN201804862 U CN 201804862U CN 201020150437 CN201020150437 CN 201020150437 CN 201020150437 U CN201020150437 U CN 201020150437U CN 201804862 U CN201804862 U CN 201804862U
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China
Prior art keywords
chips
chip
led particle
during
fixed
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Expired - Fee Related
Application number
CN 201020150437
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English (en)
Inventor
朱会兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Tenghuang Electronic Technology Co Ltd
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Henan Tenghuang Electronic Technology Co Ltd
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Publication date
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Priority to CN 201020150437 priority Critical patent/CN201804862U/zh
Application granted granted Critical
Publication of CN201804862U publication Critical patent/CN201804862U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Led Device Packages (AREA)

Abstract

一种单颗三芯片LED颗粒，其关键是：将三颗芯片固定在同一个反光杯内，采用三角形分布结构，将每一个芯片用金线分别连接在正负电极支架上，覆上荧光粉后，用胶体封装成型。将三颗芯片固定在同一个反光杯内，工作时能够很大程度上提高单颗LED颗粒的亮度；芯片的三角形分布结构，使每颗芯片之间的距离均等，能够使三颗芯片工作时所产生的热量均匀、迅速的排掉，可保证发光二极管正常工作的使用寿命。

Description

单颗三芯片LED颗粒
技术领域
本实用新型涉及一种LED颗粒。
背景技术
目前，发光二极管因省电、色彩鲜艳已被广泛地应用于照明、显示等领域。如太阳能照明、室内照明及LED显示屏等。它们是由多个发光二极管颗粒组成。现有的LED颗粒是采用单芯片封装、大芯片封装及多芯片封装工艺制作，单芯片封装、大芯片封装已不能满足目前对LED亮度的需求，而多芯片封装，由于芯片过于集中，正常工作时热量不能迅速导出，加速了LED颗粒的老化，缩短了颗粒的使用寿命，限制了LED的发展。
发明内容
本实用新型的目的是：提供一种新结构的发光二极管，以克服现有技术的不足。
实现本实用新型目的所采取的技术方案是：将三颗芯片固定在同一个反光杯内，采用三角形分布结构，将每一个芯片用金线分别连接在正负电极支架上。
本实用新型的积极效果是：将三颗芯片固定在同一个反光杯内，工作时能够很大程度上提高单颗LED颗粒的亮度；芯片的三角形分布结构，使每颗芯片之间的距离均等，能够使三颗芯片工作时所产生的热量均匀、迅速的排掉，可保证发光二极管正常工作的使用寿命。
附图说明
附图1为本实用新型的示意图；附图2为附图1的俯视示意图。
具体实施方式
本实用新型如附图1所示，将三颗芯片5固定在同一个反光杯4内，采用三角形分布结构，将每一个芯片5用金线3分别连接在正负电极支架6、2上，覆上荧光粉后，用胶体1封装成型。

Claims (1)

1.一种单颗三芯片LED颗粒，其特征在于：将三颗芯片固定在同一个反光杯内，采用三角形分布结构，将每一个芯片用金线分别连接在正负电极支架上。 
CN 201020150437 2010-03-26 2010-03-26 单颗三芯片led颗粒 Expired - Fee Related CN201804862U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020150437 CN201804862U (zh) 2010-03-26 2010-03-26 单颗三芯片led颗粒

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020150437 CN201804862U (zh) 2010-03-26 2010-03-26 单颗三芯片led颗粒

Publications (1)

Publication Number Publication Date
CN201804862U true CN201804862U (zh) 2011-04-20

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CN 201020150437 Expired - Fee Related CN201804862U (zh) 2010-03-26 2010-03-26 单颗三芯片led颗粒

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CN (1) CN201804862U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105591013A (zh) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 一种smd外封装式led
CN106597751A (zh) * 2017-01-20 2017-04-26 马跃 一种具有宽广色域的液晶显示器及其色温调节方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105591013A (zh) * 2016-03-25 2016-05-18 深圳市九洲光电科技有限公司 一种smd外封装式led
CN105591013B (zh) * 2016-03-25 2018-11-13 深圳市九洲光电科技有限公司 一种smd外封装式led
CN106597751A (zh) * 2017-01-20 2017-04-26 马跃 一种具有宽广色域的液晶显示器及其色温调节方法

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20110420

Termination date: 20160326