CN201100917Y

CN201100917Y - Efficient LED encapsulation structure

Info

Publication number: CN201100917Y
Application number: CNU2007201735886U
Authority: CN
Inventors: 秦文隆; 许德庆
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-10-11
Filing date: 2007-10-11
Publication date: 2008-08-13
Anticipated expiration: 2017-10-11

Abstract

The utility model relates to a highly effective LED packaging system, which mainly comprises a packaging LED base plate and a non-metal base plate, wherein LED crystals with the predetermined number and a predesigned circuit are arranged on the outer end surface of the non-metal base plate, the LED crystals are connected with the circuit through a line conductor to form the packaging LED base plate, a heat dissipation die set is designed under the packaging LED base plate and comprises a packaging frame which is fixed with the non-metal base plate, a non-metal heat dissipation layer with a porous structure is arranged on the terminal end of the packaging frame, hollow containing space is arranged between the non-metal base plate and the non-metal heat dissipation layer, air in the hollow containing space can be convected by the aid of pore space of the non-metal heat dissipation layer, the heat which is produced by the LED crystals can be rapidly conducted and evenly distributed on a metal thin film layer to form the even heat effect, the heat on the metal thin film layer is conducted to the other end of the non-metal heat dissipation layer to dissipate by the aid of the heat convection in the hollow containing space, and the system has the effect of simplifying the LED packaging structure and dissipating heat rapidly.

Description

High efficiency LED assembling structure

Technical field

The utility model relates to high efficiency LED structure packing technique field, relates in particular to a kind of high efficiency LED assembling structure.

Background technology

LED is the abbreviation of light-emitting diode (Light-Emitting Diode), it is the solid-state light emitting element that semi-conducting material is made, material uses III-V family's chemical element (as: gallium phosphide (GaP), GaAs (GaAs) etc.), principle of luminosity is to convert electrical energy into light, just compound semiconductor is applied electric current, by combining of electronics and electric hole, superfluous energy can disengage with the form of light, reach luminous effect, it is luminous to belong to cold property, and the life-span reached more than 100,000 hours.The characteristics of LED maximum are: need not warm up the lamp time (idlingtime), reaction speed is fast, volume is little, power-saving, shatter-proof, pollute low, be fit to volume production, the tool high-reliability, the needs on the fit applications are made the element of minimum or array type easily.But because LED is a solid-state illumination, promptly be to utilize the chip energising, the quantum excite state is replied and is sent energy (light), but in luminous process, the light energy in the chip can not reach the external world fully, energy that can not bright dipping, in chip internal and packaging body, just can be absorbed, form heat.The conversion efficiency that LED is general has only 10%～30% approximately, so the electricity of 1W only becomes the light that can see less than 0.2W, other all is a heat, if do not dispel the heat, these accumulation of heat can cause damage to chip efficient and life-span.So will apply to the problem that lighting apparatus at first will solve heat radiation with high efficiency LED.Metal fin is mostly adopted in existing LED heat radiation, or in conjunction with modes such as heat pipe, cooling chip, soaking plate, radiator fans, have generally that radiating effect is not good, radiating rate inadequately rapidly, heat radiation modular structure complexity, the high disappearance of cost.And the structure of led chip dress mode is example (patent announcement data reference on 05 01st, 2007) with the novel patent of TaiWan, China M311116 number " the printed circuit board arrangement improvement of light-emitting diode support plate ", and it includes: substrate; First insulating barrier, this first insulating barrier are to be laminated on the one side of aforesaid substrate; The copper layer, this copper layer is to be laminated on the one side of above-mentioned first insulating barrier, and has second insulating barrier on this copper layer; And the top layer, this top layer is a side that is laminated on the one side of above-mentioned copper layer and is adjacent to second insulating barrier; Wherein, this substrate can be aluminium sheet, aluminium flake.Should adorn led chip by preceding case structure on the aluminum metal substrate, because the substrate of structure dress is a metal material, thus must be at the stacked insulating barrier of the one side of this substrate, but the setting of this insulating barrier will influence the heat dissipation of led chip, too thick heat dissipation is poor, the too thin insulation usefulness that loses again.This is the disappearance of the maximum of prior art existence, and this disappearance is into the difficult problem that industry is demanded urgently overcoming.

The utility model content

In view of this, main purpose of the present utility model is to provide a kind of high efficiency LED assembling structure, has the LED assembling structure of simplification and quick heat radiating effect.

For achieving the above object, the utility model adopts following scheme to realize:

A kind of high efficiency LED assembling structure, it mainly is made of with the heat radiation module structure dress LED substrate, this structure dress LED substrate includes non-metal base plate, the circuit that this non-metal base plate outer face is provided with the LED crystal of predetermined quantity and designs in advance, the non-metal base plate inner face can be provided with metal film layer in addition, the LED crystal also constitutes structure dress LED substrate with circuit with wire bond, this heat radiation module is located at the below of structure dress LED substrate, it includes the package shelf that sets firmly with non-metal base plate, this package shelf end is provided with the nonmetal heat dissipating layer with multi-pore structure, has between the hollow appearance hole convection current that makes air interior between the hollow appearance borrow this nonmetal heat dissipating layer to have between this non-metal base plate and nonmetal heat dissipating layer.

In the such scheme, described heat radiation module also can be in the following ways: this heat radiation module of being located at structure dress LED substrate below constitutes for having mushy nonmetal heat dissipating layer, and this nonmetal heat dissipating layer has between the hollow appearance with respect to structure dress LED real estate.

By such scheme to find out, the heat that so is arranged at the LED crystal generation on the non-metal base plate can be conducted rapidly, and be distributed in metal film layer fifty-fifty, form equal thermal effect, relend hollow hold between in thermal convection the heat of metal film layer conducted to the nonmetal heat dissipating layer of the other end rapidly and dispel the heat, have the LED assembling structure of simplification and quick heat radiating effect.

Description of drawings

Fig. 1 is the utility model embodiment combination section;

Fig. 2 is for the utlity model has metal film layer embodiment combination section;

Fig. 3 is another embodiment combination section of the utility model.

Description of reference numerals:

1 structure dress LED substrate, 10 non-metal base plates

11 LED crystal, 12 circuit

13 leads, 2 heat radiation modules

20 package shelf, 21 nonmetal heat dissipating layers

3 metal film layers between 22 hollows are held

4 heat radiation modules, 40 nonmetal heat dissipating layers

Between 41 hollows are held

Embodiment

For reaching the aforementioned purpose of the utility model, enumerate following examples, and conjunction with figs. explanation as after, those skilled in the art can be thus to structure of the present utility model, feature and the effect reached, obtain better understanding.

At first, see also shown in Figure 1, as shown in Figure 1, the utility model mainly is made of with heat radiation module 2 structure dress LED substrate 1, this structure dress LED substrate 1 includes non-metal base plate 10, and (non-metal base plate is made of nonmetallic materials non-conductive and that have a radiating effect, for example: glass substrate, aluminum oxide substrate, the zirconia substrate, silicon carbide substrate etc.), these non-metal base plate 10 outer faces are provided with the LED crystal 11 of predetermined quantity and the circuit 12 that designs in advance, LED crystal 11 also links with lead 13 with circuit 12 and constitutes structure dress LED substrate 1, this heat radiation module 2 is located at the below of structure dress LED substrate 1, it includes the package shelf 20 that sets firmly with non-metal base plate 10, these package shelf 20 ends are provided with nonmetal heat dissipating layer 21 (the nonmetal heat dissipating layer 21 of multi-pore structure with multi-pore structure, TaiWan, China I256322 number and the M256967 patent of being applied for reference to this case designer), 21 of this non-metal base plate 10 and nonmetal heat dissipating layers have hollow hold between 22, make the hole convection current that 22 interior air can borrow this nonmetal heat dissipating layer 21 to have between the hollow appearance, the heat that so is arranged at LED crystal 11 generations on the non-metal base plate 10 can promptly be conducted, borrow hollow hold between thermal convections in 22 heat promptly conducted to the nonmetal heat dissipating layer 21 of the other end and dispel the heat, have the effect of simplifying LED assembling structure and quick heat radiating.

See also shown in Figure 2, aforementioned non-metal base plate 10 inner faces of the utility model can be provided with metal film layer 3, this metal film layer 3 has diffusion heat usefulness, the heat of LED crystal 11 generations that are arranged on the non-metal base plate 10 can promptly be conducted by metal film layer 3, and be distributed in metal film layer 3 fifty-fifty, form the effect of soaking, relend hollow hold between thermal convection in 22 heat of metal film layer 3 promptly conducted to the nonmetal heat dissipating layer 21 of the other end and dispel the heat.

See also shown in Figure 3, the aforementioned heat radiation module 4 of structure dress LED substrate 1 below of being located at of the utility model is for having mushy nonmetal heat dissipating layer 40 (nonmetal heat dissipating layer 40 of multi-pore structure, TaiWan, China I256322 number and the M256967 patent of being applied for reference to this case designer) constitute, this nonmetal heat dissipating layer 40 with respect to non-metal base plate 10 masks of structure dress LED substrate 1 have hollow hold between 41, same, the hole convection current that 41 interior air can borrow this nonmetal heat dissipating layer 40 to have between this hollow was held, the heat that so is arranged at LED crystal 11 generations on the non-metal base plate 10 can promptly be conducted, borrow hollow hold between thermal convections in 41 heat promptly conducted to the nonmetal heat dissipating layer 40 of the other end and dispel the heat, have the effect of simplifying LED assembling structure and quick heat radiating.And present embodiment non-metal base plate 10 inner faces can be provided with metal film layer 3, this metal film layer 3 has diffusion heat usefulness, the heat of LED crystal 11 generations that are arranged on the non-metal base plate 10 can promptly be conducted by metal film layer 3, and be distributed in metal film layer 3 fifty-fifty, form the effect of soaking, relend hollow hold between thermal convection in 41 heat of metal film layer 3 promptly conducted to the nonmetal heat dissipating layer 40 of the other end and dispel the heat.

But the above, it only is preferable possible embodiments of the present utility model, be not in order to limiting to scope of the present utility model, those skilled in the art's equivalent structure of using the utility model specification and claims to do changes such as, ought to be included in the claim of the present utility model.

Claims

1, a kind of high efficiency LED assembling structure is characterized in that, mainly includes:

Structure dress LED substrate includes non-metal base plate, and the circuit that this non-metal base plate outer face is provided with the LED crystal of predetermined quantity and designs in advance, LED crystal and circuit constitute structure dress LED substrate with wire bond;

The heat radiation module, be located at the below of structure dress LED substrate, it includes the package shelf that sets firmly with non-metal base plate, this package shelf end is provided with the nonmetal heat dissipating layer with multi-pore structure, has between the hollow appearance hole convection current that interior air can borrow this nonmetal heat dissipating layer to have between hollow was held between this non-metal base plate and nonmetal heat dissipating layer.

2, high efficiency LED assembling structure as claimed in claim 1 is characterized in that, described non-metal base plate inner face is provided with metal film layer.

3, high efficiency LED assembling structure as claimed in claim 1 is characterized in that, the described heat radiation module of being located at structure dress LED substrate below constitutes by having mushy nonmetal heat dissipating layer, and the relative non-metal base plate mask of this nonmetal heat dissipating layer has between the hollow appearance.

4, high efficiency LED assembling structure as claimed in claim 3 is characterized in that, described non-metal base plate inner face is provided with metal film layer.