CN202268391U - Cob面光源封装结构 - Google Patents
Cob面光源封装结构 Download PDFInfo
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- CN202268391U CN202268391U CN2011203889372U CN201120388937U CN202268391U CN 202268391 U CN202268391 U CN 202268391U CN 2011203889372 U CN2011203889372 U CN 2011203889372U CN 201120388937 U CN201120388937 U CN 201120388937U CN 202268391 U CN202268391 U CN 202268391U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本实用新型涉及一种COB面光源封装结构,包括金属基板,金属基板上设有塑料构件,金属基板与塑料构件构成一个向上的反射凹杯,塑料构件内封装有导电片,金属基板的底面固定有一个或多个LED芯片,LED芯片的电极通过导线与导电片连接,导电片连有引脚导电端,反射凹杯的空腔内设有填充树脂。实用新型有益的效果是:本实用新型直接在高导热率金属基板上使用小功率LED芯片集成封装,可以分散热量、改善出光效果,出光面一致性好、无色斑、无眩光、光衰小。
Description
技术领域
本实用新型涉及LED灯领域,尤其是一种COB面光源封装结构。
背景技术
LED作为绿色、节能光源虽然在这几年得到大力的发展,但其光电转换效率不是很高,大部分的电能被转换为热能,随着LED功率的提高,其发热量也逐渐的增大,如果产生的热量不能及时地散发将极大的影响LED的正常工作,缩短其使用寿命。目前市场传统的COB封装结构主要是采用将大功率或小功率LED芯片集成封装在基板上的方式,基板分为金属和陶瓷基板,在金属基板上进行大功率和小功率LED芯片集成封装的方式中,由于大功率LED芯片发热量大、热量集中,以及金属基板上有一介电层(绝缘层),因而存在散热较差等问题,这些问题最终导致基板发黄发黑、光效降低及光衰增大,从而造成LED产品不能使用;陶瓷基板虽然无上述问题,但成本较高,光效较低。另外,市场上还有一种将贴片LED焊接在基板上的应用方式,此种方式散热较差,因为贴片LED产生的热量必须先传到基板上,再由基板传导到散热装置上;热在传导过程中经过了两层介质的传导,其热传导效率受到了很大的递减;同时,此种方式还存在有明显的暗区及光斑等问题,这就需要安装扩散光线的外壳以抑制眩光,但对于眩光的抑制会造成光损耗。
发明内容
本实用新型要解决上述现有技术的缺点,提供一种分散热量,出光面一致性好的COB面光源封装结构。
本实用新型解决其技术问题采用的技术方案:这种COB面光源封装结构,包括金属基板,金属基板上设有塑料构件,金属基板与塑料构件构成一个向上的反射凹杯,塑料构件内封装有导电片,金属基板的底面固定有一个或多个LED芯片,LED芯片的电极通过导线与导电片连接,导电片连有引脚导电端,反射凹杯的空腔内设有填充树脂。
作为优选,所述金属基板上设有用于固定散热片的固定螺孔。
作为优选,所述金属基板的底面与LED芯片通过导热介质连接。
作为优选,金属基板采用铜、铝或高导热率合金制成。
作为优选,填充树脂采用环氧树脂、硅胶或其混合物。
作为优选,导线采用金线、银线或具导电好、延展性好的合金线制成。
作为优选,多个LED芯片可自由串、并组合。通过调整串、并组合方式对驱动电流、额定电压、标称功率作相应的调整。
实用新型有益的效果是:本实用新型直接在高导热率金属基板上使用小功率LED芯片集成封装,可以分散热量、改善出光效果,出光面一致性好、无色斑、无眩光、光衰小;且无须另外制作PCB板,不仅能减少制造工艺及其成本,在应用上可以节省模组制作和二次配光的成本,减少光损,适用于如射灯、球泡灯、筒灯等各类应用产品上。
附图说明
图1是本实用新型的俯视图;
图2是本实用新型的正面结构示意图;
附图标记说明:LED芯片1,导线2,填充树脂3,导热介质4,金属基板5,导电片6,引脚导电端7,固定螺孔8,反射凹杯9,塑料构件10。
具体实施方式
下面结合附图对本实用新型作进一步说明:
实施例:如图1、2,这种COB面光源封装结构,包括金属基板5,金属基板5上设有塑料构件10,金属基板5与塑料构件10构成一个向上的反射凹杯9,塑料构件10内封装有导电片6,金属基板5的底面设有通过导热介质4固定的LED芯片1,LED芯片1的电极通过导线2与导电片6连接,导电片6连有引脚导电端7,反射凹杯9的空腔内设有填充树脂3。LED芯片1工作时产生的热量通过其底部的导热介质4传递给金属基板5。
金属基板5材料采用铜、铝或高导热率合金制成。填充树脂3材质采用环氧树脂、硅胶或其混合物。导线2采用是金线、银线或合金线制成。多个LED芯片1可根据不同数量自由串、并组合,可以通过调整串、并组合方式对驱动电流、额定电压、标称功率作相应的调整。
在实际应用时,首先在引脚导电端7焊接两根导线连到驱动电源,然后用螺丝通过固定螺孔8固定在灯具散热片上即可使用。
除上述实施例外,本实用新型还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案,均落在本实用新型要求的保护范围。
Claims (7)
1.一种COB面光源封装结构,包括金属基板(5),其特征是:金属基板(5)上设有塑料构件(10),金属基板(5)与塑料构件(10)构成一个向上的反射凹杯(9),塑料构件(10)内封装有导电片(6),金属基板(5)的底面固定有一个或多个LED芯片(1),LED芯片(1)的电极通过导线(2)与导电片(6)连接,导电片(6)连有引脚导电端(7),反射凹杯(9)的空腔内设有填充树脂(3)。
2.根据权利要求1所述的COB面光源封装结构,其特征是:所述金属基板(5)上设有用于固定散热片的固定螺孔(8)。
3.根据权利要求1所述的COB面光源封装结构,其特征是:所述金属基板(5)的底面与LED芯片(1)通过导热介质(4)连接。
4.根据权利要求1所述的COB面光源封装结构,其特征是:所述金属基板(5)采用铜、铝或高导热率合金制成。
5.根据权利要求1所述的COB面光源封装结构,其特征是:所述填充树脂(3)采用环氧树脂、硅胶或其混合物。
6.根据权利要求1所述的COB面光源封装结构,其特征是:所述导线(2)采用金线、银线或具导电好、延展性好的合金线制成。
7.根据权利要求1所述的COB面光源封装结构,其特征是:所述的多个LED芯片(1)可自由串、并组合。
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CN2011203889372U CN202268391U (zh) | 2011-10-13 | 2011-10-13 | Cob面光源封装结构 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103925568A (zh) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | 一种cob灯具防护支架 |
CN104037300A (zh) * | 2013-03-08 | 2014-09-10 | 群创光电股份有限公司 | 发光二极管装置及显示装置及电子设备 |
CN112709937A (zh) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | 一种cob灯珠 |
-
2011
- 2011-10-13 CN CN2011203889372U patent/CN202268391U/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037300A (zh) * | 2013-03-08 | 2014-09-10 | 群创光电股份有限公司 | 发光二极管装置及显示装置及电子设备 |
CN103925568A (zh) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | 一种cob灯具防护支架 |
CN112709937A (zh) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | 一种cob灯珠 |
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Granted publication date: 20120606 Termination date: 20171013 |