CN201248224Y - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN201248224Y
CN201248224Y CN200820301551.1U CN200820301551U CN201248224Y CN 201248224 Y CN201248224 Y CN 201248224Y CN 200820301551 U CN200820301551 U CN 200820301551U CN 201248224 Y CN201248224 Y CN 201248224Y
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China
Prior art keywords
fan
radiator
heat abstractor
heat
fin
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Expired - Fee Related
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CN200820301551.1U
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English (en)
Inventor
曹亮亮
林有旭
吴政达
赵志航
李阳
郭磊
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200820301551.1U priority Critical patent/CN201248224Y/zh
Priority to US12/241,645 priority patent/US20100014244A1/en
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Publication of CN201248224Y publication Critical patent/CN201248224Y/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，包括散热器及给所述散热器送风的风扇，所述散热器包括一与待散热元件热接触的基座，及若干与所述基座固定在一起的散热片，所述散热片上与所述风扇的马达相对的部分被挖空而形成一挖空区域。本实用新型散热装置将所述散热片上与风扇的马达相对的部分挖空形成挖空区域从而将来自散热元件的热量集中分布在挖空区域周围，提高了散热效率并减轻了散热器的重量。

Description

散热装置
技术领域
本实用新型是关于一种散热装置，尤指一种利用风扇对散热器进行散热的重量轻且散热效率高的散热装置。
背景技术
随着中央处理器等电子元件的输出功率和工作频率的不断提高，其相应产生的热量也明显增多，若不及时排除其产生的热量，将导致热量累积引起温度升高，而严重影响电子元件的正常运行。为此，业界通常在这些发热电子元件表面安装一散热器进行辅助散热，同时在散热器上加装一风扇，以加强散热效果。传统的散热器包括若干散热鳍片，因此具有较大的重量且散热效率不高。
发明内容
鉴于以上内容，有必要提供一种重量轻且散热效率高的散热装置。
一种散热装置，包括散热器及给所述散热器送风的风扇，所述散热器包括一与待散热元件热接触的基座，及若干与所述基座固定在一起的散热片，所述散热片上与所述风扇的马达相对的部分被挖空而形成一挖空区域。
相对现有技术，本实用新型散热装置将所述散热片上与风扇的马达相对的部分挖空形成挖空区域从而将来自散热元件的热量集中分布在挖空区域周围，提高了散热效率并减轻了散热器的重量。
附图说明
图1为本实用新型散热装置较佳实施例的的立体分解图。
图2为图1的立体组装图。
具体实施方式
请参阅图1，本实用新型散热装置包括一散热器10、一风扇30及一固定风扇30到散热器10的风扇固定架40。
散热器10包括一底座15，在底座15的上表面固定有热管12，若干平行于底座15上表面设置的散热片11依次穿设在热管12上，在若干散热片11上与所述风扇30的马达33相对的部分被挖空而形成一圆形挖空区域13，所述圆形挖空区域13与所述风扇30的马达33形状相同。底座15的下表面可与一待散热元件(如中央处理器)相接触，待散热元件产生的热量由底座15经热管12而传送到散热片11上。在底座15上设有若干垂直于底座15上下表面的导热片14，用于将底座15下表面聚集的热量传导到上表面。
风扇固定架40大致为一n形的弹性片体，其包括一上板41及由上板41相对两侧垂直向下延伸而成的两侧板43、45，侧板43、45的下端向内弯折而分别形成阶梯部431、451。风扇固定架40在其一侧的四角上设置有四个螺孔42。
风扇30的四角上对应风扇固定架40的四个螺孔42设有四个固定孔32。
请一并参阅图2，将风扇固定架40的两侧边43、45向外扳开，使散热器10的散热片11收容在风扇固定架40的上板41、侧板43、45形成的空间中，并使最上端的散热片11与上板41相抵，慢慢松开两侧板43、45，则两侧板43、45分别与散热片11的两侧相贴合，且阶梯部431、451与最下端的散热片11的下端相抵，从而将风扇固定架40卡固在散热器10上。而后四个螺钉70分别穿过四个固定孔32，并旋入四个螺孔42中而将风扇30固定在风扇固定架40上。
由于散热片11上与马达33对应处无气流流过，而且散热器10上温度较高的部分集中在靠近底座15的散热片11，因此圆形挖空区域13不会影响到散热。此时来自散热元件的热量集中分布在圆形挖空区域13的周围，转动的风扇30将气流送入散热器10一侧，气流经由散热片11间的间隙而从散热器10的另一侧送出，从而将散热片11上的绝大多数热量带走，提高了散热效率，同时减轻了散热器的重量。
本实用新型散热装置将所述散热片上与风扇的马达相对的部分挖空形成挖空区域从而将来自散热元件的热量集中分布在挖空区域周围，提高了散热效率并减轻了散热器的重量。

Claims (8)

  1. 【权利要求1】一种散热装置，包括散热器及给所述散热器送风的风扇，所述散热器包括一与待散热元件热接触的基座，及若干与所述基座固定在一起的散热片，其特征在于：所述散热片上与所述风扇的马达相对的部分被挖空而形成一挖空区域。
  2. 【权利要求2】如权利要求1所述的散热装置，其特征在于：所述挖空区域的形状与所述风扇的马达形状相对应。
  3. 【权利要求3】如权利要求2所述的散热装置，其特征在于：所述散热体包括若干散热片，及若干穿设于所述散热片中的热管。
  4. 【权利要求4】如权利要求3所述的散热装置，其特征在于：所述若干散热片平行于所述基座的上表面设置。
  5. 【权利要求5】如权利要求4所述的散热装置，其特征在于：所述基座还包括位于所述基座上的若干导热片。
  6. 【权利要求6】如权利要求5所述的散热装置，其特征在于：所述若干导热片垂直于所述基座的上表面设置。
  7. 【权利要求7】如权利要求6所述的散热装置，其特征在于：所述散热装置还包括一固定风扇的风扇固定架，所述风扇固定架卡固于所述散热器。
  8. 【权利要求8】如权利要求7所述的散热装置，其特征在于：所述风扇固定架包括一上板及两侧板，所述侧板下端分别设有向内弯折而形成的阶梯部，所述上板和所述阶梯部分别抵接最上端和最下端的散热片而将所述风扇固定架卡固在所述散热器上。
CN200820301551.1U 2008-07-18 2008-07-18 散热装置 Expired - Fee Related CN201248224Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200820301551.1U CN201248224Y (zh) 2008-07-18 2008-07-18 散热装置
US12/241,645 US20100014244A1 (en) 2008-07-18 2008-09-30 Thermal device for heat generating source

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Application Number Priority Date Filing Date Title
CN200820301551.1U CN201248224Y (zh) 2008-07-18 2008-07-18 散热装置

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