CN201112414Y - 大功率led封装结构 - Google Patents

大功率led封装结构 Download PDF

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Publication number
CN201112414Y
CN201112414Y CNU2007201720147U CN200720172014U CN201112414Y CN 201112414 Y CN201112414 Y CN 201112414Y CN U2007201720147 U CNU2007201720147 U CN U2007201720147U CN 200720172014 U CN200720172014 U CN 200720172014U CN 201112414 Y CN201112414 Y CN 201112414Y
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ceramic substrate
reflection cavity
expansion
substrate
reflective cavity
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万喜红
雷玉厚
罗龙
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LIGHTING OPTOECTRONIC(SZ) CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型涉及一种大功率LED封装结构，包括散热基板、利用银胶或锡膏固定的LED发光芯片、金线、透镜、反射腔，所述散热基板为膨胀系数与LED发光芯片、反射腔的膨胀系数相当的陶瓷基板，在该陶瓷基板的正面金属化有电极和反射腔的焊接位，正面的电极通过微孔引伸到反面，反面两个电极之间是金属化的散热连接面；所述透镜为玻璃透镜，其安装在有卡槽的发射腔内；所述反射腔为金属反射腔；陶瓷基板和金属反射腔、铝基板分别用焊料连接。本实用新型采用陶瓷基板和发光芯片、金属反射腔匹配封接，膨胀系数基本一致，不会遭到热应力的破坏；整个器件都是非常好的散热体，从而保证了信赖性；采用金属焊料连接，有非常可靠的机械性能。

Description

大功率LED封装结构
技术领域
本实用新型涉及一种LED封装结构，尤其是涉及一种大功率LED封装结构。
背景技术
大功率LED以它长寿命，高光效。受到越来越多人的关注，随着光效进一步的提升，应用领域从手电，矿灯等便携式照明，发展到装饰照明，公共照明等通用照明领域。这也对大功率LED本身的品质提出了更高的要求。如图1所示，其为现有的大功率LED封装结构的示意图，主要包括发光芯片11、塑胶反射腔20、铜柱30、PC透镜40、金线50。现有的产品由于结构形式的缺失，仍然存在一些不足，主要体现在以下几个方面；一是结构上都属于金属加塑胶的结合，因为金属和塑胶的膨胀系数差异太大而遭到热应力的破坏；二是机械性能比较差，特别是采用PC透镜的产品；三是导热性能较差，塑胶是热的不良导体，基本不导热。
实用新型内容
本实用新型所要解决的技术问题是：提供一种全新的大功率LED封装形式，它具有优异的散热和机械性能，发光效率高，可以在任何条件下使用。
为解决上述技术问题，本实用新型采用如下技术方案：一种大功率LED封装结构，包括散热基板、利用银胶或锡膏固定的LED发光芯片、金线、透镜、反射腔，所述散热基板为膨胀系数与LED发光芯片、反射腔的膨胀系数相当的陶瓷基板，在该陶瓷基板的正面金属化有电极和反射腔的焊接位，正面的电极通过微孔引伸到反面，反面两个电极之间是金属化的散热连接面；所述透镜为玻璃透镜，其安装在有卡槽的发射腔内；所述反射腔为金属反射腔；陶瓷基板和金属反射腔、铝基板分别用焊料连接。
其中，所述陶瓷基板、金属反射腔焊接连接成一体。
本实用新型的有益效果是：1.采用陶瓷基板和发光芯片、金属反射腔是匹配封接，膨胀系数基本一致，即使长期在高温下使用也不会遭到热应力的破坏；2.陶瓷基板、焊料、金属反射腔都是高热导的材料，等于整个器件都是非常好的散热体，器件的散热面积加大从而保证了信赖性；3.铝基板、陶瓷基板、金属反射腔之间是采用金属焊料连接，有非常可靠的机械性能。
附图说明
图1是现有大功率LED封装结构的示意图；
图2是本实用新型大功率LED封装结构的剖面示意图。
具体实施方式
如图2所示，本实用新型公开了一种大功率LED结构，包括LED发光芯片1、银胶(锡膏或共金焊接)2、金线3、硅胶4、金属材质的反射腔5、陶瓷基板6、焊料8、铝基板7、焊料9。其特征是在陶瓷基板6的正面上金属化电极和反射腔的焊接位，并且把电极通过微孔引伸到反面，反面两个电极之间是金属化的散热连接面，玻璃透镜10是安装在有卡槽的反射腔5内，陶瓷基板6和反射腔5、铝基板7分别用焊料连接。
陶瓷基板6的膨胀系数和LED发光芯片1、反射腔5的膨胀系数基本相当，而可较好地保持同步膨胀、收缩，避免了热应力破坏。
陶瓷基板6、焊料、金属反射腔5都是高热导材料，也就是整个器件都是导热材料所构成。
陶瓷基板6、金属反射腔5是用焊接的方式连接。
本实用新型的组装步骤是；先将陶瓷基板6按需要金属化成电极和反射腔的焊接位，把金属反射腔5用焊料8先固定在陶瓷基板6上，再在陶瓷基板6的指定位置点上银胶2，把LED发光芯片1放置在银胶2上，放入150℃烘箱中3个小时，然后焊接金线3，将LED发光芯片1的正负极分别用金线3焊接在陶瓷基板6的正负极上，填充好硅胶4，盖好玻璃透镜10，完成器件的封装。检验好即可使用，使用时只要用焊料9将器件焊接到铝基板7上就行。

Claims (2)

1、一种大功率LED封装结构，包括散热基板、利用银胶或锡膏固定的LED发光芯片、金线、透镜、反射腔，其特征在于：所述散热基板为膨胀系数与LED发光芯片、反射腔的膨胀系数相当的陶瓷基板，在该陶瓷基板的正面金属化有电极和反射腔的焊接位，正面的电极通过微孔引伸到反面，反面两个电极之间是金属化的散热连接面；所述透镜为玻璃透镜，其安装在有卡槽的发射腔内；所述反射腔为金属反射腔；陶瓷基板和金属反射腔、铝基板分别用焊料连接。
2、如权利要求1所述的大功率LED封装结构，其特征在于：所述陶瓷基板与金属反射腔焊接连接成一体。
CNU2007201720147U 2007-09-21 2007-09-21 大功率led封装结构 Expired - Lifetime CN201112414Y (zh)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102185095A (zh) * 2011-04-26 2011-09-14 王海军 一种高效散热的大功率led封装结构
CN102244189A (zh) * 2011-07-19 2011-11-16 彩虹集团公司 一种陶瓷基板集成封装的led
CN102447044A (zh) * 2010-12-10 2012-05-09 奉化市匡磊半导体照明有限公司 绝缘底板发光芯片封装结构
CN102767724A (zh) * 2012-07-26 2012-11-07 中山伟强科技有限公司 一种陶瓷基板led模块及大功率led灯具
CN103062727A (zh) * 2011-10-19 2013-04-24 富士迈半导体精密工业（上海）有限公司 Led光源散热结构
CN103107276A (zh) * 2012-12-07 2013-05-15 孙雪刚 一种led封装结构
CN103413851A (zh) * 2013-08-10 2013-11-27 冯春阳 光伏旁路器件及应用该器件的保护电路、接线盒及发电***
CN103972378A (zh) * 2014-05-29 2014-08-06 中山市秉一电子科技有限公司 一种led发光装置及其封装方法
CN104485414A (zh) * 2014-12-04 2015-04-01 中山市川祺光电科技有限公司 贴片led灯芯片焊线连线结构及其制作方法
CN105627118A (zh) * 2016-03-11 2016-06-01 苏州铂奥特光电科技有限公司 一种人体可适应低能耗环保型植物生长灯
CN107246596A (zh) * 2017-06-20 2017-10-13 哈尔滨工业大学（威海） 用于led芯片的散热装置以及使用该装置的led光源
CN110299443A (zh) * 2019-05-29 2019-10-01 江苏大学 一种基于cob封装的大功率led的散热装置
CN111179774A (zh) * 2020-01-21 2020-05-19 深圳市艾比森光电股份有限公司 Led显示模组及led显示屏

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102447044A (zh) * 2010-12-10 2012-05-09 奉化市匡磊半导体照明有限公司 绝缘底板发光芯片封装结构
CN102447044B (zh) * 2010-12-10 2014-05-14 罗容 绝缘底板发光芯片封装结构
CN102185095A (zh) * 2011-04-26 2011-09-14 王海军 一种高效散热的大功率led封装结构
CN102244189A (zh) * 2011-07-19 2011-11-16 彩虹集团公司 一种陶瓷基板集成封装的led
CN103062727A (zh) * 2011-10-19 2013-04-24 富士迈半导体精密工业（上海）有限公司 Led光源散热结构
CN102767724A (zh) * 2012-07-26 2012-11-07 中山伟强科技有限公司 一种陶瓷基板led模块及大功率led灯具
CN103107276A (zh) * 2012-12-07 2013-05-15 孙雪刚 一种led封装结构
CN103413851A (zh) * 2013-08-10 2013-11-27 冯春阳 光伏旁路器件及应用该器件的保护电路、接线盒及发电***
CN103972378A (zh) * 2014-05-29 2014-08-06 中山市秉一电子科技有限公司 一种led发光装置及其封装方法
CN104485414A (zh) * 2014-12-04 2015-04-01 中山市川祺光电科技有限公司 贴片led灯芯片焊线连线结构及其制作方法
CN105627118A (zh) * 2016-03-11 2016-06-01 苏州铂奥特光电科技有限公司 一种人体可适应低能耗环保型植物生长灯
CN107246596A (zh) * 2017-06-20 2017-10-13 哈尔滨工业大学（威海） 用于led芯片的散热装置以及使用该装置的led光源
CN107246596B (zh) * 2017-06-20 2019-12-06 哈尔滨工业大学（威海） 用于led芯片的散热装置以及使用该装置的led光源
CN110299443A (zh) * 2019-05-29 2019-10-01 江苏大学 一种基于cob封装的大功率led的散热装置
CN110299443B (zh) * 2019-05-29 2020-07-31 江苏大学 一种基于cob封装的大功率led的散热装置
CN111179774A (zh) * 2020-01-21 2020-05-19 深圳市艾比森光电股份有限公司 Led显示模组及led显示屏

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